Yaesu FRG-100 Manual

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FRG-100
Technical Supplement
YAESU MUSEN CO., LTD.
C.P.0, Box 1500, Tokyo, Japan
YAESU U.S.A.
17210 Edwards Rd., Cerritos, California 90701, U.S.A.
YAESU EUROPE B. Vi
Snipweg 3.1118AA Schipol, The Netherlands

Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-l
Chip C’mponent Information . . . -. . . . . . . l . - -. . - -. . . . *. . . . . . . . . . . . . . . . . . . . . . l-3
Cse Disasembly & &cuit &ard Access - - l . - - - l - l l l - .. - - - - - l l l - - . - - . l - - - ‘J-1
Main Unit
2-l
Local Unit 2-l
Display Unit
2-3
Pilot Lamp & Lithium Battery Replacement
2-3
Resetting the Microprocessor 2-3
&cuit Des&ption ......................... . ... . . . .......m.... ... ..... . . . . 3-l
Alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-l
Aligument Preparations & Precautions 4-l
Local Uuit
4-2
Reference Oscillator
4-2
2nd Local Oscillator
4-2
vco 4-2
vco 1&2
4-2
vco 3
4-2
vco 4
4-2
vco 5
4-2
Main Unit
4-2
2nd Local Amplifier
4-2
IF Interstage Transformer
4-2
IFGain 4-2
S-Meter Full Scale
4-3
Noise Blanker
4-3
SSB Squelch Threshold 4-3
Beep Leve
4-3
Block & Interconnection J)iagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-l
PCB Diagram & Pa& List . . . . ... . . . . . . . . . . . . . sm.. . . l m. . . l l l a l . . . . . . . . . . . 6-1
Main Unit
6A-1
Local & OSC Unit
6B-1
PLL DDS Unit 6C-1
CAR DDS Unit
6D-1
Display Uni t
6E-1
SQL,VR,ENC & HP Unit 6F-1
FM hit-lOO( Option) 6G-1
TCXO-4( Option) 6H-1
Mechanical Details . . . l . - - + -. l . . . . . . . . . . . . l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-l

Introduction
This manual provides technical inf orma-
tion necessary for servicing the FRG-100 gen-
ral coverage communications receiver. It does
not include information on specifications, in-
stallation, and Operation, which are described
in the FRG-100 Operating Manual, provided
with each receiver, or on FRG-100 accessories,
which are described in manuals provided
with each.
Servicing ‘this equipment requires exper-
tise in handling surface-mount components.
Attempts by non-qualified persons to Service
this equipment may result in permanent dam-
age not covered by the warranty.
While we believe the technical information
in this manual to be correct, Yaesu assumes no
liability for darnage that may occur as a result
of typographical or other errors that may be
present. Your cooperation in pointing out any
inconsistencies in the technical information
would be appreciated.
Yaesu Musen reserves the right to make
changes in this receiver and the alignment
procedures, in the interest of technological
improvement, without notification of the
0 wners.
l-l
FRGl 00
Techm*cal Supplement

Chip Component Information
The diagrams below indicate some of the
distinguishing features of common
Chip com-
ponents.
Ceramic Capacifors
-i_
f
Tantalum Capacifors
Negati
(Unit
1 mm)
Type L W T
Resistors
INDICATED LETTERS
1 2 3 4
557s
90
0
Type
RMC l/lOW, 1/16W
Marking*
100,222,473*---
10’s unit
1’s unit
Multiplier
00
10"
1
1
10’
I
22
lo’
1
33 10”
4410’
55
1 OS
66 10”
Examples 1
100 = ion
222 = 2.2kn
473 = 47k0
1-3
FRGl 00 Technicd Supplement

Chip Component Information
Replacing Chip Components
Chip components are installed at the fac-
tory by a series of robots. The first one places
a small spot of adhesive resin at the location
where each part is to be installed, and later
robots handle and place Parts using vacuum
suction.
For Single sided boards, solder Paste is ap-
plied and the board is then baked to harden
the resin and flow the solder. For double sided
boards, no solder Paste is applied, but the
board is baked (or exposed to ultra-violet
light) to eure the resin before dip soldering.
In our laboratories and Service shops, small
quantities of chip components are mounted
manually by applying a spot of resin, placing
with tweezers, and then soldering by very
small dual streams of hot air (without physi-
cal contact during soldering). We remove
Parts by first removing solder using a vacuum
suction iron, which applies a light steady vac-
uum at the iron tip, and then breaking the
adhesive with tweezers.
The special vacuum/desoldering equip-
ment is recommended if you expect to do a lot
of Chip replacements. Otherwise, it is usually
possible to remove and replace Chip compo-
nents with only a tapered, temperature-con-
trolled soldering iron, a set of tweezers and
braided topper solder wick. Soldering iron
temperature should be below 280” C (536” F).
Precautions for Chip Replacement
DO not disconnect a Chip forcefully, or the
foil Pattern may peel off the board.
Never re-use a Chip component. Dispose of
all removed chip components immediately to
avoid mixing with new Parts.
Limit soldering time to 3 seconds or less to
avoid damaging the component and board.
Removing Chip Components
Cl
Remove the solder at each joint, one joint at a
time, using solder wick whetted with non-
acidic fluxes as shown below. Avoid applying
pressure, and do not attempt to remove tin-
ning from the chip’s electrode.
0
Grasp the chip on both sides with tweezers,
and gently twist the tweezers back and forth
(to break the adhesive bond) while alter-
nately heating each electrode. Be careful to
avoid peeling the foil traces from the board.
Dispose of the chip when removed.
0
After removing the Chip, use the topper braid
and soldering iron to wick away any excess
solder and smooth the land for installation of
the replacement part.
FREI 00 Techmkd Supplement

