Texas Instruments ONET1131EC User manual

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ONET1131EC Evaluation Module
User's Guide
SLLU256–October 2016
ONET1131EC Evaluation Module
This document describes the main features and functionality of the evaluation module (EVM) board for the
devices.
The ONET1131EC is a 11.7-Gbps transceiver with an integrated limiting amplifier and a modulator driver.
The EVM can be used to evaluate the performance of the parts in conjunction with an electroabsorptive
modulated laser (EML) transmit optical subassembly (TOSA) and a receive optical subassembly (ROSA)
in standard XMD-compliant packages.
The EVM is controlled with a graphical user interface (GUI).
Throughout this document, the images shown may represent the ONET1130Ex. Those images are
representative of the boards and parts on the ONET1131EC.
spacer
Contents
1 Hardware and Equipment................................................................................................... 2
2 EVM Block Diagram......................................................................................................... 2
3 EVM Connections............................................................................................................ 3
4 Measurement Setup......................................................................................................... 6
4.1 Open Loop Operation Without Fault Detection or Digital Monitoring ........................................ 8
4.2 Closed Loop Operation with Fault Detection and Digital Monitoring ....................................... 10
5 LED Indicators.............................................................................................................. 13
6 Typical Performance Results ............................................................................................. 13
7 Schematics and Bill of Materials ......................................................................................... 15
7.1 Schematics......................................................................................................... 15
7.2 Bill of Materials .................................................................................................... 18
List of Figures
1 ONET1131EC EVM Block Diagram....................................................................................... 2
2 ONET1131EC EVM Connections ......................................................................................... 3
3 TOSA and EML Connections for TEC Controller ....................................................................... 4
4 Main EVM Connections..................................................................................................... 5
5 Typical Setup................................................................................................................. 6
6 Low Level Register Interface Page........................................................................................ 7
7 Core Configuration Page ................................................................................................... 8
8 Transmitter Configuration Page ........................................................................................... 9
9 Core Configuration Page.................................................................................................. 10
10 Transmitter Configuration Page.......................................................................................... 11
11 Read Only Status Page ................................................................................................... 12
12 Unfiltered Transmitter Eye Diagram ..................................................................................... 13
13 Filtered Transmitter Eye Diagram........................................................................................ 14
14 Schematic (1 of 3).......................................................................................................... 15
15 Schematic (2 of 3).......................................................................................................... 16
16 Schematic (3 of 3).......................................................................................................... 17

ONET1131EC
ROSA
EML TOSA
Thermistor
Out TEC IN
-2.5-V Charge
Pump
I2C Control
EML
Bias IN
Current
Mirror
3.3 V IN
RXOUT
TXIN
Digital
Interface
2.5 V IN
Optical
RX IN
Optical
RX OUT
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ONET1131EC Evaluation Module
List of Tables
1 LED Indicators.............................................................................................................. 13
2 ONET1131EC EVM Bill of Materials..................................................................................... 18
1 Hardware and Equipment
The following hardware and equipment are required to evaluate the EVM:
1. A ONET1131EC EVM
2. An XMD-compliant EML TOSA
3. A USB Dongle
4. A USB cable with standard-A to mini-B connector
5. A PC with USB A port
6. RF cables with SMA connectors
7. An external thermoelectric controller
8. Single-mode fiber patch cords
9. Electrical cables with banana jack connections
2 EVM Block Diagram
Figure 1 represents the block diagram of the ONET1131EC EVM. The board is designed to be powered
from a 2.5-V supply using cables with banana jacks.
Figure 1. ONET1131EC EVM Block Diagram

3.3-V
Power
Source for
ROSA
USB Dongle
Connector
Transmitter Inputs
Receiver Outputs
2.5-V Power
Source
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3 EVM Connections
Figure 2 shows the location of the major inputs and outputs on the EVM board.
Figure 2. ONET1131EC EVM Connections

TEC+
TOSA
Vea GND
Thermistor +
TECí
Thermistor í
Vea
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The customer must supply a ROSA and TOSA. In addition, connections for the EML bias voltage and TEC
controller are also required. Figure 3 shows the locations for the ROSA and TOSA, EML bias voltage,
TOSA thermistor, and the TEC+ and TEC– connections to the TEC controller.
Figure 3. TOSA and EML Connections for TEC Controller

