TDK AN-000300 Installation manual

AN-000300
InvenSense, Inc. reserves the right to change
specifications and information herein without
notice unless the product is in mass production
and the application note has been designated by
InvenSense in writing as subject to a specified
Product / Process Change Notification Method
regulation.
InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A
[phone]
invensense.tdk.com
Document Number: AN-000300
Revision: 1.1
Date: 12/12/2022
SmartMotion Platform Ver. G
Hardware User Guide

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TABLE OF CONTENTS
Overview................................................................................................................................................................3
Introduction...........................................................................................................................................................4
2.1. Features Overview............................................................................................................................................4
2.2. Platform Overview............................................................................................................................................4
2.3. Hardware User Guide .......................................................................................................................................4
Sensors and Development Kits ..............................................................................................................................5
3.1. TDK Sensor to SAMG55 MCU Connection ........................................................................................................5
3.2. Magnetic Sensors Connection ..........................................................................................................................9
The Smartmotion System Design.........................................................................................................................10
4.1. System Block Diagram ....................................................................................................................................10
4.2. Main MCU SAMG55 Resource Allocation.......................................................................................................10
4.3. Connectors .....................................................................................................................................................11
4.4. Jumper Settings ..............................................................................................................................................11
Schematics and Board PCB ..................................................................................................................................12
5.1. Schematics......................................................................................................................................................12
5.2. Board PCB.......................................................................................................................................................15
Revision History ...................................................................................................................................................16
Declaration Disclaimer.........................................................................................................................................17

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OVERVIEW
The TDK SmartMotion Platform Ver. G is a comprehensive development system for TDK InvenSense Motion Sensor
devices. The platform designed around the Microchip SAMG55 MCU can be used by customers for rapid evaluation
and development of InvenSense sensor-based solutions. The platform integrates an on-board Embedded Debugger
so external tools are not required to program or debug with the SAMG55 MCU. Each InvenSense motion sensor
has its own unique development kit. Their DK numbers are listed in this document.
The SmartMotion platform comes with the necessary software including InvenSense Motion Link, a GUI based
development tool and embedded Motion Drivers (eMD) for InvenSense motion sensors.
Embedded Motion Drivers (eMD) consist of a set of APIs to configure various aspects of the platform including
motion sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise mode,
and sensor interface to host (I2C, SPI). eMDs will also provide the following enhanced motion functions that run on
the MCU:
•Sensor Fusion
•Accelerometer and Gyroscope Calibration
•Android Functions: Game Rotation Vector, Gravity, Linear Acceleration
Motion Link is a GUI based development tool included with the platform. It can be used to capture and visualize
the sensor data from the motion sensor.
The platform supports Atmel Studio and is compatible with Microchip Xplained Pro Extension boards. Xplained Pro
extension series evaluation kits offer additional peripherals to extend the features of the board and ease the
development of customer designs.

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INTRODUCTION
2.1. FEATURES OVERVIEW
•Integrated TDK InvenSense motion sensor
•Support for a magnetic sensor with plug in daughter boards (DB)
•Microchip SAMG55 microcontroller with 512 KB Flash
•On-board Embedded debugger (EDBG) for programming and debugging
•Built in FTDI USB to UART interface for fast motion sensor data transfer
•USB Connectors for host interface to software debug and data logging
•Board Power Supply through USB
2.2. PLATFORM OVERVIEW
The TDK SmartMotion Platform Ver. G is a hardware unit for TDK sensor product evaluation and algorithm
software development. The platform offers support for many different application developments. The board
shown below is the DK-20670 board (with TDK sensor in slot U2).
Figure 1. The SmartMotion Platform Overview
2.3. HARDWARE USER GUIDE
The TDK SmartMotion Platform Ver. G is compatible with Microchip’s SAM G55 Xplained Pro for updating and
flashing the firmware. The link to the Atmel Xplained Pro user guide is here:
http://www.atmel.com/Images/Atmel-42389-SAM-G55-Xplained-Pro_User-Guide.pdfTo set up board, click on
Device Programming (Ctrl + Shift + P) and select EDBG as the Tool.

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SENSORS AND DEVELOPMENT KITS
3.1. TDK SENSOR TO SAMG55 MCU CONNECTION
The TDK SmartMotion Platform Ver. G supports multiple types of TDK IMUs and pressure sensors. Table 1 lists the
TDK Sensor Development Kit (DK) ordering information.
SUPPORTED SENSOR
DK PART NUMBER
SENSOR U# SLOT
ICP-20100
DK-20100
U3
IIM-20670
DK-20670
U2
ICM-40627
DK-40627
U1
IIM-42351
DK-42351
U1
IIM-42352
DK-42352
U1
IIM-42652
DK-42652
U1
IIM-42653
DK_IIM-42653
U1
ICM-42670-P
DK-42670-P
U1
ICM-42686-P
DK-42686-P
U1
ICM-42688-P
DK-42688-P
U1
ICM-42688-V
DK-42688-V
U1
No Sensor
DK-UNIVERSAL-G
N/A
Table 1. Sensors and DKs
DK-20100
The DK-20100 is the development kit for TDK pressure sensor ICM-20100.
The ICP-20100 pressure sensor provides a high-accuracy, low power barometric pressure and temperature sensor
solution that integrates a capacitive pressure sensor for monitoring pressure changes in the range of 30 to 110 kPa.
Please refer to the datasheet for the sensor details.
The ICP-20100 is connected to SAMG55 MCU I2C or SPI. The software will select the interface type.
The sensor I2C slave address is 0x63, and its SPI /CS = NPCS0.
The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.
DK-20670
The DK-20670 is the development kit for TDK IMU IIM-20670.
The IIM-20670 is an Industrial grade 6-axis MotionTracking™device that combines a 3-axis gyroscope and a 3-axis
accelerometer in a small 4.5x4.5x1.1 mm (24-pin DQFN). There are two built-in temperature sensors. It uses an SPI
digital interfaceSPI.
Please refer to the datasheet for the sensor details.
The IIM-20670 is connected to SAMG55 MCU SPI with NPCS0.
The digital interface voltage level is 3.3V on the DK-20670. J3 for VDDIO selection must be set to pins 1-2 for 3.3V.

