Texas Instruments SimpleLink CC3200MOD User manual

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CC3200MOD
SWRS166 –DECEMBER 2014
CC3200MOD SimpleLink™ Wi-Fi
®
and Internet-of-Things Module Solution, a Single-Chip
Wireless MCU
1 Module Overview
1.1 Features
1– TCP/IP Stack
• The CC3200MOD is a Wi-Fi Module that Consists
of the CC3200R1M2RGC Single-Chip Wireless • 8 Simultaneous TCP, UDP, or RAW Sockets
MCU. This Fully Integrated Module Includes all • 2 Simultaneous TLS v1.2 or SSL 3.0
Required Clocks, SPI Flash, and Passives. Sockets
• Modular FCC, IC, and CE Certifications Save – Powerful Crypto Engine for Fast, Secured
Customer Effort, Time, and Money WLAN Connections With 256-Bit Encryption
• Wi-Fi CERTIFIED™ Modules, With Ability to – Station, Access Point, and Wi-Fi Direct™ Modes
Request Certificate Transfer for Wi-Fi Alliance – WPA2 Personal and Enterprise Security
Members – SimpleLink Connection Manager for Managing
• 1.27-mm Pitch LGA Package for Easy Assembly Wi-Fi Security States
and Low-Cost PCB Design – TX Power
• 17 dBm at 1 DSSS
• Applications Microcontroller Subsystem • 17.25 dBm at 11 CCK
– ARM Cortex-M4 Core at 80 MHz • 13.5 dBm at 54 OFDM
– Embedded Memory Options – RX Sensitivity
• Integrated Serial • –94.7 dBm at 1 DSSS
• RAM (up to 256KB) • –87 dBm at 11 CCK
• Peripheral Drivers in ROM • –73 dBm at 54 OFDM
– Hardware Crypto Engine for Advanced – Application Throughput
Hardware Security Including • UDP: 16 Mbps
• AES, DES, and 3DES • TCP: 13 Mbps
• SHA and MD5 • Power-Management Subsystem
• CRC and Checksum – Integrated DC-DC Converter With a Wide-
– 8-Bit, Fast, Parallel Camera Interface Supply Voltage:
– 1 Multichannel Audio Serial Port (McASP) • VBAT: 2.3 to 3.6 V
Interface With Support for I2S Format – Low-Power Consumption at 3.6 V
– 1 SD (MMC) Interface • Hibernate With Real-Time Clock (RTC):
– 32-Channel Micro Direct Memory Access 7μA
(μDMA) • Low-Power Deep Sleep: <275 μA
– 2 Universal Asynchronous • RX Traffic: 59 mA at 54 OFDM
Receivers/Transmitters (UARTs) • TX Traffic: 229 mA at 54 OFDM
– 2 Serial Peripheral Interfaces (SPIs) – Additional Integrated Components
– 1 Inter-integrated Circuit (I2C) • 40.0-MHz Crystal
– 4 General-Purpose Timers (GPTs) • 32.768-kHz Crystal (RTC)
– 16-Bit Pulse-Width Modulation (PWM) Mode • 8-Mbit SPI Serial Flash RF Filter and
– 1 Watchdog Timer Module Passive Components
– 4-Channel 12-Bit Analog-to-Digital Converters – Package and Operating Conditions
(ADCs) • 1.27-mm Pitch, 63-Pin, 20.5-mm ×
– Up to 25 Individually Programmable GPIO Pins 17.5 mm LGA Package for Easy Assembly
• Wi-Fi Network Processor Subsystem and Low-Cost PCB Design
– 802.11b/g/n Radio, Baseband, and Medium • Operating Temperature Range: –20°C to
Access Control 70°C
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC3200MOD
SWRS166 –DECEMBER 2014 www.ti.com
1.2 Applications
• Internet of Things (IoT) • Internet Gateway
• Cloud Connectivity • Industrial Control
• Home Automation • Smart Plug and Metering
• Home Appliances • Wireless Audio
• Access Control • IP Network Sensor Nodes
• Security Systems • Wearables
• Smart Energy
1.3 Description
Start your design with the industry’s first programmable FCC, IC, CE, and Wi-Fi Certified Wireless
microcontroller (MCU) module with built-in Wi-Fi connectivity. Created for the Internet of Things (IoT), the
SimpleLink CC3200MOD is a wireless MCU module that integrates an ARM Cortex-M4 MCU, allowing
customers to develop an entire application with a single device. With on-chip Wi-Fi, Internet, and robust
security protocols, no prior Wi-Fi experience is required for faster development. The CC3200MOD
integrates all required system-level hardware components including clocks, SPI flash, RF switch, and
passives into an LGA package for easy assembly and low-cost PCB design. The CC3200MOD is provided
as a complete platform solution including software, sample applications, tools, user and programming
guides, reference designs, and the TI E2E™ support community
The applications MCU subsystem contains an industry-standard ARM Cortex-M4 core running at 80 MHz.
