SUSS MJB4 User manual

USER MANUAL
Mask Aligner
MJB4
Laboratory Mask Aligner
Rev07/ 05-10
www.suss.com

DISCLAIMER AND PUBLISHING DETAILS
DISCLAIMER I
i
Disclaimer and Publishing Details
Information provided within this document is subject to change without notice, and although believed to be
accurate, SUSS MicroTec assumes no responsibility for any errors, omissions, or inaccuracies.
The information included in this manual is SUSS MicroTec Proprietary Information and is provided for the
use of SUSS MicroTec’s customers only and cannot be used for distribution, reproduction, or sale without
the express written permission of SUSS MicroTec. This information may be incorporated into the user’s doc-
umentation, however any changes made by the user to this information is the responsibility of the user.
If you have any questions or remarks about this manual, please contact:
SUSS MicroTec Lithography GmbH
Schleißheimer Str. 90
D 85748 Garching
Tel.:[phone]
Fax: [phone]
www.suss.com
This manual is available in the following formats: Cleanroom Printed and CD-ROM.
Printed in Europe.

DISCLAIMER AND PUBLISHING DETAILS
II DISCLAIMER
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C O N T E N T S
MJB4 - Contents Rev07 05-10 ORIGINAL DOCUMENTATION I
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CONTENTS
PREFACE ...................................................................................................................a
1. WARNINGS and SAFETY PRECAUTIONS .........................................................1
1.1. Guidelines on Safety at Work .........................................................................1
1.2. Definition of Danger Advice and Warnings .....................................................1
1.3. Intended Use of this Machine .........................................................................1
1.4. Main Switch with Emergency Off Function .....................................................1
1.5. Dangers ..........................................................................................................2
1.5.1. Physical Dangers ..................................................................................2
1.5.2. Thermal Dangers ..................................................................................2
1.5.3. Electrical Dangers .................................................................................2
1.5.4. Radiation Danger ..................................................................................3
1.5.5. Danger of Poisoning ..............................................................................3
1.6. Working with the MJB4 Mask Aligner .............................................................3
1.6.1. Fitting, Changing and Cooling the Exposure Lamp ...............................4
1.6.2. Preparing the Machine for Working .......................................................5
1.6.3. Safety Checks .......................................................................................6
2. INSTALLATION and TRANSPORT ......................................................................7
2.1. Prerequisites for Installation ............................................................................7
2.1.1. Ambient Requirements ..........................................................................7
2.2. Transporting the Mask Aligner ......................................................................10
2.2.1. Warranty and Restrictions ...................................................................10
2.2.2. Receiving and Unloading the Machine ................................................10
2.2.3. Opening the Shipping Containers .......................................................10
2.2.4. Transport without a Pallet ...................................................................10
2.2.5. Transportation Locks ...........................................................................12
2.2.6. Taking the Machine out of Service ......................................................13
3. OPERATION OF THE MJB4 ...............................................................................15
3.1. Definitions .....................................................................................................16
3.1.1. Coordinate System ..............................................................................16
3.2. Controls and Displays ...................................................................................16
3.2.1. Alignment Stage ..................................................................................16
3.2.2. Display/Touch Screen .........................................................................17
3.2.3. Topside (TSA) Microscope Manipulator ..............................................18
3.2.4. TSA Microscope ..................................................................................18
3.2.5. Microscope Illumination .......................................................................19

