TUYA WB2L User manual

Contents
Contents
1 Overview 2
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Module interfaces 4
2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Interface pin denition . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Test pin denition . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Electrical parameters 8
3.1 Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . 8
3.2 Working conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Current consumption during constant transmission and receiving . . . 9
3.4 Operating current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 RF features 11
4.1 Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 TX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 RX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5 Antenna 13
5.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 13
6 Packaging Information and Production Instructions 16
6.1 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2 Side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.3 Recommended schematic encapsulation . . . . . . . . . . . . . . . . 17
6.4 Recommended PCB Encapsulation-Pin header . . . . . . . . . . . . . . 17
6.5 Recommended PCB Encapsulation-SMT . . . . . . . . . . . . . . . . . 18
6.6 Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.7 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 20
6.8 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
I

Contents
WB2L is a low-power embedded Wi-Fi and Bluetooth LE module that Tuya has devel-
oped. It consists of a highly integrated RF chip (BK7231T) and several peripheral
components, with an embedded Wi-Fi network protocol stack and robust library func-
tions.
1 / 28

1 Overview
1 Overview
WB2L is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB ash
memory, 256 KB static random-access memory (SRAM), and extensive peripher-
als.
WB2L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and
TCP/IP protocols. You can develop embedded Wi-Fi products as required.
1.1 Features
• Embedded low-power 32-bit CPU, which can also function as an application
processor
• Clock rate: 120 MHz
• Operating voltage: 3.0 V to 3.6 V
• Peripherals: 5 GPIOs
• Wi-Fi connectivity
–802.11 b/g/n
–Channels 1 to 14 at 2.4 GHz
–Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES),WPA3 security modes
–Up to +17 dBm output power in 802.11b mode
–EZ and AP net pairing modes for Android and iOS devices
–Onboard PCB antenna with a gain of 1 dBi
–Operating temperature: –40°C to +105°C
• Bluetooth LE connectivity
–Support for Bluetooth LE 4.2
–Maximum output power of +7 dBm
–Onboard PCB antenna with a gain of 1 dBi
1.2 Applications
• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
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1 Overview
• Baby monitor
• Network camera
• Intelligent bus
1.3 Change history
Date Description Version after change
2019-11-07 This is the rst release. V1.0.0
2019-11-23 Updated antenna gain. V1.0.1
2019-12-04 Updated power
consumption of
distribution network.
V1.0.2
2019-12-10 Updated Bluetooth
related parameters.
V1.0.3
3 / 28

2 Module interfaces
2 Module interfaces
2.1 Dimensions and footprint
WB2L has one row of pins with a 2±0.1 mm pin spacing.
The WB2L dimensions (Lx Wx H) are 17.3±0.35 mm x 15±0.35 mm x 2.8±0.15 mm.
The following gure shows the WB2L front and rear views.
4 / 28

2 Module interfaces
2.2 Interface pin denition
Pin No. Symbol I/O type Function
1 PWM2 I/O Hardware PWM
pin, which is
connected to the
P8/BT_ACTIVE/PWM2
(Pin24)
2 PWM1 I/O Hardware PWM
pin, which is
connected to the
P7/WIFI_ACTIVE/PWM1
(Pin23)
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2 Module interfaces
Pin No. Symbol I/O type Function
3 PWM0 I/O Hardware PWM
pin, which is
connected to the
P6/CLK13M/PWM0
(Pin22)
4 PWM5 I/O Hardware PWM
pin, which is
connected to the
P26/IRDA/PWM5
(Pin15)
5 PWM4 I/O Hardware PWM
pin, which is
connected to the
P24/LPO_CLK/PWM4
(Pin16)
6 GND P Ground pin
7 3V3 P Power supply pin
(3.3 V)
2.3 Test pin denition
Pin No. Symbol I/O type Function
- GND P Ground pin
- RST I Reset pin, Default
high level, pull
down eective
- U1_TXD I/O UART1_TX, User
serial port
- U1_RXD I/O UART1_RX, User
serial port
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2 Module interfaces
Pin No. Symbol I/O type Function
- U2_TXD I/O UART2_TX, LOG
serial port
- U2_RXD I/O UART2_RX, LOG
serial port
- F_SCK I/O Clock pin when
data is
downloaded from
the ash memory,
which is connected
to the P20 pin on
the internal IC
- F_CSN I/O Command
enabling pin when
data is
downloaded from
the ash memory,
which is connected
to the P21 pin on
the internal IC
- F_SI I/O Data input pin
when data is
downloaded from
the ash memory,
which is connected
to the P22 pin on
the internal IC
- F_SO I/O Data output pin
when data is
downloaded from
the ash memory,
which is connected
to the P23 pin on
the internal IC
7 / 28

