Texas Instruments BQ25750 User manual

EVM User's Guide: BQ25750
BQ25750 Evaluation Module
Description
The BQ25750EVM evaluation module (EVM) is a
complete evaluation system for the BQ25750 IC, a
buck-boost battery charge controller with direct power
path control. The BQ25750 has a wide input range of
4.2 V – 70 V, a wide output voltage range of up to 70
V, and bi-directional capabilities.
The BQ25750EVM has a max input and output of 55
V and a max charge current of 10 A.
Get Started
1. Order the EVM on ti.com
2. Order the EV2400 to communicate with the EVM
3. Download the BQ25750 BQZ file
4. Download the BQ25750 EVM design files on
ti.com
Features
• Wide input voltage operating range: 4.2 V – 55 V
• Wide output operating range: up to 55 V with
CC/CV support for:
– 2 to 13–Cell Li-Ion
– 2 to 14–Cell LiFePO4
• Synchronous buck-boost DC/DC charge controller
with NFET drivers
– Adjustable switching frequency from 200 kHz to
600 kHz
– Optional synchronization to external clock
– Optional gate driver supply input for optimized
efficiency
• Resistor-programmable stand-alone with added
I2C mode
• Built in MPPT to maximize power from solar panel
arrays
• Power up from battery (reverse-mode) output 4 V
to 55 V
• High safety integration
– Adjustable input overvoltage and undervoltage
protection
– Output overvoltage and overcurrent protection
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1 Evaluation Module Overview
1.1 Introduction
The BQ25750EVM evaluates for applications that use greater than a 100 W USB input with the new USB-C
Power Delivery (PD) Extended Power Range (EPR) and up to 13 cell Li-Ion battery charging implementing
CC/CV profile. Typical applications include medical equipment, solar backup chargers, energy storage systems,
drones, cordless power and garden tools.
This EVM does not include the EV2400 or USB2ANY interface device and does not provide any electrical
isolation for the digital interfaces. EV2400 or USB2ANY can be ordered separately to evaluate the
BQ25750EVM and considering electrical safety is important when interfacing between the PC and EVM board.
When interfacing the EVM to the PC through the digital interfaces, digital isolators with isolation boundary is
recommended.
The BQ25750EVM does not have an isolation boundary and has smaller clearance and creep than normally
used on high-voltage boards. If the user applies high voltage to this board, all terminals are considered high
voltage and hazardous when live. Electric shock is possible when connecting the board to live wire. The board
must be handled by a professional with care. TI recommends the use of isolated test equipment with safety
protection features (such as overvoltage and overcurrent).
1.2 Kit Contents
This EVM kit includes:
• 1 BQ25750 EVM
1.3 Device Information
The BQ25750EVM evaluation module (EVM) is an evaluation system for the BQ25750 IC. The BQ25750 IC is a
buck-boost battery charge controller with direct power path control. The BQ25750 has a wide input range of 4.2
V – 70 V, a wide output voltage range of up to 70 V, and bi-directional capabilities.
The device offers high-efficiency battery charging with accurate charge current and charge voltage regulation
over a wide voltage range. The design also includes automatic charge preconditioning, termination, and charge
status indication. The device integrates loop compensation for the buck-boost converter, which provides a
high-density design with ease of use. In reverse mode, the device draws power from the battery and regulates
the SYS terminal voltage.
The device supports stand-alone charging mode through resistor programmable limits in addition to the I2C
host-controlled charging mode. Input current, charge current, and charge voltage regulation targets are set
through the ILIM_HIZ, ICHG and FB pins, respectively.
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1.4 Texas Instruments High Voltage Evaluation User Safety Guidelines
WARNING
Always follow TI's set-up and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help verify
your personal safety and those working around you. Contact TI's Product Information Center http://ti.com/
customer support for further information.
Save all warnings and instructions for future reference.
WARNING
Failure to follow warnings and instructions can result in personal injury, property damage or death
due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed printed
circuit board assembly. It is intended strictly for use in development laboratory environments, solely for qualified
professional users having training, expertise and knowledge of electrical safety risks in development and
application of high voltage electrical circuits. Any other use and/or application are strictly prohibited by Texas
Instruments. If you are not suitably qualified, then you need to immediately stop from further use of the HV EVM.