The device includes a wide variety of peripherals, including a fast parallel camera interface, I2S, SD/MMC,
UART, SPI, I2C, and four-channel ADC. The CC3200 family includes flexible embedded RAM for code
and data; ROM with external serial flash bootloader and peripheral drivers; and SPI flash for Wi-Fi network
processor service packs, Wi-Fi certificates, and credentials.
The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-chip™ and contains an additional
dedicated ARM MCU that completely off-loads the applications MCU. This subsystem includes an 802.11
b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with
256-bit encryption. The CC3200MOD supports station, access point, and Wi-Fi Direct™ modes. The
device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip
includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The
power-management subsystem includes integrated DC-DC converters supporting a wide range of supply
voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC mode
requiring less than 7 μA of current.
Table 1-1. Module Information(1)
PART NUMBER PACKAGE BODY SIZE
CC3200MODR1M2AMOB MOB (63) 20.5 mm × 17.5 mm
(1) For more information, see Section 9,Mechanical Packaging and Orderable Information.
2Module Overview Copyright © 2014, Texas Instruments Incorporated
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CC3200MOD
VCC
GPIO &
Peripheral
Interfaces RF Filter
Serial
Flash
8Mbit
Pull-up
resistors
CC3200R1M2RGC
Power
Inductors
Caps
32-KHz
Crystal 40-MHz
Crystal
CC3200MOD
www.ti.com SWRS166 –DECEMBER 2014
1.4 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the CC3200MOD module.
(1) For 3200MOD module pin multiplexing details, refer to CC3200R device datasheet (literature number: SWAS032)
Figure 1-1. CC3200MOD Module Functional Block Diagram
Copyright © 2014, Texas Instruments Incorporated Module Overview 3
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ARM Cortex-M4 80 MHz Processor
ARM Processor (Wi-Fi Network Processor)
Wi-Fi Baseband
Wi-Fi MAC
Wi-Fi Radio
Wi-Fi Driver
Supplicant
TCP/IP
TLS/SSL
Internet Protocols
User Application
Embedded Wi-Fi
Embedded Internet
CC3200MOD
SWRS166 –DECEMBER 2014 www.ti.com
Figure 1-2. CC3200 Hardware Overview
Figure 1-3. CC3200 Software Overview
4Module Overview Copyright © 2014, Texas Instruments Incorporated
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CC3200MOD
www.ti.com SWRS166 –DECEMBER 2014
Table of Contents
1 Module Overview ........................................ 15.3 ARM Cortex-M4 Processor Core Subsystem....... 42
1.1 Features .............................................. 15.4 CC3200 Device Encryption ......................... 43
1.2 Applications........................................... 25.5 Wi-Fi Network Processor Subsystem............... 44
1.3 Description............................................ 25.6 Power-Management Subsystem .................... 45
1.4 Functional Block Diagram ............................ 35.7 Low-Power Operating Mode ........................ 45
2 Revision History ......................................... 65.8 Memory.............................................. 46
3 Terminal Configuration and Functions.............. 75.9 Boot Modes.......................................... 48
3.1 CC3200MOD Pin Diagram ........................... 76 Applications, Implementation, and Layout ....... 51
3.2 Pin Attributes ......................................... 86.1 Reference Schematics .............................. 51
3.3 Pin Attributes and Pin Multiplexing.................. 10 6.2 Bill of Materials...................................... 52
3.4 Recommended Pin Multiplexing Configurations .... 19 6.3 Layout Recommendations .......................... 52
3.5 Drive Strength and Reset States for Analog-Digital 7 Environmental Requirements and
Multiplexed Pins..................................... 22 Specifications........................................... 56
3.6 Pad State After Application of Power To Chip But 7.1 Temperature......................................... 56
Prior To Reset Release ............................. 22 7.2 Handling Environment .............................. 56
4 Specifications........................................... 23 7.3 Storage Condition ................................... 56
