Texas Instruments LP8754EVM User manual

Using the LP8754EVM Evaluation Module
User's Guide
Literature Number: SNVU369
August 2014
SmartReflex is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.

Contents
1 Overview............................................................................................................................. 4
2 Quick Setup Guide ............................................................................................................... 4
2.1 Installing/Opening the Software ....................................................................................... 5
2.2 Power Supply Setup ..................................................................................................... 6
2.3 Notes on Efficiency Measurement Procedure........................................................................ 7
3 GUI Overview....................................................................................................................... 7
3.1 Main Tab .................................................................................................................. 7
3.2 Other Tabs and Menus.................................................................................................. 8
3.3 Console.................................................................................................................... 9
4 Bill of Materials .................................................................................................................. 10
5 Board Layout..................................................................................................................... 11
6 LP8754 Schematic.............................................................................................................. 14
2Table of Contents SNVU369–August 2014
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List of Figures
1 LP8754EVM .................................................................................................................. 4
2 Evaluation Software Graphical User Interface (GUI) When USB Board Connected................................ 5
3 Evaluation Software GUI Showing Steps Needed to Power up the LP8754 ........................................ 6
4 Top view of the LP8754EVM ............................................................................................. 11
5 Component placement near the LP8754. Capacitors marked with X are optional. ............................... 12
6 Top-layer. Input capacitors are placed close to the LP8754 and routed on top layer. GND nets are
connected to the GND plane (2nd layer) with microvias. VIN nets are connected to the VIN plane (3rd
layer) with vias in pads of the input capacitors. VOUT pads of the output capacitors and inductors are
connected together with large copper area. ............................................................................ 12
7 2nd Layer (GND). GND plane kept intact under the high current traces to provide shortest possible
return path for high frequencies. ........................................................................................ 12
8 3rd Layer (VIN). Plane kept intact around the LP8754. Below the LP8754 is small ground area
connecting the microvias (from 3rd to bottom layer) and buried vias (from 2nd to 3rd layer). .................. 12
9 Bottom-Layer and Silk. Footprints for optional input capacitors C32 and C33. GND filling in bottom layer
for sinking heat through the GND vias................................................................................... 12
10 3D View Showing the LP8754 and Nearest Components ........................................................... 12
List of Tables
1 Mode Information ............................................................................................................ 8
2 I2C-Compatible Bus Support ............................................................................................... 8
3 Console Macros.............................................................................................................. 9
3
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User's Guide
SNVU369–August 2014
The LP8754 Evaluation Module
This user’s guide describes the operation of the evaluation module for the LP8754 Multi-Phase 6-Core
Step-Down Converter from Texas Instruments (TI). The user’s guide also provides design information
including the schematic and Bill of Materials (BOM).
1 Overview
The LP8754EVM customer evaluation module demonstrates the integrated circuit LP8754 from TI. The
LP8754 is a high-performance, multi-phase step-down converter designed to meet the power
management requirements of the latest applications processors in portable applications. The device
contains six step-down converter cores, which are bundled together in a 6-phase buck converter. This
document covers user software provided with the EVM and design documentation that includes
schematics and parts list.
Figure 1. LP8754EVM
The evaluation module consists of two PCB boards, the LP8754 Evaluation Board, and the USB Interface
Board. The boards are of the same size, and the LP8754 board is stacked on top of the USB Interface
Board.
2 Quick Setup Guide
Many of the components on the LP8754 are susceptible to damage by electrostatic discharge (ESD).
Customers are advised to observe proper ESD handling precautions when unpacking and handling the
EVM, including the use of a grounded wrist strap at an approved ESD workstation.
On opening the LP8754EVM package, ensure that the following items are included:
• LP8754 Evaluation Board
• USB Interface Board
• USB Cable
If any of the items are missing, contact the closest Texas Instruments Product Information Center to
inquire about a replacement.
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www.ti.com Quick Setup Guide
2.1 Installing/Opening the Software
The EVM software is controlled through a graphical user interface (GUI). The software communicates with
the EVM through an available USB port. The minimum hardware requirements for the EVM software are:
• IBM PC-compatible computer running a Microsoft Windows® XP or newer operating system
• Available USB port
• Mouse
The latest downloadable software is available at www.ti.com. Download the zip file onto your local hard
drive, then unzip this folder. Make sure the USB Interface Board is connected to the Evaluation Board,
and connect the USB Interface Board to the PC with the USB cable. Refer to Figure 1.