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Figure 4 shows the main connections except those for the EML bias and TEC controller.
ROSA and Receiver connections are not available on the ONET131EC-EVM.
Figure 4. Main EVM Connections

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4 Measurement Setup
Follow this procedure to quickly set up to take measurements:
1. Install the ONET1130EC GUI onto the computer and follow the installation instructions.
2. Solder the TOSA onto the EVM.
3. Connect a differential data input signal source to the SMA connectors TXINP/TXINN through 50-Ω
matched impedance cables. Set the data rate between 9.8 Gbps and 11.7 Gbps. Set the amplitude
between 100 mVp-p differential and 1000 mVp-p differential.
4. Connect the USB dongle to the EVM and attach the interface cable from the USB port of the computer
to the mini-B USB port of the dongle.
5. Apply a 2.5-V supply to the +2.5-V banana jack and the supply ground to the GND banana jack.
6. Apply a negative bias voltage in the range of –0.4 V to –1.5 V for the EML to JMP28. The required
voltage is TOSA dependent.
7. Connect the TOSA thermistor at JMP24 to the TEC controller.
8. Connect the TEC+ and TEC– at JMP27 to the TEC controller.
9. Connect the TOSA to the optical input of a DCA through a single-mode fiber patch cord.
A typical setup is shown in Figure 5.
Figure 5. Typical Setup

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10. Run the GUI by clicking the ONET1130EC GUI shortcut icon on the desktop. The Low Level Register
Interface page appears (Figure 6).
NOTE: The ONET1130EC EVM GUI software works with the ONET1131EC EVM.
Figure 6. Low Level Register Interface Page

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4.1 Open Loop Operation Without Fault Detection or Digital Monitoring
The following steps are provided for open loop operation without fault detection or digital monitoring:
1. TI recommends initially operating the TOSA in open loop mode with fault detection disabled.
2. Go to the Core Configuration page as shown in Figure 7.
Figure 7. Core Configuration Page
3. Set the TX Bias Current Control to Open Loop.
4. Enable the Laser Bias Current.

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5. Go to the Transmitter Configuration page as shown in Figure 8.
Figure 8. Transmitter Configuration Page
6. Set TX Output Mode to Single Ended Mode (OUTP) using the pull-down box.
7. Set the desired TX Laser Bias Current with the slider.
8. Set the desired Transmitter Modulation Current with the slider.
9. Adjust the TX Cross Point with the slider.
10. If the transmitter modulation current is less than approximately 0xC0, then TI recommends using the
slow edge speed mode as selected with the TX edge speed selection bit. However, the need for using
this mode is TOSA dependent.

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4.2 Closed Loop Operation with Fault Detection and Digital Monitoring
The following steps are provided for closed loop operation with fault detection and digital monitoring:
1. To configure the part for automatic power control with digital monitoring and fault detection, place a
jumper between pins 1 and 2 of JMP26 to supply –2.5 V to the photodiode current mirror.
2. Go to the Core Configuration page as shown in Figure 9.
Figure 9. Core Configuration Page
3. Disable the laser bias current to prevent a fault from occurring when the Fault Detection is enabled.
4. Select Enable Fault Detection and Enable the Fault Trigger on MONP Pin.
5. Set the TX Bias Current Control to Closed Loop and initially use the default 770-µA TX Photodiode
Current Range.
6. Enable the laser bias current.
7. In the Analog to Digital Conversion box, enable the ADC and ADC oscillator and select the desired
parameter to be monitored using the drop-down box.

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8. Go to the Transmitter Configuration page as shown in Figure 10.
Figure 10. Transmitter Configuration Page
9. In the Monitor Fault Threshold box, set the Bias Current and Power sliders to their maximum value.
10. Set Digital Bias Current and Digital Photodiode Current Monitor in the Monitor Fault Threshold box.
11. Set the TX Output Mode to Single Ended Mode (OUTP).
12. Set the desired TX Laser Bias Current,Transmitter Modulation Current, and TX Cross Point (TX Eye
Cross-Point Adjust.
13. In the Monitor Fault Threshold box, reduce the Bias Current fault threshold slider until a fault occurs.
Increase the Bias Current fault threshold level at least by a value of 16.
14. Go to the Core Configuration page and toggle the Enable Laser Bias Current bit. This disables the
fault and restores the transmitter output.
15. In the Monitor Fault Threshold box, reduce the Power fault threshold slider until a fault occurs.
Increase the Power fault threshold level at least by a value of 16.
16. Go to the Core Configuration page and toggle the Enable Laser Bias Current bit. This disables the
fault and restores the transmitter output.

