Advantech SOM-2532 Series User manual

User Manual
SOM-2532

SOM-2532 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2021
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated, or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. The information provided in this manual is intended to be accurate and reliable.
However, Advantech Co., Ltd. assumes no responsibility for its use, nor for any
infringements of the rights of third parties that may result from its use.
Acknowledgments
Intel® and Pentium® are trademarks of Intel Corporation.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants the original purchaser that each of its products will be free from
defects in materials and workmanship for two years from the date of purchase.
This warranty does not apply to any products that have been repaired or altered by
persons other than repair personnel authorized by Advantech, or products that have
been subject to misuse, abuse, accident, or improper installation. Advantech
assumes no liability under the terms of this warranty as a consequence of such
events.
Because of Advantech’s high quality-control standards and rigorous testing, most
customers never need to use our repair service. If an Advantech product is defective,
it will be repaired or replaced free of charge during the warranty period. For out-of-
warranty repairs, customers will be billed according to the cost of replacement mate-
rials, service time, and freight. Please consult your dealer for more details.
If you believe your product to be defective, follow the steps outlined below.
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages displayed when the prob-
lem occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain a return merchandise authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a completed Repair and Replacement
Order Card, and a proof of purchase date (such as a photocopy of your sales
receipt) into a shippable container. Products returned without a proof of pur-
chase date are not eligible for warranty service.
5. Write the RMA number clearly on the outside of the package and ship the pack-
age prepaid to your dealer.
Part No. 2006253200 Edition 1
Printed in Taiwan January 2022

iii SOM-2532 User Manual
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables. This
type of cable is available from Advantech. Please contact your local supplier for
ordering information.
Test conditions for passing also include the equipment being operated within an
industrial enclosure. In order to protect the product from damage caused by electro-
static discharge (ESD) and EMI leakage, we strongly recommend the use of CE-
compliant industrial enclosure products.
FCC Class B
This equipment has been tested and found to comply with the limits for a Class B dig-
ital device, pursuant to part 15 of the FCC Rules. These limits are designed to pro-
vide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. However, there is no guarantee that interfer-
ence will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for assistance.
FM
This equipment has passed FM certification. According to the National Fire Protec-
tion Association, work sites are categorized into different classes, divisions, and
groups based on hazard considerations. This equipment is compliant with the specifi-
cations for Class I, Division 2, Groups A, B, C, and D indoor hazards.
Technical Support and Assistance
1. Visit the Advantech website at www.advantech.com/support to obtain the latest
product information.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before calling:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages

SOM-2532 User Manual iv
Warnings, Cautions, and Notes
Document Feedback
To assist us with improving this manual, we welcome all comments and constructive
criticism. Please send all feedback in writing to [email protected].
Packing List
Before system installation, check that the items listed below are included and in good
condition. If any item does not accord with the list, contact your dealer immediately.
SOM-2532 module
1 x Heatspreader (1960093586N000)
Warning! Warnings indicate conditions, which if not observed, can cause personal
injury!
Caution! Cautions are included to help prevent hardware damage and data
losses. For example,
“Batteries are at risk of exploding if incorrectly installed. Do not attempt
to recharge, force open, or heat the battery. Replace the battery only
with the same or equivalent type as recommended by the manufacturer.
Discard used batteries according to the manufacturer's instructions.”
Note! Notes provide optional additional information.

v SOM-2532 User Manual
Safety Instructions
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Disconnect the equipment from all power outlets before cleaning. Use only a
damp cloth for cleaning. Do not use liquid or spray detergents.
4. For pluggable equipment, the power outlet socket must be located near the
equipment and easily accessible.
5. Protect the equipment from humidity.
6. Place the equipment on a reliable surface during installation. Dropping or letting
the equipment fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. Do not cover the openings.
8. Ensure that the voltage of the power source is correct before connecting the
equipment to a power outlet.
9. Position the power cord away from high-traffic areas. Do not place anything over
the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage from transient overvoltage.
12. Never pour liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
14. If any of the following occurs, have the equipment checked by service person-
nel:
–The power cord or plug is damaged.
–Liquid has penetrated the equipment.
–The equipment has been exposed to moisture.
–The equipment is malfunctioning, or does not operate according to the user
manual.
–The equipment has been dropped and damaged.
–The equipment shows obvious signs of breakage.
15. Do not leave the equipment in an environment with a storage temperature of
below -20 °C (-4 °F) or above 60 °C (140 °F) as this may damage the compo-
nents. The equipment should be kept in a controlled environment.
16. CAUTION: Batteries are at risk of exploding if incorrectly replaced. Replace only
with the same or equivalent type as recommended by the manufacturer. Discard
used batteries according to the manufacturer’s instructions.
17. In accordance with IEC 704-1:1982 specifications, the sound pressure level at
the operator’s position does not exceed 70 dB (A).
DISCLAIMER: These instructions are provided according to IEC 704-1 standards.
Advantech disclaims all responsibility for the accuracy of any statements contained
herein.

