Kontron COMe-bHL6 User manual

COMe-bHL6
Document Revision 010 - preliminary
www.kontron.com

» Table of Contents «
1User Information..................................................................................5
1.1 bout This Document.................................................................................................................... 5
1.2 Copyright Notice.......................................................................................................................... 5
1.3 Trademarks................................................................................................................................. 5
1.4 Standards................................................................................................................................... 5
1.5 Warranty.................................................................................................................................... 6
1.6 Technical Support......................................................................................................................... 6
2Introduction........................................................................................7
2.1 Product Description......................................................................................................................7
2.2 Naming clarification..................................................................................................................... 8
2.3 Understanding COM Express® Functionality.......................................................................................8
2.4 COM Express® Documentation.........................................................................................................9
2.5 COM Express® Benefits.................................................................................................................. 9
3Product Specification..........................................................................10
3.1 Modules & ccessories................................................................................................................. 10
3.2 Functional Specification............................................................................................................... 11
3.3 Block Diagram............................................................................................................................ 19
3.4 Electrical Specification................................................................................................................20
3.4.1 Supply Voltage........................................................................................................................... 20
3.4.2 Power Supply Rise Time................................................................................................................20
3.4.3 Supply Voltage Ripple..................................................................................................................20
3.4.4 Power Consumption..................................................................................................................... 20
3.4.5 TX Mode.................................................................................................................................. 21
3.4.6 Single Supply Mode..................................................................................................................... 21
3.5 Power Control............................................................................................................................ 22
3.6 Environmental Specification......................................................................................................... 23
3.6.1 Temperature Specification............................................................................................................23
3.6.2 Humidity................................................................................................................................... 23
3.7 Standards and Certifications.........................................................................................................24
3.8 MTBF........................................................................................................................................ 26
3.9 Mechanical Specification..............................................................................................................27
3.10 Module Dimensions..................................................................................................................... 28
3.11 Thermal Management, Heatspreader and Cooling Solutions.................................................................29
3.12 Onboard Connectors.................................................................................................................... 30
3.12.1 F N Connector J6 - PCB bottom......................................................................................................30
3.12.2 CPU JT G connector J3 - PCB bottom...............................................................................................31
3.12.3 CPLD Debug connector J7 - PCB top.................................................................................................31
4Features and Interfaces.......................................................................32
4.1 S5 Eco Mode.............................................................................................................................. 32
4.2 LPC.......................................................................................................................................... 33
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COMe-bHL6 /
4.3 Serial Peripheral Interface (SPI).................................................................................................... 34
4.4 SPI boot.................................................................................................................................... 34
4.5 M. .R.S.................................................................................................................................... 35
4.6 U RT........................................................................................................................................ 36
4.7 Fast I2C.................................................................................................................................... 37
4.8 E PI, JID & PLD Driver................................................................................................................ 38
4.9 K-Tools..................................................................................................................................... 39
4.10 K-Station 2 GUI.......................................................................................................................... 39
4.11 Ke PI....................................................................................................................................... 40
4.12 GPIO - General Purpose Input and Output.........................................................................................41
4.13 Dual Staged Watchdog Timer.........................................................................................................42
4.14 Speedstep Technology................................................................................................................. 43
4.15 C-States.................................................................................................................................... 44
4.16 Hyper Threading......................................................................................................................... 45
4.17 Dynamic FSB Frequency Switching..................................................................................................46
4.18 VID-x........................................................................................................................................ 47
4.19 Intel® Turbo Boost Technology and VX...........................................................................................48
4.20 Display Configuration..................................................................................................................49
4.21 Hybrid Graphics / Multi-monitor.....................................................................................................51
4.22 Intel® Wireless Display................................................................................................................ 53
4.23 Intel® vPro™ technology..............................................................................................................54
4.24 CPI Suspend Modes and Resume Events..........................................................................................55
5System Resources...............................................................................56
5.1 Interrupt Request (IRQ) Lines........................................................................................................56
5.2 Memory rea.............................................................................................................................. 57
5.3 I/O ddress Map......................................................................................................................... 57
5.4 Peripheral Component Interconnect (PCI) Devices.............................................................................58
5.5 Internal I2C Bus......................................................................................................................... 58
5.6 External I2C Bus......................................................................................................................... 58
5.7 System Management (SM) Bus....................................................................................................... 59
6Connectors........................................................................................60
6.1 Connector Location..................................................................................................................... 60
7Pinout List.........................................................................................61
7.1 General Signal Description............................................................................................................61
8BIOS Operation...................................................................................62
8.1 Determining the BIOS Version.......................................................................................................62
8.2 BIOS Update.............................................................................................................................. 62
8.3 POST Codes................................................................................................................................ 62
8.4 Setup Guide............................................................................................................................... 62
4

