ADLINK Technology CM1-86DX3 Use and care manual

Leading EDGE COMPUTING
CM1-86DX3
Technical Reference
PC/104 Single Board Computer with Vortex86-DX3 SoC
Manual Rev.: 4.4
Revision Date: February 4, 2021
Part Number: 50-1Z161-1070
Manual Rev.: 2.4
Revision Date: February 4, 2021
Part Number: 50-1Z174-1050

ii Preface
Preface
Disclaimer
Information in this document is provided in connection with ADLINK products. No license,
express or implied, by estoppel or otherwise, to any intellectual property rights is granted by
this document. Except as provided in ADLINK´s Terms and Conditions of Sale for such prod-
ucts, ADLINK assumes no liability whatsoever, and ADLINK disclaims any express or implied
warranty, relating to sale and/or use of ADLINK products including liability or warranties relat-
ing to fitness for a particular purpose, merchantability, or infringement of any patent, copy-
right or other intellectual property right. If you intend to use ADLINK products in or as medical
devices, you are solely responsible for all required regulatory compliance, including, without
limitation, Title 21 of the CFR (US), Directive 2007/47/EC (EU), and ISO 13485 & 14971, if
any. ADLINK may make changes to specifications and product descriptions at any time, with-
out notice.
Trademarks
Product names mentioned herein are used for identification purposes only and may be trade-
marks and/or registered trademarks of their respective companies.
Revision History
Copyright © 2015, 2016, 2017, 2018, 2020, 2021 ADLINK Technology, Inc.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or other
means in any form without prior written permission of the manufacturer.
Audience
This manual provides reference only for computer design engineers, including but not limited to
hardware and software designers and applications engineers. ADLINK Technology, Inc.
assumes you are qualified to design and implement prototype computer equipment.
Revision Reason for Change Date
1.00 Initial Release Oct/15
2.00
Added VGA DDC interface to Chapter 3; revised CFast
information; added CFast pinout Chapter 3; transposed CN14
and CN16 headers for COM1 and COM2; added cooling
airflow specifications; added Getting Started section to chapter
1; added Component Features section to chapter 2;
restructured the format of this manual to four chapters
Jul/16
2.1 Added Appendix B, System Resources; updated Ordering
Information in Table 1-1 Jan/18
2.2 Revised RS485/422 mode signals in Table 3-1; changed positions of labels for jumper headers in Figure 2-5; added
Prop 65 warning and Battery labels to Preface Jul/18
2.3 Removed SPI flash support; add heat sink installation 2020-04-24
2.4 Add French safety warnings 2021-02-04

Preface iii
CM1-86DX3
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global environmen-
tal preservation through compliance with the European Union's Restriction
of Hazardous Substances (RoHS) directive and Waste Electrical and Elec-
tronic Equipment (WEEE) directive. Environmental protection is a top prior-
ity for ADLINK. We have enforced measures to ensure that our products,
manufacturing processes, components, and raw materials have as little
impact on the environment as possible. When products are at their end of
life, our customers are encouraged to dispose of them in accordance with
the product disposal and/or recovery programs prescribed by their nation
or company.
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals including acrylamide, arse-
nic, benzene, cadmium, Tris(1,3-dichloro-2-propyl)phosphate (TDCPP), 1,4-Diox-
ane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC, and vinyl materials,
which are known to the State of California to cause cancer, and acrylamide, benzene, cad-
mium, lead, mercury, phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and vinyl
materials, which are known to the State of California to cause birth defects or other reproduc-
tive harm. For more information go to www.P65Warnings.ca.gov.
AVERTISSEMENT: Ce produit peut vous exposer à des produits chimiques tels que l'acryl-
amide, l'arsenic, le benzène, le cadmium, le phosphate de tris (1,3-dichloro-2-propyle)
(TDCPP), le 1,4-dioxane, le formaldéhyde, le plomb, le DEHP, le styrène, le DINP , BBP,
PVC et matériaux en vinyle, qui sont connus dans l'État de Californie pour causer le cancer,
et acrylamide, benzène, cadmium, plomb, mercure, phtalates, toluène, DEHP, DIDP, DnHP,
DBP, BBP, PVC et vinyle matériaux, qui sont connus de l'État de Californie pour causer des
anomalies congénitales ou d'autres troubles de la reproduction. Pour plus d'informations,
visitez le site www.P65Warnings.ca.gov.
ᑜ㔚ᳰ⺧࿁ᡴ