SOM-2532 User Manual vi
Safety Precaution - Static Electricity
Follow these simple precautions to protect yourself from harm and the products from
damage.
To avoid electrical shock, always disconnect the power from the PC chassis
before manual handling. Do not touch any components on the CPU card or
other cards while the PC is powered on.
Disconnect the power before making any configuration changes. A sudden rush
of power after connecting a jumper or installing a card may damage sensitive
electronic components.

vii SOM-2532 User Manual
CONTENTS
Chapter 1 General Information ............................1
1.1 Introduction ............................................................................................... 2
1.2 Functional Block Diagram ......................................................................... 3
1.3 Product Specifications............................................................................... 4
1.3.1 Compliance ................................................................................... 4
1.3.2 Feature List ................................................................................... 4
1.3.3 Processor System......................................................................... 5
1.3.4 Memory ......................................................................................... 5
1.3.5 Graphics/Audio ............................................................................. 5
1.3.6 Expansion Interface ...................................................................... 5
1.3.7 ESPI.............................................................................................. 5
1.3.8 Serial Bus...................................................................................... 5
1.3.9 I/O ................................................................................................. 5
1.3.10 Power Management...................................................................... 8
1.3.11 Environment.................................................................................. 8
1.3.12 MTBF ............................................................................................ 9
1.3.13 OS Support (duplicate with SW chapter) ...................................... 9
1.3.14 Advantech iManager ..................................................................... 9
1.3.15 Power Consumption...................................................................... 9
1.3.16 Performance ................................................................................. 9
1.3.17 Selection Guide w/ P/N ............................................................... 10
1.3.18 Packing list.................................................................................. 10
1.3.19 Development Board .................................................................... 10
1.3.20 Optional Accessory ..................................................................... 10
1.3.21 Pin Description............................................................................ 10
Chapter 2 Mechanical Information ....................11
2.1 Board Information.................................................................................... 12
Figure 2.1 Atom®_QVXE Board Chip - Front ........................... 12
Figure 2.2 Atom®_QVXE Board Chip - Rear............................. 12
2.2 Mechanical Drawing................................................................................ 13
Figure 2.3 Atom Series Board Mechanical Diagram - Front ...... 13
Figure 2.4 Atom Series Board Mechanical Diagram - Rear....... 13
Figure 2.5 Atom Series Board Mechanical Diagram -Side ........ 13
Figure 2.6 Celeron_Pentium_J_N Series Board Mechanical Dia-
gram - Front.............................................................. 14
Figure 2.7 Celeron_Pentium_J_N Series Board Mechanical Dia-
gram – Rear.............................................................. 14
Figure 2.8 Celeron_Pentium_J_N Series Board Mechanical Dia-
gram – Side .............................................................. 14
2.3 Assembly Drawing .................................................................................. 15
Figure 2.9 Atom Series Assembly Diagram............................... 15
Figure 2.10Celeron_Pentium_J_N Series Board Assembly Dia-
gram ......................................................................... 16
Figure 2.11Main Chip Height and Tolerance .............................. 17
Figure 2.12Main Chip Height and Tolerance .............................. 17
Chapter 3 AMI BIOS ............................................19
3.1 Introduction ............................................................................................. 20
Figure 3.1 Setup Program Initial Screen.................................... 20
3.2 Entering Setup ........................................................................................ 20