CONTENTS
II ORIGINAL DOCUMENTATION MJB4 - Contents Rev07 05-10
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3.2.6. Lamp House ........................................................................................20
3.2.7. Basic Pneumatic Settings ....................................................................20
3.3. Main Screens and Menu Navigation .............................................................22
3.4. Operating Sequences ...................................................................................25
3.4.1. Switching the Machine On/Off .............................................................25
3.4.2. Switching On and Calibrating the Exposure Lamp ..............................26
3.4.3. Setting the Parameters ........................................................................26
3.4.4. Saving and Loading Programs ............................................................27
3.4.5. Loading the Mask ................................................................................28
3.4.6. Loading the Substrate .........................................................................28
3.4.7. Setting the Mask Substrate Thickness ................................................28
3.4.8. Wedge Error Compensation Pressure ................................................29
3.4.9. Wedge Error Compensation (WEC) ....................................................29
3.5. Substrate Alignment with the Top Side Microscope ......................................29
3.5.1. Setting the Exposure Values ...............................................................29
3.5.2. Loading the Mask ................................................................................29
3.5.3. Loading the Substrate .........................................................................29
3.5.4. Adjusting the Microscope ....................................................................30
3.5.5. Aligning the Substrate .........................................................................30
3.5.6. Exposure .............................................................................................31
3.5.7. Unloading the Mask .............................................................................31
3.6. Substrate Alignment with IR Illumination .......................................................31
3.6.1. Incident Light .......................................................................................31
3.6.2. Transmitted Light .................................................................................33
3.7. Exposure Programs ......................................................................................34
3.7.1. Distance Exposure ..............................................................................34
3.7.2. Soft Contact Exposure ........................................................................34
3.7.3. Hard Contact Exposure .......................................................................34
3.7.4. Vacuum Contact Exposure ..................................................................34
3.7.5. Low Vacuum Contact Exposure ..........................................................35
3.7.6. Flood Exposure ...................................................................................35
3.7.7. Test Exposure .....................................................................................35
3.7.8. Multiple Exposure ................................................................................35
3.8. Step-by-Step Machine Operation ..................................................................36
3.8.1. Selecting exposure program, e.g., soft contact ...................................36
3.8.2. Programs .............................................................................................37
3.8.3. Loading, Aligning and Exposing the Substrate ....................................38
4. SPECIALS ............................................................................................................39
4.1. Nano Imprint Lithography - NIL .....................................................................39

C O N T E N T S
MJB4 - Contents Rev07 05-10 ORIGINAL DOCUMENTATION III
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5. MAINTENANCE ...................................................................................................47
5.1. Parameter Ranges and Default Settings ...................................................... 47
5.2. Service Information .......................................................................................48
5.2.1. Overview .............................................................................................49
5.3. Lock-Out / Tag-Out Checklist ........................................................................54

CONTENTS
IV ORIGINAL DOCUMENTATION MJB4 - Contents Rev07 05-10
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PREFACE
MJB4 - PREFACE Rev06 10-09 a
PREFACE
The MJB4 Mask Aligner is a precision instrument for
high-resolution photolithography and is intended for
use in research laboratories, small-series production
and pilot projects.
The flexibility of the MJB4 is unsurpassed when
exposing standard wafers and substrates and
irregularly shaped substrates with a diameter of up
to 100 mm or 4"x 4" and various thicknesses.
The MJB4 Mask Aligner is a state-of-the-art
instrument. The MJB4 combines proven and newly
developed technology for adjusting wafers,
fragments of wafers and substrates.
Different versions of the aligner are available.
A single field microscope and a splitfield
microscope, which can also be equipped with an
optional video system, are available for adjusting the
top side. IR adjustment is available for both
microscopes.
These microscopes were developed from the
successful SUSS MJB3 Mask Aligners, which were
the international leaders among these types of
instruments for over 3 decades.

