Texas Instruments bq20z70EVM-001 User manual

User's GuideSLUU242A – May 2006 – Revised June 2006
bq20z70EVM-001 SBS 1.1 Impedance Track™TechnologyEnabled Battery Management Solution Evaluation Module
This EVM is a complete evaluation system for the bq20z70/bq29330/bq29412 batterymanagement system. The EVM includes one bq20z70/bq29330/bq29412 circuitmodule, a current sense resistor, two thermistors, an EV2300 PC interface board forgas gauge interface, a PC USB cable, and Windows™-based PC software. The circuitmodule includes one bq20z70 IC, one bq29330 IC, one bq29412 IC, and all otheronboard components necessary to monitor and predict capacity, perform cell balancing,monitor critical parameters, protect the cells from overcharge, over discharge, shortcircuit, and overcurrent in 2-, 3- or 4-series cell Li-ion or Li-polymer battery packs. Thecircuit module connects directly across the cells in a battery. With the EV2300 interfaceboard and software, the user can read the bq20z70 data registers, program the chipsetfor different pack configurations, log cycling data for further evaluation, and evaluatethe overall functionality of the bq20z70/bq29330/bq29412 solution under differentcharge and discharge conditions.
Contents1 Features ............................................................................................. 32 bq20z70/bq29330-Based Circuit Module ........................................................ 33 bq20z70/bq29330 Circuit Module Schematic ................................................... 44 Circuit Module Physical Layouts and Bill of Materials ......................................... 45 EVM Hardware and Software Setup ............................................................ 106 Troubleshooting Unexpected Dialog Boxes ................................................... 107 Hardware Connection ............................................................................ 108 Operation ........................................................................................... 129 Calibration Screen ................................................................................ 1510 Pro (Advanced) Screen .......................................................................... 1711 Related Documentation from Texas Instruments ............................................. 18
List of Figures
1 bq20z70EVM-001 Layout (Silk Screen) ......................................................... 52 Top Assembly ....................................................................................... 53 Top Layer ............................................................................................ 54 Bottom Layer ........................................................................................ 65 Bottom Assembly ................................................................................... 66 Schematic ........................................................................................... 97 bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger ...... 118 SBS Data Screen ................................................................................. 139 Data Flash Screen, 1st Level Safety Class .................................................... 1410 Calibration Screen ................................................................................ 1611 Pro (Advanced) Screen .......................................................................... 18
List of Tables
1 Ordering Information ............................................................................... 32 Bill of Materials ...................................................................................... 7
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3 Performance Specification Summary ........................................................... 104 Circuit Module to EV2300 Connections ........................................................ 11
Impedance Track is a trademark of Texas Instruments.Windows is a trademark of Microsoft Corporation.
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1 Features
1.1 Kit Contents
1.2 Ordering Information
2 bq20z70/bq29330-Based Circuit Module
2.1 Circuit Module Connections
Features
•Complete evaluation system for the bq20z70 SBS 1.1-compliant advanced gas gauge with ImpedanceTrack™ Technology, bq29330 analog front end (AFE) and protection IC, and bq29412 independentovervoltage protection IC•Populated circuit module for quick setup•PC software and interface board for easy evaluation•Software that allows data logging for system analysis
•bq20z70/bq29330/bq29412 circuit module•EV2300 PC interface board•Software CD with the evaluation software•Connection cable to interface board•Set of support documentation•EV2300 USB interface board
Table 1. Ordering Information
EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY
bq20z70EVM-001 Li-ion 2, 3, or 4 cell Any
The bq20z70/bq29330/bq29412-based circuit module is a complete and compact example solution of abq20z70 and bq29330 circuit for battery management and protection of Li-ion or Li-polymer packs. Thecircuit module incorporates a bq20z70 battery monitor IC, bq29330 AFE and protection IC, bq29412independent overvoltage protection IC, and all other components necessary to accurately predict thecapacity of 2-, 3-, or 4-series cells.
