Stihl BT 131 User manual

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SERVICE MANUAL
V59-C
ThisService manualisproperty
of Videocon Industries Ltd.
M/S. VIDEOCON INDUSTRIES LIMITED,
14Km Stone, Paithan Road, Aurangabad,
Village Chitegaon, Taluka Paithan,
AURANGABAD – 431105, MAHASHTRA, INDIA

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V59-C SERVICE MANUAL
SPECS REV
DATE
DESCRIPTION
PREPARED BY
VER 1.0 REV 1.0 20.1.2015 V59-C SERVICE MANUAL VK

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Index
1. Safety Precautions
2. Servicing Precautions
3. Chassis Block Diagram
A) Chassis block diagram
B) Actual Chassis view
C) Chassis Specification
4. Connectors and Electrical Parameters
A) Connector Details
B) Critical component list
5. Panel Information
A) Panel Specification
6. Software Installation Procedure
A) SW loading through USB
B) SW Loading through Jig
7. Circuit Diagram
8. Trouble Shooting

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2.Servicing Precautions
2.1 General Servicing Precautions:
1. Always unplug the receiver AC power cord from the AC power
Source before:
a. Removing or reinstalling any component, circuit board module or anyotherreceiver
assembly.
b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection.
c. Connectinga test substitute in parallel with an electrolytic capacitor in the receiver.
CAUTION: A wrongpart substitution or incorrect polarityinstallation of electrolytic
capacitors may result in an explosion hazard
2. Test high voltage only by measuring it with an appropriate high voltage meter or other
voltagemeasuring device (DVM, FETVOM, etc) equipped with asuitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by
applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or
comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual,
lubrication of contacts in not required.
5. Do not defeat any plug/socket voltage interlocks with which receivers covered by this
service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before
connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do
not connect the test fixture ground strap to any heat sink in this receiver.
2.2 Electrostatic Sensitive (ES) Devices:
Some semiconductor (solid-state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatic Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The followingtechniques should be used to help
reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any electrostatic chargeon your body by touching a known earth
ground. Alternatively, obtain and wear a commercially available discharging wrist strap
device, which should be removed toprevent potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a

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conductive surface such as aluminum foil, to prevent electrostatic chargebuild up or
exposure of the assembly.
3. Use only a grounded-tip soldering iron tosolder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not
classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use Freon-propelled chemicals. These can generate electrical charges sufficient to
damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately
before you are ready to install it. (Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil or comparable conductive
material).
7. Immediately before removing the protective material from the leads of a replacement ES
device, touch the protective material to the chassis or circuit assembly into which the device
will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observeall other safety
precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise
harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
2.3 General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that
will maintain tip temperaturewithin the range or500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts
lead.
3. Keep thesoldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be
soldered. Use a mall wire-
4. bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use Freon-propelled spray-
on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal
temperature (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly
draw the melted solder with an anti-static, suction-
type solder removal deviceor with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach anormal temperature (500°F to 600°F).

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b. First,hold thesoldering iron tip and solder thestrand against the component lead until
the solder melts.
c. Quickly move the solderingiron tip to the junctionof the
Component lead and the printed circuit foil, and hold it there only until the solder flows
onto and around both the component lead and the foil. CAUTION: Work quickly to avoid
overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small
wire-bristle brush.
2.4 IC Remove/Replacement: - Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat against the circuit foil. When
holes are the slotted type, the following technique should be used to remove and replace
the IC. When working with boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
2.4.1 IC Removal:
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead
with the soldering iron tip asthe solder melts.
2. Draw away the melted solder with an anti-static suction type solder removal device (or
with solder braid) before removing the IC.
2.4.2 Replacement:
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with asmall wire-bristle brush.(It is not necessary to re apply
acrylic coating to theareas).
2.5 "Small-Signal" Discrete Transistor Removal/ Replacement: -
1. Removethe defective transistor by clipping itsleads as close as possible to the
component body.
2. Bend into a "U” shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to
the corresponding leads extending from the circuit board and crimp the "U" with long nose
pliers to insure metal to metal contact then solder each connection
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2.6 Power Output, Transistor Device Removal/ Replacement: -
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuitboard.
5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink.