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DK-40627
The DK-40627 is the development kit for TDK IMU ICM-40627.
The ICM-40627 SmartMotion™sensor is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope
and a 3-axis accelerometer. This device is targeted at gesture-based handheld devices such as a mouse. It comes
bundled with TDK’s Air Motion Library, which enables precise mouse pointing, swipe, roll, and other motion
gestures. ICM-40627 has a configurable host interface that supports I2C and SPI serial communication, features a 2
KB FIFO and 2 programmable interrupts with ultra-low power wake-on-motion support to minimize system power
consumption.
Please refer to the datasheet for the sensor details.
The ICM-40627 is connected to SAMG55 MCU I2C and SPI on the DK-40627. The software will select the interface
type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.
DK-42351
The DK-42351 is the development kit for TDK 3x Accel IIM-42351.
The IIM-42351 is a 3-axis accelerometer packaged in a small 2.5 mm x 3 mm x 0.91 mm (14-pin LGA) package. It
has an output data rate up to 8 kHz. The IIM-42351 includes multiple capabilities to enable easy, robust, and
accurate inertial and inclination measurements in Industrial applications. It has a 2 KB FIFO that can lower the
traffic on the serial bus interface and reduce power consumption by allowing the system processor to burst read
sensor data and then go into a low-power mode. Its operation temperature range is -40°C to 105°C.
Please refer to the datasheet for the sensor details.
The IIM-42351 is connected to SAMG55 MCU I2C and SPI on the DK-42351. The software will select the interface
type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO level can be set by J3 to 1.8V or 3.3V.
DK-42352
The DK-42352 is the development kit for TDK 3x Accel IIM-42352.
The IIM-42352 is a 3-axis accelerometer packaged in a small 2.5 mm x 3 mm x 0.91 mm (14-pin LGA) package. It
has a wide and flat frequency response range from dc to 4 kHz (±3 dB point) with an output data rate up to 32 kHz.
The IIM-42352 includes multiple capabilities to enable easy, robust, and accurate inertial and vibration
measurements in Industrial applications. It has a 2 KB FIFO that can lower the traffic on the serial bus interface and
reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-
power mode. Its operation temperature range is -40°C to 105°C.
Please refer to the datasheet for the sensor details.
The IIM-42352 is connected to SAMG55 MCU I2C and SPI on the DK-42352. The software will select the interface
type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO level can be set by J3 to 1.8V or 3.3V.

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DK-42652
The DK-42652 is the development kit for TDK IMU IIM-42652.
The IIM-42652 is a 6-axis SmartIndustrial™MotionTracking device that supports an extended operating
temperature range. The IIM-42652 combines a 3-axis gyroscope and a 3-axis accelerometer in a small 2.5 mm x 3
mm x 0.91 mm (14-pin LGA) package. It also features a 2 KB FIFO that can lower the traffic on the serial bus
interface and reduce power consumption by allowing the system processor to burst read sensor data and then go
into a low-power mode. Its operation temperature range is -40°C to 105°C.
Please refer to the datasheet for the sensor details.
The IIM-42652 is connected to SAMG55 MCU I2C and SPI on the DK-42652. The software will select the interface
type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO level can be set by J3 to 1.8V or 3.3V.
DK_IIM-42653
The DK_IIM-42653 is the development kit for TDK IMU IIM-42653.
The IIM-42653 is a 6-axis SmartIndustrial™MotionTracking device that supports an extended operating
temperature range. The IIM-42652 combines a 3-axis gyroscope and a 3-axis accelerometer in a small 2.5 mm x 3
mm x 0.91 mm (14-pin LGA) package. It also features a 2 KB FIFO that can lower the traffic on the serial bus
interface and reduce power consumption by allowing the system processor to burst read sensor data and then go
into a low-power mode. Its operation temperature range is -40°C to 105°C.
Please refer to the datasheet for the sensor details.
The IIM-42653 is connected to SAMG55 MCU I2C and SPI on the DK_IIM-42653. The software will select the
interface type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO level can be set by J3 to 1.8V or 3.3V.
DK-42670-P
The DK-42670-P is the development kit for TDK IMU ICM-42670-P.
The ICM-42670-P is a high performance 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and
a 3-axis accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication,
features up to 2.25 KB FIFO and 2 programmable interrupts with ultra-lowpower wake-on-motion support to
minimize system power consumption.
Please refer to the datasheet for the sensor details.
The ICM-42670-P is connected to SAMG55 MCU I2C and SPI on the DK-42670-P. The software will select the
interface type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.
DK-42686-P
The DK-42686-P is the development kit for TDK IMU ICM-42686-P.