4.1 Absolute Maximum Ratings......................... 23 7.4 Baking Conditions................................... 56
4.2 Handling Ratings.................................... 23 7.5 Soldering and Reflow Condition .................... 56
4.3 Power-On Hours .................................... 23 8 Product and Documentation Support.............. 58
4.4 Recommended Operating Conditions............... 23 8.1 Development Support ............................... 58
4.5 Brown-Out and Black-Out........................... 24 8.2 Device Nomenclature ............................... 58
4.6 Electrical Characteristics (3.3 V, 25°C) ............. 25 8.3 Community Resources.............................. 59
4.7 Thermal Resistance Characteristics for MOB 8.4 Trademarks.......................................... 59
Package ............................................. 26 8.5 Electrostatic Discharge Caution..................... 59
4.8 Reset Requirement ................................. 26 8.6 Export Control Notice ............................... 59
4.9 Current Consumption ............................... 27 8.7 Glossary............................................. 59
4.10 WLAN RF Characteristics........................... 30 9 Mechanical Packaging and Orderable
4.11 Timing Characteristics............................... 31 Information .............................................. 60
5 Detailed Description ................................... 42 9.1 Mechanical Drawing................................. 60
5.1 Overview ............................................ 42 9.2 Package Option ..................................... 61
5.2 Functional Block Diagram........................... 42
Copyright © 2014, Texas Instruments Incorporated Table of Contents 5
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CC3200MOD
SWRS166 –DECEMBER 2014 www.ti.com
2 Revision History
DATE REVISION NOTES
November 2014 * Initial release.
6Revision History Copyright © 2014, Texas Instruments Incorporated
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44
45
46
47
48
49
50
51
52
53
54
27
26
25
24
23
22
21
20
19
18
17
28 29 30 31 3332 34 35 36 37 38 39 40 41 42 43
16 15 14 13 1112 10 9 8 7 6 5 4 3 2 1
63
59
55
62 61
60
57 56
58
GND
ANTSEL2
ANTSEL1
SOP1
SOP2
JTAG_TMS
JTAG_TCK
NC
GPIO28
JTAG_TDO
NC
GND
NC NC
NC
JTAG_TDI
GPIO22
GPIO13
GPIO12 GPIO17 GPIO16
GPIO15
GPIO14
GPIO11
GPIO10
GND
GND
GPIO0
NC
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GND NC
GND
RF_BG
GND
NC SOP0
nRESET
VBAT_DCDC_ANA
VBAT_DCDC_PA
GND
VDD_ANA2
VBAT_DCDC_DIG_IO
NC
GPIO30
GND
GND
GND
GND
GND
GND
GND
GND
GND
CC3200MOD
CC3200MOD
www.ti.com SWRS166 –DECEMBER 2014
3 Terminal Configuration and Functions
3.1 CC3200MOD Pin Diagram
Figure 3-1 shows the pin diagram for the CC3200MOD.
Figure 3-1. CC3200MOD Pin Diagram (Bottom View)
NOTE
Figure 3-1 shows the approximate location of pins on the module. For the actual mechanical
diagram refer to Section 9.
Copyright © 2014, Texas Instruments Incorporated Terminal Configuration and Functions 7
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CC3200MOD
SWRS166 –DECEMBER 2014 www.ti.com
3.2 Pin Attributes
Table 3-1 lists the pin descriptions of the CC3200MOD module. "DEVICE PIN NO" refers to the pin
number of the QFN part CC3200. This is stated here because the QFN pin is referred to in the SDK.
Table 3-1. Pin Attributes
MODULE MODULE PIN NAME TYPE DEVICE PIN NO MODULE PIN DESCRIPTION
PIN NO.
1 GND - Ground
2 GND - Ground
3 GPIO10 I/O 1 GPIO(1)
4 GPIO11 I/O 2 GPIO(1)
5 GPIO14 I/O 5 GPIO(1)
6 GPIO15 I/O 6 GPIO(1)
7 GPIO16 I/O 7 GPIO(1)
8 GPIO17 I/O 8 GPIO(1)
9 GPIO12 I/O 3 GPIO(1)
10 GPIO13 I/O 4 GPIO(1)
11 GPIO22 I/O 15 GPIO(1)
12 JTAG_TDI I/O 16 GPIO(1)
13 NC - 13 Reserved for TI
14 NC - 14 Reserved for TI
15 NC - 11 Reserved for TI
16 GND - Ground
17 NC - 12 Reserved for TI
18 JTAG_TDO I/O 17 GPIO(1)
19 GPIO28 I/O 18 GPIO(1)
20 NC - 23 Unused. Do not connect.
21 JTAG_TCK I/O 19 JTAG TCK input. Needs 100-kΩpulldown resistor to ground.(1)
22 JTAG_TMS I/O 20 JTAG TMS input. Leave unconnected if not used on product.(1)
23 SOP2 - 21 Add 2.7-kΩpulldown resistor to ground needed for functional
mode. Add option to pullup required for entering the UART load
mode for flashing.