Contacts on the circuit module provide the following connections:•Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+)•To the serial communications port (SMBC, SMBD, VSS)•The system load and charger connect across PACK+ and PACK–•To the system present pin (SYS PRES)
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2.2 Pin Descriptions
3 bq20z70/bq29330 Circuit Module Schematic
3.1 Schematic
3.2 Choosing Particular Precharge Mode
3.3 Testing Fuse-Blowing Circuit
4 Circuit Module Physical Layouts and Bill of Materials
bq20z70/bq29330 Circuit Module Schematic
PIN NAME DESCRIPTION1N –ve connection of first (bottom) cell1P +ve connection of first (bottom) cell2P +ve connection of second cell3P +ve connection of third cell4P +ve connection of fourth (top) cellSMBC Serial communication port clockSMBD Serial communication data portVSS Pack negative terminalPACK– Pack negative terminalSYS PRES System present pin (if low, system is present)PACK+ Pack positive terminal
This section contains information for modifying and choosing a precharge mode forbq20z70/bq29330/bq29412 implementation.
The schematic follows the bill of materials in this user's guide.
The chipset supports both a charger that has a precharge mode and one that does not. The EVM bydefault supports a charger that does not have a precharge mode. This is configured by grounding thePMS pin with a resistor. R12 and Q2 are used as the precharge current path in order to sustain sufficientPack+ voltage when the battery voltage is too low to power up the bq29330 IC.
If the charger has a precharge function, R12 and FET Q2 are not used. The PMS pin must be pulled highto disable ZVCHG output. The charge FET Q1 is used as the precharge FET, and the charger mustcontrol the precharge current and voltage.
Note: The configuration at PMS pin is a hardware level control. Once the bq20z70 is up and running, thefirmware may change the precharge settings. Please refer to bq20z70 datasheet for further information.
To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is notprovided in the circuit. FET Q4 drives TP3 low if a fuse-blow condition occurs; so monitoring TP3 can beused to test this condition.
This section contains the board layout, bill of materials, and assembly drawings for the bq20z70/ bq29330/bq29412 circuit module.
Note: For the battery pack designer: D3 is not recommended, and should be shorted out if theDSG FET does not have built-in zener diode protection.
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4.1 Board Layout
Circuit Module Physical Layouts and Bill of Materials
This section shows the dimensions, PCB layers, and assembly drawing for the bq20z70/bq29330 module.
Figure 1. bq20z70EVM-001 Layout (Silk Screen)
Figure 2. Top Assembly
Figure 3. Top Layer
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Circuit Module Physical Layouts and Bill of Materials
Figure 4. Bottom Layer
Figure 5. Bottom Assembly
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4.2 Bill of Materials
Circuit Module Physical Layouts and Bill of Materials
Table 2. Bill of MaterialsCount Ref Des Value Description Size Part No. MFR
20 C1–C11, C14,C16–C20, 0.1 µF Capacitor, ceramic, 0.1 µF, 50 V, X7R, 20% 0603 STD AnyC22–C24
1 C12 0.22 µF Capacitor, ceramic, 0.22 µF, 25 V, X7R, 20% 0603 STD Any