1. Work Area Safety:
a. Keep work area clean and orderly.
b. Qualified observers must be present anytime circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and the interface
electronics are energized, indicating operation of accessible high voltages can be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes, and other related
apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located
within a protected Emergency Power Off EPO protected power strip.
e. Use stable and non-conductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety:
a. As a precautionary measure, a good engineering practice to assume is that the entire EVM can have
fully accessible and active high voltages.
b. De-energize the TI HV EVM and all the inputs, outputs and electrical loads before performing any
electrical or other diagnostic measurements. Re-validate that TI HV EVM power has been safely de-
energized.
c. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,
measurement equipment hook-ups and other application needs, while still assuming the EVM circuit and
measuring instruments are electrically live.
d. Once EVM readiness is complete, energize the EVM as intended.
WARNING
While the EVM is energized, never touch the EVM or the electrical circuits, as the electrical
circuits and EVM can be at high voltages capable of causing electrical shock hazard.
3. Personal Safety
a. Wear personal protective equipment e.g. latex gloves or safety glasses with side shields or protect EVM
in an adequate lucent plastic box with interlocks from accidental touch.
Limitation for safe use:
EVMs are not to be used as all or part of a production unit.
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1.4.1 General Safety Information
The following warnings and cautions are noted for the safety of anyone using or working close to the BQ25750
EVM. Observe all safety precautions.
Warning Caution
The BQ25750EVM circuit module can become hot during operation due to the
dissipation of heat. Avoid contact with the board. Follow all safety procedures
applicable to your laboratory.
CAUTION
Hot surface. Contact can cause burns. Do not touch!
Warning
The BQ25750EVM does not have an isolation boundary and has smaller clearance
and creep than normally used on high-voltage boards. If the user applies high
voltage to this board, all terminals are considered high voltage and hazardous
when live. Electric shock is possible when connecting the board to live wire. The
board must be handled by a professional with care. TI recommends the use of
isolated test equipment with safety protection features (such as overvoltage and
overcurrent).
Warning
High voltages that can cause injury exist on this evaluation module (EVM). Please
follow all safety procedures when working on this EVM. Never leave a powered
EVM unattended.
Warning High voltage can be present on board capacitors after power down. Check and
discharge all on-board energy reservoirs properly after EVM power down.
!
Caution Do not leave the EVM powered when unattended.
CAUTION
The communication interfaces are not isolated on the EVM. TI recommends the use of digital
isolators. Observe all high voltage safety precautions during testing.
CAUTION
Connections for a rated current must be made at the terminal block. Test points are not rated for the
board current.
CAUTION
The circuit module can be damaged by overtemperature. To avoid damage, monitor the temperature
during evaluation and provide cooling, as needed, for your system environment. Do not operate
beyond the current and voltage limits in Section 2.3.
CAUTION
Test equipment can be damaged by the application of external voltages. Check your equipment
requirements and use blocking diodes or other isolation techniques, as needed, to prevent damage
to your equipment.
CAUTION
The circuit module has signal traces, components, and component leads on the bottom of the board.
Exposed voltages, hot surfaces, or sharp edges can result in these areas. Do not reach under the
board during operation.
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CAUTION
The default settings of the BQ25750 are not designed for all applications. Set the EVM settings
appropriately for test setup before device power up. Set all protections appropriately and limit current
for safe operations.
CAUTION
The board has no fuse installed and relies on the external voltage source current limit for circuit
protection.
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2 Hardware
2.1 Board Parameters
Table 2-1. Default Board Setup for BQ25750EVM
Description Value Unit
ACUV Input undervoltage 4.2 V
ACOV Input overvoltage 55 V
IIN Input current of the EVM 8 A
IOUT Output current of the EVM 10 A
FSW_SYNC Switching frequency of the power stage 250 kHz
Table 2-2. PCB and Mechanical Parameters
Value Unit
Board size (X dimension, or length) 112 mm
Board size (Y dimension, or width) 84 mm
IC + power stage max height 5 mm
Total copper layers 6 layer
Copper weight per layer 2 oz
Total board thickness 62 mil
2.2 IO and Jumper Descriptions
Table 2-3. Connector and Port Description
Jack Description
J1-VIN Input: positive terminal
J1-PGND Input: negative terminal (ground terminal)
J2-VSYS Charger system output voltage, typically connected to the system load
J2-PGND Ground
J3-VOUT Connected to battery pack output
J3-PGND Ground
J4-EXT_I2C Communication port for the USB2ANY
J5-I2C Communication port for the EV2400
J6-EXT_DRV Connection for external gate drive
J7-Power Connector Connection for VAC and BAT
J8-Communication Port Connection for EXT_DRV, /INT, I2C, /PG, and 3.3 V
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Table 2-4. Jumper Description
Jumper Description Factory Default
JP1 Use JP1 to connect the default feedback resistor and set the charger to the default 7
cell battery. Installed
JP2 Use JP2 to connect a new feedback resistor to program a different cell count. Not installed
JP3 Use JP3 to connect external IOUT resistor. JP3 can be shorted to PGND to turn off
hardware output current limiting.