iv Preface
Conventions
The following conventions may be used throughout this manual, denoting special levels of
information.
Important Safety Instructions
For user safety, please read and follow all Instructions, WARNINGs, CAUTIONs, and
NOTEs marked in this manual and on the associated equipment before handling/operating
the equipment.
XRead these safety instructions carefully.
XKeep this manual for future reference.
XRead the specifications section of this manual for detailed information on the operating
environment of this equipment.
XTurn off power and unplug any power cords/cables when installing/mounting or un-install-
ing/removing equipment.
XTo avoid electrical shock and/or damage to equipment:
ZKeep equipment away from water or liquid sources;
ZKeep equipment away from high heat or high humidity;
ZKeep equipment properly ventilated (do not block or cover ventilation openings);
ZMake sure to use recommended voltage and power source settings;
ZAlways install and operate equipment near an easily accessible electrical socket-
outlet;
ZSecure the power cord (do not place any object on/over the power cord);
ZOnly install/attach and operate equipment on stable surfaces and/or recommended
mountings; and,
If the equipment will not be used for long periods of time, turn off the power source and unplug
the equipment.
This information adds clarity or specifics to text and illustrations.
This information indicates the possibility of minor physical injury,
component damage, data loss, and/or program corruption.
Ces informations indiquent la possibilité de blessures physiques
mineures, de dommages aux composants, de perte de données
et / ou de corruption de programme.
This information warns of possible serious physical injury, com-
ponent damage, data loss, and/or program corruption.
Ces informations mettent en garde contre d'éventuelles blessures
physiques graves, des dommages aux composants, une perte de
données et / ou une corruption du programme.
MISE EN GARDE
ATTENTION

Table of Contents v
CM1-86DX3
Table of Contents
Preface................................................................................................................................... ii
1 Product Overview............................................................................................................. 1
1.1 Description..............................................................................................................................1
1.2 About this Manual...................................................................................................................1
1.3 Features..................................................................................................................................2
1.4 Ordering Information...............................................................................................................2
1.5 Block Diagram ........................................................................................................................3
1.6 Specifications..........................................................................................................................4
1.6.1 Physical .........................................................................................................................4
1.6.2 Mechanical .....................................................................................................................4
1.6.3 Electrical.........................................................................................................................5
1.6.4 Power .............................................................................................................................5
1.6.5 Environmental ................................................................................................................5
1.6.6 Thermal/Cooling Requirements......................................................................................6
1.7 Heat Sink Installation..............................................................................................................8
1.8 Getting Started......................................................................................................................11
2 Hardware......................................................................................................................... 13
2.1 Major IC Definitions and Locations.......................................................................................13
2.2 Header, Connector, and Socket Definitions..........................................................................16
2.3 Jumper Header Definitions...................................................................................................19
2.4 Component Features............................................................................................................20
2.4.1 CPU..............................................................................................................................20
2.4.2 SDRAM ........................................................................................................................20
2.4.3 LAN Controller..............................................................................................................20
2.4.4 CFast Card Slot............................................................................................................21
3 Interfaces ........................................................................................................................ 23
3.1 Serial Interfaces....................................................................................................................23
3.2 USB Interfaces......................................................................................................................26
3.3 Utility Interface .....................................................................................................................26
3.3.1 Keyboard ......................................................................................................................26
3.3.2 Mouse...........................................................................................................................26
3.3.3 Battery ..........................................................................................................................26
3.3.4 Reset Switch.................................................................................................................27
3.3.5 Speaker ........................................................................................................................27
3.4 Fast Ethernet Interface ........................................................................................................27
3.5 Gigabit Ethernet Interface ....................................................................................................28
3.6 Gigabit Ethernet External LED Interface...............................................................................28
3.7 Video (TFT/VGA) Interface ..................................................................................................28
3.8 VGA DDC (Display Data Channel) .......................................................................................30
3.9 Power Interface ....................................................................................................................30
3.10 Battery Interface ...................................................................................................................30

