Texas Instruments LMX9838 User manual

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Radio
Antenna Link
Manager UART
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LMX9838
SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014
LMX9838 Bluetooth Serial Port Module
1 Features 3 Description
The Texas Instruments LMX9838 Bluetooth Serial
1• Complete Bluetooth®2.0 Stack Including Port module is a fully integrated Bluetooth 2.0
– Baseband and Link Manager baseband controller, 2.4 GHz radio, crystal, antenna,
– Protocols: L2CAP, RFCOMM, SDP LDO and discreets; combined to form a complete
small form factor (10 mm x 17 mm x 2.0 mm)
– Profiles: GAP, SDAP, SPP Bluetooth node.
• High Integration: Includes Processor, Antenna, All hardware and firmware is included to provide a
Crystal, EEPROM, LDO complete solution from antenna through the complete
• Supporting up to 7 Active Bluetooth Data Links lower and upper layers of the Bluetooth stack, up to
and 1 Active SCO Link the application including the Generic Access Profile
• Class 2 Operation (GAP), the Service Discovery Application Profile
(SDAP), and the Serial Port Profile (SPP). The
• UART Command/Data Port Speed 921.6kbits/s module includes a configurable service database to
• AAI for External PCM Codec fulfil service requests for additional profiles on the
• Better than -80dBm Input Sensitivity host. Moreover, the LMX9838 is qualified as a
• FCC, IC, CE, and Japan MIC Certified Bluetooth endproduct, ready to be used in the end
application without additional testing and license cost.
• Bluetooth SIG QD ID: B012394
• Compact Size: 10 mm x 17 mm x 2.0 mm Based on TI’s CompactRISC 16-bit processor
architecture and Digital Smart Radio technology, the
LMX9838 is optimized to handle the data and link
2 Applications management processing requirements of a Bluetooth
• Factory Automation and Control node.
• Test and Measurement Device Information(1)
• Telematics PART NUMBER PACKAGE BODY SIZE (NOM)
• POS Terminals LMX9838 PLGA (70) 17.00 mm × 10.00 mm
• Medical/Telemedicine (1) For all available packages, see the orderable addendum at
• Data Logging Systems the end of the data sheet.
• Audio Gateways
4 Block Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMX9838
SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014 www.ti.com
Table of Contents
8.3 Feature Description................................................... 9
1 Features.................................................................. 18.4 Device Functional Modes........................................ 17
2 Applications ........................................................... 18.5 Programming - Command Interface........................ 21
3 Description............................................................. 19 Application and Implementation ........................ 26
4 Block Diagram........................................................ 19.1 Typical Applications ............................................... 26
5 Revision History..................................................... 210 Power Supply Recommendations ..................... 31
6 Pin Configuration and Functions......................... 310.1 Power Supply Schematics ................................... 31
7 Specifications......................................................... 510.2 Filtered Power Supply........................................... 33
7.1 Absolute Maximum Ratings ...................................... 510.3 Power Up .............................................................. 33
7.2 Handling Ratings ...................................................... 511 Regulatory Compliance...................................... 35
7.3 Recommended Operating Conditions....................... 511.1 FCC Instructions ................................................... 35
7.4 Thermal Information.................................................. 512 Device and Documentation Support ................. 38
7.5 Power Supply Requirements .................................... 612.1 Device Support .................................................... 38
7.6 Digital DC Characteristics ........................................ 612.2 Documentation Support ....................................... 38
7.7 RF Receiver Performance Characteristics................ 712.3 Trademarks........................................................... 38
7.8 RF Transmitter Performance Characteristics............ 712.4 Electrostatic Discharge Caution............................ 38
7.9 RF Synthesizer Performance Characteristics........... 812.5 Glossary................................................................ 38
8 Detailed Description.............................................. 913 Mechanical, Packaging, and Orderable