PREFACE
bMJB4 - Preface Rev06 10-09

WARNINGS AND SAFETY PRECAUTIONS
MJB4 - Warnings and Safety Rev07 05-10 1
1
1. WARNINGS AND SAFETY PRECAUTIONS
1.1. Guidelines on Safety at
Work
This machine has been developed and manufac-
tured in compliance with the current safety regula-
tions and standards.
This operating manual should be read before using
the mask aligner. It contains all the information re-
quired for the safe and correct use of the machine.
Other operating manuals included with this manual
must also be read, for power supplies CIC1200,
CPC200 and CPC350.
As a further precaution against accidents, the oper-
ating and service personnel should be trained and
instructed on delivery and at regular intervals, other-
wise communication problems and mis-interpreta-
tion of the operating manual can lead to injury to the
operator.
SUSS MicroTec cannot accept any responsibility for
physical injury or damage to the machine which re-
sults from incorrect use of this machine and failure
to follow these safety instructions.
Attention!
The instructions in this operating man-
ual are only intended for qualified per-
sonnel. The machine may only be
operated by persons who are autho-
rized and trained to do so!
1.2. Definition of Danger
Advice and Warnings
The dangers which can possibly arise during opera-
tion of this machine as well as appropriate precau-
tionary measures and recommended procedures
are described in this section of the manual - as well
as in warnings which are applied to the machine or
its assemblies or in some cases to the packaging.
Both types of warning must be understood and ob-
served by the MJB4 operator of the machine. Warn-
ings are normally divided into
• a description of the possible hazard
• directions on avoidance of the danger or on the
correct procedure to be followed in the event of
danger.
A warning or instruction symbol appears next to the
warning.
Warnings on the machine also include the key words
Danger or Warning:
• "Danger" indicates a potentially serious risk to
life,
• "Warning" indicates a risk of injury.
1.3. Intended Use of this
Machine
The machine is exclusively intended for use as an
alignment and/or exposure device for substrates
used in semiconductor and micro system technolo-
gy.
Any other form of use must be agreed on with SUSS
MicroTec Lithography's Engineering Product Sup-
port department. In the event of contravention,
SUSS MicroTec accepts no liability either for mal-
function or for personal injury.
1.4. Main Switch with
Emergency Off Function
The machine has a main switched combined with an
emergency off function. If the switch is turned to
OFF, the machine is immediately cut off from the
power supply network, the exposure lamp goes off,
and the upper microscope pivots upwards. The
switch is signal red and is located on the left front
plate.

WARNINGS AND SAFETY PRECAUTIONS
2MJB4 - Warnings and Safety Rev07 05-10
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Attention!I
In case of danger, turn the main switch
to OFF!
Warning!
The upper microscope pivots upwards.
To begin operating the machine again, the main
switch must be turned to ON and the machine must
be restarted.
1.5. Dangers
1.5.1. Physical Dangers
Moving machine parts such as the alignment station,
microscopes and their manipulators, the mirror
housing and others can cause injury to the operator.
You should take particular care of the movements of
the microscope if your machine is equipped with the
direct microscope view finder.
Warning!
Moving machine parts can injure the
fingers or face.
Do not remove any materials from the
machine until all machine movements
have stopped!
Warning!
With a machine equipped with a vibra-
tion-damped table, the base plate can
sink without warning in the event of a
drop in pressure in the compressed air
supply.
Never place the hands between the
base plate and the vibration-damped
table of the machine!
Warning!
The movement of a direct viewfinder
can cause injury to the eyes or face.
Stop looking into the microscope view-
finder before you start the microscope
movement!
Caution!
The machine warns by a beep prior to
microscope movements in upward or
forward direction. When the beep
sounds, back off from the microscope
immediately!
Danger!
A particular danger results from the
fragments thrown out in the event of a
lamp explosion!
Situations which can lead to a lamp ex-
plosion are described in a separate
section.
You should also be aware of the risk of
poisoning with Hg following a lamp ex-
plosion; this is also described in a sep-
arate section.
1.5.2. Thermal Dangers
The upper side of the lamp house gets very hot dur-
ing operation.
Operating temperatures of several hundred °C occur
on the lamp itself.
The lamp cooling must be correctly adjusted accord-
ing to the lamp type!
Warning!
There is a risk of lamp explosion if the
lamp house is opened prematurely
while the lamp is hot.
The exposure lamp has to cool down
for at least 20 minutes before the lamp
house door is opened!
The controlled cooling required for
more powerful lamp types must also be
left in operation during the cooling
phase!
1.5.3. Electrical Dangers
Live parts may be exposed when the machine cover
is removed.
High wattages and currents of up to 50 A can occur
in the lamp and lamp power supply.
The lamp starting voltage can be up to 30 kV.

