ADLINK Technology ReadyBoard 850 User manual

Advance Technologies; Automate the World.
Manual Rev.: 2.02
Revision Date: March 7, 2014
Part No: 50-1Z043-1020
ReadyBoard™ 850
Core™2 Duo EPIC Single Board Computer with
SUMIT™ Expansion and GM45/ICH9-M Chipset
User’s Manual

ii Revision History
Revision History
Revision Release Date Description of Change(s)
2.00 2010/10/26 Initial Release
2.01 2014/01/21 Correct Power On Mode Jumper default (JP2)
2.02 2014/03/07 Correct CF Voltage Setup (JP4)

Preface iii
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Preface
Copyright 2010-14 ADLINK Technology Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsibility to global
environmental preservation through compliance with the Euro-
pean Union's riction of Hazardous Substances (RoHS) directive
and Waste Electrical and Electronic Equipment (WEEE) directive.
Environmental protection is a top priority for ADLINK. We have
enforced measures to ensure that our products, manufacturing
processes, components, and raw materials have as little impact on
the environment as possible. When products are at their end of
life, our customers are encouraged to dispose of them in accor-
dance with the product disposal and/or recovery programs pre-
scribed by their nation or company.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.

iv Preface
Using this Manual
Audience and Scope
The ReadyBoard™ 850 User’s Manual is intended for hardware
technicians and systems operators with knowledge of installing,
configuring and operating embedded single board computers.
Manual Organization
This manual is organized as follows:
Preface: Presents copyright notifications, disclaimers, trade-
marks, and associated information on the proper usage of this
document and its associated product(s).
Chapter 1, Introduction: Introduces the ReadyBoard™ 850, its
features, specifications and board layout.
Chapter 2, Hardware Information: Provides technical informa-
tion on connectors, jumpers and pin assignments for configuring
the ReadyBoard™ 850.
Chapter 3, BIOS Setup: Presents information on configuring the
system BIOS.
Important Safety Instructions: Presents safety instructions all
users must follow for the proper setup, installation and usage of
equipment and/or software.
Getting Service: Contact information for ADLINK’s worldwide
offices.

Preface v
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Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.

vi Preface
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Table of Contents vii
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Table of Contents
Revision History...................................................................... ii
Preface.................................................................................... iii
List of Figures........................................................................ ix
List of Tables.......................................................................... xi
1 Introduction ........................................................................ 1
1.1 Overview.............................................................................. 1
1.2 Features............................................................................... 2
1.3 Specifications....................................................................... 3
1.4 Power Consumption ............................................................ 5
1.5 Cooling Requirements......................................................... 7
1.6 Block Diagram ..................................................................... 8
1.7 Mechanical Drawing ............................................................ 9
1.8 Package Contents ............................................................. 10
2 Hardware Information...................................................... 11
2.1 Board Layout ..................................................................... 11
2.2 Rear I/O Connectors.......................................................... 13
2.3 Onboard Connectors ......................................................... 15
2.4 Jumpers............................................................................. 19
3 BIOS Setup........................................................................ 21
3.1 Starting the BIOS............................................................... 21
3.2 Main Setup......................................................................... 25
3.3 Advanced BIOS Setup....................................................... 26
3.4 Advanced PCI/PnP Settings.............................................. 42
3.5 Boot Settings ..................................................................... 44
3.6 Security Setup ................................................................... 48

viii Table of Contents
3.7 Chipset Setup .................................................................... 51
3.8 Exit Menu........................................................................... 54
Important Safety Instructions............................................... 57
Getting Service...................................................................... 59

List of Figures ix
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List of Figures
Figure 1-1: ReadyBoard™ 850 Block Diagram..................................8
Figure 1-2: ReadyBoard™ 850 Dimensions ......................................9
Figure 2-1: ReadyBoard™ 850 Layout ............................................11
Figure 2-2: ReadyBoard™ 850 Rear I/O Layout..............................12

xListofFigures
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List of Tables xi
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List of Tables
Table 1-1: ReadyBoard™ 850 General Specifications.....................4
Table 2-1: ReadyBoard™ 850 Board Layout Legend.....................12

