TYAN GT75B-B7102 Quick start guide

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GT75B-B7102
Service Engineer’s Manual

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PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.
Copyright 2017 MITAC COMPUTING TECHNOLOGY CORPORATION. All
rights reserved. TYAN®is a registered trademark of MITAC COMPUTING
TECHNOLOGY CORPORATION.
Version 1.0
Disclaimer
Information contained in this document is furnished by MITAC COMPUTING
TECHNOLOGY CORPORATION and has been reviewed for accuracy and
reliability prior to printing. MITAC assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to sale and/or use of TYAN®
products including liability or warranties relating to fitness for a particular
purpose or merchantability. MITAC retains the right to make changes to
produce descriptions and/or specifications at any time, without notice. In no
event will MITAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting from
errors or inaccuracies of information contained in this document.
Trademark Recognition
All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
TYAN®is a trademark of MITAC COMPUTING TECHNOLOGY
CORPORATION.
Intel®is a trademark of Intel®Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
IBM®, PC®, AT®and PS/2®are trademarks of IBM Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.

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FCC Declaration
Notice for the US
A
Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following conditions:
This device must not cause harmful interference.
This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
Notice for Canada
This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003 du
Canada.
Notice for Europe (CE Mark)
This product is in conformity with the Council
Directive 2014/30/EU.
CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.
この装置は、クラスＡ情報技術装置です。この装置を家庭環境で使用すると電波妨
害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要
求されることがあります。
ＶＣＣＩ－Ａ

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Taiwan BSMI RoHS declaration
設備名稱： 伺服器
Equipment Name: Server
單位
Unit
限用物質及其化學符號
Restricted substances and its chemical symbols
鉛
Lead
(Pb)
汞
Mercury
(Hg)
鎘
Cadmium
(Cd)
六價鉻
Hexavalent
Chromium
(Cr6+)
多溴聯苯
Polybrominated
biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyl ethers
(PBDE)
電池/電池組
Battery/Battery pack
–O O O O O
CD/DVD 驅動器
CD/DVD Drive
–O O O O O
風扇 Fans –O O O O O
硬碟 Hard Disk
Drive
–O O O O O
擴充抽取盒 I/O
Drawer
–O O O O O
機械組件
Mechanical
Assemblies
–O O O O O
塑膠材料 Plastics OO O O O O
PCI 介面卡 PCI Card –O O O O O
電源線 Power Cord –O O O O O
電源供應器 Power
Supply
–O O O O O
印刷電路板 Printed
Circuit Board
–O O O O O
處理器模組
Processor Module
–O O O O O
固態硬碟 Solid State
Drive
–O O O O O
備考 1：“O” 係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 1：“O” indicates that the percentage content of the restricted substance does not exceed the
percentage of reference value of presence.
備考 2：“ – " 係指該項限用物質為排除項目。
Note 2：“ – " indicates that the restricted substance corresponds to the exemption.
法律免責聲明 CNS 15663 免責聲明：此表格提供的資訊僅符合台灣適用法律。並不代表神雲科技向客戶履行
任何保證或責任。該表格的假設正常條件是產品的使用情況與神雲科技操作手冊運作一致。
CNS 15663 Disclaimer: The information provided in this table is solely to comply with applicable laws of
Taiwan. It does not create any warranties or liabilities on behalf of MITAC Computing Technology
Corporation (“MITAC”) to customers. The table assumes that the product will be used under normal
conditions in accordance with the MITAC operating manual.

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About this Manual
This manual is intended for trained service technician/personnel with hardware
knowledge of computers. Components inside the compartments should be serviced
only by a trained service technician/personnel. This manual is aimed to provide you
with instructions on installing your TYAN GT75B-B7102.
How this guide is organized
This guide contains the following parts:
Chapter 1: Overview
This chapter provides an introduction to the TYAN GT75B-B7102 barebones and
standard parts list, describes the external components, gives an overview of the
product from different angles.
Chapter 2: Setting Up
This chapter covers procedures on installing the processors, memory modules, hard
drivers and other optional parts.
Chapter 3: Replacing the Pre-installed Components
This chapter covers the removal and replacement procedures for pre-installed
components.
Chapter 4: Mainboard Information
This chapter lists the hardware setup procedures that you need to abide by when
installing system components. It includes description of the jumpers and connectors
on the motherboard.
Chapter 5: Diagnostics
This chapter introduces the Hostboot initial program loads (IPLs) progress codes The
table describes the type of checkpoints that may occur during the IPLs portion of the
Hostboot: BIOS codes and technical terms to provide better service for the
customers.
Appendix:
This chapter provides the cable connection table, the FRU parts list for reference of
system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information
Before installing and using TYAN GT75B-B7102, take note of the following
precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

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Safety Information
Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.
Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.
You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.
Symbols on Equipment
Caution. This symbol indicates a potential hazard.
The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.
Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.
Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.
General Precautions
· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.