COMe-bHL6 / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2013 Kontron Europe GmbH
ll rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PIS ®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron G.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, T, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» ll other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5

COMe-bHL6 / User Information
1.5 arranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
6

COMe-bHL6 / Introduction
2 Introduction
2.1 Product Description
The brand new application-ready COMe-bHL6 offers increased performance density and up to twice the graphics
performance compared to its predecessors. Up to three independent, daisy-chained displays with up to 4K resolution are
supported to create stunning user experiences. Further to this, DirectX® 11.1 and OpenGL 4.0 support paves the way for
compelling visuals when videos, graphics and interactive content are being displayed. By integrating the new Intel® VX2
and OpenCL 1.2, Kontron’s new Computer-on-Modules additionally not only provide an increase in floating-point
performance they also possess improved parallel processing capacities. Typical application areas can be found in markets
such as digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as
industrial plant and machine line control on shop floor- and control room-level.
Engineers can immediately commence with evaluating these new benchmark Computer-on-Modules on all Kontron COM
Express® pin-out type 6-compliant starter kits.
The Kontron COM Express® pin-out type 6 COMe-bHL6 module is available in several different variants ranging from the
cost-optimized low-power processor versions up to quad-core Intel® Core™ i7 processors with up to 4x 2.4 GHz. The
modules are designed with the Intel® Mobile QM87 Chipset, host up to 16 GB DDR3L R M and support 7 PCI Express x1
lanes and 1 PEG x16 interface which is also compatible to standard PCI Express devices. Less complex peripherals can be
connected via SPI and LPC. dditional dedicated features include 3x S T 6Gb/s ports, 1 S T 3Gb/s port, as well as
Gigabit Ethernet, 4 USB 3.0 ports, 4 USB 2.0 and 2 serial ports. The Kontron COMe-bHL6 features comprehensive display
support with 3x dual mode DisplayPort++ which can also output, HDMI, DVI and DisplayPort 1.2. Industrial applications
benefit from the watchdog and real-time clock. The module supports an 8.5-20V wide-range power supply. The support of
smart batteries via M RS and the standardized embedded application programming interface E PI round off the feature
set and provide engineers with a comprehensive service package that eases system development as well as system
programming.
For customers wanting to instantly leverage the new graphics and computing power in their existing designs based on
individual carrier boards, Kontron also offers standardized migration support services to accelerate the design-in phase
and thus achieve fastest field deployment.
The Kontron COM Express® basic Computer-on-Module COMe-bHL6 supports the full Windows OS portfolio along with
Linux and VxWorks.

COMe-bHL6 / Introduction
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
ll Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
& B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature Pin-Out Type 1 Pin-Out Type 10 Pin-Out Type 2 Pin-Out Type 6
HD Audio 1x 1x 1x 1x
Gbit Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
Parallel ATA - - 1x -
PCI - - 1x -
PCI Express x1 6x 6x 6x 8x
PCI Express x16 (PEG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - 2x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
DP++ (SDVO/DP/HDMI/DVI) 1x optional 1x 3x shared with PEG 3x
LPC 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
GPIO 8x 8x 8x 8x
SDIO 1x optional 1x optional - -
UART (2-wire COM) - 2x - 2x
FAN PWM out - 1x - 1x
8

COMe-bHL6 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-bHL6. dditional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. ll Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
9