vi Table of Contents
3.11 Power Button Interface......................................................................................................... 31
3.12 CFast Mass Storage Socket................................................................................................. 31
4 Utilities ............................................................................................................................ 33
4.1 BIOS Setup .......................................................................................................................... 33
4.1.1 Configuring the BIOS................................................................................................... 33
4.1.2 Main screen of the BIOS.............................................................................................. 33
4.1.3 Advanced Settings screen ........................................................................................... 34
4.1.4 Boot screen.................................................................................................................. 37
4.1.5 Security screen ............................................................................................................ 38
4.1.6 Exit screen ................................................................................................................... 39
4.2 SEMA Functions .................................................................................................................. 40
4.2.1 Board Specific SEMA functions ................................................................................... 41
4.3 Real Time Clock (RTC) .......................................................................................................42
4.4 User GPIO Interface............................................................................................................. 43
4.5 Oops! Jumper (BIOS Recovery)........................................................................................... 43
4.6 Serial Console...................................................................................................................... 43
4.7 Serial Console BIOS Setup.................................................................................................. 43
4.8 Hot (Serial) Cable ................................................................................................................ 44
4.9 Watchdog Timer................................................................................................................... 44
Appendix A System Resources.................................................................................... 45
4.10 Memory Address Map..........................................................................................................45
4.11 I/O Address Map .................................................................................................................. 47
4.12 PCI Configuration Registers.................................................................................................49
4.13 IO Register Maps ................................................................................................................. 50
4.13.1 CMOS Memory and RTC Registers............................................................................. 50
4.14 Interrupts.............................................................................................................................. 51
4.14.1 SERIRQ Interrupt Mapping.......................................................................................... 51
Appendix B Technical Support .................................................................................... 53

Product Overview 1
CM1-86DX3
1 Product Overview
1.1 Description
The CM1-86DX3 is a PC/104 Single Board Computer (SBC) based on DMP’s Vortex86-DX3
single chip solution, featuring exceptionally high integration and an optimum perfor-
mance-to-power ratio. The board supports all peripherals needed for an embedded PC on a
small 3.55" by 3.77" printed circuit board.
The Vortex86-DX3 chip integrates a powerful yet efficient CPU with graphics, memory, and I/O
controller hubs to form a complete PC, with all the standard peripheral connections onboard.
The board provides two Ethernet ports (1x Gigabit and 1x 100Megabit), two RS232 serial ports,
two RS232/RS422/RS485 serial ports, and two USB 2.0 host ports to handle the communication
with external devices. A first generation optional SATA interface allows the connection of hard
disk or CD drives. Applications that require non-moving storage can use the optional CFast card
slot.
System expansion is provided over the PC/104 connector.
The CM1-86DX3 is powered by a 5V-only supply and runs DOS, Windows XP/7 and Linux oper-
ating systems. The Vortex86-DX3 SoC has a simulated ACPI to support Windows 7 (though S3
or S4 modes are not supported.)
1.2 About this Manual
This manual presents the supported features of the CM1-86DX3 Single Board Computer (SBC).
After reviewing this document you should understand the following features of the CM1-86DX3.
XBoard Features
XFunctional Block Diagram
XMajor Component (IC) Locations and Descriptions
XHeader, Connector, and Socket Locations and Descriptions
XSpecifications
XInterface Signal Definitions
XBoard Utilities

2Product Overview
1.3 Features
1.4 Ordering Information
SoC
XDMP Vortex86-DX3 @ max.
1GHz
ZX86 Dual-Core Microproces-
sor
ZFloating point unit support
ZEmbedded I/D L1 Cache
(16K each)
ZEmbedded Unified L2 Cache
(512K 4-way)
ZDDR3 Interface
ZGPU Control Unit (VGA, 2D
Graphics, UMA Architecture)
ZEmbedded 2MB Flash (BIOS
storage)
Main Memory
X2GB DDR3 Soldered Memory
(non-ECC)
Expansion
X1x 16-bit PC/104 with full DMA
capability
Interfaces
X1x Ethernet 1Gbit
X1x Ethernet 100Mbit
X1x SATA (First Generation)
X1x CFast
XPS/2 Keyboard/Mouse
X2x USB 2.0 ports
X2x RS485/RS422/RS232
X2x RS232
X1x TTL/VGA
XMISC signals: external power
button, speaker (5V), external
reset button, external battery
connector
X1x 8bit GPIO-Port, usable as
TTL-UART
X1x, 5V Power Input
Other configurations are possible. Please contact your local ADLINK
Technology representative to discuss requirements.
Table 1-1: CM1-86DX3 Models
Model Number Description
CM1-86DX3 PC/104 with Vortex 86DX3, 2GB soldered DDR3, 10/100 Ethernet,
GbE, CFast socket, TTL LCD and VGA display
Table 1-2: Cable Sets and Accessories
Model Number Description
CM1-86DX3-X-01 Adapter Cable Set
CM1-86DX3-TM-20 CM1-86DX3-TM-20 passive heatsink for -40°C to +85°C operating
range, with airflow requirements

