ADLINK Technology PC/104-Plus User manual

Leading EDGE COMPUTING
CMx-BTx
Technical Manual
PC/104-Plus Single Board Computer
with Intel Atom®E3800 Series Processors
Manual Rev.: 4.4
Revision Date: February 4, 2021
Part Number: 50-1Z161-1070

ii Preface
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license,
express or implied, by estoppel or otherwise, to any intellectual property rights is granted by
this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such prod-
ucts, ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied
warranty, relating to sale and/or use of ADLINK products including liability or warranties relat-
ing to fitness for a particular purpose, merchantability, or infringement of any patent, copy-
right or other intellectual property right. If you intend to use ADLINK products in or as medical
devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if
any. ADLINK may make changes to specifications and product descriptions at any time, with-
out notice.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trade-
marks and/or registered trademarks of their respective companies.
Revision History
Copyright © 2015, 2016, 2017, 2018, 2020, 2021 ADLINK Technology, Inc.
www.adlinktech.com
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Audience
This manual provides reference only for computer design engineers, including but not limited
to hardware and software designers and applications engineers. ADLINK Technology, Inc.
assumes you are qualified to design and implement prototype computer equipment.
Revision Reason for Change Date
1.00 Initial Release 2015-05-08
2.00 Revised for new board layout 2015-08-27
3.00 Revised for new revision of the board; removed USB 3.0 functionality and
added BAT1 interface 2016-02-12
4.00 Added note to Section 4.4.8, requiring a connected RTC battery for
enabled ECO mode 2016-08-08
4.1
Added heat spreader installation procedure to Section 2.4; added
requirements for SODIMM installation to Table 1-1; Updated BIOS setup
section to new format and content in Chapter 4; updated Figure 2-2 to
change CN17 from 10 to 9 pins; revised P/N of CN17 mating connector in
Table 2-2; Added PM changes from review of rev 5.02; Removed SATA
cable from cable set in Table 2-1
2017-11-16
4.2 Updated BMC exception blink codes in Table 4-2; moved BIOS Setup
section to its own chapter; moved System Resources to their own chapter 2018-10-31
4.3 Remove description of unsupported RS485 functionality, add HD Audio
(CN15) description 2020-11-16
4.4 Add French safety warnings 2021-02-04

Preface iii
CMx-BTx
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmen-
tal preservation through compliance with the European Union's Restriction
of Hazardous Substances (RoHS) directive and Waste Electrical and Elec-
tronic Equipment (WEEE) directive. Environmental protection is a top prior-
ity for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their end of
life, our customers are encouraged to dispose of them in accordance with
the product disposal and/or recovery programs prescribed by their nation
or company.
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arse-
nic, benzene, cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Diox-
ane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials,
which are known to the State of California to cause cancer, and acrylamide, benzene, cad-
mium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl
materials, which are known to the State of California to cause birth defects or other reproduc-
tive harm. For more information go to www.P65Warnings.ca.gov.
AVERTISSEMENT: Ce produit peut vous exposer à des produits chimiques tels que l'acryl-
amide, l'arsenic, le benzène, le cadmium, le phosphate de tris (1,3-dichloro-2-propyle)
(TDCPP), le 1,4-dioxane, le formaldéhyde, le plomb, le DEHP, le styrène, le DINP , BBP,
PVC et matériaux en vinyle, qui sont connus dans l'État de Californie pour causer le cancer,
et acrylamide, benzène, cadmium, plomb, mercure, phtalates, toluène, DEHP, DIDP, DnHP,
DBP, BBP, PVC et vinyle matériaux, qui sont connus de l'État de Californie pour causer des
anomalies congénitales ou d'autres troubles de la reproduction. Pour plus d'informations,
visitez le site www.P65Warnings.ca.gov.
ᑜ㔚ᳰ⺧࿁ᡴ