Not installed
JP4 Shunt JP4 to use default IOUT resistor. By closing JP4, the default IOUT current is
set to 10 A.
Installed
JP5 Shunt JP5 to bias TS. Installed
JP6 With JP5 shunted (REGN connected for voltage divider). Shunt JP6 to set TS status
to normal.
Installed
JP7 With JP5 shunted (REGN connected for voltage divider). Use JP7 to connect
external resistor to change TS status.
Not installed
JP8 Use JP8 to connect external FSW_SYNC resistor. Not installed
JP9 Shunt JP9 to use default FSW_SYNC resistor. By closing JP9, the default switching
frequency is set to 250 kHz.
Installed
JP10 Shunt JP10 to use default IIN resistor. By closing JP10, the maximum input current
is set to 8 A.
Installed
JP11 Use JP11 to connect external IIN resistor. JP11 can be shorted to PGND to turn off
hardware input current limiting.
Not installed
JP12
Use JP12 to select the gate driver source. Shunt pin1 to pin2 to use IC internal
LDO REGN output. Shunt pin2 to pin3 to use external gate drive supply. Maximum
external gate drive supply can be up to 11 V.
Pin1 and pin2 shunted
JP13 Shunt JP13 to enable controller in forward mode. Open JP13 to disable controller.
The /CE pin can also be used as a general purpose indicator.
Installed
JP14 Shunt JP14 to connect /INT to a pullup rail. Installed
JP15 Shunt JP15 to connect STAT1 to a pullup rail. The STAT1 pin can also be used as a
general purpose indicator.
Installed
JP16 Shunt JP16 to generate on board 3.3-V pullup rail. Installed
2.3 Recommended Operating Conditions
Table 2-5. Recommended Operating Conditions for BQ25750EVM
Description MIN TYP MAX UNIT
VIN (J1) Input voltage to the EVM 4.2 55(1) V
VOUT (J3) Output voltage of the EVM 3.3 55(1) V
IIN (J1) Input current of the EVM 10(3) (4) A
IOUT (J3) Output current of the EVM 10(3) A
Regulator output power Output power of the EVM 400(3) W
EXT_DRV (J6) Voltage applied to DRV_SUP pin of the regulator 4 11 V
EVM Operating Ambient
Temperature (TA) 25(2) °C
(1) Nodes on the EVM can have high spikes above the input voltage (in buck mode) or output voltage (in boost mode) level due to the
high di/dt and dv/dt electrical flow associated with switch-mode power supplies. Switch node voltage can swing up to input or output +
inductive spike level. High-side gate drives can swing up to switch node voltage + 11 V (DRV_SUP supply voltage dependent) + gate
drive inductive spike level. Observe safety precautions at all times.
(2) Connectors, bump-ons, and jumpers on the EVM are not good choices for evaluation under temperatures that greatly deviate from a
room temperature of 25°C. Please refer to the Bill of Materials (BOM) for temperature ratings of board components.
(3) TI recommends thermal monitoring (for example, using a thermal camera) if the power-stage output current > 5 A or total output power
> 100 W.
(4) The default EVM input current limit is set to 8 A through the IIN pin. The current-limiting feature can be turned off by setting the
EN_IIN_PIN bit to '0', changing the IIN pin resistor, or shorting the IIN pin to PGND through JP11.
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2.4 Equipment
TI recommends two ways to test the EVM. The first and preferred way to test the EVM is to use a four-quadrant
power supply. The second is to use a electronic load in constant voltage mode. Testing with a constant voltage
load is covered in Section 2.4.3. TI recommends the following list of equipment when testing with a four-quadrant
power supply.
1. Power Supplies:
A power supply capable of supplying 40 V at 8 A is required. This part can handle larger voltage and current,
however, larger power levels are not necessary for this procedure.
2. Load 1:
A Kepco load: BOP36-6M, DC 0 to ±36 V, 0 to ±6 A (or higher), or equivalent. When testing without a real
battery, connect 2000 uF of capacitance across the input.
3. Meters:
Six Fluke 75 multimeters, (equivalent or better) or: Three equivalent voltage meters and three equivalent
current meters.
4. Computer:
A computer with at least one USB port and a USB cable.
5. EV2400 Communication Kit
6. Software:
Download and properly install bqStudio.