Product Overview 3
CM1-86DX3
1.5 Block Diagram
Figure 1-1 provides a functional representation of the CM1-86DX3.
Figure 1-1: Functional Block Diagram
Vortex86DX3
BMC
LM 73
Power Supply
+-
5VDC
ATX
Stack
I2C
ISA
RS232/422/485
18/24-bit
TTL/TFT
VGA
COM 1/ COM 2
2GB DDR3-800/1333
Memory Down
VGA
COM 3/ COM 4
Level Shifter
JTAG
8x GPIO
2x USB 2.0
i210IT
Ethernet
PCIe GbE
10/100 ETH
CM1-86DX3
MUXSATA
RS232
Utility Header
CFast
SATA
PC/104
Backlight
DDR3 – 1.5V
RTC DB40 Service Connector
KB,Mouse,Speaker,RESET
SMBus
PCA9535BS
VGA-DDC

4Product Overview
1.6 Specifications
1.6.1 Physical
Table 1-3 provides the physical dimensions of the module.
1.6.2 Mechanical
Figure 1-2: Mechanical Overview (Top Side)
Table 1-3: Weight and Footprint Dimensions
Item Dimension Overall height is measured from the upper board
surface to the highest permanent component (PC/
104 bus connector) on the upper board surface. This
measurement does not include the heatsink, which
can vary. The heatsink could increase this dimension.
Weight 0.12 kg (0.25 lbs)
Height (overall) 11.05 mm (0.435 inches)
Board thickness 2.362 mm (0.093 inches)
Width 90.17 mm (3.55 inches)
Length 95.86 mm (3.77 inches)
All dimensions are given in inches and millimeters. Pin 1 is shown as a solid,
black square on headers and connectors.

Product Overview 5
CM1-86DX3
1.6.3 Electrical
Table 1-4 specifies the electrical characteristics of the module.
1.6.4 Power
Table 1-5 provides the power consumption values of the CM1-86DX3.
Operating configurations:
XIdle operating configuration includes a 1024x768 display, Windows 7, 2GB DDR3 mem-
ory, SATA HDD, 4.60 watts power supply
XTypical operating configuration is the same as the Idle configuration
1.6.5 Environmental
Table 1-6 provides the most efficient operating and storage condition ranges required for this
module.
Table 1-4: Electrical Specifications
Parameter Value
Voltage Input
Modes
Standard
RTC
XAT, only
X+5V DC +/-5%, =/- 50mV ripple
X3.0V, 2.0V to 3.3V (battery), +/-30mV ripple
Power States XS3, S4, S5 (S3 and S4 not supported by Win-
dows 7)
Power Management XACPI compliant
Table 1-5: Power Supply Requirements
Parameter Board Characteristics
Input Type Regulated DC voltage
Typical Idle Current and Power 1.04A (5.20W) @ 5V
Typical Operating Current and
Power 1.25A (6.25W) @ 5V
Table 1-6: Environmental Requirements
Parameter Conditions
Temperature
Operating -40° C to +85° C (-40° F to +185° F) NOTE: this temperature range
requires the CM1-86DX3-TM-20 passive heatsink with specified airflow.
Storage –55° C to +85° C (–67° F to +185° F)
Humidity
Operating 5% to 90% relative humidity, non-condensing
Non-operating 5% to 95% relative humidity, non-condensing