COMe-bHL6 / Product Specification
3 Product Specification
3.1 Modules & Accessories
The COM Express® basic sized Computer-on-Module COMe-bHL6 (BHL6) follows pin-out Type 6 and is compatible to PICMG
specification COM.0 Rev 2.1. The COMe-bHL6 based on latest Shark Bay platform is available in different variants to cover
the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor Graphics TDP PCH USB 3.0 SATA 6G SATA 3G
38025-0000-24-7 COMe-bHL6 i7-4700EQ Intel® Core™ i7-4700EQ GT2 47W/37W QM87 4 3 1
38025-0000-27-5 COMe-bHL6 i5-4400E Intel® Core™ i5-4400E GT2 37W QM87 4 3 1
38025-0000-16-5 COMe-bHL6 i5-4402E Intel® Core™ i5-4402E GT2 25W QM87 4 3 1
Accessories
Product Number Baseboards
38114-0000-00-0 COM Express® Reference Carrier Type 6 (8mm COMe connector)
38106-0000-00-0 COM Express® Eval Carrier Type 6 (5mm COMe connector)
Product Number Memory
97015-2048-16-1 DDR3L-1600 SODIMM 2GB
97015-4096-16-1 DDR3L-1600 SODIMM 4GB
97015-8192-16-1 DDR3L-1600 SODIMM 8GB
97015-2048-16-3 DDR3L-1600 SODIMM 2GB E2
97015-4096-16-3 DDR3L-1600 SODIMM 4GB E2
97015-8192-16-3 DDR3L-1600 SODIMM 8GB E2
Product Number Cooling & Mounting
38025-0000-99-2 HSP COMe-bHL6 heatpipe thread
38025-0000-99-3 HSP COMe-bHL6 heatpipe through
38025-0000-99-4 HSP COMe-bHL6 low power thread (for low temperature usage only)
38013-0000-99-0C05 HSK COMe-bHL6 active (to be mounted on HSP)
38017-0000-00-5 COMe Mount KIT 5mm 1set
38017-0100-00-5 COMe Mount KIT 5mm 100sets
38017-0000-00-0 COMe Mount KIT 8mm 1set
38017-0100-00-0 COMe Mount Kit 8mm 100sets
Product Number Adapter & Cables
9-5000-0352 D -LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353 D -LVDS-DVI 24bit (LVDS to DVI converter)
96007-0000-00-7 D -Type6-DP3 (3x DP++ adapter between carrier and module)
96006-0000-00-8 D -DP-LVDS (DP++ to LVDS adapter)
96082-0000-00-0 K B- D PT-DP-DVI (DP++ to DVI adapter cable)
96083-0000-00-0 K B- D PT-DP-VG (DP++ to VG adapter cable)
96084-0000-00-0 K B- D PT-DP-HDMI (DP++ to HDMI adapter cable)
96079-0000-00-0 K B-HSP 200mm (Cable adapter to connect F N to module)
96079-0000-00-2 K B-HSP 40mm (Cable adapter to connect F N to module)
96006-0000-00-2 COMe POST T6 (Debug Card)
10

COMe-bHL6 / Product Specification
3.2 Functional Specification
Processor
The 22nm Intel® 4th Gen Core™ i7/i5/i3/Celeron® embedded (Haswell / Crystal Well) CPU family with 37.5x32mm
package size (BG 1364 socket) supports:
» Intel® Turbo Boost Technology 2.01
» Intel® 64
» Intel® Virtualization Technology (VT-x)
» Intel® Virtualization Technology for Directed I/O (VT-d)
» ES New Instructions ( ES-NI)
» Intel® Hyper-Threading Technology
» Enhanced Intel SpeedStep® Technology
» Idle States (C-States)
» Intel® Smart Cache
» Thermal Monitoring Technologies
» Intel® Fast Memory ccess
» Intel® Flex Memory ccess
» Integrated Intel® HD Graphics with Dynamic Frequency
Optional available (with customized BIOS):
» Intel® vPRO™ Technology including:
» Intel® ctive Management Technology ( MT)
» Intel® Trusted Execution Technology (TXT)
» dvanced Encryption Standard Instructions ( ES-NI)
11