3 C13, C15, C27 1.0 µF Capacitor, ceramic, 1.0 µF, 25 V, X7R, 20% 0805 STD Any
2 C21, C26 0.47 µF Capacitor, ceramic, 0.47 µF, 16 V, X7R, 20% 0603 STD Any
1 C25 2.2 µF Capacitor, ceramic, 2.2 µF, 10 V, X7R, 20% 0805 STD Any
4 D1, D3, D4, D6 BAS16 Diode, Switching, 150-mA, 75-V, 350 mW SOT23 BAS16 Vishay-Liteon
2 D2, D5 AZ23C5V6 Diode, dual, zener, 5.6V, 300mW SOT23 AZ23C5V6 Vishay-Telefunken
1 J1 22-05-3041 Header, friction lock assembly, 4-pin right angle 0.400 x 0.500 22-05-3041 Molex
2 Q1, Q3 FDS6690A MOSFET, N-ch, Logic Level, Power Trench, 30 SO8 FDS6690A FairchildV, 11 A, 12.5 m Ω
1 Q2 Si4435DY MOSFET, P-ch, 30 V, 8 A, 20 m ΩSO8 Si4435DY Siliconix
1 Q4 NDS331N MOSFET, N-ch, 20 V, 1.3 A, 0.16 ΩSOT23 NDS331N Fairchild
1 Q5 BSS138 MOSFET, N-ch, 50 V, 0.22 A, 6 ΩSOT23 BSS138 Fairchild
12 R1–R5, 100 Resistor, chip, 100 Ω, 1/16 W, 5% 0603 STD STDR21–R24, R31,R32, R36
2 R11, R19 3M Resistor, chip, 3 M Ω, 1/16 W, 5% 0603 STD STD
1 R12 301 Resistor, chip, 301 Ω, 1 W, 1% 2512 WSL-2512-301 Vishay
3 R13, R15, R18 5.1K Resistor, chip, 5.1 k Ω, 1/16 W, 5% 0603 STD STD
3 R14, R25, R30 1M Resistor, chip, 1 M Ω, 1/16 W, 5% 0603 STD STD
1 R16 100K Resistor, chip, 100 k Ω, 1/16 W, 5% 0603 STD STD
1 R17 0.010 Resistor, chip, 0.010 Ω, 1 W, 1% 2512 WSL-2512-010 Vishay75ppm
1 R20 10K Resistor, chip, 10 k Ω, 1/16 W, 5% 0603 STD STD
2 R26, R34 8.45K Resistor, chip, 8.45 k Ω, 1/16 W, 1% 0603 STD STD
2 R27, R33 61.9K Resistor, chip, 61.9 k Ω, 1/16 W, 1% 0603 STD STD
3 R28, R29, R35 220K Resistor, chip, 220 k Ω, 1/16 W, 5% 0603 STD STD
6 R6–R10, R37 1K Resistor, Chip 1 k Ω, 1/16W, 5% 0603 STD STD
2 RT1, RT2 10K Thermistor, 10 k Ω0.095 x 0.150 NTC103AT Sematec
2 TB1, TB3 ED1515 Terminal block, 3 pin, 6 A, 3,5 mm 0.41 x 0.25 ED1515 OST
1 TB2 ED1514 Terminal block, 2 pin, 6 A, 3,5 mm 0.27 x 0.25 ED1514 OST
1 TP1 GND Test point, White, Thru Hole Color Keyed 0.100 ×0.100 in 5002 Keystone
1 TP2 VCC Test point, White, Thru Hole Color Keyed 0.100 ×0.100 in 5002 Keystone
1 TP3 ~FUSE Test point, White, Thru Hole Color Keyed 0.100 ×0.100 in 5002 Keystone
1 U1 IC, voltage protection for 2, 3, or 4 cell Li-Ion, MSOP-08 BA29412DT3R TI2nd protection, 4.45 OVP ±25 mV (DCT3)
1 U2 IC, 2, 3, or 4 cell series protection control AFE TSSOP-30 bq29330DBT TI
1 U3 IC, SBS 1.1-Compliant GG Enabled with TSSOP-20 bq20z70PW TIImpedance Track™ technology, use with thebq29330
Connector
2 J5 mate Connector, Female, 0.100 centers Molex 22-01-3407
8 N/A Terminals, crimp, tin Molex 08-50-0114
N/A Wire, insulated 24 AWG. red, 18 inches ( ±3 inches) (USB_5V) Alpha 1854-3
N/A Wire, insulated 24 AWG. white, 18 inches ( ±3 inches) (SCL) Alpha 1854-1
N/A Wire, insulated 24 AWG. black, 18 inches ( ±3 inches) (GND) Alpha 1854-2
N/A Wire, insulated 24 AWG. brown, 18 inches ( ±3 inches) (SDA) Alpha 1854-7
1 N/A Heatsink, 1 inch Any Any
Notes:
1. These assemblies are ESD sensitive; observe ESD precautions.
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Circuit Module Physical Layouts and Bill of Materials
Table 2. Bill of Materials (continued)Count Ref Des Value Description Size Part No. MFR
2. This assembly must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. This assembly must comply with workmanship standards IPC-A-610 Class 2.