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2.7 Diode Removal/ Replacement: -
1. Remove defective diode by clipping its leads as close as possibleto diode body.
2. Bend the two remaining leads perpendicular y to the circuitboard.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead
on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If
they arenot shiny, reheat them and if necessary, apply additional solder.
2.8 Fuse and Conventional Resistor Removal/ Replacement:
1. Clip each fuse or resistor lead at top ofthe circuit board hollows take.
2. Securely crimp the leads of replacement component around notchat stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between thereplaced component and adjacent
components and the circuit board to prevent excessive component temperatures.
2.9 Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the
adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off"
the board. The following guidelines and procedures should be followed whenever this
condition is encountered. At IC Connections to repair a
defective copper pattern at IC connections use the following procedure to install a jumper
wire on the copper pattern side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much
copper as absolutely necessary).
2. Carefully scratch away the solder resist and acrylic coating (if used) from the end of the
remainingcopper pattern.
3. Bend a small "U" in one end of a small gauge jumper wireand carefully crimp it around
the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of theout-away copper pattern and let it overlap
the previously scraped end of the good copper pattern. Solder the overlapped area and clip
off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at
connections other than IC Pins. This technique involves the installation of a jumper wire on
the component side of the circuit board.
1. Remove the defective copper pattern with asharp knife. Remove at least 1/4inch of
copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the
nearest component that isdirectly connected to the affected copper pattern.
3. Connectinsulated 20-gaugejumper wire from the lead of the nearest component on one
side of the pattern break to the lead of the nearest component on the other side. Carefully
crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so
the it does not touch components or sharp edges.

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3) Chassis block diagram:-

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b)Actual Chassis view V59C:-

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c) Chassis Specification:-
PARAMETERS SPECS
TUNNING
NUMBER OF PROGRAMS 200
TUNING SYSTEM FS
COLOUR SYSTEM PAL/ SECAM/AUTO
NTSC PLAYBACK YES
SOUND SYSTEM I/BG/DK
TURBO TUNING NO
PLUG & PLAY NO
CHANNEL NAME (PROGRAM NAME) YES
MANUAL SEARCH YES
UPDATE SEARCH NO
FINE TUNE YES
SKIP YES
EXCHANGE CHANNEL (SWAP) NO
INSERT CHANNEL NO
COPY CHANNEL YES
DELETE CHANNEL YES
AUTO DETECTION COLOR AND SOUND YES
PICTURE
SELECTABLE PICTURE MODES USER/CINEMA/SPORTS/VIVID/HI-BRIGHT
WHITE PEAK LIMITER YES (Inbuilt)
BLACK STRETCH YES (Inbuilt)
BLUE STRETCH YES (Inbuilt)
DYN. SKIN TONE (FLESH TONE) YES
ZOOM MODE Normal/16:9/4:3/Full (Direct Key ON REMOTE)
FAVOURITE COLOUR CONTROL NO
PICTURE IMPROVEMENT YES(Inbuilt)
DCDI YES (Inbuilt)
MADI MODE YES
CCS MODE Yes
ADAPTIVE LUMA CONTROL NO
ACTIVE COLOUR MANAGEMENT Yes(Active color 3D)
ADAPTIVE CONTRAST AND COLOUR No
AUTOMATIC IMAGE OPTIMIZATION YES
FLESH TONE ADJUST YES
GREEN TONE ADJUST NO
BLUE TONE ADJUST NO
DE-INTERLACING YES
3:2 2:2 PULL DOWN YES
DIGITAL COMB FILTER YES (3D)
AVERAGE PICTURE LEVEL (APL) No
3D NOISE REDUCTION YES(INBUILT)
DNR YES