COMe-bHL6 / Product Specification
The integrated Intel® HD Graphics HD4600 supports:
» GraphicsTechnology GT2 with 20 Execution Units or GT3 with 40 Execution Units
» Intel® Quick Sync Video
» Intel® InTru™ 3D Technology
» Intel® Wireless Display
» Intel® Flexible Display Interface (Intel® FDI)
» Intel® Clear Video HD Technology
» Intel® Graphics Render C-State RC6
» Intel® Smart 2D Display Technology (S2DDT)
» 3 simultaneous displays (Win7/8 and Linux)
» Hybrid Multi Monitor with 2 internal and 2 external displays
» Video Decode for VC/H.264/VC-1/MPEG-2
» Video Encode for VC/H.264/MPEG-2
» Blu-ray Playback (incl. P VP)
12

COMe-bHL6 / Product Specification
CPU Featureset
Intel® Core™ Core™ Core™
- i -4 00EQ i5-4400E i5-4402E
# of Cores 4 2 2
# of Threads 8 4 4
TDP Core frequency 2400MHz 2 00MHz 1600MHz
Max Turbo Frequency 1 core 3400MHz 3300MHz 2700MHz
Max Turbo all cores 2800MHz 3200MHz 2600MHz
LFM/LPM Frequency 800MHz 800MHz 800MHz
Bus/Core Ratio 8 - 24 8 - 27 8 - 16
TjMax 100°C 100°C 100°C
Thermal Design Power (TDP) 47W 37W 25W
cTDP-Down 37W - -
cTDP-Down Core frequency 1 00MHz - -
cTDP-Up - - -
cTDP-Up Core frequency - - -
Max Turbo Power (PL2 max) 58.75/46.25W 46.25W 46.25W
C-States C0-C7 C0-C7 C0-C7
eDR M - - -
Smart Cache 6MB 3MB 3MB
Min Memory Type DDR3L-1066 DDR3L-1066 DDR3L-1066
Max Memory Type DDR3L-1600 DDR3L-1600 DDR3L-1600
Max Memory Size 2x8GB 2x8GB 2x8GB
# of Memory Channels 2 2 2
Graphics Model HD4600 HD4600 HD4600
GFX LFM Frequency 200MHz 200MHz 200MHz
GFX Base Frequency 400MHz 400MHz 400MHz
GFX Turbo Frequency 1000MHz 1000MHz 900MHz
GFX Technology GT2 20EU GT2 20EU GT2 20EU
GFX Func/Phys Cores 2/2 2/2 2/2
Quick Sync Video Yes Yes Yes
InTru™ 3D Yes Yes Yes
Wireless Display Yes Yes Yes
Clear Video HD Yes Yes Yes
vPRO™ (optional) Yes Yes Yes
TXT (optional) Yes Yes Yes
ES-NI (optional) Yes Yes Yes
VT-x Yes Yes Yes
VT-d Yes Yes Yes
PCI Express Graphics x16 Gen 3.0 Gen 3.0 Gen 3.0
13

COMe-bHL6 / Product Specification
Memory
Sockets 2x DDR3 SO-DIMM
Memory Type DDR3L-1333/1600
Maximum Size 2x8GB
Technology Dual Channel
Chipset
The 32nm Intel® 8-Series Platform Controller Hub Lynx Point supports:
» PCI Express Revision 2.0
» PCI Express Configurations x1, x2, x4
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology (TXT)
» Intel® vPro Technology (optional)
» Intel® ctive Management Technology 9.0 (optional)
» Intel® nti-Theft Technology
» Intel® Rapid Storage Technology
» Intel® Smart Response Technology
PCH comparison
Feature QM8 HM86
TDP 4.1W 4.1W
Rapid Storage YES YES
USB 3.0 (USB 2.0 compatible) YES (4x on COMe) YES (2x on COMe
USB 2.0 YES (4x on COMe) YES (6x on COMe
Wireless Display YES YES
3 Displays simultaneously YES YES
VT-d YES NO
vPRO YES NO
MT 9.0 YES NO
TXT YES NO
S T R ID YES NO
S T 6Gb/s (Gen3) YES (3x on COMe) YES (2x on COMe)
S T 3Gb/s (Gen2) YES (1x on COMe) YES (2x on COMe)
The Intel® vPro Technology including Trusted Execution Technology (TXT), ctive
Management Technology ( MT) and Encryption ES-NI is not supported by default on
COMe-bHL6. Please contact your local sales or support for custom BIOS variants supporting
vPro.
14