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The ICM-42686-P is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis
accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication, features a 2
kB FIFO and 2 programmable interrupts with ultra low-power wake-on-motion support to minimize system power
consumption.
The ICM-42686-P has an extended full-scale range (FSR) of ±4000 dps for gyroscope and ±32g for accelerometer to
support precise motion analysis for today’s wearable and sports solutions, including game controllers, golf or tennis
swing analyzers, intelligent soccer balls, or basketballs that track the player’s performance.
Please refer to the datasheet for the sensor details.
The ICM-42686-P is connected to SAMG55 MCU I2C and SPI on the DK-42686-P. The software will select the
interface type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.
DK-42688-P
The DK-42688-P is the development kit for TDK IMU ICM-42688-P.
The ICM-42688-P is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis
accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication, features
a 2 KB FIFO and 2 programmable interrupts with ultra low-power wake-on-motion support to minimize system
power consumption.
Please refer to the datasheet for the sensor details.
The ICM-42688-P is connected to SAMG55 MCU I2C and SPI on the DK-42688-P. The software will select the
interface type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.
DK-42688-V
The DK-42688-V is the development kit for TDK IMU ICM-42688-V.
The ICM-42688-V is a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis
accelerometer. It has a configurable host interface that supports I3CSM, I2C, and SPI serial communication, features
a 2 KB FIFO and 2 programmable interrupts with ultra low-power wake-on-motion support to minimize system
power consumption. It is bundled with 3DoF algorithm software.
Please refer to the datasheet for the sensor details.
The ICM-42688-V is connected to SAMG55 MCU I2C and SPI on the DK-42688-V. The software will select the
interface type.
The sensor I2C slave address is 0x68, and its SPI /CS = NPCS0.
The VDDIO voltage level can be set by J3 to 1.8V or 3.3V.
DK-UNIVERSAL-G
The DK-UNIVERSAL-G is the development kit for DB (sensor daughter board) and EVB (sensor evaluation board).
There is no sensor mounted on the DK-UNIVERSAL-G board. CN1 for EVB and CN4/CN5 for DB are mounted on
board for people to evaluate sensors which are not listed in this document.

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3.2. MAGNETIC SENSORS CONNECTION
Third party magnetic sensors can be connected to the same SAMG55 MCU I2C bus with TDK sensor through DB,
assuming it has a different slave address.
CN2/3 are designed for the magnetic sensor DB plug in. It only supports I2C.

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THE SMARTMOTION SYSTEM DESIGN
This section is a system design overview and addresses MCU SAMG55 resource allocation.
4.1. SYSTEM BLOCK DIAGRAM
On board EDBG MCU AT32UC3A4256HHB-C1UR allows user to do main MCU SAMG55 debug, trace, and
programming without using external tools. Figure 2 shows the system block diagram.
Figure 2. System Block Diagram
4.2. MAIN MCU SAMG55 RESOURCE ALLOCATION
SAMG55 RESOURCE
USAGE
UART 0
(PA9/10/25/26)
The UART0 is connected to FTDI input by default. In the use case of Extension-1
on J200, the UART0 to FTDI connection can be disconnected through jumper J3.
TW6 (I2C)
(PB8/9)
TDK sensor is connected to this master I2C. On board sensor slave address =
0x69. Sensors on DB and EVB have slave address = 0x68.
SPI5
(PA11/12/13/14)
The SPI5 master is connected to TDK IMU sensor.
On board IMU sensor /CS = PNCS0
GPIO (INTs)
PA17/18/20/30 and PB15
The GPIOs are used for sensor interrupt inputs and other intelligent functions.
Refer to the table in Figure 2.
TW4 (I2C)
The master I2C communicates with EDBG MCU slave I2C.
UART6
The UART6 is used for EDBG DGI-UART interface.
UART7
The UART7 is used for EDBG CDC-UART interface.
Table 2. SAMG55 Resource Allocation