iv Preface
Conventions
The following conventions may be used throughout this manual, denoting special levels of
information.
Important Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and
NOTEs marked in this manual and on the associated equipment before handling/operating
the equipment.
XRead these safety instructions carefully.
XKeep this manual for future reference.
XRead the specifications section of this manual for detailed information on the operating
environment of this equipment.
XTurn off power and unplug any power cords/cables when installing/mounting or un-install-
ing/removing equipment.
XTo avoid electrical shock and/or damage to equipment:
ZKeep equipment away from water or liquid sources;
ZKeep equipment away from high heat or high humidity;
ZKeep equipment properly ventilated (do not block or cover ventilation openings);
ZMake sure to use recommended voltage and power source settings;
ZAlways install and operate equipment near an easily accessible electrical socket-
outlet;
ZSecure the power cord (do not place any object on/over the power cord);
ZOnly install/attach and operate equipment on stable surfaces and/or recommended
mountings; and,
ZIf the equipment will not be used for long periods of time, turn off the power source and
unplug the equipment.
This information adds clarity or specifics to text and illustrations.
This information indicates the possibility of minor physical injury,
component damage, data loss, and/or program corruption.
Ces informations indiquent la possibilité de blessures physiques
mineures, de dommages aux composants, de perte de données
et / ou de corruption de programme.
This information warns of possible serious physical injury, com-
ponent damage, data loss, and/or program corruption.
Ces informations mettent en garde contre d'éventuelles blessures
physiques graves, des dommages aux composants, une perte de
données et / ou une corruption du programme.
MISE EN GARDE
ATTENTION

Table of Contents v
CMx-BTx
Table of Contents
Preface ..................................................................................................................................ii
1 Introduction ...................................................................................................................... 1
1.1 Overview ................................................................................................................................1
1.2 Features .................................................................................................................................1
1.3 Block Diagram ........................................................................................................................2
1.4 Ordering Information ..............................................................................................................3
1.5 Specifications .........................................................................................................................4
1.5.1 Electrical Specifications .................................................................................................4
1.5.2 Environmental Specifications .........................................................................................4
1.5.3 Mechanical Specifications .............................................................................................5
1.5.4 Heat Sink Specifications ................................................................................................5
2 Getting Started ................................................................................................................. 7
2.1 Header and Connector Locations ..........................................................................................7
2.2 Mechanical Dimensions .......................................................................................................11
2.3 LED Indicators .....................................................................................................................12
2.4 Hardware Setup ...................................................................................................................13
3 Module Description .......................................................................................................15
3.1 SoC (System on a Chip) ......................................................................................................15
3.1.1 Processor Core ............................................................................................................15
3.1.2 Memory Controller .......................................................................................................15
3.1.3 Graphics Engine ..........................................................................................................15
3.1.4 Image Signal Processor ...............................................................................................16
3.1.5 Power Management .....................................................................................................16
3.1.6 PCI Express .................................................................................................................16
3.1.7 SATA Controller ...........................................................................................................16
3.1.8 USB xHCI Controller ....................................................................................................16
3.1.9 USB 2.0 EHCI Controller .............................................................................................16
3.1.10 HD-Audio Controller .....................................................................................................16
3.1.11 Intel® Trusted Execution Engine (Intel® TXE) ............................................................17
3.1.12 Platform Control Unit (PCU) ........................................................................................17
3.2 VGA Interface ......................................................................................................................17
3.3 LVDS Interface .....................................................................................................................18
3.4 LVDS Backlight ....................................................................................................................19
3.4.1 Selecting Panel and Backlight voltage .........................................................................20
3.5 Ethernet Controllers .............................................................................................................21
3.6 USB Ports ............................................................................................................................23
3.7 On-Board Power Supply ......................................................................................................24
3.8 System Panel .......................................................................................................................25
3.9 Serial Ports ..........................................................................................................................26
3.10 Setting RS422 Termination ..................................................................................................28