4. Reference designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent MFG'scomponents.
5. Make one SMBus connector wire assembly for each assembly produced, from J5 mate, 4-24 AWG wires, and crimp terminals. Wire colorsfor pin numbers are listed below. The wire assembly shall have a J5 mate on each end.
•Red – Pin 4 (Signal USB_5V)•Brown – Pin 3 (Signal Data)•White – Pin 2 (Signal Clock)•Black – Pin 1 (GND)6. RT1/RT2 should be assembled horizontally laying flat against the board edge with the sensing tip out.
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Note: For the battery pack designer:D3 is not recommended,
and should be shorted out if the DSG FET does not
have built-in zener diode protection.
4.3 bq20z70/bq29330/bq29412 Circuit Module Performance Specification Summary
Circuit Module Physical Layouts and Bill of Materials
Figure 6. Schematic
This section summarizes the performance specifications of the bq20z70/ bq29330/bq29412 circuit module.
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5 EVM Hardware and Software Setup
5.1 System Requirements
5.2 Software Installation
6 Troubleshooting Unexpected Dialog Boxes
7 Hardware Connection
7.1 Connecting the bq20z70/bq29330/bq29412 Circuit Module to a Battery Pack
EVM Hardware and Software Setup
Table 3. Performance Specification Summary
Specification Min Typ Max Units
Input voltage Pack+ to Pack- 6 15 25 VCharge and discharge current 0 2 7 A
This section describes how to install the bq20z70EVM-001 PC software, and how to connect the differentcomponents of the EVM.
The bq20z70EVSW requires Windows 2000 or Windows XP. Drivers for Windows 98SE are provided, butMicrosoft no longer supports Windows 98; and there may be issues in Windows 98 with USB driversupport. The EV2300 USB drivers have been tested for Windows 98SE, but no assurance is made forproblem-free operation with specific system configurations.
Find the latest software version in the bq20z70 tool folder on power.ti.com . Use the following steps toinstall the bq20z70EVSW software:1. Copy the files from the CD into the temporary directory you selected, in the folder "bq20z70 EV SWInstall", double-click on bqEVSWSetup00.09.32.exe and follow the installer instructions to complete thebq20z70 EVSW installation.2. If the EV2300 was not previously installed, after bq20z70 EVSW installation, a TI USB DRIVERINSTALLER will pop up. Click "Yes" for the agreement message and follow its instructions.3. Plug the EV2300 into a USB port.4. The Win98 Driver can be found in the archive Win98EV2300Drivers-DocUpdateDec1703.zip under the"EV2300 Drivers" folder.
If files were downloaded from the Web:1. Open the archive containing the installation package, and copy its contents in a temporary directory.2. Follow the preceding steps 1 - 4.
Ensure that the files were extracted from the zip file using the Preserve Folder names option.
Ensure that all the files were extracted from the zip file.
The user that is downloading the files must be logged in as the administrator.
The driver is not signed, so the administrator must allow installation of unsigned drivers in the operatingsystem policy.
The bq20z70EVM-001 comprises three hardware components: the bq20z70/bq29330/bq29412 circuitmodule, the EV2300 PC interface board, and the PC.
Figure 7 shows how to connect the bq20z70/bq29330/bq29412 circuit module to the cells and systemload/charger.
The cells should be connected in the following order:1. 4-Cell Pack: 1N (BAT-), 1P, and 2P (see Section 2.1 for definitions).
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7.2 PC Interface Connection
Hardware Connection
2. 3-Cell Pack: 1N (BAT-), 1P, 2P, and then connect 4P and 3P together.3. 2-Cell Pack: 1N (BAT-), 1P, and then connect 4P, 3P, and 2P together
To start charge or discharge test, connect SYS PRES pin to PACK- pin to set SYS PRES state. To testsleep mode, disconnect the SYS PRES pin.