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4.3. CONNECTORS
Error! Reference source not found. details the TDK SmartMotion Platform Ver. G connector and header reference
names and descriptions.
CONNECTOR REF NAME
CONNECTOR FUNCTION DESCRIPTIONS
CN1
Not loaded for:
Loaded for: DK-UNIVERSAL G
CN2/CN3
Daughter board connector for Mag. sensor. I2C interface only.
CN4/CN5 (Not loaded)
CN6
USB connector for FTDI USB to serial UART interface
J1
Select host I2C connections, for IMU sensor and mag. sensor or mag. sensor only.
J2
Board power source selection.
J3
Select VDDIO voltage level, 3V0 or 1V8.
J4
Digital signal test pins
J200 (Not loaded)
Extension header 1. Has same function as J200 on Microchip’s Xplained-Pro board.
J301
MCU SAMG55 USB connector
J500
EDBG MCU USB connector
SW300
User button
SW301
RESET button.
Table 3. Connectors
4.4. JUMPER SETTINGS
JUMPER
DESCRIPTION
J1
J1 is used to select input source for SAMG55 master I2C. Only two jumper shunts are allowed.
Jumper shunts on pin-1/2 and 3/4: IMU Sensor primary I2C is connected to SAMG55 I2C master
Jumper shunts on pin-5/6 and 7/8: Magnetic Sensor I2C is connected to SAMG55 I2C master. In this
configuration TDK IMU Sensor is connected to SAMG55 SPI master.
J2
The J2 is for board power source selection. Only one jumper shunt is allowed.
Jumper shunt on pin-1/2: board power is from EDBG USB on J500.
Jumper shunt on pin-3/4: board power is from FTDI USB on CN6
Jumper shunt on pin-5/6: board power is from SAMG55 USB on J301
J3
J3 is for system VDDIO level selection.
Jumper shunts on pin-1/2: VDDIO=3V0
Jumper shunts on pin-3/2: VDDIO=1V8
J4
J4 have digital signals as test points.
Pin-1: SPI /CS
Pin-2: SPI SCLK, I2C SCL
Pin-3: SPI MOSI, I2C SDA
Pin-4: SPI MISO, I2C AD0
Pin-5: INT1
Pin-6: INT2
Pin-7: GND
Table 4. Jumper Setting

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SCHEMATICS AND BOARD PCB
5.1. SCHEMATICS
Figure 3. Hierarchy Top
EDBG_DGI_USART_RX
PB09_TWCK6
PB07_SWCLK
PB08_TWD6
EDBG_DGI_SCL
PA02_WKUP2
PA27_UART7_RXD
SN_CS0PA06_GPIO
Title
Size Document Number Rev
Date: Sheet of
Top G
SmartMotion G, PCBA=860-80009
TDK (Invensense)
1745 Technology Dr.
Custom
2 5Friday, February 07, 2020
San Jose, CA 95110 www.inv ensense.com
Phone: [phone]
Fax: [phone]
PA20_AD3
Main MCU
1. Main MCU
TRACESWO
SWDIO
SWCLK
TARGET_RESET
DGI_GPIO0
TARGET_RESET_SENSE
DGI_GPIO1
DGI_GPIO2
DGI_CLK
SDA
SCL
PA28_UART7_TXD
PA27_UART7_RXD
ID1
ID4
PA12_SPI5_MISO
PA11_SPI5_NPCS0
PB08_TWD6
PA14_SPI5_CLK
PA13_SPI5_MOSI
PB09_TWCK6
PA30_GPIO
PA17_AD0
DGI_TXD
DGI_RXD
DGI_GPIO3
PA20_AD3
PA18_AD1
PB15_GPIO
PB06_SWDIO
SN_MISO/AD0
SN_SCLK/SCL
INVN Sensor
3. INVN Sensor
SN_CS0
SN_SCLK/SCL
SN_MOSI/SDA
SN_MISO/AD0
INT1
INT2_FSYNC_CLKIN
AUXDA
AUXCL
AK_DRDY
FSYNC
ALARM
EDBG_DGI_SDA
PA17_AD0
TARGET_RESET
EDBG_CDC_UART_RX
J1
HEADER 4X2, Male, 180D
2 4 6 8
1 3 5 7
TARGET_RESET_SENSE
ID1
PB13_USART6_CLK
PA24_WKUP11
ID4
PB14_GPIO SN_MOSI/SDA
EDBG MCU
2. EDBG MCU and PWR
TARGET_RESET_SENSE
SWDIO
SWCLK
TARGET_RESET
TRACESWO
EDBG_DGI_GPIO0
EDBG_DGI_GPIO1
EDBG_DGI_GPIO2
EDBG_DGI_USART_RX
EDBG_DGI_USART_TX_
EDBG_DGI_USART_CLK_
EDBG_CDC_UART_TX_
EDBG_CDC_UART_RX
ID1
ID4
EDBG_DGI_SDA
EDBG_DGI_SCL
EDBG_DGI_GPIO3
PB15_GPIO
PB05_TRACESWO
PA30_GPIO
PA18_AD1