3 Electrical parameters
3 Electrical parameters
3.1 Absolute electrical parameters
Parameter Description
Minimum
value
Maximum
value Unit
Ts Storage
temperature
-40 105 ℃
VBAT Power supply
voltage
3.0 3.6 V
Static
electricity
voltage
(human body
model)
TAMB-25℃ - 2 KV
Static
electricity
voltage
(machine
model)
TAMB-25℃ - 0.5 KV
3.2 Working conditions
Parameter Description
Minimum
value
Typical
value
Maximum
value Unit
Ta Operating
tempera-
ture
-40 - 105 ℃
VBAT Power
supply
voltage
3.0 3.3 3.6 V
VIL I/O
low-level
input
-0.3 - VCC*0.25 V
8 / 28

3 Electrical parameters
Parameter Description
Minimum
value
Typical
value
Maximum
value Unit
VIH I/O
high-level
input
VCC*0.75 - VCC V
VOL I/O
low-level
output
- - VCC*0.1 V
VoH I/O
high-level
output
VCC*0.8 - VCC V
Imax I/O drive
current
- - 12 mA
3.3 Current consumption during constant transmission and receiving
Working
status Mode Rate
TX
Power/
Receiving
Typical
value
Maximum
value Unit
TX 11b 11Mbps +17dBm 295 354 mA
TX 11g 54Mbps +13.5dBm 266 300 mA
TX 11n MCS7 +12dBm 260 290 mA
RX 11b 11Mbps Constant
receiving
98 100 mA
RX 11g 54Mbps Constant
receiving
98 100 mA
RX 11n MCS7 Constant
receiving
98 100 mA
3.4 Operating current
9 / 28

3 Electrical parameters
Working mode
Working status
(Ta = 25°C) Average value
Maximum
value Unit
EZ The module is
in EZ mode,
and the Wi-Fi
indicator
blinks quickly.
70 312 mA
AP The module is
in AP mode,
and the Wi-Fi
indicator
blinks slowly.
70 364 mA
Connected The module is
connected to
the network,
and the Wi-Fi
indicator is
steady on.
40 244 mA
Disconnected The module is
disconnected
from the
network, and
the Wi-Fi
indicator is
steady o.
100 232 mA
10 / 28

4 RF features
4 RF features
4.1 Basic RF features
Parameter Description
Frequency band 2.412~2.484GHz
Wi-Fi standard IEEE 802.11b/g/n(channels1-14)
Data transmission rate 11b:1,2,5.5, 11 (Mbps)
11g:6,9,12,18,24,36,48,54(Mbps)
11n: HT20 MCS0~7
Antenna type PCB antenna with a gain of 1dBi
4.2 TX performance
Performance during constant transmission.
Parameter
Minimum
Value Typical Value
Maximum
Value Unit
Average RF
output
power,802.11b
CCK Mode
11M
- 17 - dBm
Average RF
output
power,802.11g
OFDM Mode
54M
- 13.5 - dBm
Average RF
output
power,802.11n
OFDM Mode
MCS7
- 12 - dBm
11 / 28

4 RF features
Parameter
Minimum
Value Typical Value
Maximum
Value Unit
CCK 11Mbps
Mode 17dBm
- -23 - dB
OFDM 54Mbps
Mode
13.5dBm
- -27 - dB
OFDM MCS7
Mode 12dBm
- -28 - dB
Frequency
error
-15 - 15 ppm
4.3 RX performance
RX sensitivity
Parameter
Minimum
value Typical value
Maximum
value Unit
PER<8%, RX
sensitivity,
802.11b DSSS
Mode 11M
- -81 - dBm
PER<10%, RX
sensitivity,
802.11g OFDM
Mode 54M
- -72 - dBm
PER<10%, RX
sensitivity,
802.11n OFDM
Mode MCS7
- -68 - dBm
12 / 28

5 Antenna
5 Antenna
5.1 Antenna type
WB2L uses the PCB antenna.
5.2 Antenna interference reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB
antenna, it is recommended that the antenna be at least 15mm away from other
metal parts.
To prevent an adverse impact on the antenna radiation performance, avoid copper
or traces along the antenna area on the PCB. The following describes three antenna
placement solutions:
1. Place the antenna outside the PCB frame.
2. Place the antenna along with the PCB frame without copper nearby.
3. Place the antenna in a carved area on the PCB.
The preceding solutions ensure that there are no substrate media above or be-
low the antenna and that copper is at a certain distance away from the antenna
to maximize the antenna radiation performance.
13 / 28

5 Antenna
14 / 28

5 Antenna
15 / 28

6 Packaging Information and Production Instructions
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (L x Wx H) are 17.3±0.35mm (L)×15±0.35mm (W)
×0.8±0.1mm (H).
6.2 Side view
16 / 28

6 Packaging Information and Production Instructions
6.3 Recommended schematic encapsulation
6.4 Recommended PCB Encapsulation-Pin header
WB2L can be mounted onto a PCB by using an SMT placement machine or through-
hole mounted onto the PCB through a pin header.
17 / 28
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