Figure 7. bq20z70/bq29330 Circuit Module Connection to Cells and System Load/Charger
The following steps configure the hardware for interface to the PC:1. Connect the bq20z70/bq29330-based smart battery to the EV2300 using wire leads as shown inTable 4 .
Table 4. Circuit Module to EV2300 Connections
bq20z70/bq29330-Based Battery EV2300
SMBD SMBDSMBC SMBCVSS GND
2. Connect the PC USB cable to the EV2300 and the PC USB port.
The bq20z70EVM-001 is now set up for operation.
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8 Operation
8.1 Starting the Program
Operation
This section details the operation of the bq20z70 EVSW software. Note: the EV2300 driver does notsupport Windows Sleep or Hibernate. In case there is a problem communicating with the EV2300 or theEVM, first unplug the USB cable then plug it back in. If the problem persists, check whether the EVM is inShutdown mode. The bq20z70 can be waken up by momentarily applying a voltage higher than 5.5V (butless than 25V) at Pack+ pin of the EVM.
With the EV2300 and the bq20z70 EVM connected to the computer, run bq20z70 EVSW from the Start |Programs | Texas Instruments | bq20z70 EVSW menu sequence. The SBS Data screen appears. Databegins to appear once the <Refresh> (single time scan) button is clicked, or when the <Keep Scanning>check box is checked. To disable the scan feature, deselect <Keep Scanning>.
The continuous scanning period can be set via the |Options| and |Set Scan Interval| menu selections. Therange for this interval is 0 ms to 65535 ms. Only items that are selected for scanning are scanned withinthis period.
The bq20z70 EVSW provides a logging function which logs the values that were last scanned by EVSW.To enable this function, select the Start Logging button; this causes the Keep Scanning button to beselected. When logging is Stopped, the keep scanning button is still selected and has to be manuallyunchecked.
The logging interval are specified under the |Options| menu with the maximum value of 65535milliseconds. The Log interval cannot be smaller than the scan interval because this results in the samevalue being logged at least twice.
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8.2 Setting Programmable bq20z70 and bq29330 Options
Operation
Figure 8. SBS Data Screen
This screen shows the SBS data set along with additional ManufacturersAccess() command informationsuch as individual cell measurements. Additional Flag and Static data can be viewed by selecting theappropriate tab at the bottom of the SBS screen.
Data such as SBS.ManufacturerName( ) is static and does not change. This data is viewed separatelyusing the Static Data tab available at the bottom of the screen.
Dragging the splitter bar (line that separates the Flags/Static data from SBS values) changes the height ofthe Flags/Static Data display. Selecting |View| then |Auto Arrange| returns the splitter bar to its originallocation.
The bq20z70 data flash comes configured per the default settings detailed in the bq20z70 data sheet(SLUS686 ). Ensure that the settings are correctly changed to match the pack and application for thebq20z70/bq29330 solution being evaluated.
IMPORTANT: The correct setting of these options is essential to get the best performance.
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Operation
The settings can be configured using the Data Flash screen.
Figure 9. Data Flash Screen, 1st Level Safety Class
To read all the data from the bq20z70 data flash, click on menu option | Data Flash | Read All |.
To write to a data flash location, click on the desired location, enter the data, and press <Enter>, whichwrites the entire tab of flash data, or select menu option |Data Flash|Write All|. The data flash must beread before any writes are performed to avoid any incorrect data being written to the device.
The | File | Special Export | menu options allows the data flash to be exported, but it configures theexported data flash to a learned state ready for mass production use.
The data flash configuration can be saved to a file by selecting | File | Export |, and entering a file name. Adata flash file can also be retrieved in this way, imported, and written to the bq20z70 using the | Write All |button.
The configuration information of the bq29330 and module calibration data is also held in the bq20z70 dataflash.