1. With the power supply disconnected from the unit under test (UUT), open the un-zipped folder, and
click on lp8754_nnn.exe (nnn is the version number) to start the software.
2. On the Evaluation SW window bottom right corner you should see text “USB Board connected”. Refer
to Figure 2.
Figure 2. Evaluation Software Graphical User Interface (GUI)
When USB Board Connected
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Quick Setup Guide www.ti.com
2.2 Power Supply Setup
To power up the EVM, one power supply is needed. For full-load testing of the LP8754EVM, a DC-power
supply capable of at least 10 A and 4 V is required. 5 A is suggested as a practical minimum for partial
load. The power supply is connected to the EVM using connector X3. The power supply and cabling must
present low impedance to the UUT; the length of power supply cables must be minimized. Remote sense,
using connector X4, can be used to compensate for voltage drops in the cabling.
With the power supply disconnected from the UUT, set the supply to 3.7 V DC and the current limit to 5-A
minimum. Set the power supply output OFF. Connect the power supply's positive terminal (+) to VIN and
negative terminal (-) to GND on UUT (X3 Power-in terminal block). Check that jumpers on the boards are
set as shown in Figure 1 (factory default jumper configuration).
Set power supply output ON, and then continue with the following steps.
1. On Evaluation software GUI, click on Assert VIOSYS. See Figure 3: Marking “1”.
2. Click on Assert NRST. See Figure 3: Marking “2”.
3. Click on Read Registers button. You should see ready message on green background next to the
Read Registers button. See Figure 3: Marking “3”.
4. Check that the GUI indicates "PWM" under "Mode" and "Master; 1/6 Phases Active" under "Multi-
phase" status. See Figure 3: Marking “4”.The EVM is now ready for testing with default register
settings loaded.
Figure 3. Evaluation Software GUI Showing Steps Needed to Power up the LP8754
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www.ti.com Quick Setup Guide
2.3 Notes on Efficiency Measurement Procedure
Output Connections: An appropriate electronic load or high-power system source meter instrument,
specified for operation down to 500 mV, is desirable for loading the UUT. The maximum load current is
specified as 10 A. Be sure to choose the correct wire size when attaching the electronic load. A wire
resistance that is too high will cause a voltage drop in the power distribution path which becomes
significant compared to the absolute value of the output voltage. Connect an electric load positive terminal
(+) to X1 and negative terminal (-) to X2. It is advised that, prior to connecting the load, it be set to sink 0A
to avoid power surges or possible shocks.
Voltage drop across the PWB traces will yield inaccurate efficiency measurements. For the most accurate
voltage measurement at the EVM, use TP14 to measure the input voltage and TP10 to measure the
output voltage.
To measure the current flowing to/from the UUT, use the current meter of the DC power supply/electric
load as long as it is accurate. Some power source ammeters may show offset of several milliamps and
thus will yield inaccurate efficiency measurements. In order to perform very accurate Iqmeasurements on
the UUT, disconnect input protective Zener diode D1 by removing the shunt J2 from the board. When
connected, this diode will cause some leakage, especially on high VIN voltages. Also, the output voltage
ADC on the USB Interface Board will load the output of LP8754 with a resistance in order of a hundred of
kΩ. The 0-Ωresistor between the pads of J11 on the lower left corner of the EVB may also be removed
(see Section 6).
3 GUI Overview
The evaluation software has the following tabs: Main, Config, and Advanced. The three tabs together
provide the user access to the whole register map of LP8754.
3.1 Main Tab
The Main tab has the elemental controls for the EVM and provides a view to the chip status. Starting from
top, the main controls are:
• Assert VIOSYS: This checkbox will assert 1.8-V voltage to LP8754 VIOSYS pin. This pin will enable
the chip internal voltage reference and LDO, release POR, and launch OTP read cycle. The VIOSYS
voltage is the reference voltage for the System I2C bus.