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PIP NO
POP NO
CINEMA MODE YES (Inbuilt)
CTI (Colour Transient Improvement) YES (Inbuilt)
FREEZE No
DYNAMIC SHARPNESS No
DYNAMIC CONTRAST (DCI) YES (Inbuilt)
BACKLIGHT ADJUST YES
COLOUR TEMP YES
AUTO ADJUST (IN PC) YES
H POSITION (IN PC) YES
V POSITION (IN PC) YES
PHASE (In PC) YES
CLOCK (In PC) YES
AUDIO
SELECTABLE SOUND MODES USER/SPEECH/MUSIC/SOEN
AUTO VOLUME LEVELLER YES
AUDIO OUTPUT POWER (RMS) 2x10W (+/-2W)
MUSIC MODE YES (Eco Vision =Audio Only)
REVERB NO
STEREO PLAYBACK Yes
BASS / TREBLE / BALANCE YES
EQUALIZER 5 BAND
INCREDIBLE STEREO NO
SOUND BOOSTER NO
LOUDNESS NO
SURROUND NO
VOLUME PP NO
NO.OF SPEAKERS 2
FRONT SPEAKER NO
TWEETER NO
WOOFER NO
VOICE NO
DYNAMIC BASS NO
OMNI SURROUND NO
EXTERNAL SPEAKER NO
V CHIP NO
SRS (SRS TSXT sound) NO
AV OUT VOLUME NO
TIMER
CLOCK NO
ON CHANNEL NO
OFF TIME NO
ON TIME NO
REMINDER TIMER NO
REMIND CHANNEL NO
SLEEP TIMER YES

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CLOCK DISPLAY NO
AUTO SWITCH OFF(NO SIGNAL) YES
H/W FEAATURES
FM NO(OPTIONAL TRANSMITTER)
DTH NO
PANEL COMPABILITY YES
PANEL BRIGHTNESS YES
MESSAGE NO
TELEPHONE DIARY NO
PROGRAM DIRECTORY YES
CHANNEL ON DEMAND (COD) NO
FEATURES
ECO VISION (OFF/ POWER SAVING LOW/ POWER SAVING MID
/POWER SAVING HIGH/AUDIO ONLY)
SCREEN SAVER No
CURTAIN EFFECT NO
SCAN NO
SORT NO
QUICK VIEW YES
FAVOURITE YES
ALARM NO
HOTEL MODE YES
VOLUME LOCK YES
CHILD LOCK YES (In User Lock)
TUNING LOCK YES
MAX VOLUME LOCK YES
HELP NO
SELF DEMO NO
OSD TRASPARENCY NO
OSD LANGUAGES(ATV)
English
SKY-REMOTER NO
RF-REMOTE NO
Full HD panel support YES
CALENDAR NO
SOURCE LOCK (VIDEO LOCK) YES(In User Lock)
FRONT PANEL KEY LOCK YES
GAME NO
BLUE SCREEN No
CORDLESS HEADPHONE NO
OSD HPOS NO
OSD VPOS NO
OSD TIMER NO
GAME PORT NO
VGA UPDATE S/W(service) YES

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Start on predefined Source YES
Start on predefined Channel NO. YES
CE,ROHS&EUP Directivies NO
RS232 SUPPORT NO
SPECIAL FEATURES
ENERGY METER No
SCENE SELECT No
BOOT UP SOUND YES
CAPTURE LOGO/BOOT LOGO NO
FAMILY FAVOURITE YES
TOUCH CONTROL KEY NO
RF REMOTE NO
BEE STAR RATING NO
DEMO SHOP(Eops) YES
BODY MASS INDEX(BMI) NO
EFFECTS NO
HEALTH CARE VIEW NO
WORLD CLOCK NO
VIDEO AND AUDIO DIAGNOSIS NO
MFM NO
CONNECTIVITY
RF 1
AV IN (FRONT/SIDE) 2
S-VIDEO IN No
DVD COMPATIBILITY (YPbPr/YCbCr) 1
HDMI INPUT 4
IDTV INPUT NO
PC(VGA IN) 1
PC AUDIO IN 1
EURO SCART IN NO
USB INPUT (2.0 SUPPORT) 2
BLUETOOTH NO
DVI INPUT NO
AV OUT 1(CVBS OUT)
EARPHONE SOCKET NO
CORDLESS HEADPHONE NO
OPTICAL OUT NO
SMART CARD SLOT NO
DIGITAL RF INPUT NO
USB SUPPORT
USB 2.0 SUPPORT YES
STILL PICTURE SUPPORT YES
REPEAT/GUIDE/ANGLE/INFO YES
SUBTITLE YES
MP3,MP4,AVI SUPPORT YES
WMA YES
RMVB YES
Program FUNCTION NO