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Figure 4. Main MCU
TARGET_USB_N TARGET_USB_N
PA20_AD3
0.1uF
C301
R301
4.7K
ID1
R6 0R
UART to USB
PA18_AD1
PA29_GPIO
GND
DGI_USART
PA25_GPIO_CTS0
PA28_UART7_TXD
VDDCORE_P1V2
R202
1K
R91K
GND
PA18_AD1
PB09_TWCK6
PA09_UART_RXD0
4.7uF
C302
R21
10K
GND
PB14_GPIO
PB11_TWCK4
TARGET_USB_P TARGET_USB_P
PB08_TWD6
TARGET_RESET_SENSE
Title
Size Document Number Rev
Date: Sheet of
Main MCU G
SmartMotion G, PCBA=860-80009
TDK (Invensense)
1745 Technology Dr.
Custom
3 5Friday , February 07, 2020
San Jose, CA 95110 www.invensense.com
Phone: [phone]
Fax: [phone]
PA25_GPIO_CTS0
VCC_TARGET_USB_P5V0
PA00_TIOA0
PA19_AD2
PA13_SPI5_MOSI
SWCLK
VCC_P3V3
GND
PA02_WKUP2
0.1uF
C307
VCC_P3V3
PB05_TRACESWO_TDO
PB10_TWD4
PB15_GPIO
PA24_WKUP11
U300
ATSAMG55J19B-AUT
VDDIO 1
RESETN
2
PB12 3
PA04
4PA03
5
PA00
6
PA01
7
PA05
8
VDDCORE 9
TEST
10
XIN32/PA07
11 XOUT32/PA08
12
GND
13
PB15 14
PB14 15
PA31
16
PA06
17
PA16
18
PA30
19 PA29
20 PA28
21
PA15
22
PA23
23 PA22
24 PA21
25
VDDUSB 26
VDDIO 27
VREFP 28
GND
29
VDDOUT 30
VDDIO 31 VDDIO 32
PA17
33
PA18
34
PA19
35
PA20
36
PB00 37
PB01 38
PB02 39
PB03 40
PA14
41 PA13
42 PA12
43 PA11
44
VDDCORE 45
PB10 46
PB11 47
PA10
48 PA09
49
TDO/TRACESWO/PB05 50
PA27
51 PA26
52
GND
53
TMS/SWDIO/PB06 54
TCK/SWCLK/PB07 55
PA25
56
PB13 57
PA24
58
PB08 59
PB09 60
PA02
61
TDI/PB04 62
JTAGSEL 63
VDDIO 64
PB01_UART_RXD6
PA23_TIOA1
C141uF
PA10_UART_TXD0
R315 0R
GND
VCC_P3V3
4.7uF
C309
9pF
C400
R32047K
0.1uF
C305
GND
PB06_SWDIO_TMS
GND
PA24_WKUP11
PA17_AD0
PA30_GPIO
DGI_RXD
PA13_SPI5_MOSI
GND
USER_BUTTON
PA06_GPIO
GND
PA16_WKUP7
{
PA30_GPIO
PA11_SPI5_NPCS0
PB07_SWCLK_TCK
PA29_GPIO
GND
PB10_TWD4
VCC_P3V3
GND
TARGET_RESET
{
PA27_UART7_RXD
VCC_P3V3
PB07_SWCLK_TCK
PB08_TWD6
PA17_AD0
PA18_AD1
R14100K
PA10_UART_TXD0
SDA
PA01_TIOB0
DGI_GPIO
R302
4.7K
R300
4.7K
4.7uF
C308 0.1uF
C303
R312
47K
R317
10K
0.1uF
C310
VDDCORE_P1V2
PA11_SPI5_NPCS0
PB11_TWCK4
PA18_AD1
PA23_TIOA1
PA14_SPI5_CLK
DGI_GPIO1
PB04_GPIO_TDI
GND
PA06_GPIO
{
PA04_TWCK3
PB01_UART_RXD6
GND
PA12_SPI5_MISO
0.1uF
C314
D1
LED0402_RED
1
2
C130.1uF
PA20_AD3
AH-32.768KDZF-T
XC400
PB15_GPIO
R2 0R
{
TRACESWO
PA03_TWD3
R31130K
GND
R304
39R
SW300
SKRAAKE010
1
4
2
3
VDDCORE_P1V2
GND
GND
TARGET_RESET
PB06_SWDIO_TMS
PA10_UART_TXD0
PA26_GPIO_RTS0
PA11_SPI5_NPCS0
0.1uF
C311
PA05_SPI5_NPCS1
PA28_UART7_TXD
PB15_GPIO
GND
0.1uF
C312
PA16_WKUP7
PB10_TWD4
PB14_GPIO
{
PA21_USB_N
PA19_AD2
PB13_USART6_CLK
R305 1K
PA17_AD0
PB09_TWCK6
GND
TST
PB05_TRACESWO_TDO
GND
PA13_SPI5_MOSI
GND
PB11_TWCK4
PA07_XIN32
R316 0R
PA01_TIOB0
PB08_TWD6
TARGET_RESET
CN6
Conn. USB Micro AB SMT
GND 5
ID 4
DP 3
VBUS 1
DM 2
NC3
6/2
NC4
7/2 NC2 8/2
NC1 9/2
R31947K
J200
NM HEADER 10X2
1
1/2
3
3/2
5
5/2
7
7/2
9
9/2
11
11/2
13
13/2
15
15/2
17
17/2
19
19/2
22/2
44/2
66/2
88/2
10 10/2
12 12/2
14 14/2
16 16/2
18 18/2
20 20/2
C150.1uF
DGI_TWI
PA26_GPIO_RTS0
C160.1uF
PA27_UART7_RXD
R3 0R
PA26_GPIO_RTS0
SCL
GND
PA20_AD3
PA14_SPI5_CLK
VCC_P3V3
PA24_WKUP11
PB13_USART6_CLK
4.7uF
C304
R308
10K
9pF
C401
VCC_P3V3
PA02_WKUP2
J301
Conn. USB Micro AB SMT
GND 5
ID 4
DP 3
VBUS 1
DM 2
NC3
6/2
NC4
7/2 NC2 8/2
NC1 9/2
R31847K
R201
1K
PA08_XOUT32
DGI_GPIO2
DGI_GPIO3
PA28_UART7_TXD
DGI_GPIO0
D300 LED0402_RED
1 2
VCC_P3V3
{
GND
CDC_UART
SW301
SKRAAKE010
1
4
2
3
PB00_UART_TXD6
PB00_UART_TXD6
SWDIO
GND
R5 0R
PA25_GPIO_CTS0
PA17_AD0
PB09_TWCK6
PA12_SPI5_MISO
R309
39R
GND
GND
VCC_FTDI_USB_P5V0
U5
FT232RL TXD 1
DTR#
2
RTS# 3
VCCIO
4
RXD 5
RI#
6
GND
7
NC
8
DSR#
9
DCD#
10
CTS# 11
CBUS4
12
CBUS2
13
CBUS3
14
USBDP
15 USBDM
16
3V3OUT
17
GND
18
RESET#
19
VCC
20
GND
21 CBUS1 22
CBUS0 23
NC
24
AGND
25 TEST
26
OSCI
27
OSCO
28
PA02_WKUP2
PA27_UART7_RXD
GND
PA09_UART_RXD0
DGI_TXD
VCC_P3V3
R303
4.7K
0.1uF
C300
R203
10K
Together w/ SPI5
Sensor/DB/EVB
GND
PA22_USB_P
PA09_UART_RXD0
DGI_CLK
GND
VDDCORE_P1V2
PA05_SPI5_NPCS1
PA30_GPIO
R200
100K
PA14_SPI5_CLK
USER_LED
PA00_TIOA0
R310
39R
PA12_SPI5_MISO
VCC_P3V3
VCC_P3V3
VCC_P3V3
VCC_P3V3
SWD