• Assert NRST: This checkbox will assert 1.8-V voltage to LP8754 NRST pin. Asserting NRST will
launch power-up sequence.
• Assert SW Reset: To perform a complete SW reset to the chip, assert and de-assert this checkbox.
See the LP8754 datasheet for explanation of LP8754 reset scenarios.
• Assert NSLP: When this bit is asserted it tells LP8754 that the device it is powering is in a high-load
condition state. On LP8754 this effectively prevents the bucks from entering the Low-Power PFM Mode
(ECO).
NOTE: The recommended start-up sequence for LP8754 is to first assert VIOSYS, then write all
needed configuration bits by using the GUI, and then to assert NRST.
NOTE: The NRST pin is the reference for the DVS (Dynamic Voltage Scaling) bus (that is,
SmartReflex™ bus). NRST needs to be asserted before the chip will acknowledge any
transmission on the DVS bus.
The Bucks section provides status information for all the 6 buck cores. The Mode field provides
information on each of the buck core and can have any of the values given in Table 1:
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GUI Overview www.ti.com
Table 1. Mode Information
Buck Mode
Disabled Buck state machine in 'disable'
Soft Startup Buck state machine in 'soft startup'. May occur when too much loading is present when powering-up the
buck.
PWM Pulse Width Modulation
PFM Pulse Frequency Modulation
ECO PFM with 'low power coasting' mode enabled. This means that lots of analog resources are disabled
between PFM bursts. Reaction time to load transients is compromised, while Iq is minimized.
Sleeping Multi-phase slave is passive.
The "Multi-phase Status" info field tells whether a buck core is configured as a master or slave. The field
also tells how many phases are active.
An ADC on the USB interface card is connected to measure the output voltage of the buck converter, and
this is displayed on GUI.
The "System Flags / Interrupts" section gives data on system faults and warnings. If the interrupt is set for
any reason the Interrupt active field shall show ‘1’ on red background. The flag causing the interrupt will
also be set on the Main tab. Interrupts on LP8754 can only be cleared by writing ‘0’ to associated
registers. Any individual flag can be cleared by clicking the Clear button next to each flag field. The USB
Interface Board uses an I2C-accessible temperature sensor IC to sense the EVB temperature near the
LP8754 IC. This information is presented in the "Board Temperature" field. LP8754 register 0x0D provides
a coarse temperature indication of the chip. This info is interpreted into the "Chip Temperature" field when
the "Poll Status" option is selected.
At the bottom of the GUI window is the "Auto Write" checkbox. If "Auto Write" is checked (default) any
checking, un-checking or pull-down menu selections will immediately launch I2C writes to the chip
register(s). If not checked, the user can update the chip registers to correspond the configuration selected
on the GUI by clicking "Write Registers".
If "Poll Status" is selected the software sends a query to the LP8754 at a fixed interval in order to detect
the status of the chip, including operation mode, multi-phase status, and output current. If not selected,
user can read the registers by applying "Read Registers". On the EVM both System I2C and DVS
(Dynamic Voltage Scaling) (that is, SmartReflex) buses can be used to interface the chip. The interface to
be used can be selected from the Interface pull-down menu. "Bus Speed" pull-down menu selections are
given in Table 2 below and are instantly applied for both buses. Notice that for DVS bus to work, NRST
needs to be high.
Table 2. I2C-Compatible Bus Support
Bus Speed Selection Explanation
Fast (400 kHz) Fast I2C-compliant operation at 400 kHz
Fast++ (3.4 MHz) I2C protocol data transfer with 3.4 MHz clock rate. No writing of master code needed, but can done. Input
filters correspond to HS lengths – 10 ns minimum filter length for SCL and SDA:
High-Speed (3.4 MHz) HS I2C-compliant data transfer with master codes.
3.2 Other Tabs and Menus
The "Tools" pull-down menu hosts another way of accessing the LP8754 registers. The "Direct Register
Access" tool can be used to read or write any register. When using direct register access, un-checking the
poll status checkbox is recommended. This way the GUI will only do the reads and writes commanded
from the direct access dialog.