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REPEAT FUNCTION YES
SLOW NO
STEP NO
H.264 SUPPORT YES
RM,RMVB SUPPORT SUPPORTS UP TO SD
USB Update SW YES
4. Connectors and Electrical Parameters.
a) Connector Details:-
IR & Key Board Connector CNB9
NO. Symbol Function Voltages (Stand by) Voltages (ON condition)
1 GND GND 0 0
2 KEY_2 KEY VOLTAGE 3.2V 3.27V
3 GND GND 0 0
4 KEY_1 KEY VOLTAGE 2.57V 2.57V
5 LED_R LED VOLTAGE 0.024V 4.96V
6 5V_SB 5VSB SUPPLY 3.3V 3.3V
7 LED_G LED_G 2.8V 0.024V
8 IR IR Signal 3.2V 3.2V
Power Connector CN26
No Pin Connection Voltages (Stand by) Voltages (ON Condition)
1 12V 12V 12V
2 12V 12V 12V
3 GND 0V 0V
4 12V 12V 12V
5 GND 0V 0V
6 GND 0V 0V
7 5V 5.03V 5.03V
8 5V 5.03V 5.03V
9 5V_STB 5.08V 5.08V
10 GND 0V 0V
11 SW 3.6V 3.6V
12 GND 0V 0V
13 Back Light ON/OFF 0V 5V
14 Dimming Control 3.6V 3.6V

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Key Voltage Matrix
KEY VOLTAGE AD1 VOLTAGE AD2
VOL+
0.01
VOL- 1.02
CH+ 0.432
CH- 1.9V
MENU 1.03V
TV/AV 0.433V
STANDBY 0.01V
AUDIO OUTPUT CONN. CN14
NO. Symbol Function
1 L_OUT+ L_OUT+
2 GND GND
3 GND GND
4 R_OUT+ R_OUT+
LVDS PORT CNF1
No Pin Connection Voltages (Stand by) Voltages (ON Condition)
1 VCC 0V 12V (As per panel)
2 VCC 0V 12V (As per panel)
3 VCC 0V 12V (As per panel)
4 VCC 0V 12V (As per panel)
5 GND 0V 0V
6 GND 0V 0V
7 LVTX_A_CH0P 1.1V 1.1V
8 LVTX_A_CH0N 1.1V 1.1V
9 LVTX_A_CH1P 1.1V 1.1V
10 LVTX_A_CH1N 1.1V 1.1V
11 LVTX_A_CH2P 1.1V 1.1V
12 LVTX_A_CH2N 1.1V 1.1V
13 GND 0V 0V
14 GND 0V 0V
15 LVTX_A_CLKP 1.1V 1.1V
16 LVTX_A_CLKN 1.1V 1.1V
17 LVTX_A_CH3P 1.1V 1.1V
18 LVTX_A_CH3N 1.1V 1.1V
19 LVTX_A_CH4P 1.1V 1.1V
20 LVTX_A_CH4N 1.1V 1.1V
21 LVTX_B_CH0P 1.1V 1.1V