WARNINGS AND SAFETY PRECAUTIONS
MJB4 - Warnings and Safety Rev07 05-10 3
1
Danger!
Do not open the machine until the
whole machine has been isolated from
the power supply!
Pay attention to this warning symbol on
covers!
Where applicable, observe local "log
out - tag out" regulations!
The individual electrical assemblies, especially bal-
lasts CIC1200, CPC200 and CPC350, contain no
parts which the user could repair or adjust.
1.5.4. Radiation Danger
The high luminous density of the exposure lamp can
cause eye damage.
In particular, the invisible ultraviolet component of
the light can lead to permanent eye damage or skin
burns.
Warning!
UV light can permanently damage your
eyes.
Covers over the ray path may not be re-
moved while the UV lamp is switched
on!
Lamp adjustment work may only be
carried out with UV-protective goggles
- also with skin protection in the case of
intensive radiation!
Light measurements on the exposure
chuck also require the use of UV-pro-
tective goggles.
UV-protective goggles must carry a marking indicat-
ing the protection class. The color of the goggles
provides no indication of their protective effect!
Warning!
The lamps of the microscope illumina-
tion provide light of high intensity. Es-
pecially exposure to the concentrated
light from the optical fibers may cause
eye injuries or skin irritations.
Do not activate the illumination light
while not completely covered and all
light paths and optical fibers are in
place and secured. Do not peer directly
to the light source - in particular not a
the end of a fiber.
1.5.5. Danger of Poisoning
1.5.5.1. Mercury Fumes following Lamp
Breakage
The biggest danger following a lamp explosion or
lamp breakage lies in the inhalation of the toxic mer-
cury fumes. Mercury can cause acute and chronic
poisoning.
Note:
The EU safety data sheets can be found in the
Appendix and must be read.
Advice on minimizing health risks following a lamp
explosion:
• Leave the lamp house exhaust switched on (with
powerful lamps)!
• Leave the contaminated room immediately!
• Ventilate the room well for at least 30 minutes!
• Do not open the lamp house for the time being.
Allow the interior of the lamp house to cool down
for at least 1 hour!
• Carry out lamp house decontamination using an
appropriate decontamination agent (see section
on changing the exposure lamp)!
• Follow the general and national safety regula-
tions relating to Hg!
• A doctor should be consulted immediately if there
is a possibility of mercury fumes having been in-
haled!

WARNINGS AND SAFETY PRECAUTIONS
4MJB4 - Warnings and Safety Rev07 05-10
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1.5.5.2. Generation of Ozone during the
Operation of the Lamp
Short-wavelength ultraviolet light can ionize the at-
mospheric oxygen.
An exposure lamp therefore generates ozone during
operation.
Long-term and intensive exposure to ozone can lead
to damage to the respiratory organs.
Warning!
Where powerful lamps or special lamps
for deep-UV are used, additional ex-
traction and controlled cooling by
means of nitrogen flushing should be
ensured (see setting tables)!
If the stipulated settings are applied correctly, the
ozone concentration in the area surrounding the
lamp house should remain well below the permissi-
ble limit.
1.6. Working with the MJB4
Mask Aligner
Only SUSS MicroTec employees or qualified and
trained staff may service the machine.
Danger!
The operating and starting voltages in
high-pressure lamps are deadly dan-
gerous!
The machine must be switched off be-
fore beginning servicing work on the
lamp house or other electrical compo-
nents!
1.6.1. Fitting, Changing and Cool-
ing the Exposure Lamp
When working with high-pressure lamps, the appro-
priate safety regulations and service life specifica-
tions of the lamp manufacturer must be observed.
Hg-filled UV high-pressure lamps must be changed
once the service life specified by the manufacturer
has expired. There is an increased risk of lamp ex-
plosion after this date!
Premature failure of a lamp can be the result of in-
correct lamp cooling (too powerful or too weak), in-
correct power setting, soiling of the lamp tube or
similar.
Exposure lamps should only be handled with gloves.
Clean any grease marks with alcohol!
1.6.1.1. Danger of Lamp Explosion
If the Hg high-pressure lamps are operated accord-
ing to their specification (type selection on CIC, cool-
ing, min/max power, service life), lamp explosions
during operation are extremely rare.
The exposure lamp should always be protected
against shock when handling - the lamps should al-
ways be stored and transported in their original
packaging!
Any other mechanical stress such as bending or
twisting during installation should also be carefully
avoided!
Warning!
The exposure lamp is under high pres-
sure.
Mechanical face and eye protection
should be worn when handling a high-
pressure lamp!
If the lamp breaks, do not touch the
components with the hand and do not
inhale the Hg fumes!
Use a breathing mask with gas absorp-
tion during decontamination!
In the event of a lamp explosion, after the immediate
measures described in section Danger of poisoning
an Hg decontamination kit (e.g Mercurisorb) should
be used to eliminate the mercury which is still
present. Such a kit should always be kept in store.
These can be obtained, for example, from:
Carl Roth GmbH & Co
P.O. Box 100121
D-76231 Karlsruhe
http://www.carl-roth.de