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17. To read the value from the ADC, go to the Read Only Status page as shown in Figure 11.
Figure 11. Read Only Status Page
18. Click the Refresh button and read the value of the Output Representation of the ADC Input Source.

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5 LED Indicators
Table 1 shows the meaning of the 2 LEDs on the EVM.
Table 1. LED Indicators
LED LED Color Default State Indication When On
D1 Red On The transmit CDR or the receive CDR has indicated Loss of Lock (LOL).
6 Typical Performance Results
A typical set of conditions for operating the EVM are as follows:
• 10.71 Gbps, PRBS31 Pattern
• Transmitter Single-Ended Mode of Operation
• TOSA Temperature = 37°C
• Vea = –0.65 V
• Laser Bias Current = 0xF0 (approximately 53 mA)
• Transmitter Modulation Current = 0xB0
• Transmitter Cross Point = 0xB0
• TX and RX CDRs Enabled
A typical unfiltered eye diagram is shown in Figure 12.
Figure 12. Unfiltered Transmitter Eye Diagram

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A typical filtered eye diagram is shown in Figure 13.
Figure 13. Filtered Transmitter Eye Diagram

2P5V_RX
2P5V_TX
SPLIT PLANES AND BULK DECOUPLING
3P3V _ROSA_PWR
VCC
2.5V
GND
POWER AND LOCAL DECOUPLING
Note: Isolate the VCC Nets on
either side of the Header
Pins. Connect them only
through a Wide Trace directly
between the pins on the Bottom
Layer of the Board.
2P5V_VDD
2.5V EXTERNAL INPUT
3.3V EXTERNAL INPUT
VCC
3.3V
- DNI
- DNI
2P5V_INV
VINV_C1+ VINV_C1-
2P5V_SOURCE
2P5V_SOURCE
2P5V_SOURCE
2P5V_RX
2P5V_TX
2P5V_RX
2P5V_TX
2P5V_VDD 2P5V_VDD
2P5V_TX
2P5V_RX
2P5V_SOURCE
2P5V_VDD
2P5V_SOURCE 2P5V_NEG
3P3V_SOURCE
3P3V_ROSA
3P3V_SOURCE
C24
1uF
L13
C33
100pF
C55
1uF
L11
C30
10uF
C25
0.1uF
C34
10uF
C14
0.1uF
P5
Banana-Jack
1
C6
0.1uF
R1 50
C8
1uF
C13
0.1uF
U1F
ONET1131Ex
VCC_TX1 11
VCC_TX2 14
C9
10uF
C21
0.1uF
L10
C20 DNI - 100pF
C19DNI - 0.1uF
L16
U1K
ONET1131Ex
VDD 15
C46
0.1uF
L8 JMP6
2 Pin Header
1 2
C31
1uF
C12
0.1uF
C15
22uF
C26
10uF
P1
Banana-Jack
1
JMP3
DNI - 2 Pin Header
1 2
C48
1uF
C22
22uF
C32
0.1uF
C23
10uF
L14
C37
100pF
C36
0.1uF
L15
C11
0.1uF
U1E
ONET1131Ex
VCC_RX1 27
VCC_RX2 30
C17DNI - 10uF
JMP4
2 Pin Header
1 2
JMP5
2 Pin Header
1 2
C18DNI - 1uF
C28
0.1uF
P2
Banana-Jack
1
TPS60400
U4
IN
2OUT 1
GND 4
C1-
3
C1+
5
L6
C29
100pF
C27
1uF
U1G
ONET1131Ex
GND1 3
GND2 6
GND3 19
GND4 22
GND_PAD 33
C35
1uF
C49 1uF
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7 Schematics and Bill of Materials
This section contains the EVM schematics and BOM.
7.1 Schematics
Figure 14,Figure 15, and Figure 16 illustrate the EVM schematics.
Figure 14. Schematic (1 of 3)