AN-000300
Document Number: AN-000300 Page 14 of 18
Revision: 1.1
Figure 5. Embedded Debugger
Figure 6. Sensors, DB and EVB connectors
GND
TARGET_RESET_SENSE
0.1uF
C504
22pF
C500
R51439R
L500
BLM18PG471SN1
VCC_TARGET_USB_P5V0
4.7uF
C101
R102
30K
EDBG_ADC0 TARGET_RESET_SENSE
VCC_P3V3
VCC_P3V3
0.1uF
C511
22pF
C501
2.2uF
C515
EDBG_CDC_UART_TX
EDBG_CDC_UART_TX_
GND
GND
VCC_P3V3
EDBG_DGI_SCL
0.1uF
C512
PB06_SWDIO
1nF
C506
EDBG_DGI_USART_CLK_
GND
GND
VCC_EDBG_USB_P5V0
EDBG_DGI_GPIO3
GND
STATUS_LED_CTRL
R10018K
PB05_TRACESWO
R504
1K
GND
EDBG_DGI_SDA
R506 1M
1nF
C507
PB07_SWCLK
R510 330R
R503
1M
3.3V linear regulator
EDBG_DGI_GPIO0
GND
TARGET_RESET
GND
EDBG_CDC_UART_RX
SWCLK
R51339R
GND
EDBG_USB_HS_N
GND
VCC_P3V3
ID_4
R500
1K
U500
AT32UC3A4256HHB-C1UR
PA00/PA18
G8
PA01/PA17
G10
PA02/PX47
E1
PA03
F9
PA04
E9
PA05
G9
PA06/PA13
E8
PA07/PA19
H10
PA08
F8
PA09
D8
PA10
C10
PA11
C9
PA12/PA25
G7
PA14/PX11
K7
PA15/PX45
J7
PA16
E7
PA20/PX18
H9
PA21/PX22
K10
PA22/PX20
H6
PA23/PX46
G6
PA24/PX17
J10
PA26/PB05
F7
PA27
A2
PA28
A1
PA29
B4
PA30
A4
PA31
C2
USB_VBUS
A10
DMHS
A9
DPHS
A8
DMFS
B9
DPFS
B8
USB_VBIAS
C7
VDDANA
J6
GNDANA
H8
VDDIN
D9
VDDCORE
E10
GNDCORE
F10
VDDIN
D10
GNDPLL
B10
VDDIO
E5
VDDIO
B5
VDDIO
J5
VDDIO
B6
VDDIO
F2
VDDIO
F6
GNDIO
F5
GNDIO
C3
GNDIO
H3
GNDIO
E2
GNDIO
C8
GNDIO
E6
RESET_N J9
TMS H7
TDO J8
TDI K8
TCK K9
PX00 G4
PX01 G2
PX02 G3
PX03 J1
PX04 H1
PX05 G1
PX06 F3
PX07 F4
PX08 E3
PX09 E4
PX10 D2
PX15/PX32 K4
PX12 D1
PX13 D3
PX16/PX53 D4
PX19/PX59 F1
PX21 H2
PX23 K1
PX24 J2
PX25 H4
PX26 J3
PX27 K2
PX28 K3
PX29 J4
PX30 G5
PX31 H5
PB00 B1 PB01 B2 PB02 B3 PB03 C4 PB04 A3 PB06 D7 PB07 D6
PB08 C6 PB09 C5 PB10 D5 PB11 C1
PC00/PX14 K5
PC01 K6 PC02 A5 PC03 A6 PC04 B7 PC05 A7
GND
GND
R113
47K
ID1
J500
Conn. USB Micro AB SMT
GND 5
ID 4
DP 3
VBUS 1
DM 2
NC3
6/2
NC4
7/2 NC2 8/2
NC1 9/2
DGI_GPIO0
POWER_LED_CTRL
EDBG_DGI_USART_RX
EDBG_DGI_SCL
VCC_P3V3
GND
VCC_P3V3
R512 330R
R509 330R
2.2uF
C514
R505
1K
EDBG_DGI_USART_TX_ R518 330R
DGI_GPIO1
ID_1
VCC_P3V3
GND
VCC_P3V3
EDBG_USB_FS_P
EDBG_DGI_GPIO2
GND
Power
multiplexer
EDBG_DGI_USART_TX
2.2uF
C509
R502 1K
R508 330R
GND
TRACESWO
VCC_EDBG_USB_P5V0
DGI_GPIO2
TARGET_RESET
VCC_P3V3
TARGET_RESET
D500
LED0402_GREEN
1
2
C100
10uF
Current limiters
0.1uF
C510
EDBG_USB_FS_N
R511 330R
SWDIO
GND
GND
Title
Size Document Number Rev
Date: Sheet of
EDBG (Embedded Debugger) G
SmartMotion G, PCBA=860-80009
TDK (Invensense)
1745 Technology Dr.
Custom
4 5Friday , February 07, 2020
San Jose, CA 95110 www.invensense.com
Phone: [phone]
Fax: [phone]
GND
Q500
2N7002DW
G1
5
S1
4D1 3
S2
1G2 2
D2 6
VCC_FTDI_USB_P5V0
EDBG_DGI_USART_CLK
J2
HEADER 3X2, Male, 180D
2
4
6
1
3
5
VCC_P5V0
0.1uF
C513
2.2uF
C505
L501
BLM18PG471SN1
ID4
EDBG_USB_HS_P
DGI_GPIO3
R515
6.81k
10p
C502
R507 330R
1nF
C508
U100 SPX3819R2-L/TR
EN
1
NC
2
VIN
3
NC
4VOUT 5
NC 6
GND 7
ADJ/BYP 8
GND
9
XC500
12.0 MHz
EDBG_CDC_UART_RX
VCC_P3V3
EDBG_DGI_SDA
GND
GND
GND GND
XOUT0
GND
XIN0
EDBG_DGI_USART_RX
D502
PRTR5V0U2X
1
1
2
233
44
10mA @ 3.3V
D501
LED0402_YELLOW
1
2
500mA
R112
47K
EDBG_DGI_GPIO1
GND
EDBG Power and Status LEDs
GND
GND