8.1 Overview................................................................... 9Information........................................................... 38
8.2 Functional Block Diagram......................................... 9
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (January 2014) to Revision F Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
• Changed EN 301 489-17 v1.2.1 to EN 301 489-17 v2.2.1................................................................................................... 35
Changes from Revision D (April 2013) to Revision E Page
• Added two parameters for operating conditions..................................................................................................................... 5
• Changed schematic.............................................................................................................................................................. 28
Changes from Revision C (April 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 36
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6 Pin Configuration and Functions
PLGA NAW0070A Package
70 Pins
Top View
Pin Functions
PAD NAME PAD LOCATION I/O DEFAULT LAYOUT DESCRIPTION
SYSTEM INTERFACE SIGNALS
OP3 16 I OP3: Pin checked during Startup Sequence for configuration option
OP4: I OP4: Pin checked during Startup Sequence for configuration option
OP4/PG4 26 PG4: I/O PG4: GPIO
OP5 25 I/O OP5: Pin checked during Startup Sequence for configuration option
32K- 28 O NC (if not used) 32.768 kHz Crystal Oscillator
32K+ 27 I GND (if not used) 32.768 kHz Crystal Oscillator
UART Interface Signals
CTS#(1) 15 I GND (if not used) Host Serial Port Clear To Send (active low)
RTS#(2) 14 O NC (if not used) Host Serial Port Request To Send (active low)
RXD 12 I Host Serial Port Receive Data
TXD 13 O Host Serial Port Transmit Data
AUXILIARY PORTS INTERFACE SIGNALS
PG6 7 I/O GPIO - Default setup LINK STATUS indication
PG7 19 I/O GPIO - Default setup RF traffic LED indication
Low active, either
RESET# 2 I NC or connect to Module Reset (active low)
host
XOSCEN 8 O Host main Clock Request. Toggles with Main crystal (X1) enable/disable
AUDIO INTERFACE SIGNALS
SCLK 20 I/O Audio PCM Interface Clock
SFS 21 I/O Audio PCM Interface Frame Synchronization
SRD 23 I Audio PCM Interface Receive Data Input
STD 22 O Audio PCM Interface Transmit Data Output
(1) Connect to GND if CTS is not use.
(2) Treat As No Connect If RTS is not used. Pad required for mechanical stability.
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SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014 www.ti.com
Pin Functions (continued)
PAD NAME PAD LOCATION I/O DEFAULT LAYOUT DESCRIPTION
POWER, GROUND AND NO CONNECT SIGNALS
3, 4, 17, 18, 24,
GND I GND Must be connected to ground plane
29, 30, 31, 32
MVCC 6 I Module internal Voltage Regulator Input
1, 5, 33, 34, 35,
NC NC Place Pads for stability.
36, 37, 38, 39, 40
41, 42, 43, 44,
45, 46, 47, 48,
49, 50, 51, 52,
53, 54, 55, 56,
NC NC DO NOT PLACE ANY PADS.
57, 58, 59, 60,
61, 62, 63, 64,
65, 66, 67, 68,
69, 70
VCC_CORE 9 I/O Voltage Regulator Input/Output
VCC 10 I Voltage Regulator Input Baseband
VCC_IO 11 I Power Supply I/O
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7 Specifications
7.1 Absolute Maximum Ratings(1)
The following conditions are true unless otherwise stated in the tables: TA= –40°C to +85°C. VCC = 3.3 V. RF system
performance specifications are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform.
MIN MAX UNIT
VCC Digital Voltage Regulator input -0.2 4 V
VIVoltage on any pad with GND = 0 V -0.2 VCC + 0.2 V
Lead Temperature NOPB(2)(3)
TLNOPB 250 °C
(solder 40 sec.)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. This device is a high performance RF integrated circuit and is ESD sensitive. Handling and
assembly of this device should be performed at ESD free workstations.
(2) Reference IPC/JDEC J-STD-20C spec.
(3) NOPB = No Pb (No Lead).
7.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000
pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification 1000
JESD22-C101, all pins(2)
ESDMM ESD - Machine Model 200(3) V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) All pins meet 200V Macine Model ESD rating except pins RXD, TXD, CTS, RTS, PG4, OP5, PG6, PG7, SCL, SDA, MDOD1, MWCS,
SFS, STD, SRD RATED AT 150v.
7.3 Recommended Operating Conditions MIN NOM MAX UNIT
MVCC Module internal Voltage Regulator input 3.0 3.3 3.6 V
VCC Digital Voltage Regulator input 2.5 3.3 3.6 V
TRDigital Voltage Regulator Rise Time 10 μs
Ambient Operating Temperature Range
TA-40 +25 +85 °C
Fully Functional Bluetooth Node
VCC_IO(1) Supply Voltage Digital I/O 1.8 3.3 3.6 V
VCC_CORE Supply Voltage Output(2) 1.8 V
VCC_COREMAX Supply Voltage Output Max Load 5 mA
VCC_CORESHORT When used as Supply Input (VCC grounded) 1.6 1.8 2 V
(1) VCC must be > (VCC_IO - 0.5V) to avoid backdrive supply.