vi Table of Contents
3.11 Mini-PCIe Interface ............................................................................................................. 29
3.12 PCI-104 Bus Interface ......................................................................................................... 30
3.13 PC/104 Bus Interface .......................................................................................................... 32
3.14 Audio Interface .................................................................................................................... 34
3.15 BMC Service Connector ......................................................................................................35
3.16 User GPIO Interface ............................................................................................................ 37
3.17 Fan Interface ...................................................................................................................... 38
3.18 Battery Interface .................................................................................................................. 38
4 Using the Module .......................................................................................................... 39
4.1 SEMA Functions ................................................................................................................. 39
4.1.1 Board Specific SEMA Functions ................................................................................. 40
4.1.2 Watchdog Timer .......................................................................................................... 41
4.2 SW4 BIOS Control Switch ................................................................................................... 42
4.3 Temperature Sensors .........................................................................................................43
4.4 Real Time Clock (RTC) ......................................................................................................43
5 BIOS Setup ....................................................................................................................45
5.1 Menu Structure .................................................................................................................... 45
5.2 Starting the BIOS Setup Utility ............................................................................................ 46
5.3 Main Menu .......................................................................................................................... 46
5.3.1 Main > BIOS Information ............................................................................................. 46
5.3.2 Main > CPU Information .............................................................................................. 46
5.3.3 Main > Memory Information ........................................................................................ 46
5.3.4 Main > VGA Information .............................................................................................. 46
5.3.5 Main > TXE Information .............................................................................................. 47
5.3.6 Main > System Management ..................................................................................... 47
5.3.7 Main > System Management > Temperatures and Fan Speed .................................. 47
5.3.8 Main > System Management > Power Consumption .................................................. 48
5.3.9 Main > System Management > Runtime Statistics ..................................................... 48
5.3.10 Main > System Management > Flags ......................................................................... 49
5.3.11 Main > System Management > Power Up .................................................................. 49
5.3.12 Main > System Management > LVDS Backlight ......................................................... 50
5.3.13 Main > System Management > Smart Fan ................................................................. 50
5.3.14 Main > System Date and Time ................................................................................... 51
5.4 Advanced Menu .................................................................................................................. 51
5.4.1 Advanced > CPU Configuration .................................................................................. 51
5.4.2 Advanced > Graphics Configuration ........................................................................... 52
5.4.3 Advanced > SATA Configuration ................................................................................ 53
5.4.4 Advanced > USB Configuration .................................................................................. 54
5.4.5 Advanced > SDIO Configuration ................................................................................. 55
5.4.6 Advanced > Network Configuration ............................................................................. 55
5.4.7 Advanced > Audio Configuration ................................................................................ 55
5.4.8 Advanced > PCI and PCIe Configuration .................................................................... 56
5.4.9 Advanced > PCI and PCIe > PCIe Configuration Settings .......................................... 57

Table of Contents vii
CMx-BTx
5.4.10 Advanced > PCI and PCIe > PCI Subsystem Settings ................................................58
5.4.11 Advanced > Baytrail Features Configuration ...............................................................59
5.4.12 Advanced > ACPI Settings ..........................................................................................59
5.4.13 Advanced > Serial Port Console Redirection ...............................................................60
5.4.14 Advanced > Thermal Configuration .............................................................................60
5.4.15 Advanced > Security Configuration .............................................................................61
5.4.16 Advanced > Miscellaneous ..........................................................................................61
5.4.17 Advanced > NCT5104D Super IO Configuration .........................................................62
5.4.18 Advanced > Ethernet Configuration .............................................................................64
5.4.19 Advanced > Mini-PCIe-Slot function ............................................................................64
5.4.20 Advanced > USB Controls ..........................................................................................64
5.5 Boot Menu ............................................................................................................................65
5.5.1 Boot > Boot Configuration ............................................................................................65
5.5.2 Boot > Boot Configuration > CSM Configuration .........................................................66
5.6 Security Menu ......................................................................................................................66
5.7 Save & Exit Menu ................................................................................................................67
6 System Resources .......................................................................................................69
6.1 Memory Address Map ..........................................................................................................69
6.2 I/O Address Map ..................................................................................................................72
6.3 PCI Configuration Registers ................................................................................................73
6.4 IO Register Maps .................................................................................................................75
6.4.1 CMOS Memory and RTC Registers ............................................................................75
6.5 Interrupts ..............................................................................................................................76
6.5.1 SERIRQ Interrupt Mapping ..........................................................................................76
7 Getting Service ..............................................................................................................77