OFFSET VOLTAGE
0201
0201
0402
0402
TXINP_SMA TXINP
TXINN
TXINN_SMA
RXINN
RXINP
TXOUTP
RXOUTN_SMA
RXOUTP_SMA RXOUTP
RXOUTN
VPD_IN
LD_ANODE
LD_ANODE_BT
PD_ANODE
MOD_ANODE
THERMISTOR
MOD_AN_OFFSET
TEC-
TEC+
BIAS
ROSA_PIN8
PD_ANODE_CM_E
PD_CM_E
PD_VNEG
PD
PD_CM_C
TXOUTN
ROSA_THERMISTOR
ROSA_PIN1
VPD
RXINP_ROSA
RXINN_ROSA
TXOUTP_BT
TXOUTP_BTV
MOD_AN_BT
MOD_AN_BTV
3P3V_ROSA
2P5V_NEG
2P5V_TX
2P5V_TX
R2
475
R50
DNI - 10K
DMC20201
Q1
C2 4
B2
C1 5
E2
3
E1
1
C50DNI - 0.1uF
R48
DNI - 0
JMP12
2 Pin Header
1 2
U1M
ONET1131Ex
BIAS 10
PD 7
R49 DNI_0
R6
100
L5
R3
475
C16
0.1uF
C54
0.1uF
L3
C2 DNI - 0.1uF
C51
DNI - 2.2uF
R43
0
JMP14
DNI - 2 Pin Header
1
2
L12
L9
U1A
ONET1131Ex
TXINP
4
TXINN
5
J2
DNI - sma_edge
U1B
ONET1131Ex
TXOUTN 12
TXOUTP 13
C10 0.1uFC7 0.1uF
R4
50
C1 DNI - 0.1uF
JMP15
DNI - 2 Pin Header
1
2
J3
sma_edge
JMP2
Header 2x2
1
3
2
4
R45
DNI_0
L4
L1
R47 DNI_0
C3 DNI - 0.1uF
L2
R7
100
C52
DNI - 0.1uF
EML_TOSA
P4
LD ANODE
7
PD ANODE
6
GND
5
MOD ANODE
4
GND1
3
TEC(+)
2
THERMISTOR 8
TEC(-)
1
C5 0.1uF
U1C
ONET1131Ex
RXINN 21
RXINP 20
U1D
ONET1131Ex
RXOUTN
28
RXOUTP
29
C53
0.1uF
JMP10
3 Pin Header
1
2
3
R8
475
J5
sma_edge
R5
475
ROSA
P3
VPD
7
GND2
6
DATA_N
5
DATA_P
4
GND1
3
VCC
2
GND3 8
GND
1
L7
J4
DNI - sma_edge
R46 DNI - 0
R44
DNI - 0
JMP11
2 Pin Header
1
2
C4 DNI - 0.1uF
JMP1
2 Pin Header
1
2
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Figure 15. Schematic (2 of 3)