COMe-bHL6 / Product Specification
HighSpeed I/O Port Configuration
- QM8 I/O HM86 I/O COMe with QM8 COMe with HM86
Port1 USB3 #1 USB3 #1 USB #0 = USB3.0 USB #0 = USB3.0
Port2 USB3 #2 USB3 #2 USB #1 = USB3.0 USB #1 = USB3.0
Port3 USB3 #5 - USB #2 = USB3.0 -
Port4 USB3 #6 - USB #3 = USB3.0 -
- USB2 USB2 USB #4-7 = USB 2.0 USB #2-7 = USB 2.0
Port5 USB3 #3 or PCIe #1 USB3 #3 or PCIe #1 PCIe #0 PCIe #0
Port6 USB3 #4 or PCIe #2 USB3 #4 or PCIe #2 PCIe #1 PCIe #1
Port PCIe #3 PCIe #3 PCIe #2 PCIe #2
Port8 PCIe #4 PCIe #4 PCIe #3 PCIe #3
Port9 PCIe #5 PCIe #5 PCIe #4 PCIe #4
Port10 PCIe #6 PCIe #6 PCIe #5 PCIe #5
Port11 PCIe #7 PCIe #7 PCIe #6 PCIe #6
Port12 PCIe #8 PCIe #8 PCIe #7 PCIe #7
Port13 S T 3 #4 or PCIe #1 S T 3 #4 S T #0 = S T 6Gb/s S T #0 = S T 6Gb/s
Port14 S T 3 #5 or PCIe #2 S T 3 #5 S T #1 = S T 6Gb/s S T #1 = S T 6Gb/s
Port15 S T 3 #0 S T 2 #0 S T #2 = S T 6Gb/s S T #2 = S T 3Gb/s
Port16 S T 3 #1 - - -
Port1 S T 2 #2 S T 2 #2 S T #3 = S T 3Gb/s S T #3 = S T 3Gb/s
Port18 S T 2 #3 - - -
Graphics Core
The integrated Intel® GM HD (Gen7.5) supports:
Graphics Core Render Clock GT1/GT2/GT3
Base clock: 400/200 MHz
GT Turbo: up to 1000 MHz
Execution Units / Pixel Pipelines GT3: 40EU / GT2: 20EU / GT1: 10EU
Max Graphics Memory 1720MB
GFX Memory Bandwidth (GB/s) 25.6
GFX Memory Technology DVMT
API (DirectX/OpenGL) 11.1 / 4.0 + OCL 1.2
Shader Model 5.0
Hardware accelerated Video MPEG2, VC-1, VC, Blu-ray (+3D)
Independent/Simultaneous Displays 3
Display Port DP 1.2 / eDP 1.3
HDCP support HDCP 1.4a
Monitor output
CRT max Resolution 1920x1200
TV out: -
LVDS
LVDS Bits/Pixel 1x18/24, 2x18/24 with eDP2LVDS
LVDS Bits/Pixel with dithering -
LVDS max Resolution: 1920x1200
PWM Backlight Control: YES
Supported Panel Data: JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics 1x PEG 3.0
Digital Display Interface DDI1 DP++
Digital Display Interface DDI2 DP++
Digital Display Interface DDI3 DP++
Maximum Resolution on DDI HDMI: 4096x2304 DP: 3840x2160
15