viii Table of Contents
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Introduction 1
CMx-BTx
1 Introduction
1.1 Overview
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the
PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Ver-
sion 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features
the 22nm, Intel®Bay Trail SoC.
The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, up
to four USB 2.0 ports (with one port routed to mini-PCIe slot), up to two Gigabit Ethernet ports,
up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one
LVDS port, up to four COM ports, one mini-PCIe slot (including one USB 2.0 port).
The CMx-BTx can be run with only 5 volts and is capable of running operating systems like
DOS, Windows 7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others.
Another feature included on the board is a fail safe BIOS that enables the user to start the mod-
ule even if the original BIOS is corrupted.
1.2 Features
SoC
XIntel® Bay Trail I/M/D with inte-
grated Graphics
ZBay Trail-I Premium (E3845)
ZBay Trail-I Med (E3825)
ZBay Trail-I Entry (E3815)
Main Memory
XSingle channel 64bit DDR3L
1067 MT/s and 1333 MT/s
Non-ECC, unbuffered DDR3L
SO-DIMM up to 4 GB
Expansion slots
X1x mini-PCIe with mSATA and
USB capability (3.3V I/O)
X1x 16-bit PC/104 without DMA
and no bus mastering capability
X1x 32-bit PCI-104
Interfaces
X2x Ethernet, 1GBit
X2x SATA 3Gb/s
X4x USB 2.0 (one routed to
mini-PCIe slot)
X4x RS232/422
X5.1 channel HD-Audio (analog &
SPDIF)
X1x VGA
X1x 18/24 Bit LVDS for displays
X8x User GPIO
XSystem panel connector for
power and reset button cable,
watchdog out, speaker and
HDD-LED
Other configurations are possible. Please contact your
local ADLINK Technology representative to discuss
requirements.

2Introduction
1.3 Block Diagram
Figure 1-1: Functional Block Diagram
Intel
BayTrail-I
SoC
E3845 (4C)
E3825 (2C)
E3815 (1C)
PCI
LPC
I210IT
Ethernet
(option)
PCIe[1] x1
Optional:
2nd GbE
LVDS Inverter CTRL
PCI-104
I210IT
Ethernet
1st GbE
LVDS
single/dual channel 18/24-bit
PTN3460
eDP to LVDS
DDI 0
(eDP 1.3 / 2 lanes)
DDR3L-1333
SO-DIMM socket
Inverter
(Backlight)
PCIe[2] x1
BIOS 2
BIOS 1 BMC / SEMA
DIAG
LM 73
Power Supply
+- ATX
5VDC
Stack
I2C
PCIe[3] x1 mPCIe / mCard
slot
1x mSATA
PCIe[0] x1
DB40 Service
Connector
1x USB 2.0
System Panel Con.
XIO2001IZGU
PCIe to PCI
ISA F85226AF
LPC to ISA
(option)
Optional:
PC/104
3x USB 2.0 3x USB 2.0
VGA
ALC888
Audio Codec
HD Audio
8x GPIO
PCA9535BS
Channel 0
CM x-BTx
SPI[0]
I2C
LPC
1x SATA 3 GB/s
shared with mSATA
Optional:
2x SATA 3 GB/s
(1x shared with mSATA)
BIOS/Jumper selection
NCT5104D 2x COM
Optional:
4x COM
SDIO
Micro SD
socket

Introduction 3
CMx-BTx
1.4 Ordering Information
Table 1-1: CMx-BTx Models
Model Number Description
CM1-BT1-E3815
PC/104, E3815, 1.46 GHz, Single Core, incl. heat
spreader, 0°C to 60°C (memory not included; see Table
1-2 for DDR3L memory options)
CM2-BT2-E3825
PC/104-Plus, E3825, 1.33 GHz, Dual Core, incl. heat
spreader, 0°C to 60°C (memory not included; see Table
1-2 for DDR3L memory options)
CM3-BT4-E3845
PCI-104, E3845, 1.91 GHz, Quad Core, incl. heat
spreader, 0°C to 60°C (memory not included; see Table
1-2 for DDR3L memory options)
CM3-BT1-E3815
PCI-104, E3815, 1.46 GHz, Single Core, incl. heat
spreader, 0°C to 60°C (memory not included; see Table
1-2 for DDR3L memory options)
CM1-BT1-E3815-ETT PC/104, E3815, 1.46 GHz, Single Core, incl. heat
spreader, -40°C to 85°C
CM2-BT2-E3825-ETT PC/104-Plus, E3825, 1.33 GHz, Dual Core, incl. heat
spreader, -40°C to 85°C
CM3-BT1-E3815-ETT PCI-104, E3815, 1.46 GHz, Single Core, incl. heat
spreader, -40°C to 85°C
CM3-BT4-E3845-ETT
(supported with active heat
sink, CMx-BTx-TM-20)
PCI-104, E3845, 1.91 GHz, Quad Core, incl. heat
spreader, -40°C to 85°C
Table 1-2: CMx-BTx Cable Sets and Accessories
Ordering number Description
CMx-BTx-X-10
Adapter Cable Set:
XPower
X2x GBit-Ethernet
X3x USB 2.0
X2x or 4x COM
XHD-Audio
X1x System Panel
XExternal RTC Battery
CMx-BTx-TM-10 Passive, low-profile heat sink for CMx-BTx (see Table on
page 5 for more details)
CMx-BTx-TM-20 Active, low-profile heat sink (with fan) for CMx-BTx (see
Table on page 5 for more details)
DDR3L memory Verified industrial grade 2GB and 4GB DDR3L SODIMM
memory modules available

