SUSS MJB4 User manual

USER MANUAL
Mask Aligner
MJB4
Laboratory Mask Aligner
Rev07/ 05-10
www.suss.com

DISCLAIMER AND PUBLISHING DETAILS
DISCLAIMER I
i
Disclaimer and Publishing Details
Information provided within this document is subject to change without notice, and although believed to be
accurate, SUSS MicroTec assumes no responsibility for any errors, omissions, or inaccuracies.
The information included in this manual is SUSS MicroTec Proprietary Information and is provided for the
use of SUSS MicroTec’s customers only and cannot be used for distribution, reproduction, or sale without
the express written permission of SUSS MicroTec. This information may be incorporated into the user’s doc-
umentation, however any changes made by the user to this information is the responsibility of the user.
If you have any questions or remarks about this manual, please contact:
SUSS MicroTec Lithography GmbH
Schleißheimer Str. 90
D 85748 Garching
Tel.:[phone]
Fax: [phone]
www.suss.com
This manual is available in the following formats: Cleanroom Printed and CD-ROM.
Printed in Europe.

DISCLAIMER AND PUBLISHING DETAILS
II DISCLAIMER
i

C O N T E N T S
MJB4 - Contents Rev07 05-10 ORIGINAL DOCUMENTATION I
i
CONTENTS
PREFACE ...................................................................................................................a
1. WARNINGS and SAFETY PRECAUTIONS .........................................................1
1.1. Guidelines on Safety at Work .........................................................................1
1.2. Definition of Danger Advice and Warnings .....................................................1
1.3. Intended Use of this Machine .........................................................................1
1.4. Main Switch with Emergency Off Function .....................................................1
1.5. Dangers ..........................................................................................................2
1.5.1. Physical Dangers ..................................................................................2
1.5.2. Thermal Dangers ..................................................................................2
1.5.3. Electrical Dangers .................................................................................2
1.5.4. Radiation Danger ..................................................................................3
1.5.5. Danger of Poisoning ..............................................................................3
1.6. Working with the MJB4 Mask Aligner .............................................................3
1.6.1. Fitting, Changing and Cooling the Exposure Lamp ...............................4
1.6.2. Preparing the Machine for Working .......................................................5
1.6.3. Safety Checks .......................................................................................6
2. INSTALLATION and TRANSPORT ......................................................................7
2.1. Prerequisites for Installation ............................................................................7
2.1.1. Ambient Requirements ..........................................................................7
2.2. Transporting the Mask Aligner ......................................................................10
2.2.1. Warranty and Restrictions ...................................................................10
2.2.2. Receiving and Unloading the Machine ................................................10
2.2.3. Opening the Shipping Containers .......................................................10
2.2.4. Transport without a Pallet ...................................................................10
2.2.5. Transportation Locks ...........................................................................12
2.2.6. Taking the Machine out of Service ......................................................13
3. OPERATION OF THE MJB4 ...............................................................................15
3.1. Definitions .....................................................................................................16
3.1.1. Coordinate System ..............................................................................16
3.2. Controls and Displays ...................................................................................16
3.2.1. Alignment Stage ..................................................................................16
3.2.2. Display/Touch Screen .........................................................................17
3.2.3. Topside (TSA) Microscope Manipulator ..............................................18
3.2.4. TSA Microscope ..................................................................................18
3.2.5. Microscope Illumination .......................................................................19

CONTENTS
II ORIGINAL DOCUMENTATION MJB4 - Contents Rev07 05-10
i
3.2.6. Lamp House ........................................................................................20
3.2.7. Basic Pneumatic Settings ....................................................................20
3.3. Main Screens and Menu Navigation .............................................................22
3.4. Operating Sequences ...................................................................................25
3.4.1. Switching the Machine On/Off .............................................................25
3.4.2. Switching On and Calibrating the Exposure Lamp ..............................26
3.4.3. Setting the Parameters ........................................................................26
3.4.4. Saving and Loading Programs ............................................................27
3.4.5. Loading the Mask ................................................................................28
3.4.6. Loading the Substrate .........................................................................28
3.4.7. Setting the Mask Substrate Thickness ................................................28
3.4.8. Wedge Error Compensation Pressure ................................................29
3.4.9. Wedge Error Compensation (WEC) ....................................................29
3.5. Substrate Alignment with the Top Side Microscope ......................................29
3.5.1. Setting the Exposure Values ...............................................................29
3.5.2. Loading the Mask ................................................................................29
3.5.3. Loading the Substrate .........................................................................29
3.5.4. Adjusting the Microscope ....................................................................30
3.5.5. Aligning the Substrate .........................................................................30
3.5.6. Exposure .............................................................................................31
3.5.7. Unloading the Mask .............................................................................31
3.6. Substrate Alignment with IR Illumination .......................................................31
3.6.1. Incident Light .......................................................................................31
3.6.2. Transmitted Light .................................................................................33
3.7. Exposure Programs ......................................................................................34
3.7.1. Distance Exposure ..............................................................................34
3.7.2. Soft Contact Exposure ........................................................................34
3.7.3. Hard Contact Exposure .......................................................................34
3.7.4. Vacuum Contact Exposure ..................................................................34
3.7.5. Low Vacuum Contact Exposure ..........................................................35
3.7.6. Flood Exposure ...................................................................................35
3.7.7. Test Exposure .....................................................................................35
3.7.8. Multiple Exposure ................................................................................35
3.8. Step-by-Step Machine Operation ..................................................................36
3.8.1. Selecting exposure program, e.g., soft contact ...................................36
3.8.2. Programs .............................................................................................37
3.8.3. Loading, Aligning and Exposing the Substrate ....................................38
4. SPECIALS ............................................................................................................39
4.1. Nano Imprint Lithography - NIL .....................................................................39

C O N T E N T S
MJB4 - Contents Rev07 05-10 ORIGINAL DOCUMENTATION III
i
5. MAINTENANCE ...................................................................................................47
5.1. Parameter Ranges and Default Settings ...................................................... 47
5.2. Service Information .......................................................................................48
5.2.1. Overview .............................................................................................49
5.3. Lock-Out / Tag-Out Checklist ........................................................................54

CONTENTS
IV ORIGINAL DOCUMENTATION MJB4 - Contents Rev07 05-10
i

PREFACE
MJB4 - PREFACE Rev06 10-09 a
PREFACE
The MJB4 Mask Aligner is a precision instrument for
high-resolution photolithography and is intended for
use in research laboratories, small-series production
and pilot projects.
The flexibility of the MJB4 is unsurpassed when
exposing standard wafers and substrates and
irregularly shaped substrates with a diameter of up
to 100 mm or 4"x 4" and various thicknesses.
The MJB4 Mask Aligner is a state-of-the-art
instrument. The MJB4 combines proven and newly
developed technology for adjusting wafers,
fragments of wafers and substrates.
Different versions of the aligner are available.
A single field microscope and a splitfield
microscope, which can also be equipped with an
optional video system, are available for adjusting the
top side. IR adjustment is available for both
microscopes.
These microscopes were developed from the
successful SUSS MJB3 Mask Aligners, which were
the international leaders among these types of
instruments for over 3 decades.

PREFACE
bMJB4 - Preface Rev06 10-09