(2) Should not be used for external supplies
7.4 Thermal Information LMX9838
THERMAL METRIC(1) NAW UNIT
70 PINS
RθJA Junction-to-ambient thermal resistance 45 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Power Supply Requirements(1)(2)
PARAMETER MIN TYP(3) MAX UNIT
ICC-TX Power supply current for continuous transmit 65 mA
ICC-RX Power supply current for continuous receive 65 mA
IRXSL Receive Data in SPP Link, Slave 26 mA
IRXM Receive Data in SPP Link, Master 23 mA
ISnM Sniff Mode, Sniff interval 1 second 6.5 mA
ISC-TLDIS Scanning, No Active Link, TL Disabled 1.1 mA
(1) Power supply requirements based on Class II output power.
(2) Based on UART Baudrate 115.2kbit/s.
(3) VCC = 3.3 V, Ambient Temperature = +25 °C.
7.6 Digital DC Characteristics
PARAMETER TEST CONDITIONS MIN MAX UNIT
Logical 1 Input Voltage high 1.8 V ≤VCC_IO ≤3.0 V 0.7 x VCC_IO VCC_IO + 0.2
VIH V
(except oscillator I/O) 3.0 V ≤VCC_IO ≤3.6 V 2.0 VCC_IO + 0.2
Logical 0 Input Voltage low 1.8 V ≤VCC_IO ≤3.0 V -0.2 0.25 x VCC_IO
VIL V
(except oscillator I/O) 3.0 V ≤VCC_IO ≤3.6 V -0.2 0.8
Logical 1 Output Voltage high VCC_IO = 1.8 V 0.7 x VCC_IO
VOH V
(except oscillator I/O) VCC_IO = 3.0 V 2.4
Logical 0 Output Voltage low
VOL 0.4 V
(except oscillator I/O)
VHYS Hysteresis Loop Width(1) 0.1 x VCC V
IIH Logical 1 Input leakage High 10 µA
IIL Logical 0 Input leakage Low -10 µA
IOH Logical 1 Output Current VOH = 2.4 V, VCC_IO = 3.0 V -10 mA
IOL Logical 0 Output Current VOH = 0.4 V, VCC_IO = 3.0 V 10 mA
(1) Specified by design.
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7.7 RF Receiver Performance Characteristics
All tests performed are based on Bluetooth Test Specification revision 2.0. All tests are measured at antenna port unless
otherwise specified. TA= –40°C to +85°C--VDD_RF = 2.8 V unless otherwise specified. RF system performance specifications
are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform. All RF parameters are tested prior to the
antenna. PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
2.402 GHz -80 -76 dBm
RXsense Receive Sensitivity BER < 0.001 2.441 GHz -80 -76 dBm
2.480 GHz -80 -76 dBm
PinRF Maximum Input Level -10 0 dBm
F1= + 3 MHz,
IMP(2) Intermodulation Performance F2= + 6 MHz, -38 -36 dBm
PinRF = -64 dBm
RSSI Dynamic Range at LNA
RSSI -72 -52 dBm
Input PinRF = -10 dBm,
30 MHz < FCWI < 2 GHz, -10 dBm
BER < 0.001
PinRF = -27 dBm,
2000 MHz < FCWI < 2399 MHz, -27 dBm
BER < 0.001
Out Of Band Blocking
OOB(2) Performance PinRF = -27 dBm,
2498 MHz < FCWI < 3000 MHz, -27 dBm
BER < 0.001
PinRF = -10 dBm,
3000 MHz < FCWI < 12.75 GHz, -10 dBm
BER < 0.001
(1) Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.
(2) The f0= -64 dBm Bluetooth modulated signal, f1= -39dbm sine wave, f2= -39 dBm Bluetooth modulated signal, f0= 2f1- f2, and |f2- f1|
= n * 1MHz, where n is 3, 4, or 5. For the typical case, n = 3.
7.8 RF Transmitter Performance Characteristics
All tests performed are based on Bluetooth Test Specification revision 2.0. All tests are measured at antenna port unless
otherwise specified. TA= -40°C to +85°C--VDD_RF = 2.8V unless otherwise specified. RF system performance specifications
are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform. All RF parameters are tested prior to the
antenna. PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
2.402 GHz −4 0 +3 dBm
POUTRF Transmit Output Power 2.441 GHz −4 0 +3 dBm
2.480 GHz −4 0 +3 dBm
MOD ΔF1AVG Modulation Characteristics Data = 00001111 140 165 175 kHz
MOD ΔF2MAX(2) Modulation Characteristics Data = 10101010 115 125 kHz
ΔF2AVG/DF1AVG(3) Modulation Characteristics 0.8
20 dB Bandwidth 1000 kHz
Maximum gain setting:
POUT2*fo(4) PA 2nd Harmonic Suppression f0= 2402 MHz, -30 dBm
Pout = 4804 MHz
RF Output Impedance/Input
ZRFOUT(5) Pout @ 2.5 GHz 47 Ω
Impedance of RF Port (RF_inout)
(1) Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.