Note: 5V_USB is not used on
this board and may show as an
open net in a DRC Check.
USB INTERFACE
I2C Monitor or External Input
I2C Pullup
Resistors already
pulled to the USB
3.3V, On-Board
resistors are
backup
DIGITAL AND I2C CONTROL
Place Q8 on the TOP side
of the board underneath
the socket as close to the
DUT as possible.
Place Q9 on the BOTTOM side
of the board underneath the
socket as close to the DUT as
possible.
Place U<x> away from
the DUT near U<x>.
I2C Device Address = 1001100
0x98 with Write Bit
0x99 with Read Bit
TEMP SENSOR
Resistors allow the I2C
to GPIO device to be
disconnected from the
ONET1131EC signals
Note: Place Loop
Filter Caps as
close to the
device pins as
possible.
ANALOG CONTROL
TX_DIS
I2C_TX_DIS
USB_I2C_SCK
USB_I2C_SDA
EXT_I2C_RESET
EXT_I2C_INT
I2C_GPIO_SDA
SDA
SCK
I2C_GPIO_SCL
USB_I2C_INT
USB_I2C_RESET
EXT_I2C_SDA
EXT_I2C_SCK
I2C_RESET
I2C_INT
I2C_ADDR
TX_FLT_L
TX_FLT_G
TX_FLT_D
I2C_RX_DIS
I2C_TX_FLT
RX_DIS
TMP_SCK
TMP_SDA
TMP_DX1
TMP_DX2
RX_LOS_L
RX_LOS_G
RX_LOS_D
TMP_DX3
TMP_DX4
RX_LOS
LOL_L
LOL_G
LOL_D
LOL
I2C_RX_LOS
I2C_LOL
TX_FLT
I2C_VCC_PU
AMP
RX_LF
TX_LF
COMP
MONP
MONB
MONP_R
MONB_R
3P3V_USB
3P3V_USB
5V_USB3P3V_USB
3P3V_USB
2P5V_SOURCE
2P5V_SOURCE
2P5V_SOURCE
2P5V_VDD
2P5V_SOURCE
3P3V_USB
2P5V_SOURCE
3P3V_USB
JMP18
2 Pin Header
1 2
R32 DNI - 0
R41
0
U2
TCA6408A_RGT
/INT 11
VCCI 15
/RESET 1
VCCP
14
GND 6
ADDR 16
SCL 12
SDA 13
P00
2
P01
3
P02
4
P03
5
P04
7
P05
8
P06
9
P07
10
GND_PP 17
JMP13
1
2
R24
DNI_10K
D2
DNI - RED
2
1
R14 0
Q3 MMSTA55
3 2
1
JMP9
Header 4x2
1
3
5
7
2
4
6
8
R40 DNI - 0
C39
1uF
R13 DNI - 0
C44
2200pF
C40
0.1uF R21
DNI_4.99K
Q2 MMSTA55
3 2
1
JMP20
DNI - Header 2x2
1
3
2
4
R15 10K
U1L
ONET1131Ex
MONB 2
MONP 8
COMP 23
R33
0
R26 0
Q5
FDV301N
G
SD
R51
4.99K
R37
0
R22
DNI_10K
R9
250
D3
RED
2
1
R39
0
R27 0
R31 0
R18 10K
R30 0
U1I
ONET1131Ex
RX_LOS 24
LOL/NC 1
RX_DIS 26
TX_DIS 32
TX_FLT 31
R16 DNI - 10K
R23
DNI_10K
J1A
MEC1-120-02-F-D-A Connector
11
33
55
77
99
11 11
13 13
17 17
19 19
21 21
23 23
25 25
27 27
29 29
31 31
33 33
35 35
37 37
39 39
C41
0.1uF
C43
0.1uF
R28
4.99K
Q4
FDV301N
G
SD
Q6
DNI - FDV301N
G
SD
C42
0.1uF
R35
0
R36
0
JMP19
Header 2x2
1
3
2
4
C38
10uF
R11 250
R10
DNI - 250
JMP17
1
2
C47
0.01uF
R42 0
U1J
ONET1131Ex
RX_LF/NC 25
TX_LF/NC 9
AMP 16
R17 DNI - 10K
C45
DNI - 2200pF
R52
750
D1 RED
2
1
JMP16
1
2
R25 0
U1H
ONET1131Ex
SCK 18
SDA 17
R34
0
R38
0
R12 0
R20
DNI_10K
R29 0
U3
TMP422
DX1
1
DX2
2
DX3
3
DX4
4GND 5
SDA 6
SCL 7
VCC 8
R19 10K
JMP8
1 2 3
JMP7
2 Pin Header
1
2
J1B
MEC1-120-02-F-D-A Connector
2
2
4
4
6
6
8
8
10
10
12
12
14
14
18
18
20
20
22
22
24
24
26
26
28
28
30
30
32
32
34
34
36
36
38
38
40
40
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Figure 16. Schematic (3 of 3)