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9 Calibration Screen
9.1 How to Calibrate
9.2 To Calibrate the bq20z70
9.3 Board Offset Calibration
9.4 Pack Voltage Calibration
Calibration Screen
The bq20z70 allows for an automatic data flash export function, similar to the SBS Data logging function.This feature, when selected via | Options | Auto Export |, exports Data Flash to a sequential series of filesnamed as FilenameNNNNN.gg where N = a decimal number from 0 to 9.
The AutoExport interval is set under the | Options menu | with a minimum value of 15 seconds. TheAutoExport filename is also set under the | Options menu |.
When there is a check next to | AutoExport |, the AutoExport is in progress. The same menu selection isused to turn on/off AutoExport.
If the data flash screen is blank, then the bq20z70 that is being used may not be supported by thebqEVSW version that is being used. An upgrade may be required.
Before the bq20z70 is calibrated:•Connect a load to Pack- and Pack+ that draws approximately 2 A and measures discharge current touse the FETs.•Connect a current source to Batt- and Pack- to calibrate without using the FETs.•Measure the pack voltage from Batt+ to Batt- (Total of Cell voltages).•Measure the temperature of the pack.•These steps may or may not be required, depending on the type of calibration being performed.
Select the types of calibration to be performed.
Enter the measured values for the types selected (Except for CC Offset Calibration).
If Voltage Calibration is selected, then enter the number of cells on the pack.
If Temperature Calibration is selected, then select the sensor that is to be calibrated.
If the load is connected between Pack+ and Pack-, then select the Use FETs check box.
Press the Calibrate Part button.
This performs the offset calibration for the current offset of the board.
Remove load/external voltage.
Press the Software Board Offset Calibration button.
This calibrates the voltage at the AFE Pack pin.
Make sure Voltage Calibration has been performed for the pack. If Voltage Calibration is not performed,then Pack Voltage Calibration calibrates incorrectly.
Remove load/external voltage applied between Pack+ and Pack-.
Press the Pack Voltage button to calibrate.
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Calibration Screen
Figure 10. Calibration Screen
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10 Pro (Advanced) Screen
10.1 SMB Communication
10.2 Hex/Decimal Converter
Pro (Advanced) Screen
The set of read/write operations over SMBus are not specific to any gas gauge. These are provided asgeneral-purpose communication tools.
These two boxes convert between hexadecimal (hex) and decimal as soon as values are typed into theboxes. Invalid values may cause erroneous results.
When scaling converted hex values to a higher number of bytes, follow these rules:•When unsigned is selected, the left pad contains zeroes.•When signed is selected, the left pad contains zeroes for a positive number, or the left pad contains Ffor negative numbers.
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10.3 Programming
11 Related Documentation from Texas Instruments
Related Documentation from Texas Instruments
Allows for device reprogramming from unencrypted and encrypted files.
Figure 11. Pro (Advanced) Screen
To obtain a copy of any of the following TI document, call the Texas Instruments Literature ResponseCenter at [phone] or the Product Information Center (PIC) at [phone]. When ordering,identify this document by its title and literature number. Updated documents can also be obtained throughthe TI Web site at www.ti.com
Documents: Literature Number:bq20z70 Data Sheet SLUS686bq20z70 Technical Reference SLUU250bq29330 Data Sheet SLUS673
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EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATIONPURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling theproduct(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided arenot intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations,including product safety and environmental measures typically found in end products that incorporate such semiconductorcomponents or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regardingelectromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet thetechnical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BYSELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDINGANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from allclaims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility totake any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHERFOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement ofpatents or services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling theproduct. This notice contains important safety information about temperatures and voltages. For additional information on TI’senvironmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh .No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATIONPURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, andcan radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of thisequipment in other environments may cause interference with radio communications, in which case the user at his own expensewill be required to take whatever measures may be required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 6 V to 25 V and the output voltage range of 0 V to 16.4 V.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there arequestions concerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to theEVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the loadspecification, please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than 60 °C. The EVM is designed tooperate properly with certain components above 60 °C as long as the input and output ranges are maintained. These componentsinclude but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types ofdevices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes nearthese devices during operation, please be aware that these devices may be very warm to the touch.
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