Chip Component Information
--
Installing a Replacement Chip
As the value of some Chip components is
not indicated on the body of the Chip, be care-
51l to get the right part for replacement.
0 Apply a small amount of solder to the land on
one side where the chip is to be installed.
Avoid too much solder, which may Cause
bridging (shorting to other Parts).
.I.
0 Hold the chip with tweezers in the desired
Position, and apply the soldering iron with a
motion line as indicated by the arrow in the
diagram below. DO not apply heat for more
than 3 seconds.
0 Remove the tweezers and solder the elec-
trode on the other side in the manner just
described.
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Techmkd Supplement

Case Disassembly & Circuit Board Access
- Main Unit Local
Unit
0 Turn off the receiver and disconnect all ca-
bles.
0 Place the set on a stable work surface, and
remove the 8 screws affixing the top cover
(Figure 1).
Figure 1.
0 Carefully remove the top cover, paying spe-
cial attention to the wire connecting the loud
speaker to the main unit. The plug tan be
removed from the socket on the main board
if desired (remember to reconnect before at-
tathing the top cover again).This exposes the
component side of the Main Unit.
0 To remove the main unit, remove the 8 screws
affixing the unit and the screws affixing the
antenna terminal and EXT DC connector on
the rear Panel (Figure 2).
Figure 2.
0
To access the local unit, remove the 8 screws
affixing the bottom cover (Figure 3).
Figure 3.
To remove the local unit, remove the 7 screws
affixing the unit, and the 2 screws used on the
CAT connector on the rear Panel. This ex-
poses the component side of the Local Unit
(Figure 4).
Figure 4.
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FRGl 00
Tmlmical Supplement

Case Disassembly & Circuit Board Access
Display Unit
0 To access the Display Unit (including poten-
tiometer, squelch, rotary encoder and head-
phone jack), remove both the top and bottom
covers as previously described, then remove
the 2 middle screws from both edges on each
side of the display unit (Figure 1).
Figure 1.
0 Next Zoosen the 2 remaining screws Gently
pull the unit away from the Chassis and fold
it down (Figure 2).
Figure 2.
Cl To remove the Display Unit, slightly loosen
the hex nut affixing the main dial (do not
uyIscrez.u it!) and pull it Off, then remove the 2
screws located underneath (Figure 3).
Cl Gently pull off the VOL, SQL and MEM
knobs, then remove the 4 screws (2-each, top
& bottom) attaching the front Panel to the
display unit Chassis.
Figure 3.
0
0
0
0
0 Remove the wiring connectors from the SQL
and VOL controls on the rear of the Display
Unit.
0 Gently press in the plastic catch which mates
with the tab on the Display Unit circuit board
to release and lower the front Panel (Figure
4).
Figure 4.
Next, using a small flat screwdriver, gently
pry out and remove the wiring connector
from the back of the MEM knob, then remove
the front Panel.
Gently pull the POWER, AlT (2pcs.), NB,
and AGC buttons out from the Panel. Then
remove the spring screw, nylon washer,
threaded brass collar and washer affixing the
rotary encoder shaft to the Chassis.
Remove and the 6 screws aff ixing the Display
Unit circuit board to the Chassis (Figure 5).
Last, carefully remove the three wiring con-
nectors from the bottom edge of the Display
Unit circuit board to free the unit.
Figure 5.
FRGlOO Tedmicd Supplement
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_.-_.l..- . -_.______._._- ..“.----- .._.” --.--.. --.
-

Case Disassembly & Circuit Board Access
Pilot Lamp Replacement
Cl Disconnect all cables and remove the top and
bottom covers as previously described.
0 Remove the 2 middle screws from both edges
of the display unit and loosen the 2 lower
screws at the edge of each side.
‘Loosen
0 Locate the Pilot light then pull it out from it’s
grommet, trace the two blue wires leading
from the bulb to TP1005 & TP1006 on the
corner of the circuit board as shown below.
Carefully unsolder these wires to remove the
lamp and resolder the replacement lamp as-
sembly (polarity of the wires is not impor-
tant).
To Change the backup cell, use your fingers
to remove the old cell from it’s holder (do not
grab it with metal tweezers or pliers, as that
could short it out). Replace only with Sony
lithium type CR2032 (Yaesu Part No.
Q900564), or equivalent .
Removing Lithium Ce11
Slide cell inward, then pry up to eject
Inserting Replacement Battery
Pilot Lamp TP1005 & TP1006
Battery replacement
The lithium backup battery tan be re-
placed by removing the bottom cover (as pre-
viously described). Battery location is shown
below.
Slide battery downward through slot, then
inward and release
Resetting the microprocessor
Functional Problems involving frequency,
mode and memory selection tan sometime be
resolved by simply resetting the microproces-
sor. There are two ways to reset the CPU in the
FRG-100, both of which clear the contents of
all memories, leaving them at the factory de-
faults.
Soft Reset
The procedure relies on a ROM routine
which should normally suffice to correct most
operating malfunctions.
0 Turn the receiver Off, then hold the MEM
CLEAR button while switching the receiver
back on. If the Problem still persists, proceed
to the hard reset.
FRGlOO Techmixl Supplement
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Case Disassembly & Circuit Board Access
Hard Reset
D Turn the receiver off, then disconnect the DC
power Source. Turn the BACK UP switch on
the rear Panel to OFF. Reconnect the DC
power Source, then turn the receiver back on.
BACK UP
ON OFF
BACK Ul? SWITCH
2-4
FRGl 00
Technical Supplement