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7.2 Bill of Materials
Table 2 lists the ONET1131EC EVM BOM.
Table 2. ONET1131EC EVM Bill of Materials
Item Qty Reference Value Part Number Manufacturer PCB Footprint Notes
1 1 C44 2200pF GRM033R61A222KA01D Murata Electronics North America 0201 2200pF 10V Ceramic Capacitor X5R 0201 (0603 Metric) 0.024" L x 0.012" W (0.60mm
x 0.30mm)
2 0 C45 DNI - 2200pF GRM033R61A222KA01D Murata Electronics North America 0201 2200pF 10V Ceramic Capacitor X5R 0201 (0603 Metric) 0.024" L x 0.012" W (0.60mm
x 0.30mm)
3 1 C47 0.01uF GRM033R71A103KA01D Murata Electronics North America 0201 10000pF 10V Ceramic Capacitor X7R 0201 (0603 Metric) 0.024" L x 0.012" W (0.60mm
x 0.30mm)
4 5 C11, C12, C13, C14,
C21 0.1uF GRM033R61A104KE15D Murata Electronics North America 0201 0.10µF 10V Ceramic Capacitor X5R 0201 (0603 Metric) 0.024" L x 0.012" W (0.60mm x 0.30mm))
5 3 C29, C33, C37 100pF 885012205001 Wurth Electronics Inc 0402 100pF 10V Ceramic Capacitor X7R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
6 0 C20 DNI - 100pF 885012205001 Wurth Electronics Inc 0402 100pF 10V Ceramic Capacitor X7R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
7 3 C5, C7, C10 0.1uF GRM155R71C104KA88J Murata Electronics North America 0402 0.10µF 16V Ceramic Capacitor X7R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
8 0 C1, C2, C3, C4, DNI - 0.1uF GRM155R71C104KA88J Murata Electronics North America 0402 0.10µF 16V Ceramic Capacitor X7R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
9 13 C16, C25, C28, C32,
C36, C40, C41, C42,
C43, C53, C54, C46,
C6
0.1uF GRM155R71C104KA88J Murata Electronics North America 0402 0.10µF 16V Ceramic Capacitor X7R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
10 0 C19, C50, C52, DNI - 0.1uF GRM155R71C104KA88J Murata Electronics North America 0402 0.10µF 16V Ceramic Capacitor X7R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
11 6 C24, C27, C31, C35,
C39, C8 1uF GRM155R61A105KE15D Murata Electronics North America 0402 1µF 10V Ceramic Capacitor X5R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x 0.50mm)
12 0 C18 DNI - 1uF GRM155R61A105KE15D Murata Electronics North America 0402 1µF 10V Ceramic Capacitor X5R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
13 0 C51 DNI - 2.2uF C0402C225M8PACTU Kemet 0402 2.2µF 10V Ceramic Capacitor X5R 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x
0.50mm)
14 3 C55, C49, C48 1uF GRM188R61A105KA61D Murata Electronics North America 0603 1µF 10V Ceramic Capacitor X5R 0603 (1608 Metric) 0.063" L x 0.031" W (1.60mm x
0.80mm)
15 7 C23, C26, C30, C34,
C38, C9 10uF GRM188C81A106MA73D Murata Electronics North America 0603 10µF 10V Ceramic Capacitor X6S 0603 (1608 Metric) 0.063" L x 0.031" W (1.60mm x 0.80mm)
16 0 C17 DNI - 10uF GRM188C81A106MA73D Murata Electronics North America 0603 10µF 10V Ceramic Capacitor X6S 0603 (1608 Metric) 0.063" L x 0.031" W (1.60mm x
0.80mm)
17 2 C22, C15 22uF GRM21BR61A226ME51L Murata Electronics North America 0805 22µF 10V Ceramic Capacitor X5R 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x
1.25mm)
18 4 R5, R8, R3, R2 475 ERJ-1GEF4750C Panasonic Electronic Components 0201 RES SMD 475 OHM 1% 1/20W 0201
19 18 R12, R14, R25, R26,
R27, R29, R30, R31,
R33, R34, R35, R36,
R37, R38, R39, R41,
R42, R43
0 RC0402JR-070RL Yageo 0402 RES SMD 0.0OHM JUMPER 1/16W 0402
20 0 R13, R32, R40, R48,
R46, R44 DNI - 0 RC0402JR-070RL Yageo 0402 RES SMD 0.0OHM JUMPER 1/16W 0402
21 0 R49, R47, R45 DNI_0 Any (1% Tolerance) Any 0402
22 2 R4, R1 50 504L50R0FTNCFT American Technical Ceramics 0402 RES SMD 50 OHM 1% 1/8W 0402