6Product Overview
Table 1-7 provides shock and vibration tests performed on the board.
Table 1-8 presents the average times between system failures.
1.6.6 Thermal/Cooling Requirements
The CM1-86DX3 is designed to operate at its maximum CPU speed and requires a thermal
solution to cool the CPU. ADLINK offers a heat spreader and a passive heatsink (separate order
numbers) for cooling. The heatsink can be used for module evaluation. If a custom heatsink is
used, it is recommended to connect it to the ADLINK heat spreader. This facilitates future mod-
ule upgrades without the need to re-design the custom heatsink. Refer to Figure 1-3 for heatsink
dimension and mounting information. See Figures 1-4 and 1-5 for airflow requirements.
Table 1-7: Shock and Vibration
Parameter Result
Shock Test MIL-STD-202F, Method 213B, Table 213-I, Condition A
Random Vibration Test MIL-STD-202F, Method 214A, Table 214-I, Condition D
Table 1-8: Mean Time Between Failures
Parameter Value
MTBF at 25°C 200,000 hrs (according to Bellcore calculation)
12.05 [0.474]
6.25 [0.246]
3 [0.118]
12.05 [0.474]
9.82 [0.387]
32.82 [1.292]
0.52 [0.02]
0.52 [0.02]
3.02 [0.119]
31.52 [1.241]
47.52 [1.871]
78.52 [3.091]
21.42 [0.843]
74.92 [2.95]
2 [0.079]
Pitch:4 [0.157]
2 [0.079]
Pitch:4.1 [0.161]
79.02 [3.111] 81.52 [3.209]
27.72 [1.091]
72.42 [2.851]
14.22 [0.56]
10.12 [0.398]
37.52 [1.477]
44.92 [1.769]
74.42 [2.93]
78.62 [3.095]
68.92 [2.713]
5.12 [0.202]
CM1-86DSX_heatsink_mnt_dmn_a

Product Overview 7
CM1-86DX3
Figure 1-3: Heatsink mounting dimensions (top side)
Figure 1-4 provides airflow versus temperature ratios with regard to four different airflow direc-
tions. See Figure 1-5 for an illustration of the four airflow directions.
Figure 1-4: Temperature vs Airflow Chart
Figure 1-5 presents four separate directions of airflow across the fins of the passive heatsink.
Refer to Figure 1-4 for required airflow ratios with regard to each of the airflow directions.
Figure 1-5: Airflow Directions with CM1-86DX3-TM Heatsink
Airflow
Direction 4
Airflow
Direction 3
Airflow
Direction 1
Airflow
Direction 2
CM1-86DX3_airflow_direction_a

8Product Overview
1.7 Heat Sink Installation
Follow the steps below to mount the passive heat sink to the top side of the board. The heat sink
features thermal pads to draw heat away from the SoC, SDRAM, BMC controller, and other
transceivers.
1. Locate the heat sink kit in the package. The thermal pads are labelled with their corre-
sponding parts on the board
2. Remove the blue film protecting the thermal pads on the heat sink. Orient the board
and heatsink on your work surface as shown.

Product Overview 9
CM1-86DX3
3. Align the heat sink with the board as shown below. The five mounting holes on the
board are circled in red.
4. Place the heat sink over the board so that the five mounting holes on the heat sink are
aligned with mounting holes on the board.
5. Apply light pressure on the heat sink to ensure the thermal pads are in contact with the
components on the board

10 Product Overview
6. Turn the board and heat sink assembly over and secure the heat sink to the board with
five M2.5 screws (torque: 2 kgf.cm) as shown below.
7. The heat sink installation is now complete.

Product Overview 11
CM1-86DX3
1.8 Getting Started
This section provides the most efficient way to setup and power on your CM1-86DX3 SBC.
Select a clean flat, anti-static work surface for setup and operation, large enough to include any
external peripherals and optional devices.
Use the cable set provided by ADLINK Technology to connect the CM1-86DX3 to a VGA moni-
tor. Connect either PS/2 or USB keyboard or mouse, respectively. Use the SATA cable to con-
nect the hard disk. Make sure that the pins match their counterparts correctly and are not
twisted. If you plan to use additional peripherals, connect them to the appropriate headers.
Connect a 5 volt, 5 amps power supply to the power connector and switch on the power.
The display shows the BIOS messages. If you want to change the standard BIOS settings,
press the <DEL> key to enter the BIOS setup menus. See Chapter 4 for setup details.
If you need to load the BIOS default values, they can be automatically loaded at boot time.
The CM1-86DX3 boots from CD drives, USB sticks, hard disks, or µSD-Cards. Provided that
any of these is connected and contains a valid operating system image, the display then shows
the boot screen of your operating system.
The CM1-86DX3 needs adequate cooling measures depending on the desired operating tem-
perature range. Using the board without cooling could damage the board permanently.
Be sure to observe ESD prevention measures. Make sure you are
always at the same potential as the module.
Assurez-vous de respecter les mesures de prévention des décharges
électrostatiques. Assurez-vous que vous êtes toujours au même
potentiel que le module.
Never connect or disconnect peripherals like HDDs while the power
supply is connected and switched on.
Ne connectez ou ne déconnectez jamais des périphériques tels que
des disques durs lorsque l'alimentation est connectée et sous tension.
The 5 amps value is the minimum you should have for the standard
peripherals mentioned. For additional peripherals, make sure enough
power is available. The system will not work if there is not enough
supply current for all your devices.
MISE EN GARDE
MISE EN GARDE