4Introduction
1.5 Specifications
1.5.1 Electrical Specifications
1.5.2 Environmental Specifications
Table 1-3: Electrical Specifications
Rise time: < 10 ms
Supply voltage tolerance: 5VDC ±5 %
Inrush current: 3.5A at 5V in
Supply current: 3.5A
Table 1-4: Operating Environmental Specifications
Temperature range: -40°C … +85°C
Temperature change: max. 10 Kelvin per 30 minutes
Humidity (relative): 10 % … 90 % (non condensing)
Pressure: 450 hPa … 1100 hPa
Table 1-5: Non-Operating/Transport Environmental Specifications
Temperature range: -55°C … +85°C
Temperature change: max. 10 Kelvin per 30 minutes
Humidity (relative): 5 % … 95 % (non condensing)
Pressure: 450 hPa … 1100 hPa
Table 1-6: HALT Parameters
Cold Temperature Step
Stress: The board remained operational during test down to
-100°C, starting at +20°C and decreasing in 10°C incre-
ments with 15 minute dwells
Hot Temperature Step
Stress: The board remained operational during test up to +90°C,
starting at +30°C and increasing in 10°C increments with
15 minute dwells
Rapid Thermal Transitions: The board was subject to five rapid temperature cycles
from -90°C to +85°C @ set transition rate of 60°C per min-
ute
Vibration Step Stress: The board was subject to vibration step stress with set
points from 5 grams to 45 grams @ 20°C and vibration
increasing by 5 grams with 15 minute dwells at each level
of 2Hz to 5000Hz bandwidth
Combined Environment: The board was subject to thermal cycles from -90°C to
+85°C at an average rate of 60°C per minute combined
with vibration at set points of 8, 16, 24, 32 and 40 grams
from the first to the fifth thermal cycle and 10-minute
dwells at each extreme temperature

Introduction 5
CMx-BTx
1.5.3 Mechanical Specifications
1.5.4 Heat Sink Specifications
Table 1-7: Mean Time Between Failures
MTBF at 40°C 253981 Hrs
MTBF at 85°C 74186 Hrs
Table 1-8: Mechanical Specifications
Dimensions: (L x W) 90.6 mm x 95.2 mm
Height: X25mm with heat spreader
Weight: X172g with heat spreader
Mounting: 4 mounting holes
Heat spreader pre-mounted
ADLINK strongly recommends plastic spacers instead of metal spacers for mounting
the board. Metal spacers create the possibilities of short circuits with the components
located around the mounting holes. This can damage the board.
ADLINK recommande fortement des entretoises en plastique au lieu d'entretoises
métalliques pour le montage de la carte. Les entretoises métalliques créent des possi-
bilités de courts-circuits avec les composants situés autour des trous de montage.
Cela peut endommager la carte.
Table 1-9: Cooling Requirements
Passive Heat Sink • Supported by all CMx-BTx models in standard temperature
range (0°C to +60°C) with 0.8m/s airflow. (Quad -core models
start to throttle at +61°C.)
• Supported by all CMx-BTx models (except for Quad-core
models) in extended temperature range (-40°C to +85°C) with
0.8m/s airflow. (Dual-core models start to throttle at +87°C.)
Active Heat Sink • Supported by all CMx-BTx models, including Quad-core
models, in extended temperature range (-40°C to +85°C)
MISE EN GARDE