Machine Room Environment
· This device is for use only in a machine room or IT room.
 · Make sure that the area in which you install the system is properly
ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
·Do not install the system in or near a plenum, air duct, radiator, or heat
register.
·Never use the product in a wet location.
Equipment Chassis
· Do not block or cover the openings to the system.
·Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
·Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
·Lift equipment using both hands and with your knees bent.
Equipment Racks
To avoid injury or damage to the equipment:
·Observe local occupational health and safety requirements and guidelines
for manual materials handling.
·Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
·Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
·Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.
·Make sure the rack is properly secured to the floor or ceiling.
·Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
·Make sure racks are coupled together if it is a multiple-rack installation.
·Make sure the rack is level and stable before installing an appliance in the
rack.
·Make sure the leveling jacks are extended to the floor.

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·Make sure the full weight of the rack rests on the leveling jacks.
·Always load the rack from the bottom up. Load the heaviest component in
the rack first.
·Make sure the rack is level and stable before pulling a component out of the
rack.
·Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.
To avoid damage to the equipment:
· The rack width and depth must allow for proper serviceability and cable
management.
· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
·The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.
·If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.
·Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
·Verify that the AC power supply branch circuit that provides power to the
rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.
Equipment Power Cords
· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.
·Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
·In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.
·
Do not place objects on AC power cords or cables. Arrange them so that no

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one might accidentally step on or trip over them.
·Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.
·To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.
Equipment Batteries
· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.
·Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.
·Do not expose the battery to temperatures higher than 60°C (140°F).
·The system battery is not replaceable. If the battery is replaced by an
incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.
·Do not attempt to recharge the battery.
·Dispose of used batteries according to the instructions of the manufacturer.
Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.
Equipment Modifications
· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.
Equipment Repairs and Servicing
· The installation of internal options and routine maintenance and service of
this product should be performed by individuals who are knowledgeable about
the procedures, precautions, and hazards associated with equipment
containing hazardous energy levels.
·Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.
·Allow the product to cool before removing covers and touching internal

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components.
·Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
·Do not use conductive tools that could bridge live parts.
·Use gloves when you remove or replace system components; they can
become hot to the touch.
·If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:
– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the
product.
–The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating
instructions.

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Table of Contents
Chapter 1: Overview....................................................................... 17
1.1 About the TYAN GT75B-B7102 ............................................. 17
1.2 Product Models....................................................................... 17
1.3 Features.................................................................................. 18
1.4 Standard Parts List................................................................. 25
1.4.1 Box Contents................................................................... 25
1.5 About the Product................................................................... 26
1.5.1 System Front View .......................................................... 26
1.5.2 System Rear View........................................................... 29
1.5.3 System Top View............................................................. 30
Chapter 2: Setting Up..................................................................... 31
2.0.1 Before you Begin............................................................. 31
2.0.2 Work Area........................................................................ 31
2.0.3 Tools................................................................................ 31
2.0.4 Precautions...................................................................... 32
2.1 Installing Motherboard Components ...................................... 33
2.1.1 Removing the Chassis Cover.......................................... 33
2.1.2 Installing the CPU and Heatsink...................................... 34
2.1.3 Installing the Air Duct....................................................... 36
2.1.4 Installing the Memory ...................................................... 37
2.1.5 Installing the PCI-E Card................................................. 38
2.1.6 Installing the M2093 (optional, for NVMe SKU)...............40
2.1.7 Installing Hard Drives ...................................................... 44
2.2 Rack Mounting........................................................................ 46
2.2.1 Installing the Server in a Rack......................................... 46
2.2.2 Installing the inner Rails to the Chassis .......................... 47
2.2.3 Installing the Outer Rails to the Rack.............................. 49
2.2.4 Rack mounting the Server............................................... 50
Chapter 3: Replacing Pre-Installed Components ........................ 53
3.0.1 Introduction...................................................................... 53
3.0.2 Disassembly Flowchart.................................................... 53
3.1 Removing the Cover............................................................... 54
3.2 Replacing Motherboard Components..................................... 54
3.2.1 Disconnecting All Motherboard Cables........................... 54
3.2.2 Removing the Motherboard............................................. 56
3.3 Replacing the Riser Cards...................................................... 57
3.5 Replacing the Fan .................................................................. 58
3.6 Replacing the HDD Backplane Board.................................... 60
3.6.1 HDD BP Board Features................................................. 62