2.4.1 Equipment Set Up
EV2400
USB
+
–
+
–
A
VAC
IAC
VBAT
IBAT
Op  onal Gate
Drive Supply
DMM
VAC
A
DMM
I2C
Use the following guidelines to set up the equipment:
1. Set power supply 1 for 23 V DC, 8 A current limit and then turn off the supply.
2. Connect the output of power supply 1 in series with a current meter to J1 (VIN and PGND).
3. Connect a voltage meter across J1 (VIN) and J1 (PGND).
4. Connect load 1 in series with a current meter to J3 (VBAT and PGND).
5. Connect a voltage meter across J5 (VBAT and PGND).
6. Set 23 V at KEPCO load output. Limit KEPCO to 6 A. Use load 2 to power EVM from the VOUT output.
7. Connect J5 to the EV2400. Connect J5 to the I2C PORT 2 on the EV2400.
8. Install the jumpers as indicated in IO and Jumper Descriptions.
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9. Turn on the computer and load 2. Open the bqStudio software.
a. Select Charger and click the Next button.
b. Select Charger_1_00_BQ25750.bqz on the Select a Target Page.
c. Click Field View after selecting the target device and then click the Read Register button.
10. Set WATCHDOG and EN_CHG to disabled.
11. Set ICHG_REG to 4000 mA and IPRECHG to 1000 mA in the 16 Bit Registers field.
12. Turn on power supply 1, measure:
V(J1(VAC)) = 23 V ± 0.5 V
I(J1(IAC)) = 4.1 A ± 0.5 A
V(J3(VBAT)) = 23 V ± 0.5 V
I(J3(IBAT)) = 3.9 A ± 0.5 A
13. Set power supply 1 for 40 V, measure:
V(J1(VAC)) = 40 V ± 0.5 V
I(J1(IAC)) = 2.4 A ± 0.5 A
V(J3(VBAT)) = 23 V ± 0.5 V
I(J3(IBAT)) = 3.9 A ± 0.5 A
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14. Set power supply 1 for 19 V, measure:
V(J1(VAC)) = 19 V ± 0.5 V
I(J1(IAC)) = 5.0 A ± 0.5 A
V(J3(VBAT)) = 23 V ± 0.5 V
I(J3(IBAT)) = 3.9 A ± 0.5 A
Use the following guidelines to test the BQ25750 EVM power path:
1. Disconnect the power supply from J1 (VIN and PGND) and disconnect Load 1 from J3 (VOUT and PGND).
2. Connect the output of power supply #1 to J3 (VOUT and PGND).
3. Set power supply 1 for 20 V DC, 8 A current limit and then turn off power supply.
4. Connect a voltage meter across J2 (VSYS) and J2 (PGND).
5. Turn on power supply 1, measure V(J2(VSYS)) = 20 V ± 0.5 V.
2.4.2 Equipment - Using a CV Load
The following list of equipment is recommended when testing with a constant voltage electronic load.
1. Power Supplies:
A power supply capable of supplying 40 V at 8 A is required. This part can handle larger voltage and current,
however, larger power levels are not necessary for this procedure.
2. Load 1:
Kikusui PLZ164WA 0-150 V, 0-33 A when testing without a real battery, connect 2000 uF of capacitance
across the input.
3. Meters:
Six Fluke 75 multimeters (equivalent or better) or three equivalent voltage meters and three equivalent
current meters.
4. Computer:
A computer with at least one USB port and a USB cable.
5. EV2400 Communication Kit
6. Software:
Download and properly install bqStudio.
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2.4.3 Equipment Setup - Using a CV Load
EV2400
USB
+
–
+
–
A
VAC
IAC
VBAT
IBAT
Op  onal Gate
Drive Supply
DMM
VAC
A
DMM
I2C
Use the following guidelines to set up the equipment:
1. Set power supply 1 for 40 VDC, 6 A current limit and then turn off the supply.
2. Connect the output of power supply 1 in series with a current meter to J1 (VIN and PGND).
3. Connect a voltage meter across J1 (VIN) and J1 (PGND).
4. Connect load 1 in series with a current meter to J3 (VBAT and PGND).
5. Connect a voltage meter across J5 (VBAT and PGND).
6. Set 23.5 V at electronic load input.
7. Connect J5 to the EV2400 and connect J5 to the I2C PORT 2 on the EV2400.
8. Install the jumpers as indicated in IO and Jumper Descriptions.
9. Unplug Jumper 13.
10. Turn on the computer and power supply 1. Open the bqStudio software.
a. Select Charger and click the Next button.
b. Select Charger_1_00_BQ25750.bqz on the Select a Target Page.
c. Click Field View after selecting the target device and then click the Read Register button.