C19
0.1uF
ALARM
AUXCL_VDDIO
VDDIO
VDDIO
GND
GND
GND
MOSI/SDA_VDDIO
MISO/AD0_VDDIO
AK_DRDY_VDDIO
GND
INT2_VDDIO
/CS_VDDIO
MISO/AD0_VDDIO
GND
SIP-3 2.54mm
J3
1 2 3
INT1_VDDIO
AK_DRDY_VDDIO
MOSI/SDA_VDDIO
C9
0.1uF
INT1_VDDIO
AUXDA
U1
2.5x3 mm (14-pin LGA)
AP_AD0/AP_SDO
1
RESV
2
RESV
3
INT1
4
VDDIO
5
GND
6
FSYNC
7
VDD 8
INT2 9
RESV 10
RESV 11
AP_CS 12
AP_SCL / AP_SCLK 13
AP_SDA / AP_SDIO/AP_SDI 14
INT2_VDDIO
SCLK/SCL_VDDIO
AK_DRDY_VDDIO
INT2_FSYNC_CLKIN
GND
MOSI/SDA_VDDIO
R1 10K
VCC_P3V3
SN_MISO/AD0
SN_SCLK/SCL
AUXDA
ALARM
GND
VDDIO
SN_CS0
VDDIO
R17 10K
R8
10K
GND
GND
VDDIO
INT1_VDDIO
AUXDA_VDDIO
/CS_VDDIO
R12 47K
SN_SCLK/SCL
U7
MAX3378EEUD
VL
1
IO-VL1
2
IO-VL2
3
IO-VL3
4
IO-VL4
5
NC
6
GND
7/Tri-State 8
NC 9
IO-VCC4 10
IO-VCC3 11
IO-VCC2 12
IO-VCC1 13
VCC 14
/Tri-State
FSYNC_VDDIO
SCLK/SCL_VDDIO
AUXDA_VDDIO
CN2
HDR 5X2, 2.54mmX2.54mm
2
4
6
8
10
1
3
5
7
9
GND
U2
4.5x4.5 mm (24-pin DQFN)
MOSI
1
GND
2
GND
3
GND
4
GND
5
FL
6
GND
7
VDDIO
8
MISO
9
REGOUT
10
VDD
11
FL
12
FL 13
GND 14
GND 15
GND 16
GND 17
RESETN 18
ALARM 19
VPP 20
FL 21
GND 22
nCS 23
SCLK 24
Other Sensor DB
GND
R4
10K
C1
0.1uF
SN_CS0
SOT235
TLV70218DBVT
U4
Vin
1OUT 5
GND
2
EN
3NC 4
GND
VCC_P3V3
SN_MOSI/SDA
VCC_P3V3
U3
2x2 mm(10-pin LGA)
CSB
1
SCL/SCLK
2
VSS
3
SDA/SDIO/SDI
4
VDD
5
SDO/AD0 6
INT 7
RESV 8 RESV 9
VDDIO 10
C18
0.1uF
MISO/AD0_VDDIO
MISO/AD0_VDDIO
R18 10K
C6
0.1uF
VDDIO
AK_DRDY
INT2_VDDIO
SCLK/SCL_VDDIO
C11 0.1uF
1V8 J4
SIP7 2.54mm
1
2
3
4
5
6
7
SCLK/SCL_VDDIO
R2010K
R7
10K
AUXDA_VDDIO
GND
R10 0R
VDDIO
FSYNC_VDDIO
GND
R19 10K
INT2_VDDIO
AUXCL
VCC_P3V3
GND
GND
INT1
SCLK/SCL_VDDIO
VDDIO
INT1_VDDIO
C2
0.1uF
R16 10K
VDDIO
VCC_P3V3
AUXCL
/CS_VDDIO
300mA
GND
U6
MAX3378EEUD
VL
1
IO-VL1
2
IO-VL2
3
IO-VL3
4
IO-VL4
5
NC
6
GND
7/Tri-State 8
NC 9
IO-VCC4 10
IO-VCC3 11
IO-VCC2 12
IO-VCC1 13
VCC 14
VDDIO
SN_SCLK/SCL
R11 0R
MISO/AD0_VDDIO
AK_DRDY
VCC_P5V0
VCC_P3V3
SN_MISO/AD0
INT2_VDDIO
GND
C8 0.1uF
VDDIO
FSYNC
C17
0.1uF
SN_MOSI/SDA
AUXCL_VDDIO
FSYNC
0.1uF
C21
AUXCL_VDDIO
GND
VDDIO
MOSI/SDA_VDDIO
/CS_VDDIO
GND
GND
AUXDA_VDDIO
GND
C12
0.1uF
GND
CN4
HDR 5X2, 2.54mmX2.54mm
2
4
6
8
10
1
3
5
7
9
MOSI/SDA_VDDIO
VCC_P3V3
C3
0.1uF
GND
SCLK/SCL_VDDIO
GND
SN_MISO/AD0
FSYNC_VDDIO
/Tri-State
INT1_VDDIO
INV Sensor DB
CN3
HDR 5X2, 2.54mmX2.54mm
2
4
6
8
10
1
3
5
7
9
C7 0.1uF
VCC_P3V3
AUXCL_VDDIO
GND
GND
/CS_VDDIO
CN1
HDR 10X2, Female, RA, 2.54mmx2.54mm
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
CN5
HDR 5X2, 2.54mmX2.54mm
2
4
6
8
10
1
3
5
7
9
1uF
C22
VCC_P3V3
GND
VCC_P3V3
MOSI/SDA_VDDIO U8
MAX3378EEUD
VL
1
IO-VL1
2
IO-VL2
3
IO-VL3
4
IO-VL4
5
NC
6
GND
7/Tri-State 8
NC 9
IO-VCC4 10
IO-VCC3 11
IO-VCC2 12
IO-VCC1 13
VCC 14
SN_CS0
INT1
GND
SN_MOSI/SDA
VCC_P3V3
GND
/Tri-State
INT2_FSYNC_CLKIN
Title
Size Document Number Rev
Date: Sheet of
TDK (InvenSense Sensor) G
SmartMotion G, PCBA=860-80009
TDK (Invensense)
1745 Technology Dr.
Custom
5 5Wednesday, July 07, 2021
San Jose, CA 95110 www.invensense.com
Phone: [phone]
Fax: [phone]
/CS_VDDIO
MOSI/SDA_VDDIO
INT1_VDDIO
C20
1uF
FSYNC_VDDIO
GND
C10
0.1uF
VCC_P3V3
1V8
SCLK/SCL_VDDIO
EVB Connector
MISO/AD0_VDDIO