xii List of Tables
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Introduction 1
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1 Introduction
This chapter will introduce the ReadyBoard™ 850, its features,
specifications, and mechanical layout.
1.1 Overview
The Ampro by ADLINK™ ReadyBoard™ 850 is an EPIC form fac-
tor single board computer (SBC) supporting the Intel® Core™2
Duo and Celeron® processors (Socket P) with Intel® GM45
Express chipset for ultra high performance. The ReadyBoard™
850 supports 45nm process CPUs at up to 2.26GHz and 1066
MHz Front Side Bus (FSB) and Dual Channel DDR3
800/1066 MHz memory up to 4GB in two SODIMM slots. Features
include dual Gigabit Ethernet, USB 2.0, SATA and integrated
graphics supporting dual independent display and dual channel
18/24-bit LVDS.
The ReadyBoard™ 850 supports stackable expansion with
PCI-104 modules or SUMIT™ expansion modules (SUMIT-ISM™
Legacy Type 2). Please refer to the SUMIT™ and SUMIT-ISM™
specifications for detailed information on the SUMIT™ interface and
stacking with SUMIT™ modules: http://www.sff-sig.org/sumit.html.

2Introduction
1.2 Features
XEPIC form factor (165.1 mm x 114.3 mm)
XSupports Intel® Core™2 Duo and Celeron® processors
(Socket P)
XIntegrated graphics supports VGA, LVDS
XDual 10/100/1000Mbps Ethernet
X4x USB 2.0 ports (2x front I/O, 2x onboard pin header)
X2x SATA ports
XCompactFlash socket
XPCI-104 connector
XSUMIT AB connectors: One PCIe x4, two PCIe x1, 4x USB,
LPC Bus, and SMBus
XWatchdog Timer, Hardware Monitor
XHD audio
XRoHS compliant

Introduction 3
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1.3 Specifications
System
CPU • Intel® Core™2 Duo P8400, 2.26GHz, 1066MHz FSB,
3MB L2 Cache, 45nm
• Intel® Core™2 Duo T7500, 2.20GHz, 800MHz FSB,
4MB L2 Cache, 65nm
• Intel® Celeron® T3100, 1.90GHz, 800MHz FSB,
1MB L2 Cache, 45nm
FSB • 800/1066 MHz
Chipset • Intel® GM45 Graphics Memory Controller Hub
• Intel® ICH9M I/O Controller Hub
Memory • Two SODIMM sockets support Dual Channel
800/1066MHz DDR3 (up to 4GB)
BIOS • AMI BIOS with 16 Mb SPI flash memory
Audio • Realtek ALC888 codec
• Supports line-in, mic-in and speaker-out
Watchdog Timer • 1-255 second/minute programmable
Hardware Monitor • CPU temperature and supply voltages
Operating System • Linux (Ubuntu)
• Windows CE 6.0, XPe, XP Professional
• VxWorks 6.6
I/O Interfaces
Onboard I/O • 2x SATA ports with 300 MB/s data transfer
• 1x USB 2.0 pin header (2 ports)
• 1x serial port pin header
• CompactFlash socket
Rear I/O • 2x RJ-45 LAN port
• 2x USB 2.0 ports
• 1x D-Sub VGA connector
• 1x serial port connector
• PS2 keyboard/mouse port (Mini-DIN 6-pin)
LEDs/Reset • Power, IDE (CF) active , SATA active
• Reset button
Expansion • PCI-104 connector
• SUMIT AB connectors

4Introduction
Table 1-1: ReadyBoard™ 850 General Specifications
Display
VGA • GMA 4500MHD integrated in GM45 GMCH
CRT • Dsub-15 connector, up to 2048x1536 (QXGA)
LVDS • Single/dual channel 18/24-bit LVDS
Ethernet
Controller • Dual Intel® 82574L PCIe network controllers
• 10/100/1000Base-T dual-Gigabit Ethernet
• Wake on LAN supported
Ports • 2x RJ-45 Ethernet port
Mechanical and Environment
Form Factor • EPIC size single board computer
Dimensions • 165.1 mm x 114.3 mm (L x W)
Board Thickness • 1.6mm (0.062”)
Operating Temp. • Standard: 0°C to 60°C
• Extended: -20°C to 70°C
Storage Temp. • -20ºC to 75ºC
Rel. Humidity • 90% at 60°C
Shock • 15G peak-to-peak, 11ms duration, non-operation
Vibration • Non-operating : 1.88 Grms, 5-500 Hz, each axis
• Operating : 0.5 Grms, 5-500 Hz, each axis
Certifications • CE, FCC Class A