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11. Set WATCHDOG and EN_CHG to disabled.
12. Set ICHG_REG to 4000 mA and IPRECHG to 1000 mA in the 16 Bit Registers field.
13. Set EN_CHG to enabled and plug in Jumper 13.
14. Set power supply 1 to 40 V, measure:
V(J1(VAC)) = 40 V ± 0.5 V
I(J1(IAC)) = 1.2 A ± 0.5 A
V(J3(VBAT)) = 23.5 V ± 0.5 V
I(J3(IBAT)) = 2 A ± 0.5 A
15. Set power supply 1 for 23 V, measure:
V(J1(VAC)) = 23 V ± 0.5 V
I(J1(IAC)) = 2.1 A ± 0.5 A
V(J3(VBAT)) = 23.5 V ± 0.5 V
I(J3(IBAT)) = 2 A ± 0.5 A
16. Set power supply 1 for 10 V, measure:
V(J1(VAC)) = 10 V ± 0.5 V
I(J1(IAC)) = 5 A ± 0.5 A
V(J3(VBAT)) = 23.5 V ± 0.5 V
I(J3(IBAT)) = 2 A ± 0.5 A
Use the following guidelines to test the BQ25750 EVM power path:
1. Disconnect the power supply from J1 (VIN and PGND) and disconnect Load 1 from J3 (VOUT and PGND).
2. Connect the output of power supply 1 to J3 (VOUT and PGND).
3. Set power supply 1 for 20 V DC, 8 A current limit and then turn off power supply.
4. Connect a voltage meter across J2 (VSYS) and J2 (PGND).
5. Turn on power supply 1, measure V(J2(VSYS)) = 20 V ± 0.5 V.
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3 Hardware Design Files
This section includes the hardware design files for BQ25750EVM. This section also includes the schematics, board layouts, and Bill of Materials (BOM).
3.1 Schematic
PGND
PGND
1
2
J P2
PGNDPGND
PGND
PGND
100nF
100V
C10
100nF
100V
C11
100nF
100V
C19
100nF
100V
C20
DNP
100nF
100V
C21
100nF
100V
C23
100nF
100V
C32
DNP
750mW
3.30
R14
DNP
750mW
3.30
R15
DNP
100V
33pF
C14
DNP
100V
33pF
C15
DNP
100V
100pF
C25
DNP
0
R59
DNP
TP45 TP 46
TP41
PGND
5m
5W
R24
100nF
25V
C18
100nF
25V
C12
10uH
L1
1
2
J1
TB005-76 2-0 2BE
1
2
J3
TB005-76 2-0 2BE
ACDRV
DRV_SUP
BAT_DRV
BAT_SRC
MODE
ACP
ACN
ACUV
ACOV
/CE
/INT
SDA
SCL
/PG
STAT1
STAT2
HIDRV1
SW1
LODRV1
SYS
LODRV2
SW2
BTST2
HIDRV2
SRP
SRN
FB
FBG
TS
ILIM_HIZ
FSW_SYNC
ICHG
VAC
REGN
BAT
10
R10
SCL
1SDA
2INT
3
STAT1
4
STAT2
5
PG
6
CE
7TS 8
ICHG 9
ILIM_HIZ 10
FBG 11
FB 12
SRN 13
SRP 14
BAT_DRV
15
BAT_SRC
16
MODE
17
SW2 18
HIDRV2 19
BTST2 20
LODRV2 21
PGND
22
DRV_SUP
23
REGN
24
LODRV1 25
BTST1 26
HIDRV1 27
SW1 28
ACN
29 ACP
30
ACDRV
31
SYS 32
VAC
33
ACUV
34
ACOV
35
FSW_SYNC 36
PGND 37
BQ25750RRVT
U1
1
2
J P1
VBAT~29.4V
PGND
25V
4.7µF
C26
25V
4.7µF
C22
100k
R151
DNP
PGND
1.00M
R21
4.7uF
100V
C2
10
R5
10
R6
10
R22
10
R25
100nF
100V
C200
BTST1
100V
1µF
C16
100V
1µF
C74
DNP
0
R3
0
R8
0
R13
0
R23
0
R17
0
R20
VIN
GND
VOUT/VBAT
GND
Use Kelvin sense for SRP/SRN
Use Kelvin sense for ACP/ACN
*snubber circuit as placeholders only