SOM-2532 User Manual viii
3.2.1 Main Setup.................................................................................. 21
Figure 3.2 Main Setup Screen................................................... 21
3.2.2 Advanced BIOS Features Setup................................................. 22
Figure 3.3 Advanced BIOS Features Setup Screen.................. 22
Figure 3.4 CPU Configuration ................................................... 23
Figure 3.5 PCH-FW Configuration............................................. 24
Figure 3.6 Firmware Update Configuration ............................... 25
Figure 3.7 Intel®Time coordinated computing........................... 26
Figure 3.8 Intel® Time Coordinated Computing ........................ 27
Figure 3.9 Trusted Computing................................................... 28
Figure 3.10ACPI Settings ........................................................... 29
Figure 3.11Embedded Controller ............................................... 30
Figure 3.12Serial Port 1 Configuration ....................................... 31
Figure 3.13Serial Port 2 Configuration ....................................... 32
Figure 3.14Hardware Monitor..................................................... 33
Figure 3.15Serial Port Console Redirection ............................... 33
Figure 3.16USB Configuration.................................................... 35
Figure 3.17Network Stack Configuration.................................... 36
Figure 3.18SDIO Configuration .................................................. 37
Figure 3.19Network Stack Configuration.................................... 38
3.2.3 Chipset Setup ............................................................................. 39
Figure 3.20Chipset Setup........................................................... 39
Figure 3.21System Agent (SA) Configuration ............................ 40
Figure 3.22Memory Configuration .............................................. 41
Figure 3.23Graphics Configuration............................................. 41
Figure 3.24LCD Control.............................................................. 42
Figure 3.25PCH-IO Configuration .............................................. 43
Figure 3.26PCI Express Configuration ....................................... 44
Figure 3.27PCI Express Root Port 1 .......................................... 45
Figure 3.28PCI Express Root Port 2 .......................................... 46
Figure 3.29PCI Express Root Port 3 .......................................... 47
Figure 3.30PCI Express Root Port 4 .......................................... 48
Figure 3.31SATA Configuration.................................................. 49
Figure 3.32USB Configuration.................................................... 50
Figure 3.33Security Configuration .............................................. 51
Figure 3.34HD Audio Subsystem Configuration Settings........... 52
Figure 3.35SerialIO Configuration .............................................. 53
Figure 3.36Serial IO I2C0 Settings............................................. 54
Figure 3.37Serial IO I2C2 Settings............................................. 55
Figure 3.38Serial IO I2C3 Settings............................................. 55
Figure 3.39Serial IO I2C4 Settings............................................. 56
Figure 3.40Serial IO SPI1 Settings............................................. 57
Figure 3.41Serial IO UART0 Settings......................................... 59
Figure 3.42Serial IO UART2 Settings......................................... 60
Figure 3.43PSE Controller.......................................................... 61
Figure 3.44PSE Controller.......................................................... 62
Figure 3.45PSE Controller.......................................................... 64
Figure 3.46PSE Controller.......................................................... 66
Figure 3.47PSE Controller.......................................................... 67
Figure 3.48TSN GBE configuration ............................................ 69
3.2.4 Security Chipset.......................................................................... 70
Figure 3.49Security Chipset ....................................................... 70
Figure 3.50Boot Setup................................................................ 71
3.2.5 Save & Exit ................................................................................. 72
Figure 3.51Save & Exit............................................................... 72
Chapter 4 S/W Introduction and Installation.... 73
4.1 S/W Introduction ..................................................................................... 74

ix SOM-2532 User Manual
4.2 Driver Installation .................................................................................... 74
4.2.1 Windows Driver Setup (TBD)...................................................... 74
4.2.2 Other OS..................................................................................... 74
4.3 Advantech iManager (SUSI 4.0) ............................................................. 75
Appendix A Pin Assignment .................................77
A.1 SOM-2532 Pin Assignment..................................................................... 78
Appendix B Watchdog Timer ................................87
B.1 Programming the Watchdog Timer ......................................................... 88
Appendix C System Assignments ........................89
C.1 System I/O Ports ..................................................................................... 90
Table C.1: System I/O Ports ...................................................... 90
C.2 Interrupt Assignments ............................................................................. 91
Table C.2: Interrupt Assignments............................................... 91
C.3 1st MB Memory Map ............................................................................... 92
Table C.3: 1st MB Memory Map ................................................ 92

SOM-2532 User Manual x

Chapter 1
1General Information
This chapter details background
information on the SOM-2532 CPU
Computer on Module.
Sections include:
Introduction
Functional Block Diagram
Product Specification