6Introduction
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Getting Started 7
CMx-BTx
2 Getting Started
2.1 Header and Connector Locations
Top Side
Figure 2-1: Header and Connector Locations (Top Side)
Table 2-1: Header, Connector, Socket, and Switch Definitions (Top Side)
Connector Description Mating Connector
BAT1 External battery header, 1*2 pins, 1.25mm
pitch for power from external battery (SMP,
W125-0210-310-Z)
Molex, 51021-0200 housing for
50058-8000 terminals
CN1/CN2 Standard PC/104 connector, female Standard PC/104 connector, male
CN4 mini-PCIe socket, 1*52 pins, 0.08mm pitch
(shared with mSATA)
8mm, 52-pin mini PCIe edge
connector
CN7 Standard SATA connector for the 3Gb/s,
SATA1 interface
Standard female SATA
CN8 Standard SATA connector for the 3Gb/s,
SATA2 interface (Shared with mSATA)
Standard female SATA
CN10 Gigabit-Ethernet header, 2*5 pins, 2.0mm
pitch for GbE1 interface
(Molex, 87832-1014)
Molex, 51110-1051 crimp housing for
50394 crimp terminals
SATA1
(CN7) SATA2
GbE1 GbE2
System
VGA
3x USB 2.0
COM3
mPCIe / mSATA (CN4)
Micro-SD
Slot
SW3 SW4 SW2
COM2
FAN
(CN27) (CN18)
(CN19) (CN16) (CN14)
Panel
(CN20)
Power (CN24)
(CN11)
(CN10)
(CN8)
[full COM interfaces]
(CN28)
PC/104 (CN1/CN2)
CN1
CN2
B1A1
LEDs 1-13
11
1
1
1
BAT1
1
1
C0D0
1
1
1
1
1
1

8Getting Started
CN11 Gigabit-Ethernet header, 2*5 pins, 2.0mm
pitch for GbE2 interface
(Molex, 87832-1014)
Molex, 51110-1051 crimp housing for
50394 crimp terminals
CN14 VGA header, 2*5 pins, 2mm pitch
(Molex, 87832-1014)
Molex, 51110-1051 crimp housing for
50394 crimp terminals
CN16 USB 2.0 header, 2*10 pins, 2.0mm pitch
(Molex, 87832-2014)
Molex, 51110-2051 crimp housing for
50394 crimp terminals
CN18 COM 2 header, 2*5 pins, 2.0mm pitch
(Molex, 87832-1014)
Molex, 51110-1051 crimp housing for
50394 crimp terminals
CN19 COM 3 header, 2*5 pins, 2.0mm pitch
(Molex, 87832-1014)
Molex, 51110-1051 crimp housing for
50394 crimp terminals
CN20 System panel header, 2*5 pins, 2.0mm pitch
(Molex, 87832-1014)
Molex, 51110-1051 crimp housing for
50394 crimp terminals
CN24 ATX Power Input connector, 1*15 pins,
1.5mm pitch
(JST, B15B-EH)
JST, EHR-15 with crimp contacts,
SHE-001T-P0.6
CN27 FAN connector, 1*4 pins, 1.25mm pitch
(Hirose, DF13-4P-1.25DSA)
Hirose, DF13-4S-1.25C with crimp
contact DF13-2630SCFA (04)
CN28 Micro-SD card, push-pull (no ejection),
hinge-type, standard, right-angle, 1.83mm,
8-pin slot
Micro-SD card
SW2 4-pin, 8.1mm, 25mA 24VDC dip switch for
COM 0/1 termination
N/A
SW3 4-pin, 8.1mm, 25mA 24VDC dip switch for
COM 2/3 termination
N/A
SW4 4-pin, 8.1mm, 25mA 24VDC dip switch for
BIOS Settings
N/A
Table 2-1: Header, Connector, Socket, and Switch Definitions (Top Side) (Continued)
Connector Description Mating Connector