(2) ΔF2max ≥115 kHz for at least 99.9% of all Δf2max.
(3) Modulation index set between 0.28 and 0.35.
(4) Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.
(5) Not tested in production.
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7.9 RF Synthesizer Performance Characteristics
All tests performed are based on Bluetooth Test Specification revision 2.0. All tests are measured at antenna port unless
otherwise specified. TA= -40°C to +85°C. VDD_RF = 2.8V unless otherwise specified. RF system performance specifications
are ensured on Texas Instruments Flagstaff board rev 2.1 evaluation platform. All RF parameters are tested prior to the
antenna. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fVCO VCO Frequency Range 2402 2480 MHz
tLOCK Lock Time f0± 20 kHz 120 µs
Initial Carrier Frequency
Δf0offset(1) During preamble -75 0 75 kHz
Tolerance DH1 data packet -25 0 25 kHz
DH3 data packet -40 0 40 kHz
Δf0drift(1) Initial Carrier Frequency Drift DH5 data packet -40 0 40 kHz
Drift Rate -20 0 20 kHz/50µs
tD- Tx Transmitter Delay Time From Tx data to antenna 4 µs
(1) Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of < ±20ppm to meet
Bluetooth specifications.
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GPIO
UART
POR
LFO
32 kHz
Config
Options
Audio
Port
CVSD
Codecs
Combined
System and
Patch RAM
ROM
EPROM
Voltage
Regulator
XTAL
Compact RISC
Processor
BLUEtoothTM
Core
2.4 GHz
Radio
Antenna Link
Manager UART
Transport
PG6
PG7
TXD
RXD
RTS#
CTS#
RESET#
OP3
OP4/PG4
OP5
SCLK
SF
STD
SRD
32k+
32k-
LMX9838
www.ti.com SNOSAZ9F –JULY 2007–REVISED DECEMBER 2014
8 Detailed Description
8.1 Overview
LMX9838 is a fully certified Bluetooth 2.0 module, with integrated processor, radio, antenna, LDO, crystal, and
passive components to form a small form factor plug-n-play solution. The built-in Bluetooth stacks up to the
application layer allows users to communicate directly with SPP commands, and develop additional SPP-based
Bluetooth profiles on Host through UART interface.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Features Overview
The firmware supplied in the on-chip ROM memory offers a complete Bluetooth (v2.0) stack including profiles
and command interface. This firmware features point-to-point and point-to-multipoint link management supporting
data rates up to the theoretical maximum over RFComm of 704 kbps. The internal memory supports up to 7
active Bluetooth data links and one active SCO link.
The on-chip Patch RAM provided for lowest cost and risk, allows the flexibility of firmware upgrade.
The module is lead free and RoHS (Restriction of Hazardous Substances) compliant.
For more information on those quality standards, please visit our green compliance website at
http://focus.ti.com/quality/docs/qualityhome.tsp.
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Feature Description (continued)
8.3.2 Hardware
• Baseband and Link Management Processors based on TI's CompactRISC Core
• Embedded ROM and Patch RAM Memory
• Auxiliary Host Interface Ports:
– Link Status
– Transceiver Status (Tx or Rx)
• Advanced Power Management (APM) Features
• Supports Low-Power Mode with Optional 32.768 kHz Oscillator
• Full Radio Path Integrated Including Antenna
• On-Chip Reference Crystal for Bluetooth Operation
• Single Supply Voltage
8.3.3 Firmware
• Additional Profile Support on Host. e.g:
– Dial Up Networking (DUN)
– Facsimile Profile (FAX)
– File Transfer Protocol (FTP)
– Object Push Profile (OPP)
– Synchronization Profile (SYNC)
– Headset (HSP)
– Handsfree Profile (HFP)
– Basic Imaging Profile (BIP)
– Basic Printing Profile (BPP)
• On-Chip Application Including:
– Default Connections
– Command Interface:
– Link Setup and Configuration (also Multipoint)
– Configuration of the Module
– Service Database Modifications
– UART Transparent Mode
– Optimized Cable Replacement:
– Automatic Transparent Mode
– Event Filter
8.3.4 Compliance
• FCC compliance: The device complies with Part 15 of FCC Rules. Operation is subject to the following two
conditions:
– This device may not cause harmful interference
– This device must accept any interference received, including interference that may cause undesired
operation
• Compliant with IC for Canada, CE for Europe, and MIC for Japan. See Regulatory Compliance.
8.3.5 Package
• Complete system interface provided in Lead Grid Array on underside for surface mount assembly
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