SOM-2532 User Manual 2
1.1 Introduction
Advantech’s SOM-2532 series features SMARC 2.1.1 specifications and is equipped
with the newest generation of Intel® processors — including the Pentium®, Cele-
ron®, and Atom® platforms. SOM-2532 is designed with up to 4 cores and yields
40% better CPU performance and improved graphics processing when compared
with previous models. SOM-2532 supports onboard DDR4 3200MT/s, up to 16GB
capacity, and IBECC on selected SKUs. It is equipped with onboard eMMC up to
64GB to ensure product stability. SOM-2532 supports multiple I/Os and display
inputs — including dual GbE LAN with TSN PHY to improve device accuracy, 2 x
CAN FD, and 3 x independent displays up to 4K. Several I/Os are faster than those
on its predecessors — these include 2 x USB 3.2 Gen2 (10GT/s), 4 x PCIe Gen3
(8.0GT/s), and 1 x SATA Gen3. CAN-FD enables a maximum 8Mbps data transfer
rate and is capable of reaching 10 x the payload transmission speed to empower
data-intensive applications. Likewise, SOM-2532 uses an increased data payload
size and CAN-FD protocol to enhance security.
Advantech iManager (SUSI 4) satisfies diverse embedded application requirements
by providing a multi-level watchdog timer, voltage and temperature monitoring, ther-
mal protection and mitigation through processor throttling, LCD backlight on/off and
brightness control, and embedded storage for customized information. When com-
bined with Advantech’s WISE-PaaS/RMM, it can remotely monitor and control
devices over the Internet. All Advantech SMARC modules integrate iManager and
WISE-PaaS/RMM.
Acronyms
Term Define
AC’97 Audio CODEC (Coder-Decoder)
ACPI Advanced Configuration Power Interface – standard to implement power saving
modes in PC-AT systems.
BIOS Basic Input Output System – firmware in PC-AT system that is used to initialize
system components before handing control over to the operating system.
CAN
Controller-area network (CAN or CAN-bus) is a vehicle bus standard designed
to allow micro-controllers to communicate with each other within a vehicle with-
out a host computer.
DDI Digital Display Interface – containing Display Port, HDMI/DVI, and SDVO.
EAPI
Embedded Application Programmable Interface.
Software interface for COM Express® specific industrial function:
System information
Watchdog timer
I2C Bus
Flat Panel brightness control
User storage area
GPIO
GbE Gigabit Ethernet
GPIO General purpose input output
HDA
Intel High Definition Audio (HD Audio) refers to the specification released by
Intel in 2004 for delivering high definition audio that is capable of playing back
more channels at higher quality than AC’97.

3 SOM-2532 User Manual
Chapter 1 General Information
1.2 Functional Block Diagram
I2C
Inter Integrated Circuit – 2 wire (clock and data) signaling scheme allowing
communication between integrated circuit, primarily used to read and load reg-
ister values.
ME Management Engine
PC-AT “Personal Computer – Advanced Technology” – an IBM trademark term used to
refer to Intel based personal computer in 1990s.
PEG PCI Express Graphics
RTC Real Time Clock – battery backed circuit in PC-AT systems that keeps system
time and date as well as certain system setup parameters.
SPD Serial Presence Detect – refers to serial EEPROM on DRAMs that has DRAM
Module configuration information.
TPM Trusted Platform Module, chip to enhance the security features of a computer
system.
UEFI Unified Extensible Firmware Interface
WDT Watchdog Timer

SOM-2532 User Manual 4
1.3 Product Specifications
1.3.1 Compliance
SMARC (Smart Mobility Architecture) 2.1
Basic Size – 82 x 50 mm (3.22 x 1.96 in)
1.3.2 Feature List
Feature Min/Max in SMARC2.1 SOM-2532
Memory 1 LPDDR4
eMMC (on module) 0/(N/A) 1
LVDS LCD/eDP/MIPI-DSI 1/1/1 1/1/1
HDMI/DP++ 0/1 1/1
DP++ 0/1 1
MIPI-CSI 0/2 0
SDIO 0/1 1
SPI 0/2 1
I2S 0/1 1
Audio HDA/I2S2 0/1 1
SMBus 0/1 1
I2C 2/6 2
Serial Port 2/4 4
CAN Bus 0/2 2
USB 2.0 2/6 6
USB 3.2 0/2 2
USB (OTG) 0/2 0
PCIe (Gen3) 0/4 4
SATA 0/1 1
GbE 0/2 2
Watchdog 0/1 1
GPIO 14/14 14
Management 1/1 1
Boot Select 1/1 1
JTAG (on board) 0/1 0
Wi-Fi Module 0/1 0
TPM 0/(N/A) 1
RTC 0/1 1
Force Recov 0/1 1