24 SOP1 - 34 Reserved. Do not connect.
25 ANTSEL1 I/O 29 Antenna selection control(1)
26 ANTSEL2 I/O 30 Antenna selection control(1)
27 GND - Ground
28 GND - Ground
29 NC - 27, 28 Reserved for TI
30 GND - Ground
31 RF_BG I/O 31 2.4-GHz RF input/output
32 GND - Ground
33 NC - 38 Reserved for TI
34 SOP0 - 35 Optional 10-kΩpullup if user chooses to use SWD debug mode
instead of 4-wire JTAG
35 nRESET I 32 Power on reset. Does not require external RC circuit
36 VBAT_DCDC_ANA - 37 Power supply for the device, can be connected to battery (2.3 V
to 3.6 V)
37 VBAT_DCDC_PA - 39 Power supply for the device, can be connected to battery (2.3 V
to 3.6 V)
38 GND - Ground
(1) For pin multiplexing details, refer to CC3200R device data sheet
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CC3200MOD
www.ti.com SWRS166 –DECEMBER 2014
Table 3-1. Pin Attributes (continued)
MODULE MODULE PIN NAME TYPE DEVICE PIN NO MODULE PIN DESCRIPTION
PIN NO.
39 NC - 47 Leave unconnected
40 VBAT_DCDC_DIG_IO - 10, 44, 54 Power supply for the device, can be connected to battery (2.3 V
to 3.6 V)
41 NC - 25, 36, 48 Reserved for TI
42 GPIO30 I/O 53 GPIO(1)
43 GND - Ground
44 GPIO0 I/O 50 GPIO(1)
45 NC - 51 Reserved for TI
46 GPIO1 I/O 55 GPIO(1)
47 GPIO2 I/O 57 GPIO(1)
48 GPIO3 I/O 58 GPIO(1)
49 GPIO4 I/O 59 GPIO(1)
50 GPIO5 I/O 60 GPIO(1)
51 GPIO6 I/O 61 GPIO(1)
52 GPIO7 I/O 62 GPIO(1)
53 GPIO8 I/O 63 GPIO(1)
54 GPIO9 I/O 64 GPIO(1)
55 GND - Thermal Ground
56 GND - Thermal Ground
57 GND - Thermal Ground
58 GND - Thermal Ground
59 GND - Thermal Ground
60 GND - Thermal Ground
61 GND - Thermal Ground
62 GND - Thermal Ground
63 GND - Thermal Ground
Copyright © 2014, Texas Instruments Incorporated Terminal Configuration and Functions 9
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CC3200MOD
SWRS166 –DECEMBER 2014 www.ti.com
3.3 Pin Attributes and Pin Multiplexing
The module makes extensive use of pin multiplexing to accommodate the large number of peripheral
functions in the smallest possible package. To achieve this configuration, pin multiplexing is controlled
using a combination of hardware configuration (at module reset) and register control.
The board and software designers are responsible for the proper pin multiplexing configuration. Hardware
does not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode
used. Table 3-2 describes the general pin attributes and presents an overview of pin multiplexing. All pin
multiplexing options are configurable using the pin mux registers. The following special considerations
apply:
• All I/Os support drive strengths of 2, 4, and 6 mA. Drive strength is configurable individually for each
pin.
• All I/Os support 10-μA pullups and pulldowns.
• These pulls are not active and all of the I/Os remain floating while the device is in Hibernate state.
• The VIO and VBAT supply must be tied together at all times.
• All digital I/Os are nonfail-safe.
NOTE
If an external device drives a positive voltage to the signal pads and the CC3200MOD is not
powered, DC current is drawn from the other device. If the drive strength of the external
device is adequate, an unintentional wakeup and boot of the CC3200MOD can occur. To
prevent current draw, TI recommends any one of the following:
• All devices interfaced to the CC3200MOD must be powered from the same power rail as
the chip.
• Use level-shifters between the module and any external devices fed from other
independent rails.
• The nRESET pin of the CC3200MOD must be held low until the VBAT supply to the
module is driven and stable
10 Terminal Configuration and Functions Copyright © 2014, Texas Instruments Incorporated
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