www.ti.com Schematics and Bill of Materials
19
SLLU256–October 2016
Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated
ONET1131EC Evaluation Module
Table 2. ONET1131EC EVM Bill of Materials (continued)
Item Qty Reference Value Part Number Manufacturer PCB Footprint Notes
23 2 R7, R6 100 RC0402FR-07100RL Yageo 0402 RES SMD 100 OHM 1% 1/16W 0402
24 3 R9, R11 249 RC0402FR-07249RL Yageo 0402 RES SMD 249 OHM 1% 1/16W 0402
25 0 R10 DNI - 249 RC0402FR-07249RL Yageo 0402 RES SMD 249 OHM 1% 1/16W 0402
26 1 R28 4.99K ERJ-2RKF4991X Panasonic Electronic Components 0402 RES SMD 4.99K OHM 1% 1/10W 0402
27 0 R21 DNI_4.99K Any (1% Tolerance) Any 0402
28 6 R15, R18, R19 10K RC0402JR-0710KL Yageo 0402 RES SMD 10K OHM 5% 1/16W 0402
29 0 R16, R17, R50 DNI - 10K RC0402JR-0710KL Yageo 0402 RES SMD 10K OHM 5% 1/16W 0402
30 0 R20, R22, R23, R24 DNI_10K Any (1% Tolerance) Any 0402
31 1 R52 750 RC0805JR-07750RL Yageo 0805 RES SMD 750 OHM 5% 1/8W 0805
32 1 R51 4.99K ERJ-6ENF4991V Panasonic Electronic Components 0805 RES SMD 4.99K OHM 1% 1/8W 0805
33 3 D1, D3 RED HSMS-C170 Avago Technologies Us Inc LED_SM_HSMB_C170 Red 626nm LED Indication Discrete 2.1V Diffused White Lens 0805 (2012 Metric)
34 0 D2 DNI - RED HSMS-C170 Avago Technologies Us Inc LED_SM_HSMB_C170 Red 626nm LED Indication Discrete 2.1V Diffused White Lens 0805 (2012 Metric)
35 11 JMP4, JMP5, JMP6,
JMP7, JMP13,
JMP16, JMP17,
JMP18, JMP12,
JMP11, JMP1
0.1" Header (1x2) TSW-150-08-G-S Samtec HDR_THVT_1x2_100 50 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold
36 0 JMP3, JMP15,
JMP14, DNI - 0.1" Header (1x2) TSW-150-08-G-S Samtec HDR_THVT_1x2_100 50 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold
37 2 JMP8, JMP10 0.1" Header (1x3) TSW-150-08-G-S Samtec HDR_THVT_1X3_100 50 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold
38 2 JMP19, JMP2 0.1x0.1" Header (2x2) 67997-404HLF Amphenol HDR_THVT_2x2_100 4 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Tin
39 0 JMP20 DNI - 0.1x0.1" Header
(2x2) 67997-404HLF Amphenol HDR_THVT_2x2_100 4 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Tin
40 1 JMP9 0.1x0.1" Header (2x4) TSW-150-08-G-S Samtec HDR_THVT_2X4_100 50 Positions Header, Unshrouded Connector 0.100" (2.54mm) Through Hole Gold
41 2 J5, J3 Edge Launch SMA 32K243-40ML5 Rosenberger CON_02K243-40M RF Connectors / Coaxial Connectors R/A Jack PCB
42 0 J2, J4, DNI - Edge Launch
SMA 32K243-40ML5 Rosenberger CON_02K243-40M RF Connectors / Coaxial Connectors R/A Jack PCB
43 1 J1 MEC1-120-02-F-D-A
Connector MEC1-120-02-F-D-RA1-SL Samtec CON_SMRT_MEC1_4 0_F CONN EDGE CARD DL 40POS SMD
44 2 L12, L1 Inductor 47uH, 35mA GLFR1608T470M-LR Taiyo Yuden 0603 47µH Shielded Wirewound Inductor 100mA 2.3 Ohm 0603 (1608 Metric)
45 3 L9, L5, L2 Ferrite Bead 1.8kohm,
200mA BLM15HD182SN1D Murata 0402_2020MIL 1.8 kOhm Impedance Ferrite Bead 0402 (1005 Metric) Surface Mount Signal Line 200mA 1 Lines 2.2 Ohm Max DCR -55°C ~ 125°C
46 3 L7, L4, L3 Ferrite Bead 1000ohm,
125mA BLM03HG102SN1D MuRata 0201 1 kOhm Impedance Ferrite Bead 0201 (0603 Metric) Surface Mount 125mA 1 Lines 2.6 Ohm Max DCR -55°C ~ 125°C
47 3 L15, L11, L8 CIC10P330 CIC10P330 Samsung 0603 33 Ohm Impedance Ferrite Bead 0603 (1608 Metric) Surface Mount Power Line 3A 1
Lines 25 mOhm Max DCR -55°C ~ 125°C
48 0 L13 DNI - CIC10P330 CIC10P330 Samsung 0603 33 Ohm Impedance Ferrite Bead 0603 (1608 Metric) Surface Mount Power Line 3A 1
Lines 25 mOhm Max DCR -55°C ~ 125°C
49 4 L16, L10, L6 DNI_CIC10P330 CIC10P330 Samsung 0603 33 Ohm Impedance Ferrite Bead 0603 (1608 Metric) Surface Mount Power Line 3A 1
Lines 25 mOhm Max DCR -55°C ~ 125°C
50 0 L14, DNI_CIC10P330 CIC10P330 Samsung 0603 33 Ohm Impedance Ferrite Bead 0603 (1608 Metric) Surface Mount Power Line 3A 1
Lines 25 mOhm Max DCR -55°C ~ 125°C
51 3 P1, P2, P5 Solderless Banana
Jack 108-0740-001 Emerson Network Power JACK_THVT_BANANA _500dia Banana Jack Connector Standard Banana Threaded, External (Nut)
52 0 P3 DNI_ROSA DNI DNI MSA_XMD_ROSA_IN
VNote: TI will assemble the ROSA