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22 LVTX_B_CH0N 1.1V 1.1V
23 LVTX_B_CH1P 1.1V 1.1V
24 LVTX_B_CH1N 1.1V 1.1V
25 GND 0V 0V
26 GND 0V 0V
27 LVTX_B_CH2P 1.1V 1.1V
28 LVTX_B_CH2N 1.1V 1.1V
29 LVTX_B_CLKP 1.1V 1.1V
30 LVTX_B_CLKN 1.1V 1.1V
31 GND 0V 0V
32 GND 0V 0V
33 LVTX_B_CH3P 1.1V 1.1V
34 LVTX_B_CH3N 1.1V 1.1V
35 LVTX_B_CH4P 1.1V 1.1V
36 LVTX_B_CH4N 1.1V 1.1V
37 3D_EN/AL 0V 0V
38 LVDS_SEL (Rotate) 3.3V (As per panel) 3.3V (As per panel)
39 NC NC NC
40 NC NC NC
a)Critical component list:-
COMPONENT DESCRIPTION LOCATION
1100043109 CAP,CER,Y5U,400VAC,1KPF,M,10MM
1100043114 DIODE,CHIP,SOT23,LBAV70LT1G,TP
1100043194 IC,OPTO-COUPLER,KP10101B/KPC817B,DIP-4
1100043197 VARISTOR,560V,25AMP,TVR10681KSY
1100043202 THERMISTER,NTC,SCK,6A,2.5E,M,7.5MM,L-5M
1100057520 C,CER,Y5P,1KV,2.2KPF,K,P5MM
1100093176 CAP,CER,275VAC,330KPF,K,15MM
1100098978 C,CER,Y5P,1KV,100PF,K,P5MM
1100105840 IC,CHIP,MQFN76,SiI9687ACNUC,HDMI SW
1100105843 IC,CHIP,SOP8,MX25L3206D/E M2I-12G,NEW
1100106737 C,ELCT,500V,100MFD,M,20X36,P10MM,105°CKM
1100106760 IC,CHIP,EPLQFP,128Pin,TSUMV59XUS-Z1
1100107706 IC,PWM,OB2273A,SOT23-6
1100111347 C,ELCT,250V,33MFD,M,13X20,P5MM,TP,105°C
1100111348 CAP,CBB21,450V,100KPF,K,10MM
1100111349 CAP,CBB21,450V,470KPF,K,15MM
1100111353 PFC INDUCTANCE,GL-2634WH-ER26
1100111354 DIODE,CHIP,DO-201AD,1N5408
1100111356 IC,SOP8,OB6561PCPA-PFC
1100111358 IC,CHIP,SOP8,TP358
1100111361 TRANS,N-MOS,650V/11A MMF60R360P,TO-220MF
1100111362 TRANS,N-MOSFET,650V/4A 4N65L,TO263
1100111363 TRANS,N-MOSFET,800V/8A 8N80-TF1,TO-220MF

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5. Panel information.
SCREEN SIZE
40" FHD
4
0
"
HD
LED / LED
98
cm TFT LCD /LED
98
cm TFT LCD /LED
Display Resolution
1920 x 1080
1366 X768
Viewing Angel
178(H), 178(V) Deg.
Lamp life time
50,000 Hours Minimum
Receiving System Anlog
PAL BG/I/DK
NTSC (3.58 / 4.43)In
playback only
Channel Coverage
VHF
-
2
-
12
UHF21-69
CATV(X
-
Z+2,S1
-
S41)
Power supply AC 110-240V, 50/60Hz
Antenna Input
Impedance 75 Ohms Unbalanced
Power Consumption
(TYP) 90W (115W MAX)
Audio Output (RMS) 10Watt x 2
Accessories
Remote
Handset, User Guid
e
Book
Power Cord (Optional)
Battery
UM
-
3, "AA" 1.5V (2no.)

6. SW INSTALLATION PROCEDURE
The ATV SW installation in B-Type V59 chassis can be done with USB in three
ways.
1.) SW Installation through USB in Set stand by condition.
2.) SW Installation throughUSB in Set ON condition.
3.) SW Installation through MST Tool.
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1Copy the SW (.bin) file in USB to root
directory.
2Rename the SW file name as
3Keep the TV set in Power OFF condition.
4Plug in the USB drive in USB port of the TV.
5 Turn ON the Mains power of TV set.
6Now after a few sec., RED LED indicator of TV will start blinking, indicating the SW is
loading.
7After a few sec. LED blinking will stop and SW loading is finished. Then follow below
steps.
A.) SW INSTALLATION THROUGH USB IN STAND BY CONDITION: -

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8After SW update, goto Design Menu by
Pressing MENU => AUDIO MENU => 8 5 3 2
9Go to Setup design menu and Select Clear
EEPROM option and press OK key of remote.
10 After Clear EEPROM, the set will go to stand by andwill againrestart automaticallyin RF
source.
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Then verify the modelwise Audio/ Video
settings asper Design data (inPLM). Verify
the SW date andversion in Version info in
Design data
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Then press Shipping in Setup designmenu by
pressing OK key of remote, after shippingset
then
Switch OFF the set from mainpower and
againSwitch ON. The SW loading process Is
complete.