WARNINGS AND SAFETY PRECAUTIONS
MJB4 - Warnings and Safety Rev07 05-10 5
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1.6.1.2. Changing the Lamp
Only use lamps of a type approved for use by SUSS
MicroTec Lithography!
Caution!
In almost all exposure lamps, the anode
(positive pole) is at the bottom.
Only the 500W DUV Hg/Xe lamp (Ushio)
position is reversed.
After changing the lamp type or replac-
ing a CIC1200, CPC200 or CPC350 it is
essential to check the correct polarity
of the lamp and correct type selection
on the CIC1200 before switching on the
lamp!
Always follow the lamp manufacturer's directions!
When fitting or removing the lamp, avoid any me-
chanical load acting on the glass tube! Only tighten
the lamp by hand!
Pay attention to the correct handling of different
lamp mountings (depending on the lamp house
type) - see Servicing section in the manual!
Connect the connection contacts on the lamp in
such a way that electrical contact resistances are
minimized. Replace all components which show
traces of corrosion or overheating!
1.6.1.3. Setting Regulations for Lamp
Cooling
The UV-exposure lamps must be cooled in a con-
trolled way in order to maintain safe and optimum
operating conditions. The cooling should be set up
individually according to the lamp type.
Detailed values for the lamp cooling and the vol-
ume flow which needs to be extracted for differ-
ent lamps can be found in the table "Setting
values for lamp cooling and lamp house extrac-
tion" in section 2.1. "Prerequisites for Installa-
tion".
The basic components of the cooling are:
• Blowing of nitrogen onto the metallic lamp cap
(but never the glass tube),
• Blowing of compressed air into a heat sink (for ra-
diation of heat) in the lamp house.
The lamp-specific values both for the adjustment of
the blowing of nitrogen onto the upper and lower
lamp caps and also for the extraction should be ob-
served.
Significant deviations from the setting values endan-
ger your safety!
Minor deviations affect the operating safety of the
lamp and machine.
If a lamp frequently illuminates in an unstable man-
ner, or of the life of the lamp has systematically de-
teriorated, carefully check the settings for the lamp
cooling. Frequently, the cause of such problems lies
in incorrect setting of these data or in incorrect fixing
of the connections. If you are not sure, call in SUSS
MicroTec's service to carry out a check!
Note!
In addition, in order to achieve good exposure
results, the evenness of the light should be ad-
justed after fitting a new lamp.
1.6.1.4. Lamp Housing Extraction
As a rule, no suction is required for 200W and 350W
lamps.
Ozone extraction from the lamp housing must be en-
sured for the 500W DUV Hg/Xe lamp in the 350W
lamp housing to avoid health risk. Add-on kit item no.
189553 is required for this purpose.
Detailed values can be found in the table "Set-
ting values for lamp cooling and lamp house ex-
traction" in section 2.1. "Prerequisites for
Installation".
1.6.1.5. Disposal
Used lamps should also only be stored and trans-
ported in the original protective packaging!
UV high-pressure lamps contain up to 1g of highly-
toxic mercury.
These lamps should therefore be treated as special-
category waste.
Local regulations on disposal should be observed.
It is possible to return the lamps to the supplier or
manufacturer.

WARNINGS AND SAFETY PRECAUTIONS
6MJB4 - Warnings and Safety Rev07 05-10
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1.6.2. Preparing the Machine for
Working
Check that the vibration-insulated table (if present)
is working.
Caution!
In the event of a loss of pressure, the ta-
ble can drop and trap your fingers!
1.6.2.1. Preparing to Switch ON
The following instructions assume that the mask
aligner has been correctly installed and that the ma-
chine has been connected to the power supply net-
work by switching on the main power switch.
The following pressure values should be present on
the machine:
• Compressed air
5,5 - 7 bar (COMPRESSED AIR)
• Nitrogen
2 - 3 bar (NITROGEN)
• Vacuum
-0.8 bar (means 0.2 bar absolute (VACUUM))
Caution!
When CDA supply is being pressurized
the microsope will rise to its upper rest-
ing position immediately.
1.6.2.2. Configuration of MJB4 after
Maintenance or Service
Caution!
The moveable front tube of the mirror
house shall be adjusted so that there is
no gap visible between the front tube
and the fixed rear tube in order to avoid
pinch points and UV light leaking.
1.6.3. Safety Checks
The important safety functions of the machine
should be checked for safe functioning at regular in-
tervals - i.e at least every three months.
This applies as long as the check itself does not rep-
resent a hazard.
The following should be tested:
• that the machine stops immediately and the mi-
croscope moves up if the main switch is posi-
tioned to OFF.
• acoustic warning signal by the power supply unit
in the event of a failure in the nitrogen supply -
only very brief for test purposes!