5 SOM-2532 User Manual
Chapter 1 General Information
1.3.3 Processor System
1.3.4 Memory
Dual channels onboard LPDDR4 3200MT/s up to 16GB, up to 4267MT/s by specific
SPU SKUs (non-ECC)
1.3.5 Graphics/Audio
Graphic Core: Intel® Gen10 UHD/P630 Graphic supports DX12, OGL5.0, OCL2.1,
and MPEG2, HEVC/H265, VC1/WMV9 HW decode/encode/transcode acceleration.
1.3.6 Expansion Interface
1.3.6.1 PCIe x1
PCI Express x1: Supports default 4 x ports PCIe x1 that are compliant to PCIe Gen3
(8.0 GT/s) specifications, and configurable to PCIe x4 or PCIe x2 upon request. Sev-
eral configurable combinations may need BIOS modifications. Please contact Advan-
tech sales or FAE for more details.
1.3.7 ESPI
2 x eSPI to Carrier Board (ESPI_CS0#, ESPI_CS1#), 1 x eSPI to EC.
1.3.8 Serial Bus
1.3.8.1 SMBus
Support SMBus 2.0 specification.
1.3.8.2 I2C Bus
Supports I2C bus 7-bit and 10-bit address modes, up to 400KHz
1.3.9 I/O
1.3.9.1 Gigabit Ethernet
Ethernet: Marvell 88E1512 Gigabit LAN supports 10/100/1000 Mbps speed, support
TSN via specific SKUs
CPU Std. Freq. Max. Turbo Freq. Core Cache (MB) TDP(W)
Pentium®N6415 1.2 GHz 3.0 GHz 4 1.5 6.5
Atom®x6211E 1.3 GHz 3.0 GHz 2 1.5 6
Atom®x6413E 1.5 GHz 3.0 GHz 4 1.5 9
Atom®x6425E 2.0GHz 3.0 GHz 4 1.5 12
Atom®x6425RE 1.9GHz NA 4 1.5 12
CPU Graphic Core Base Freq. Max Freq.
Pentium®N6415 Gen10 UHD Graphic 350MHz 800MHz
Atom®x6211E Gen10 UHD Graphic 350MHz 750MHz
Atom®x6413E Gen10 UHD Graphic 500MHz 750MHz
Atom®x6425E Gen10 UHD Graphic 500MHz 750MHz
Atom®x6425RE Gen10 UHD Graphic 400MHz NA

SOM-2532 User Manual 6
1.3.9.2 SATA
Support 1 x ports SATA3.0 (6.0 Gb/s).
1.3.9.3 USB 3.2 /USB 2.0
2 x ports USB 3.2(10.0 Gaps) and 6 x ports USB 2.0 (480Mbps, include 1 client port)
which are backward compatible to USB 1.
1.3.9.4 USB 3.2
1.3.9.5 USB 2.0
1.3.9.6 HDA
Supports HD-Audio and LPE Audio for DDI[1:0] (DisplayPort and HDMI), 1.8V signal
level, up to 24 MHz serial data clock.
1.3.9.7 Audio I2S
From EHL SOC I2S port 2(follow CRB, Support Linux only). Only supports ALC5660
codec.
1.3.9.8 SPI Bus
Supports Master SPI operation only. SPI clock can be 50MHz, 33MHz, or 20MHz,
capacity up to 16MB.
1.3.9.9 CAN Bus
Supports 2 x CAN-FD bus interfaces
1.3.9.10 eMMC v5.1
HS400 DDR Mode. Supports transfer the data in 8-bit modes. Maximum HS400 Dual
Rate 400 MB/s (200 MHz).
1.3.9.11 GPIO
14 x programmable general purpose Input or output (GPIO).
1.3.9.12 SDIO
Supports 1 x SDIO 3.0 interface
1.3.9.13 TXE
Trusted Execution Engine 3.0 (TXE3.0).
1.3.9.14 SMBus
SMBus 2.0 specification. Supports SMBALERT# signal. Signal level 3.3V or 1.8V
selectable
SMARC P0 P1
SoC P0 P1
SMARC USB_0_1_OC
SoC USB_OC# OC_0#
SMARC P0 P1 P2 P3 P4 P5
SoC P0 P1 P2 P3 P4 P5
SMARC USB0_EN_OC
USB1_EN_OC
USB2_EN_OC
USB3_EN_OC
USB4_EN_OC
USB5_EN_OC
SoC
USB_OC#