The "Config" and "Advanced" tabs provide the user with pull-down menus and check-boxes for the part of
the register space that is not covered by the Main tab, such as output voltage control. These controls are
self-explanatory. Please refer to the LP8754 datasheet for explanation of the functions.
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3.3 Console
To show or hide the console, toggle the option in View pull-down menu. The console can be used to
access the LP8754 registers. Registers can be read or written simply by referring to the logical registers
by their name. The console has a number of integrated macros that are listed in Table 3.
Table 3. Console Macros
Command Parameters Explanation
register_name = register value | - Write a value to writable I2C register or logical register. If no parameter given, will
return the current register value. The logical register names are the same as
given in the datasheet, and must be in uppercase.
Example: VSET_B0 = 40
wait (time) Wait for time given in ms. Useful in loops.
advanced Change to advanced user mode.
user Return from advanced to regular user mode.
iout (buck number) Returns the measured load current of the chosen buck core.
i2c_bus sr | sys | - Change serial bus communications from the console and the GUI to be made
with the specified bus. If called with no parameter treated as query and current
selection is returned.
0x address = data I2C read or write command.
or addr = value
address[bits] = data examples:
0x12 = 0xaa
0x12[7] = 1
0x12[3:0] = 15
The console supports use of scripts. If a text file containing commands supported by the console is stored
in the same folder with the evaluation software executable, then the script can be launched from the
console by typing the text file name, like script.txt. For demonstration purposes, the evaluation software
comes with a set of scripts, which are loaded when Power Saver, Balanced, or High Performance buttons
on the "Advanced" tab are clicked. These scripts (saved as script1.txt, script2.txt and script3.txt) will load a
collection of register settings that will save energy, maximize load transient performance, or achieve a
balance between the two. Clicking the User button will load a script "script4.txt". By default this file
contains a demo which loops through all output voltage settings (VSET_B0). User can modify this file for
specific register settings.
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Bill of Materials www.ti.com
4 Bill of Materials
Designator Description Manufacturer Part Number Qty.
!PCB Printed Circuit Board Any SV600763-001 REV A 1
CAP, CERM, 10µF, 10V, ±10%, X5R,
C001, C201, C301, C501 TDK C1608X5R1A106M 4
0603
CAP, TANT, 220µF, 10V, ±10%, 0.05Ω,
C1 AVX TPSD227K010R0050 1
7343-31 SMD
CAP, CERM, 100µF, 6.3V, ±20%, X5R,
C2 MuRata GRM31CR60J107ME39L 1
1206
C010, C30, C31, C110, C310, CAP, CERM, 22µF, 10V, ±20%, X5R, Samsung CL10A226MP8NUNE 6
C410 0603
CL03 Series 0201 1000nF 6.3 V 20 %
C23, C24, C27 Samsung CL03A105MQ3CSNH 3
X5R SMD
CAP, CERM, 0.1µF, 10V, ±10%, X5R,
C28 MuRata GRM155R61A104KA01D 1
0402
D1 Diode, Zener, 5.1V, 5W, SMB Micro Commercial Co SMBJ5338B-TP 1
H1, H2, H3, H4 MACHINE SCREW PAN PHILLIPS 4-40 B&F Fastener Supply NY PMS 440 0050 PH 4
H5, H6, H7, H8 Standoff, Hex, 0.5"L #4-40 Nylon Keystone 1902C 4
H19, H20, H21, H22 M4 CIRC CLEARANCE SPACER 5MM Harwin Inc R40-6710594 4
Header, TH, 100mil, 2x1, Gold plated,
J1, J2, J8, J9 Samtec, Inc. TSW-102-07-G-S 4
230 mil above insulator
J3, J4, J11 RES, 0 ohm, 5%, 0.063W, 0402 Vishay-Dale CRCW04020000Z0ED 3
J5 Connector, SMT, High Speed, 20 pairs Samtec, Inc. QTE-020-01-L-D-A 1
Header, TH, 100mil, 2x2, Gold plated,
J7 Samtec, Inc. TSW-102-07-G-D 1
230 mil above insulator
Inductor, Multilayer, Ferrite, 470nH, 2.7A,