12 Product Overview
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Hardware 13
CM1-86DX3
2 Hardware
This chapter describes the major integrated circuits (ICs) and interface connectors and headers
on the module. The third section of this chapter further describes the major ICs including the
manufacturers’ model numbers.
2.1 Major IC Definitions and Locations
Table 2-1 describes the major ICs on the CM1-86DX3, including a brief description of each IC.
Figures 2-1 and 2-2 show the locations of the major ICs.
Table 2-1: Major Component Descriptions and Functions
Chip Type Mfg. Model Description Function
CPU (U1) DMP
Electronics,
Inc.
VX86DX3 Vortex x86 6.5W,
32-bit SoC (System
on Chip)
Integrates
Processor Core,
Graphics and
Memory
Controller Hub,
and I/O Hub
DDR3L SDRAM (U7
and U8 - on top side)
[see Figure 2-1]
Micron MT41K256M16 On-board DDR3L,
1.35V, 4Gb,
32Mx16x8,non-ECC,
un-buffered System
Memory
Provides
high-speed data
transfer
DDR3L SDRAM (U9
and U10 - on bottom
side) [see Figure 2-2]
Micron MT41K256M16 On-board DDR3L,
1.35V, 4Gb,
32Mx16x8,non-ECC,
un-buffered System
Memory
Provides
high-speed data
transfer
Ethernet EEPROM
(U21) Winbond W25Q16DVSSIG Three-Wire Serial EEPROM for Gigabit
Ethernet Controller
Providesstorage
for MAC
addresses,
serial numbers,
and pre-boot
configuration
data
Ethernet Controller
(U22) Intel WGI210IT SLIXT Single-port Gigabit Ethernet controller Integrates GbE MAC, PHY, and
SGMII/SerDes
to enable 10T/
100TX/1000T
Ethernet signals
using the PCIe
x1 bus
RS-485/422/232
Transceiver (U26 and
U27 - on bottom side)
[see Figure 2-2])
EXAR SP339EER1-L RS-485/422/232
Transceiver for
COM1 and COM2
Transmits and
receives
RS-485/422/232
signals for
COM1 and
COM2
RS-232 Transceiver
(U28 and U29 - on top
side) [see Figure 2-1]
Analog
Devices ADM213EARSZH6ZRB RS-232 Transceiver for COM3 and COM4 Transmits and receivesRS-232
signals for
COM3 and
COM4

14 Hardware
Figure 2-1: Component Locations (Top Side)
BMC (U33)
[Optional]Texas Instruments TM4C123BH6ZRBIR Microcontroller Provides logistics and
forensic
information, flat
panel control,
I2C bus control,
user flash,
Watchdog Timer
and fan control
Gb Ethernet
Transformer (TF2 - on
bottom side) [see
Figure 2-2]
BOTHHAND GST5009M Gigabit Ethernet
Magnetics Provides electrical
isolation for
Gigabit Ethernet
controller
Fast Ethernet
Transformer (TF3 - on
top side) [see
Figure 2-1]
BOTHHAND GST5009M Fast Ethernet
Magnetics Provides electrical
isolation for Fast
Ethernet
controller in SoC
Table 2-1: Major Component Descriptions and Functions (Continued)
Chip Type Mfg. Model Description Function
U29 U28
U1
U8
U7
TF3
U21
U33
Key:
U1 - SoC
U7 - DDR3 SDRAM - System Memory
U8 - DDR3 SDRAM - System Memory
U21 - EPROM - 10/100/1000 Gb Ethernet
U28 - Transceiver - COM3 RS-232
U29 - Transceiver - COM4 RS-232
U33 - Microcontroller - BMC
TF3 - Transformer - 10/100 Fast Ethernet