Introduction 5
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1.4 Power Consumption
Intel® Core™2 Duo Processor P8400
Test Configuration
CPU Intel® Core™2 Duo Processor P8400, 2.26GHz
Memory UNIGEN 2GB DDR3 1066MHz 204-pin
UG12U6400M8SU-9B0002 x2
Graphics GMA 4500MHD integrated in Intel® GM45 GMCH
SATA Channel 1 Seagate ST3160813AS Barracuda 7200.11 160GB
Power Supply Zippy HP2-6460P 460W
DOS (idle)
Power Req. +12V
Current (A) 1.600
Watts (W) 19.20
Windows XP, Idle
Power Req. +12V
Current (A) 0.957
Watts (W) 11.48
Windows XP, KPower
Power Req. +12V
Current (A) 2.734
Watts (W) 32.81
Windows XP, 100% CPU Usage
Power Req. +12V
Current (A) 2.341
Watts (W) 28.09

6Introduction
Intel® Core™2 Duo Processor T7500
Test Configuration
CPU Intel® Core™2 Duo Processor T7500 , 2.20GHz
Memory UNIGEN 2GB DDR3 1066MHz 204-pin
UG12U6400M8SU-9B0002 x2
Graphics GMA 4500MHD integrated in Intel® GM45 GMCH
SATA Channel 1 Seagate ST3160813AS Barracuda 7200.11 160GB
Power Supply Zippy HP2-6460P 460W
DOS (idle)
Power Req. +12V
Current (A) 2.144
Watts (W) 25.73
Windows XP, Idle
Power Req. +12V
Current (A) 0.956
Watts (W) 11.47
Windows XP, KPower
Power Req. +12V
Current (A) 3.908
Watts (W) 46.90
Windows XP, 100% CPU Usage
Power Req. +12V
Current (A) 2.899
Watts (W) 34.79

Introduction 7
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Intel® Core™2 Duo Processor T3100
1.5 Cooling Requirements
The CPU, Graphics Memory Controller Hub (Northbridge), I/O
Controller Hub (Southbridge), and voltage regulators are the main
sources of heat on the board. The ReadyBoard 850 is designed to
operate at its maximum CPU speed of 2.26GHz. The Northbridge
and Southbridge require heatsinks, and the CPU requires a heat-
sink with a fan.
Test Configuration
CPU Intel® Celeron® Duo Processor T3100, 1.90GHz
Memory UNIGEN 2GB DDR3 1066MHz 204-pin
UG12U6400M8SU-9B0002 x2
Graphics GMA 4500MHD integrated in Intel® GM45 GMCH
SATA Channel 1 Seagate ST3160813AS Barracuda 7200.11 160GB
Power Supply Zippy HP2-6460P 460W
DOS (idle)
Power Req. +12V
Current (A) 1.570
Watts (W) 18.84
Windows XP, Idle
Power Req. +12V
Current (A) 0.997
Watts (W) 11.96
Windows XP, KPower
Power Req. +12V
Current (A) 2.489
Watts (W) 29.87
Windows XP, 100% CPU Usage
Power Req. +12V
Current (A) 2.093
Watts (W) 25.12

8Introduction
1.6 Block Diagram
Figure 1-1: ReadyBoard™ 850 Block Diagram
Southbridge
Intel®ICH9M
CPU
Intel®Core™ 2 Duo
P8400, T7500
Intel®Celeron®
T3100
Northbridge
Intel®GM45 GMCH
DMI
Interface
2 GB/s
LPC
USB 2.0
SPI BIOS
KB/Mouse
COM1/2
CRT
DB-15
Winbond
W83627HF
Super I/O
4x USB 2.0
800/1066 MHz FSB
DDR3 800/1066MHz
PCIe x1
PCIe
Controller
PCIex1
PCI Bus PCI-104
connector
SATA
2x SATA ports
JMD330
SATA to PATA
SO-DIMM up to 4GB
Realtek
ALC888
HDA
Hardware
Monitor
PCI
Controller
Intel® 82574L
RJ-45
SPI
Dual Channel
18/24-bit LVDS
SUMIT A
Connector
4x USB, LPC, SMBus,
SPI, PCIe x1 (ICH9M)
Audio
Line-in/Mic-in/Speaker-out
Intel® 82574L
RJ-45
SO-DIMM up to 4GB
DDR3 800/1066MHz
CompactFlash
socket
SUMIT B
Connector
PCIe x4 (GM45)
PCIe x1 (ICH9M)