7 SOM-2532 User Manual
Chapter 1 General Information
1.3.9.15 TPM
Supports TPM 2.0 module by default
1.3.9.16 Watchdog
Support multi-level watchdog time-out output. Provides 1-65535 level, from 100ms to
109.22 minutes interval.
1.3.9.17 Serial port
2 x ports 4-wire and 2 x ports 2-wire HSUART signal interface using RTS/CTS control
only
Programmable FIFO enable/disable
64B iDMA FIFO per channel with up to 32B burst capability
Even, odd, or no parity bit selectable
1, 1.5, or 2 stop bit selectable
1.3.9.18 BIOS
The BIOS chip is on module by default. This allows the user to place BIOS chip on
carrier board with appropriate design and a pull-down to GND on BIOS_DISABLE#
pin.
Notice: if system CMOS is cleared, we strongly suggest going to the BIOS setup
menu and loading the default settings during the first boot up.
The standard module has no jumper at SCN6, so BIOS settings is kept without a
RTC coin battery. If you need to restore to BIOS default settings follow the steps
below:
1. Remove the coin battery
2. Put jumper on SCN6 pin1-2
3. Turn on power supply.
4. System will boot up a few times.
5. BIOS will be load default setting successfully.

SOM-2532 User Manual 8
1.3.10 Power Management
1.3.10.1 Power Supply
Supports both ATX and AT power modes. VSB is for suspend power and is optional if
not required by standby (suspend-to-RAM) support. RTC battery may be optional if
keeping the time/date is not required.
VCC: 5V +/- 5%
VSB: 5V +/- 5% (Suspend power)
RTC Battery Power: 2.0V - 3.3V
1.3.10.2 PWROK
Power OK monitors the main power supply. A high value indicates that the power is
good. This signal can be used to hold off module startup and to allow carrier based
FPGAs or other configurable devices time to be programmed.
1.3.10.3 Power Sequence
According to SMARC 2.1 specifications.
1.3.10.4 Wake Event
Support for various wake-up events allows users to adapt to different scenarios.
Wake-on-LAN(WOL): Wake to S0 from S3/S4
USB Wake: Wake to S0 from S3/S4
PCIe Device Wake: depends on user inquiry and may need customized BIOS
1.3.10.5 Advantech S5 ECO Mode (Deep Sleep Mode)
Advantech iManager provides additional features that allow the system to enter a
very low suspend power mode – S5 ECO mode. In this mode, the module will cut all
power, including suspend and active power, into the chipset and keep an on-module
controller active. As such, under 50mW power will be consumed to expand the bat-
tery packs lifespan. While this mode is enabled in BIOS, the system (or module) only
supports power button boot and not other methods like WOL.
1.3.11 Environment
1.3.11.1 Temperature
Operating: 0 ~ 60 °C (32 ~ 140 °F)
Storage: -40 ~ 85 °C (-40 ~ 185 °F)
Extended temperature: -40 ~ 85 °C (-40 ~ 185 °F)
1.3.11.2 Humidity
Operating: 40 °C @ 95% relative humidity, non-condensing
Storage: 60 °C @ 95% relative humidity, non-condensing
1.3.11.3 Vibrations
3.5G, 5~500Hz X/Y/Z Axis
1.3.11.4 Drop Test (Shock)
Federal Standard 101 Method 5007 test procedure with standard packing
1.3.11.5 EMC
CE EN55022 Class B and FCC Certifications: validate with standard development
boards in Advantech chassis.