*perform component value calculation separately
HV present on board. Not all HV nodes are labeled on design file. Proceed with caution
Output power limited by circuit operating conditions and power stage components
SW2
BTST2
DRV_SUP
BTST1
SW1
2.2µF
C13
0.1%
249k
R28
0.1%
13.7k
R64
Avoid physical contact with any part of the board when power is active
ACP ACN
HIDRV1
LODRV1
SW1
HIDRV2
SW2
LODRV2
FB
FBG
MODE
ACUV
ACOV
1
3
2
D7
FS V12 100V
DNP
1
3
2
D8
FS V12 100V
DNP
10uH
L2
DNP
470nF
16V
C35
470nF
16V
C34
133k
R27
25.5k
R30
PGND
PGND
PGND
PGND
PGND
PGND
PGNDPGND
PGND
PGND
PGND
0
R1000
DNP
0
R1001
DNP
0
R1002
DNP
0
R1003
DNP
2m
R2
4
1 5-6-7-8
2
3
Q1
AON6226 4
1 5-6-7-8
2
3
Q3
AON6226
4
1 5-6-7-8
2
3
Q4
AON6226
4
1 5-6-7-8
2
3
Q2
AON6226
AC_OUT
P_OUT
VSYS
SRP SRN
PGND
BAT
Voltage Divider
PGND
VSYS
1
2
J2
TB005-76 2-0 2BE
100nF
100V
C63
100V
1µF
C77
1nF
100V
C151
GND
PGND
VAC
0
R100
0
R101
DNP
SYS
4
15-6-7-8
2
3
100V
Q5
AONS66917
4
1 5-6-7-8
2
3
100V
Q6
AONS66917
13
NC
2
15V D1
SZBZX84C15LT3G
1nF
50V
C9
DNP
0
R12
ACDRV
BAT_DRV 0
R9
4
1 5-6-7-8
2
3
100V
Q7
AONS66917
1nF
50V
C36
DNP BAT_SRC
4
15-6-7-8 2 3
100V
Q8
AONS66917
0
R1004
DNP 0
R1005
DNP
21
D3
V1FM10-M3/H
2 1
D2
V1FM10-M3/H
0
R120
3.00k
R32
+
56uF
C44 +
56uF
C7
PGND
+
56uF
80V
C70
PGND
PGND
+
56uF
C57
PGND
+
56uF
C39 +
56uF
C38
PGND
Figure 3-1. BQ25750 EVM Schematic
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4.7uF
100V
C5
4.7uF
100V
C8
100V
10uF
C42
100V
10uF
C150
4.7uF
100V
C3
DNP 100V
10uF
C4
100V
10uF
C6
DNP
4.7uF
100V
C60
DNP
VSYS
PGND
100V
100pF
C43
100nF
100V
C80
100V
1µF
C81
100k
R152
DNP 100k
R153
DNP 100k
R154
DNP
+
15uF
75V
C502
DNP
+
15uF
75V
C503
DNP
100V
100pF
C152
4.7uF
100V
C45
DNP 100V
10uF
C46
DNP 100V
10uF
C53
4.7uF
100V
C54
DNP
100nF
100V
C17
100V
1µF
C82
4.7uF
100V
C28
100V
10uF
C29
4.7uF
100V
C40
100V
10uF
C56
+
15uF
75V
C504
DNP
+
15uF
75V
C505
DNP
P_OUT
PGND
100nF
100V
C24
1nF
100V
C31
100V
1µF
C78
+
15uF
75V
C507
DNP
+
15uF
75V
C506
DNP
PGND
BAT
+
15uF
75V
C500
DNP
+
15uF
75V
C501
DNP
PGND
AC_OUT
100k
R401
DNP 100k
R400
DNP
+
15uF
75V
C509
DNP
+
15uF
75V
C510
DNP
+
15uF
75V
C508
DNP +
15uF
75V
C511
DNP
+
15uF
75V
C513
DNP
+
15uF
75V
C512
DNP
+
15uF
75V
C514
DNP
+
15uF
75V
C515
DNP
+
15uF
75V
C516
DNP
+
15uF
75V
C517
DNP
+
15uF
75V
C518
DNP
+
15uF
75V
C519
DNP
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14 BQ25750 Evaluation Module SLUUCY7 – NOVEMBER 2023
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4
1
2
3
J5
0022 053041
1 2
3 4
5 6
7 8
9 10
J4
NORMAL
TS
1
2
J P 6
1
2
J P 5
1
2
J P 7
1
2
J P 9
1
2
J P 3
1
2
J P11
1
2
3
J P 12
PGND
1
2
J6