COMe-bHL6 / Product Specification
PEG Configuration
The x16 PCI Express Graphics Port (PEG) is compatible to standard PCI Express devices like Ethernet or R ID controllers.
The COMe-bHL6 supports following PEG Port configuration when used as PCI Express Interface:
» 1×16
» 1×8
» 1×4
» 1×2
» 1×1
The internal PCI Express controller can be re-configured to support up to 3 PCIe ports. The following port configurations
are configurable via setup option:
» 2×8 (lanes #0-7 + #8-15)
» 1×8 + 2×4 (lanes #0-7 + #8-11 + #12-15)
Storage
onboard SSD -
SD Card support -
IDE Interface -
Serial-ATA up to 3x S T 6Gb/s, 1x S T 3Gb/s
SATA AHCI NCQ, HotPlug, Staggered Spinup, eS T , PortMultiplier
SATA RAID 0, 1, 5, 10
If S T HCI or R ID is disabled in setup, the S T Interface only supports 3Gb/s transfer
rate and Staggered Spin-Up. To configure a R ID enable R ID support in BIOS Chipset/S T
settings, connect at least two hard drives and enter the R ID Option ROM by pressing
'CTRL'+'I'
16

COMe-bHL6 / Product Specification
Connectivity
USB 2.0 8x USB 2.0
USB 3.0 up to 4x USB 3.0
USB Client -
PCI -
PCI External Masters -
PCI Express 7x PCIe x1 Gen 2.0
Max PCI Express 8x PCIe without L N
PCI Express x2/x4 configuration YES (Softstrap option)
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® i218-LM (Clarkville)
PCI Express Configuration
By default, the COMe-bHL6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
PCIe Port #0 Port #1 Port #2 Port #3 Port #4 Port #5* Port #6* Port # *
Configuration0 x1 x1 x1 x1 x1 - - -
Configuration1 x2 x1 x1 x1 x1 x1 x1
Configuration2 x2 x2 x1 x1 x1 x1
Configuration3 x2 x2 x2 x1 x1
Configuration4 x2 x2 x2 x2
Configuration5 x4 x1 x1 x1 x1
Configuration6 x4 x2 x1 x1
Configuration7 x4 x2 x2
Configuration8 x4 x4
- *PCIe Port #7 is available without Ethernet Controller only
Ethernet
The Intel® i218-LM (Clarkville) ethernet supports:
» Jumbo Frames - 9K
» M Csec IEEE 802.1 E
» Time Sync Protocol Indicator
» WOL (Wake On L N)
» PXE (Preboot eXecution Environment)
» IEEE1588
1

COMe-bHL6 / Product Specification
Misc Interfaces and Features
Audio HD udio + DisplayPort dual stream
Onboard Hardware Monitor Nuvoton NCT7802Y
Trusted Platform Module tmel T97SC3204-U2 1 -10
Miscellaneous 2x U RT / PWM F N
Kontron Features
External I2C Bus Fast I2C, MultiMaster capable
Smart Battery (M.A.R.S.) support YES
Embedded API PICMG E PI / JID 32
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Additional features
» ll solid capacitors (POSC P). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support YES
Supply Voltage 8.5V - 20V
ACPI CPI 4.0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Misc Power Management tbd
Power Consumption and Performance
Full Load Power Consumption tbd
Kontron Performance Index tbd
Kontron Performance/Watt tbd
*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0
Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics
and Memory performance are available in pplication Note KEM P054 at EMD Customer
Section.
Supported Operating Systems
The COMe-bHL6 supports:
» Microsoft Windows 7 32bit/64bit
» Microsoft Windows Embedded Standard 7 (WES7) 32bit/64bit
» Microsoft Windows 8 32bit/64bit
» Microsoft Windows Embedded Standard 8 (WES8) 32bit/64bit
» Linux
» VxWorks 6.9 32bit/64bit
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COMe-bHL6 / Product Specification
3.3 Block Diagram
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COMe-bHL6 / Product Specification
3.4 Electrical Specification
3.4.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC: 8.5V - 20V
Standby: 5V DC +/- 5%
RTC: 2.5V - 3.3V
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only
3.4.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the TX specification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power Consumption of the different COMe-bHL6 variants is tbd (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in pplication Note KEM P054 available on
EMD Customer Section. Information there is available after registration.
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