Getting Started 9
CMx-BTx
Bottom Side
Figure 2-2: Header and Connector Locations (bottom side)
Table 2-2: Header and Connector Definitions (bottom side)
Connector Description Mating Connector
CN1/CN2 Standard PC/104 connector, male Standard PC/104 connector, female
CN9 Standard DDR3L SODIMM socket DDR3L memory module, non-buffered,
non-ECC
CN12 LVDS Backlight connector, Hirose DF13,
1*8 pins, 1.25mm pitch
(Hirose, DF13A-8P-1.25H)
Hirose, DF13-8S-1.25C with crimp
contact DF13-2630 SCF
CN13 LVDS connector, Hirose DF19, 1*30 pins,
1.0mm pitch
(Hirose, DF19G-30P-1H)
Hirose, DF19-30S-1C with crimp contact
DF19A-3032 SCF A
CN15 HD Audio connector, Molex PicoBlade
Header, 1*15 pins, 1.25mm pitch
(Molex 53261-1571)
Molex PicoBlade female connector,
(Molex 51021-1500)
CN17 COM0/1 connector, Hirose DF13, 1*9 pins,
1.25mm pitch
(Hirose, DF13A9P-1.25H)
Hirose, DF13-9S-1.25C with crimp
contact DF13-2630 SCF
CN21 User GPIO connector, Hirose DF13, 1*10
pins, 1.25mm pitch
(Hirose, DF13A-10P-1.25H)
Hirose, DF13-10S-1.25C with crimp
contact DF13-2630 SCF
LVDS (CN13)
LVDS
HD Audio
DB40
COM0/1
(CN17)
[4-wire COM interfaces]
(CN26)
(CN15)
SODIMM socket (CN9)
PCI-104 (CN22/CN23)
GPIO
Backlight
(CN12) (CN21)
JP1
1
11
1
1
1
1
11
00
A1 C1D1
B1
CN22
PC/104 (CN1/CN2)
CN2
CN1
CN23
1

10 Getting Started
CN22/CN23 Standard PCI-104 connector, male Standard PC/104 connector, female
CN26 DB40 debug connector, FFC, 1*40 pins,
0.5mm pitch
(Molex, 502790-4091)
FPC/FFC, 0.3mm thick (+/- 0.05mm) with
0.5mm pitch
JP1 LCD and Backlight voltage selection jumper
block, 2*3 pins, 2.0mm pitch
2.0mm mini jumper
Table 2-2: Header and Connector Definitions (bottom side) (Continued)
Connector Description Mating Connector

Getting Started 11
CMx-BTx
2.2 Mechanical Dimensions
Figure 2-3: Mechanical Dimensions
Mechanical dimensions in Figure 2-3 shown in millimeters.
4,34
22,10
43,20
16,13
4,32
1,67
44,42
39,70
32,10
38,93
54,61
62,61
72,01
64,08
80,01
90,80
12,19
14,35 13,33
1,27
85,80
22,30
68,58
58,55
51,74
41,70
0
0
50,80
72,02
79,25
4x2,7
90,2
7,5
3,2
96
5,1
4x
76,20
4x
55,24
18,42
4x
82,24
24,9
2
11,50

12 Getting Started
2.3 LED Indicators
All LEDs are located on the top-side, board edge shown in Figure 2-1. See Figure 2-4 for LED
locations and Table for LED function definitions.
Figure 2-4: LED Locations
Table 2-3: LED Definitions
LED# Color Function
LED10 red Watchdog indicator LED
LED1 green HDD Activity indicator LED
LED8 blue BMC Status indicator LED
LED4 green mini-PCIe WPAN Connection indicator LED
LED3 green mini-PCIe WLAN Connection indicator LED
LED2 green mini-PCIe WWAN Connection indicator LED
LED7 yellow Gbit Ethernet Speed = 1000 Mbit/s indicator on ETH1
LED6 yellow Gbit Ethernet Activity indicator on ETH1
LED5 green Gbit Ethernet Speed = 100 Mbit/s indicator on ETH1
LED9 green Power Good indicator LED
LED13 yellow Gbit Ethernet Speed = 1000 Mbit/s indicator on ETH2
LED12 yellow Gbit Ethernet Activity indicator on ETH2
LED11 green Gbit Ethernet Speed = 100 Mbit/s indicator on ETH2
LED3
LED1
LED8
LED9
LED7
LED6
LED5
LED10
LED11
LED12
LED13
LED2
LED4