TP22TP21 TP29 TP 3 0 TP 31 TP32 TP33 TP 3 4
TP35 TP 3 6 TP39
PGND PGND
TP38
PGND
TP6TP4 TP7TP5 TP8 TP16TP9 TP10 TP11 TP12 TP 1 3 TP14 TP 15
TP23
TP17
TP24 TP25 TP 2 6 TP 27 TP28
TP18 TP 1 9 TP 20
TP42
TP43
TP44
Gre en
21
D4
1500 60VS75 000
Gre en
21
D5
1500 60VS75 000
Gre en
21
D6
1500 60VS75 000
LDO to generate pull-up voltage
VDC = 8V to 55V
3.3VDC@10mA
TP1 TP2 TP3
PGND
1 2
J P 16
USB2ANY Connector
SHDN
5
IN
8OUT 1
NC
3
NC
6
NC
7
ADJ 2
GND 4
GND 9
U2
LT3010EMS8E#PBF
499k
R48
220pF
50V
C50
1µF
25V
C48
PGND
1
2
J P 8
1
2
J P 14
1
2
J P 15
1
2
J P 13
30.1k
R65
5.23k
R34
3V3_PULLUP
EXT_DRV
PGND
1
2
J P 10
1
2
J P 4
2.21k
R50
2.21k
R51
2.21k
R52
100V
1uF
C49
DNP 100V
1uF
C33
316k
R49
20
R46
0
R45
1.5
R300
DNP
BQStudio Connector
2.49k
R66
4.99k
R67
5%
1.8k
R201
5%
1.8k
R200
PGND
PGND
PGND
100nF
10V
C202
100nF
10V
C201
10.0k
R56
10.0k
R55
10.0k
R41
BATVAC
SCL SDA
SDA
SCL
REGN
TS
FSW_SYNC
ICHG
REGN
DRV_SUP
ILIM_HIZ
SCL SDA /CE
/INT
/PG
STAT1 STAT2
LODRV2
LODRV1
FBG
REGN SYS BAT ACDRV BAT_DRV BAT_SRC ILIM_HIZ TS /PG ACP ACN VAC ACUV ACOV DRV_SUP FSW_SYNC ICHG SW1 SW2 MODE
/CE SRP SRN FB HIDRV1 BTST1 HIDRV2 BTST2 STAT1 /INT STAT2 SCL SDA
133k
R36
PGND
PGND
PGND
PGND
PGND
10.0k
R53
10.0k
R54
2 1
D10
VS-1EMH01HM3/5AT
21
D9
VS-1EMH01HM3/5AT
TP47
PGND
0
R160
1
2
3
4
5
MNT_1
MNT_2
J7
109159005101916 PGND
PGND
1 2
3 4
5 6
7 8
J8
TS W-10 4-0 7-G-D
0
R68
EXT_DRV
PP5V
0
R69
VIN3V3
PGND
PGND
3V3_PULLUP
BAT
VAC
3V3_PULLUP
EXT_DRV
/INT
SCL
SDA
/PG
TP37 TP 4 0
PGND PGND
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BMS042
A
PCB Number:
PCB Rev:
Assembly Note
ZZ1
These assemblies are ESD sensi

ve, ESD precau

ons shall be observed.
Assembly Note
ZZ2
These assemblies must be clean and free from

ux and all contaminants. Use of no clean

ux is not acceptable.
Assembly Note
ZZ3
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise speci

ed.
SH-JP1 SH-JP2 SH-JP3 SH-JP4 SH-JP9 SH-JP10SH-JP7 SH-JP11SH-JP6 SH-JP8
LOGO
PCB
LOGO7
WEEE logo
LOGO5
CE Mark
LOGO
PCB
LOGO4
Texas Instruments
LOGO
PCB
LOGO6
FCC disclaimer
PCB Label
LBL1
THT-14-423-10
Label Table
Variant LBL1 Label Text
BQ25750 BQ25750EVM
LOGO
PCB
LOGO3
CAUTION. READ USER GUIDE BEFORE USE
H1
SJ-5303 (CLEAR)
H2
SJ-5303 (CLEAR)
H3
SJ-5303 (CLEAR)
H4
SJ-5303 (CLEAR)
BQ25751
BQ25756
BQ25820
BQ25758 BQ25758EVM
SH-JP5
Assembly Note
ZZ5
For BQ25750 variant, Install JP1, JP4, JP5, JP6, JP9, JP10, pin 1-2 of JP12, JP13, JP14, JP15, and JP16
FID1
Fiducial
Assembly Note
ZZ4
Install label in silkscreened box aer final wash. Text shall be 8 pt font. Text shall be per the Label Table in the PDF schemac.