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3.6.2 Connector Definition........................................................ 63
3.7 Replacing the Front Panel Board...........................................64
3.7.1 Front Panel Board Features............................................ 66
3.7.2 Connector Definition........................................................ 67
3.8 Replacing the Power Supply .................................................. 68
Chapter 4: Mainboard Information................................................ 69
4.1 Board Image........................................................................... 70
4.2 Block Diagram ........................................................................ 72
4.3 Mainboard Mechanical Drawing............................................. 73
4.4 Board Parts, Jumpers and Connectors .................................. 74
4.5 Tips on Installing Motherboard in Chassis ............................. 82
4.6 Memory................................................................................... 84
4.7 Connecting External Devices ................................................. 86
4.8 Installing the Power Supply.................................................... 87
Chapter 5: BIOS Setup................................................................... 89
5.1 About the BIOS....................................................................... 89
5.1.1 Setup Basics.................................................................... 89
5.1.2 Getting Help..................................................................... 90
5.1.3 In Case of Problems........................................................ 90
5.1.4 Setup Variations .............................................................. 90
5.2 Main Menu.............................................................................. 91
5.3 Advanced Menu...................................................................... 92
5.3.1 iSCSI Configuration......................................................... 94
5.3.2 Intel® Virtual RAID on CPU........................................... 100
5.3.3 Trusted Computing........................................................ 108
5.3.4 ACPI Settings................................................................ 109
5.3.5 Hardware Health Configuration..................................... 110
5.3.6 Onboard Device Configuration......................................112
5.3.7 AST2500 Super IO Configuration.................................. 113
5.3.8 S5 RTC Wake Settings.................................................. 115
5.3.9 Serial Port Console Redirection .................................... 116
5.3.10 Option ROM Dispatch Policy.......................................122
5.3.11 PCI Subsystem Settings..............................................123
5.3.12 Network Stack Configuration....................................... 124
5.3.13 CSM Configuration...................................................... 126
5.3.14 USB Configuration....................................................... 128
5.4 Platform Configuration..........................................................130
5.4.1 PCH Configuration......................................................... 131
5.4.2 Miscellaneous Configuration ......................................... 140
5.4.3 Server ME Configuration............................................... 141
5.5 Socket Configuration............................................................ 142
5.5.1 Processor Configuration................................................ 143

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5.5.2 Common RefCode Configuration.................................. 145
5.5.3 UPI Configuration.......................................................... 147
5.5.4 Memory Configuration................................................... 149
5.6 Server Management............................................................. 178
5.6.1 System Event Log .........................................................180
5.6.2 BMC Network Configuration..........................................181
5.7 Security................................................................................. 183
5.7.1 Secure Boot...................................................................184
5.8 Boot..................................................................................... 188
5.8.1 Network Device BBS Priorities......................................190
5.9 Save & Exit........................................................................... 191
Chapter 6: Diagnostics ................................................................ 193
6.1 Flash Utility...........................................................................193
6.2 Hostboot IPLs Progress Code..............................................194
Appendix I: Cable Connection Tables ........................................ 199
Appendix II: Fan and Temp Sensors .......................................... 201
Appendix III: FRU Parts Table ..................................................... 205
Appendix III: Technical Support ................................................. 207

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NOTE

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Chapter 1: Overview
1.1 About the TYAN GT75B-B7102
Congratulations on your purchase of the TYAN®GT75B-B7102, a highly optimized
1U rack-mountable barebone system. The GT75B-B7102 is designed to support
dual Intel®Xeon Processor Scalable Family and up to 768GB RDIMM / 1,536GB
LRDIMM / 3,072GB RDIMM/LRDIMM 3DS DDR4 memory, providing a rich feature
set and incredible performance. Leveraging advanced technology from IBM®, the
GT75B-B7102 server system is capable of offering scalable 32 and 64-bit computing,
high bandwidth memory design, and lightning-fast PCI-E bus implementation. The
GT75B-B7102 not only empowers your company in nowadays IT demand but also
offers a smooth path for future application usage.
TYAN®also offers the GT75B-B7102 in a version that can support up to ten
hot-swap SAS 12Gb/s / SATA 6Gb/s hard drives. The GT75B-B7102 uses TYAN’s
latest chassis featuring a robust structure and a solid mechanical enclosure. All of
this provides GT75B-B7102 the power and flexibility to meet the needs of nowadays
server application.
1.2 Product Models
The system board within the Tyan MicroServer blade contains different processors
and chipsets, which are defined by the following models:
B7102G75BV6E4HR-2T: Intel-based platform
B7102G75BV10HR-2T: Intel-based platform