Schematics and Bill of Materials www.ti.com
20 SLLU256–October 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
ONET1131EC Evaluation Module
Table 2. ONET1131EC EVM Bill of Materials (continued)
Item Qty Reference Value Part Number Manufacturer PCB Footprint Notes
53 0 P4 DNI_EML_TOSA DNI DNI 162X_TOSA Note: TI will assemble the TOSA
54 3 Q5, Q4 FDV301N FDV301N Fairchild SOT23_3 MOSFET N-CH 25V 220MA SOT-23
55 0 Q6, DNI - FDV301N FDV301N Fairchild SOT23_3 MOSFET N-CH 25V 220MA SOT-23
56 2 Q3, Q2 MMSTA55 MMSTA55-7-F Diodes Inc. SOT_323-3 TRANS PNP 60V 0.5A SC70-3
57 1 Q1 DMC20201 DMC20201 Panasonic SOT23_5 TRANS 2NPN 50V 0.1A MINI5
58 1 U1 ONET1131Ex ONET1131ECRSMT Texas Instruments ONET1130Ex_QFN32 Note: TI will supply
59 1 U2 TCA6408A_RGT TCA6408ARGTR Texas Instruments QFN_16_3MSQ IC I/O EXPANDER I2C 8B 16QFN
60 1 U3 TMP422 TMP422AIDCNT Texas Instruments DCN_SOT23-8 SENSOR TEMPERATURE SMBUS SOT23-8
61 1 U4 TPS60400 TPS60400DBVT Texas Instruments SOT23-5 Charge Pump Switching Regulator IC Positive or Negative Fixed -Vin, 2Vin, Vin/2 1
Output 60mA SC-74A, SOT-753
62 8 Standoff Round Threaded 0.5" 2204 Keystone Electronics ROUND SPACER #4 NYLON 1/2"
63 8 Screws Round 4-40/0.25" PMSSS 440 0025 PH Building Fasteners PMSSS 440 0025 PH
64 1 PCB ONET1131EC-EVM INT056 ANY PCB boards