L0, L1, L2, L3, L4, L5 MuRata LQM21PNR47MGH 6
0.04 ohm, SMD
RES, 0.01Ω, 1%, 3W, 2512 High Power
R1 Bourns CRA2512-FZ-R010ELF 1
Current Sense Chip Resistor
R7, R8, R9 RES, 1.8kΩ, 5%, 0.1W, 0603 Vishay-Dale CRCW06031K80JNEA 3
R10, R11, R12, R13, R14, R15, RES, 0 ohm, 5%, 0.1W, 0603 Vishay-Dale CRCW06030000Z0EA 8
R16, R22
SH-J9, SH-J12 Shunt, 100mil, Gold plated, Black 3M 969102-0000-DA 2
TP1, TP2, TP3, TP4, TP5, TP6, Test Point, TH, Miniature, Yellow Keystone 5004 11
TP7, TP8, TP9, TP12, TP15
TP11, TP13 Terminal, Turret, TH, Double Keystone 1502-2 2
LP8754 Multi-phase 6-Core Step-Down
U1 Texas Instruments LP8754YFQT 1
Converter, YFQ0049AEAK
Low Power Digital Temperature Sensor
U2 With SMBus/Two-Wire Serial Interface in Texas Instruments TMP102AIDRL 1
SOT563, DRL0006A
PC terminal block, Pitch: 5.08 mm,
X1, X2, X3 Phoenix Contact 1715721 3
Number of positions: 2
Phoenix Contact screw terminal 2 way,
X4, X5 Phoenix Contact 1725656 2
2.54mm pitch
Phoenix Contact screw terminal 8 way,
X6 Phoenix Contact 1725711 1
2.54mm pitch
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5 Board Layout
This section describes the board layout of the LP8754EVM. See LP8754 data sheet for specific PCB
layout recommendations.
The board is constructed on a 4-layer PCB. Figure 4 shows the top view of the entire board and Figure 5
through Figure 10 show the component placement, layout and 3D view close to the LP8754 device. Vias
under the LP8754 are filled microvias from top layer to the GND plane (layer 2), buried vias between 2nd-
layer and 3rd-layer and microvias from 3rd-layer to bottom layer.
Routing is mostly done on top and bottom layers. Top layer contains the large copper area connecting the
VOUT pads of the inductors and output capacitors together and to the load terminals. 2nd layer is the
ground plane and 3rd layer is the VIN plane. Also the bottom layer contains large copper area filled with
ground. Input capacitors are placed as close to the LP8754 as possible for keeping the critical VIN and
GND traces short. Output capacitors and inductors are placed around the input capacitors. Using the 0603
size input and output capacitors and 2.0 mm x 1.2 mm size inductors the total solution size is about 82.5
mm2.
Figure 4. Top view of the LP8754EVM
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LP8754
CIN2 CIN1
CIN4 CIN3
COUT4
COUT3 COUT1
COUT2
CIN5
L2 L1 L0
L5 L4 L3
CVDDA
CVLDO
CVIOSYS
7.5 mm
11 mm
CIN6
COUT6
COUT5
Board Layout www.ti.com
Figure 5. Component placement near the LP8754. Capacitors marked with X are optional.
Figure 6. Top-layer. Input capacitors are placed close to Figure 7. 2nd Layer (GND). GND plane kept intact under
the LP8754 and routed on top layer. GND nets are the high current traces to provide shortest possible return
connected to the GND plane (2nd layer) with microvias. path for high frequencies.
VIN nets are connected to the VIN plane (3rd layer) with
vias in pads of the input capacitors. VOUT pads of the
output capacitors and inductors are connected together
with large copper area.
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Figure 8. 3rd Layer (VIN). Plane kept intact around the Figure 9. Bottom-Layer and Silk. Footprints for optional
LP8754. Below the LP8754 is small ground area input capacitors C32 and C33. GND filling in bottom layer
connecting the microvias (from 3rd to bottom layer) and for sinking heat through the GND vias.
buried vias (from 2nd to 3rd layer).
Figure 10. 3D View Showing the LP8754 and Nearest Components
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LP8754 Schematic www.ti.com
6 LP8754 Schematic
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER

FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Copyright © 2015, Texas Instruments Incorporated