INSTALLATION AND TRANSPORT
MJB4 - Installation and Transport Rev07 05-10 7
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2. INSTALLATION AND TRANSPORT
Containers must be opened and the machine must
be transported and installed by a SUSS MicroTec
service technician or person authorized by SUSS
MicroTec.
Users who open containers with system compo-
nents or install or transport the machine without a
SUSS MicroTec technician or a person authorized
by SUSS MicroTec do so at their own risk.
Power connections and supply connections (com-
pressed air, nitrogen, etc.) at the installation site
must be completely installed by the customer before
installation so the machine can be connected.
2.1. Prerequisites for Installa-
tion
The following installation prerequisites must be met
before the machine can be operated optimally:
2.1.1. Ambient Requirements
• The machine must be installed on a vibration-free
surface since vibrations can negatively influence
the machine’s function.
--> We recommend setting up the machine on a
SUSS MicroTec vibration-insulated base
frame intended for this purpose.
• The machine must be installed in a clean room.
Impurities in the air have negative effect on the
machine’s function.
--> We recommend clean room class 1000 or
better.
• The room temperature and relative humidity
should be controlled at the setup site.
--> We recommend a room temperature
between 20°C (68°F) and 22°C (72°F) and a
relative humidity between 45 and 55% (not
condensing).
• When planning the working area for the operator,
allow sufficient dorsal space. The microscope
moves forward for the exposure, therefore the
operator must have adequate space to back off
from the machine.
• The back of the machine must be at least 10 cm
(4 in) away from the room wall. See the figure “Di-
mensions of the MJB4 Mask Aligner:” for the ex-
act dimensions of the aligner.
--> We recommend a distance of 30cm (12in).
Dimensions of the MJB4 Mask Aligner:
Width: 603 mm
Depth: 760 mm
Height: 658 mm
1400 mm (with base)
Weight: approx. 150 kg MJB4
160 kg base

INSTALLATION AND TRANSPORT
8MJB4 - Installation and Transport Rev07 05-10
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Power Data:
Specifications for Automatic Circuit Breakers:
Supply Media:
The machine has connections for pneumatic hoses
with a 6mm outer diameter or connections for pneu-
matic hoses with a 1/4 inch outer diameter. Hose
couplings for supply media connections are not in-
cluded.
Standard with
CPC200:
300 VA ; 230 V AC ±10% ;
50/60 Hz
Standard with
CPC350:
500 VA ; 230 V AC ±10% ;
50/60 Hz
Standard with
CIC1200:
1200 VA ; 230 V AC ±10% ;
50/60 Hz
Power overview: CPC200 = 300 VA
CPC350 = 500 VA
CIC1200 = 1200 VA
Machine = 250 VA
Ext. power =250 VA (standard)
Max. connected load = 16 A
Power cord: grounded 3-wire cable;
3.0 m
V(AC) input 1
1. The CIC1200 only works with 230 V (AC) current
100-240
F1(A) Main Power 7.5
F2(A) Ext. Power 7,5
F3(A) Lamp Power
Supply 7,5
F4(A) Electronics 4
Nitrogen: ca. 1.5bar, 30 - 45 psi;
Consumption: Depends on lamp model; see
table 1.
! Warning ! Use dry nitrogen only
Water, oil and dust particles
must be removed from the
compressed air supply
system.
Vacuum: -0.8 bar manometer reading
(equals 0.2 bar absolute)
Compressed air:
Without base: ca. 5.5 bar, 75 psi
With base: ca. 7.0 bar, 105 psi
Consumption: ca. 1.0 m3/h, 35 scf/h
Table 1: Settings for lamp cooling and lamp housing extraction
Notes
Exposure lamp [W] 200
Osram
350
Osram
350
Ushio
500
Ushio
Nitrogen
Main pressure
[bar] 1.5 1.5 1.5 1.5
Nitrogen lower lamp
base
[l/h] 180 180 180 220 Must be set by
service technician
Nitrogen upper lamp
base
[l/h] - - - 220 Must be set by
service technician
Nitrogen
Shutter
[l/h] 260 260 260 260 Must be set by
service technician
Diameter of exhaust
on bottom
[mm] closed closed closed 100
required
needs adapter tube
outlet temp.< 60°C
Notes reduced
DUV+Ozone
for DUV appl.
REVERSED
polarity!