FID2
Fiducial
FID3
Fiducial
FID4
Fiducial
FID5
Fiducial
FID6
Fiducial
LOGO2
CAUTION HOT SURFACE
LOGO1
DANGER HIGH VOLTAGE
Assembly Note
ZZ6
For BQ25758 variant, Install JP4, JP5, JP6, JP9, JP10, pin 1-2 of JP12, JP13, JP14, JP15, and JP16
BQ25756EVM
Assembly Note
ZZ7
For BQ25756 variant, Install JP1, JP4, JP5, JP6, JP9, JP10, pin 1-2 of JP12, JP13, JP14, JP15, and JP16
1. DNP means Do Not Populate.
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3.2 PCB Layout
Figure 3-2. Top Layer and Overlay
Figure 3-3. Layer 2 -GND
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Figure 3-4. Signal Layer 1
Figure 3-5. Signal Layer 2
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Figure 3-6. Layer 5 - GND
Figure 3-7. Bottom Layer
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3.3 Bill of Materials
Table 3-1. Bill of Materials
Item
Number Designator Quantity Value Part Number Manufacturer Description Package Reference
1 C2, C5, C8,
C28, C40
5 4.7µF GCJ32DC72A475KE01L Murata 4.7uF ±10% 100V Ceramic Capacitor X7S
1210 (3225 Metric)
1210
2 C4, C29, C42,
C53, C56, C150
6 10µF C3225X7R2A106K250AC TDK 10 µF ±10% 100V Ceramic Capacitor X7R
1210 (3225 Metric)
1210
3 C7, C38, C39,
C44, C57, C70
6 56µF 80SXV56M Panasonic 56 µF 80 V Aluminum - Polymer Capacitors
Radial, Can - SMD 28mOhm 1000 Hrs @
125°C
SMT_CAP_10MM3_10MM3
4 C10, C11, C17,
C19, C21, C23,
C24, C63, C80,
C200
10 0.1uF HMK107B7104KAHT Taiyo Yuden CAP, CERM, 0.1 µF, 100 V,+/- 10%, X7R,
AEC-Q200 Grade 1, 0603
603
5 C12, C18 2 0.1uF 06033C104KAT2A AVX CAP, CERM, 0.1 uF, 25 V, +/- 10%, X7R, 0603 603
6 C13 1 CGA6N3X7R2A225K230AE TDK Corporation Cap Ceramic 2.2uF 100V X7R 10% SMD
1210 FlexiTerm 125C Plastic T/R
1210
7 C16, C77, C78,
C81, C82
5 1uF 08051C105K4Z2A AVX CAP, CERM, 1 µF, 100 V,+/- 10%, X7R, AEC-
Q200 Grade 1, 0805
805
8 C22, C26 2 4.7µF CGA4J1X7R1E475K125AE TDK Corporation Cap Ceramic 4.7uF 25V X7R 10% Pad SMD
0805 +125°C Automotive T/R
805
9 C31, C151 2 1000pF CGA3E2X7R2A102K080AA TDK Multilayer Ceramic Capacitors MLCC -
SMD/SMT CGA 0603 100V 1000pF X7R 10%
AEC-Q200
603
10 C33 1 1µF 12101C105KAT2A AVX General Purpose Ceramic Capacitor, 1210,
1uF, 10%, X7R, 15%, 100V
1210
11 C34, C35 2 0.47uF C0603C474K4RACTU Kemet CAP, CERM, 0.47 uF, 16 V, +/- 10%, X7R,
0603
603
12 C43, C152 2 100pF CGA3E2C0G2A101J080AA TDK Multilayer Ceramic Capacitors MLCC -
SMD/SMT CGA 0603 100V 100pF C0G 5%
AEC-Q200
603
13 C48 1 1uF C0805C105K3RACTU Kemet CAP, CERM, 1 uF, 25 V, +/- 10%, X7R, 0805 805
14 C50 1 220pF C0603C221K5RACTU Kemet CAP, CERM, 220 pF, 50 V, +/- 10%, X7R,
0603
603
15 C201, C202 2 0.1uF C0603C104K8RACTU Kemet CAP, CERM, 0.1 uF, 10 V, +/- 10%, X7R, 0603 603
16 D1 1 SZBZX84C15LT3G On Semiconductor Zener Diode Single 15V 5% 30Ohm 300mW
Automotive 3-Pin SOT-23 T/R
SOT23
17 D2, D3 2 V1FM10-M3/H Vishay Diode Schottky 1A Surface Mount DO-219AB
(SMF)
DO-219AB
18 D4, D5, D6 3 Green 150060VS75000 Wurth Elektronik LED, Green, SMD LED_0603
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