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1.3 Features
TYAN GT75B-B7102 (B7102G75BV6E4HR-2T)
System
Form Facto
r
1U Rackmount
Chassis Model GT75B
Dimension (D x W x
H) 29.72" x 17.24" x 1.72" (755 x
438.5 x 43.7mm)
Motherboard S7102GM2NR-2T
Front Panel
Buttons (1) RST, (1) PWR, (1) UID
LEDs (1) HDD, (2) LAN, (1) Warning,
(1) UID
I/O Ports (2) USB 3.0 port
External Drive Bay
Type / Q'ty 2.5" Hot-Swap SSD/HDD +
NVMe/ (6) + (4)
HDD backplane
support SATA 6Gb/s/ SAS 12Gb/s,
NVMe
Supported HDD
Interface (6) SATA 6Gb/s + (4) NVMe
System Cooling
Configuration FAN (4) 4056 fans + (4) 4028 fans
Power Supply
Type RPSU
Input Range AC 100-127V/8.9A, AC
200-240V/4.5A
Output Watts 750 Watts
Efficiency 80 plus Platinum
Redundancy 1+1
Processor
Socket Type / Q'ty LGA3647/ (2)
Supported CPU
Series Intel Xeon Processor Scalable
Family
Thermal Design
Power (TDP)
wattage Max up to 165W
System Bus Up to 10.4/9.6 GT/s with Intel
UltraPath Interconnect (UPI)
support
Chipset PCH Intel C621

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Memory
Supported DIMM
Qty (12)+(12) DIMM slots
DIMM Type /
Speed DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS 2666
Capacity
Up to 768GB RDIMM/ 1,536GB
LRDIMM/ 3,072GB
RDIMM/LRDIMM 3DS *Follow
latest Intel DDR4 Memory POR
Memory channel 6 Channels per CPU
Memory voltage 1.2V
Expansion Slots
PCI-E (2) PCI-E Gen3 x8 slots, (2)
PCI-E Gen3 x16 slots
Pre-install TYAN
Riser Card
M2091, PCI-E x16 1U riser card
(left), M2091-R, PCI-E x16 1U
riser card (right)
LAN
Port Q'ty (2) 10GbE ports, (1) PHY
Controlle
r
Intel X550-AT2
PHY Realtek RTL8211E
Storage SATA
Connector (3) Mini-SAS
(12-ports) + (2)
SATA-III
Controlle
r
Intel C621
Speed 6.0 Gb/s
RAID RAID 0/1/10/5 (Intel
RST)
Graphic
Connector type D-Sub 15-pin
Resolution Up to 1920x1200
Chipset Aspeed AST2500
I/O Ports
USB (2) USB3.0 ports (2 at rear), (2)
USB3.0 ports (2 at front)
COM (1) DB-9 COM port
V
G
A
(1) D-Sub 15-pin port
RJ-45 (2) 10GbE ports, (1) PHY
dedicated for IPMI
TPM (Optional) TPM Support Please refer to our TPM

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supported list.
System Monitoring
Chipset Aspeed AST2500
Temperature Monitors temperature for CPU
& memory & system
environment
Voltage Monitors voltage for CPU,
memory, chipset & power
supply
LED Over temperature warning
indicator, Fan & PSU fail LED
indicator
Others Watchdog timer support
Server Management
Onboard Chipset Onboard Aspeed AST2500
AST2500 iKVM
Feature
IPMI 2.0 compliant baseboard
management controller (BMC),
Supports storage over IP and
remote platform-flash, USB 2.0
virtual hub
AST2500 IPMI
Feature
24-bit high quality video
compression, 10/100/1000 Mb/s
MAC interface
BIOS
Brand / ROM size AMI, 32MB
Feature
PXE boot support, ACPI 5.0,
SMBIOS 3.0/PnP/Wake on LAN,
User-configurable H/W
monitoring, ACPI sleeping states
S4,S5
Operating System OS supported list Please refer to our Intel OS
supported list.
Regulation FCC (DoC) Class A
CE (DoC) Yes
Operating Environment
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158°
F)
In/Non-operating
Humidity 90%, non-condensing at 35°
C
RoHS RoHS 6/6 Compliant Yes