9 SOM-2532 User Manual
Chapter 1 General Information
1.3.12 MTBF
Please refer Advantech SOM-2532 Series Reliability Prediction Report No: TBD.
(Estimated date: 2021 Q4).
1.3.13 OS Support (duplicate with SW chapter)
To install the drivers, please connect to the Internet and go to the following website:
http://support.advantech.com.tw to download the setup file.
1.3.14 Advantech iManager
Support APIs for GPIO, smart fan control, multi-stage watchdog timer, and output,
temperature sensor, hardware monitor, etc. It follows PICMG EAPI 1.0 specifications
in order to provide backwards compatibility.
1.3.15 Power Consumption
Hardware Configurations:
1. MB: SOM-2532DCBC-U0A1
2. DRAM: 16GB DDR4 3200MHz
3. Carrier board: SOM-DB2500-00A1
Test Condition:
1. Test temperature: room temperature (about 25 °C/77 °F)
2. Test voltage: rated voltage DC +5.0V
3. Test loading:
–Maximum load mode: Running programs
–Idle mode: DUT power management off and no running any program
4. OS: Windows 10 Pro
1.3.16 Performance
For reference performance or benchmark data that compare with other module,
please refer to “Advantech COM Performance & Power Consumption Table”.
Power Consumption Table (Watt.)
VSB=5V Active Power Domain Mechanical off
Power State S0 Max. Load S0 Burn-in S0 Idle S5/G3RTC (uA)
SOM-2532DCBC-U0A1 24.107 W 15.723 W 4.013 W 1.44/5.09

SOM-2532 User Manual 10
1.3.17 Selection Guide w/ P/N
1.3.18 Packing list
1.3.19 Development Board
1.3.20 Optional Accessory
1.3.21 Pin Description
Advantech provides useful checklists for schematic design and layout routing. The
schematic checklist will specify details about each pin’s electrical properties and how
to connect them for different user scenes. The layout checklist will specify the layout
constraints and recommendations for trace length, impedance, and other necessary
information during design.
Please contact the nearest Advantech branch office to acquire the design documents
and/or advanced support.
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Part No. CPU Core Graphics Base
Freq.
Max.
Boost
Freq.
GFX
HFM
GFX
Burst
Mode
CPU
TDP
Onboard
Memory EMMC IBECC Thermal solution
Operating
Temp.
SOM-2532CCBC-
S9A1
Atom®
x6425RE 4 32EU 1.9GHz N/A 400MHz N/A 12W 8GB 32GB Yes Passive 0 ~ 60 °C
SOM-2532DCBC-
U0A1
Atom®
x6425E 4 32EU 2.0GHz 3.0GHz 500MHz 750MHz 12W 16GB N/A Yes Passive 0 ~ 60 °C
SOM-2532CCBC-
U0A1
Atom®
x6425E 4 32EU 2.0GHz 3.0GHz 500MHz 750MHz 12W 8GB 32GB Yes Passive 0 ~ 60 °C
SOM-2532CCBC-
S5A1
Atom®
x6413E 4 16EU 1.5GHz 3.0GHz 500MHz 750MHz 9W 8GB 32GB Yes Passive 0 ~ 60 °C
SOM-2532CCBC-
S3A1
Atom®
X6211E 2 16EU 1.3GHz 3.0GHz 350MHz 750MHz 6W 8GB 32GB Yes Passive 0 ~ 60 °C
SOM-2532CNBC-
S2A1
Pen-
tium®
N6415
4 16EU 1.2GHz 3.0GHz 350MHz 800MHz 6.5W 8GB 32GB No Passive 0 ~ 60 °C
SOM-2532CCBX-
S9A1
Atom®
x6425RE 4 32EU 1.9GHz N/A 400MHz N/A 12W 8GB 32GB Yes Passive -40 ~ 85 °C
SOM-2532DCBX-
U0A1
Atom®
x6425E 4 32EU 2.0GHz 3.0GHz 500MHz 750MHz 12W 16GB 32GB Yes Passive -40 ~ 85 °C
SOM-2532CCBX-
S5A1
Atom®
x6413E 4 16EU 1.5GHz 3.0GHz 500MHz 750MHz 9W 8GB 32GB Yes Passive -40 ~ 85 °C
SOM-2532CCBX-
S3A1
Atom®
X6211E 2 16EU 1.3GHz 3.0GHz 350MHz 750MHz 6W 8GB 32GB Yes Passive -40 ~ 85 °C
Part No. Description Quantity
- SOM-2532 COM module 1
1970005009N001/1970005010N001 Heatspreader IHS/'Heatspreader NON-I 1
Part No. Description
SOM-DB2500 SMARC Development Board, SMARC2.0 & 2.1 compliance
Part No. Description
1970005111T001 Semi-heatsink