AN-000300
Document Number: AN-000300 Page 15 of 18
Revision: 1.1
5.2. BOARD PCB
Figure 7. Ver. G PCB Top view (left) and Bottom view (right)

AN-000300
Document Number: AN-000300 Page 16 of 18
Revision: 1.1
REVISION HISTORY
REVISION DATE
REVISION
DESCRIPTION
07/07/2021
1.0
Initial Release
12/12/2022
1.1
Format update, added DK_IIM-42653

AN-000300
Document Number: AN-000300 Page 17 of 18
Revision: 1.1
DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but
cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component
characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on
data received from vendors and suppliers, which has not been validated by InvenSense.

AN-000300
Document Number: AN-000300 Page 18 of 18
Revision: 1.1
This information furnished by InvenSense or its affiliates (“TDK InvenSense”) is believed to be accurate and reliable. However, no responsibility
is assumed by TDK InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use.
Specifications are subject to change without notice. TDK InvenSense reserves the right to make changes to this product, including its circuits
and software, in order to improve its design and/or performance, without prior notice. TDK InvenSense makes no warranties, neither expressed
nor implied, regarding the information and specifications contained in this document. TDK InvenSense assumes no responsibility for any claims
or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is
not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or
otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. TDK InvenSense sensors should not be used or sold
in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear
instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2021 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP,
AAR, and the InvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product
names may be trademarks of the respective companies with which they are associated.
©2021 InvenSense. All rights reserved.