INSTALLATION AND TRANSPORT
MJB4 - Installation and Transport Rev07 05-10 9
2
Lamps that can be used:
• HG 200 W/2 - PN: 146 051
(additional lamp adapter required, item no.:
189336)
• HBO 350 W-S - PN: 146 049
• USH 350 DS - PN: 182 538
UXM 501 MD - PN: 148 979
(additional lamp adapter required, item no.: 202485)
Connections at MJB4 rear
1 Nitrogen
2CDA
3 Vacuum
4 Outgoing air
5 F2 - Lamp Power Supply
6 F3 - External Power
7 Main Power
8 External Power
9 Lamp Power Supply
10 External Power
2
3
5
6
7
8
9
10
1
4

INSTALLATION AND TRANSPORT
10 MJB4 - Installation and Transport Rev07 05-10
2
2.2. Transporting the Mask
Aligner
Special safety precautions must be taken to protect
the Mask Aligner from damage before it can be
transported.
The machine must be transported and installed by a
SUSS MicroTec service technician or person
authorized by SUSS MicroTec.
Users who transport the machine without a SUSS
MicroTec service technician or a person authorized
by SUSS MicroTec do so at their own risk.
2.2.1. Warranty and Restrictions
Devices are delivered with a 12-month warranty.
This warranty also applies to material included with
the machine and working quality of the machine.
This warranty can vary in individual cases due to
different national laws in other parts of the world, for
example. The warranty for this machine is included
in the attached documents.
The warranty is limited to:
• Equipment and material unpacked and installed
by a SUSS MicroTec service technician
• Equipment and material used according to the
instructions in the operating manual
• Equipment and material that is maintained and
handled carefully and as indicated in the
instructions
This warranty does not cover:
• Damage caused while transporting the machine
(damage must be shown to the shipping
company)
• All parts subject to normal wear and tear (e.g.
exposure lamps, exposure masks, microscope
lights, etc.)
2.2.2. Receiving and Unloading
the Machine
• Persons must never stand under suspended
loads!
• Check the number of shipping containers
• Observe the transport instructions on the
shipping container
• Never tilt or hit shipping containers
• Check shipping packaging for traces of damage
due to shipping
• (tilt indicator, impact indicator)
• Inform SUSS MicroTec and the shipper
immediately if any damage is detected
• If necessary, the machine must be stored in a
dry, heated room
2.2.3. Opening the Shipping Con-
tainers
• If shipping damage is suspected, do not open
containers until a SUSS MicroTec service
technician or a person authorized by SUSS
MicroTec is present. If clear damage is detected,
call in an average adjuster or an insurance claims
adjuster.
• Unpack the machine only in the presence of a
SUSS MicroTec service technician or person
authorized by SUSS MicroTec.
• Do not lift the machine from the pallet until the
sides of the container and machine fixings have
been removed.
• Check all accessory parts against the packing
slip.
• Store packing material for reshipment or return
shipment.
• If you would like to return packaging material, you
must make arrangements with the appropriate
SUSS MicroTec representative.
2.2.4. Transport without a Pallet
• The relevant safety and shipping conditions in
force must be observed for transport
• Persons must never stand under suspended
loads!
• Leave the cover above the machine until the
machine has reached the intended location
• Do not, under any circumstances, loosen the
machine’s transport locks before the machine
has reached the intended location
• Lifting the machine by placing a forklift directly
beneath the bare base plate causes a serious
slip hazard
• Avoid tilting the machine beyond 10° when