Advantech SOM-6872 User manual

To learn more about EMAC’s products and services and how they can help your project
http://ftp.emacinc.com/Tech_Info/About_EMAC_Products_and_Services.pdf
Authorized Distributor, Integrator, and Value-Added Reseller
Manual downloaded from ftp.emacinc.com
For purchase information please contact [e-mail]
For technical support please submit a ticket at www.emacinc.com/support

User Manual
SOM-6872

SOM-6872 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2021
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated, or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. The information provided in this manual is intended to be accurate and reliable.
However, Advantech Co., Ltd. assumes no responsibility for its use, nor for any
infringements of the rights of third parties that may result from its use.
Acknowledgments
Intel® and Pentium® are trademarks of the Intel® Corporation.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants the original purchaser that each of its products will be free from
defects in materials and workmanship for two years from the date of purchase.
This warranty does not apply to any products that have been repaired or altered by
persons other than repair personnel authorized by Advantech, or products that have
been subject to misuse, abuse, accident, or improper installation. Advantech
assumes no liability under the terms of this warranty as a consequence of such
events.
Because of Advantech’s high quality-control standards and rigorous testing, most
customers never need to use our repair service. If an Advantech product is defective,
it will be repaired or replaced free of charge during the warranty period. For out-of-
warranty repairs, customers will be billed according to the cost of replacement mate-
rials, service time, and freight. Please consult your dealer for more details.
If you believe your product to be defective, follow the steps outlined below.
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages displayed when the prob-
lem occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain a return merchandise authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a completed Repair and Replacement
Order Card, and a proof of purchase date (such as a photocopy of your sales
receipt) into a shippable container. Products returned without a proof of pur-
chase date are not eligible for warranty service.
5. Write the RMA number clearly on the outside of the package and ship the pack-
age prepaid to your dealer.
Part No. 2006M68700 Edition 1
Printed in Taiwan October 2021

iii SOM-6872 User Manual
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables. This
type of cable is available from Advantech. Please contact your local supplier for
ordering information.
Test conditions for passing also include the equipment being operated within an
industrial enclosure. In order to protect the product from damage caused by electro-
static discharge (ESD) and EMI leakage, we strongly recommend the use of CE-
compliant industrial enclosure products.
FCC Class B
This equipment has been tested and found to comply with the limits for a Class B dig-
ital device, pursuant to part 15 of the FCC Rules. These limits are designed to pro-
vide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. However, there is no guarantee that interfer-
ence will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one
or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for assistance.
FM
This equipment has passed FM certification. According to the National Fire Protec-
tion Association, work sites are categorized into different classes, divisions, and
groups based on hazard considerations. This equipment is compliant with the specifi-
cations for Class I, Division 2, Groups A, B, C, and D indoor hazards.
Technical Support and Assistance
1. Visit the Advantech website at www.advantech.com/support to obtain the latest
product information.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before calling:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages

SOM-6872 User Manual iv
Warnings, Cautions, and Notes
Document Feedback
To assist us with improving this manual, we welcome all comments and constructive
criticism. Please send all feedback in writing to [email protected].
Packing List
Before system installation, check that the items listed below are included and in good
condition. If any item does not accord with the list, contact your dealer immediately.
1 x SOM-6872 CPU module
1 x Heatspreader (1960093586N000)
Warning! Warnings indicate conditions, which if not observed, can cause personal
injury!
Caution! Cautions are included to help prevent hardware damage and data
losses. For example,
“Batteries are at risk of exploding if incorrectly installed. Do not attempt
to recharge, force open, or heat the battery. Replace the battery only
with the same or equivalent type as recommended by the manufacturer.
Discard used batteries according to the manufacturer's instructions.”
Note! Notes provide optional additional information.

v SOM-6872 User Manual
Safety Instructions
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Disconnect the equipment from all power outlets before cleaning. Use only a
damp cloth for cleaning. Do not use liquid or spray detergents.
4. For pluggable equipment, the power outlet socket must be located near the
equipment and easily accessible.
5. Protect the equipment from humidity.
6. Place the equipment on a reliable surface during installation. Dropping or letting
the equipment fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. Do not cover the openings.
8. Ensure that the voltage of the power source is correct before connecting the
equipment to a power outlet.
9. Position the power cord away from high-traffic areas. Do not place anything over
the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage from transient overvoltage.
12. Never pour liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
14. If any of the following occurs, have the equipment checked by service person-
nel:
–The power cord or plug is damaged.
–Liquid has penetrated the equipment.
–The equipment has been exposed to moisture.
–The equipment is malfunctioning, or does not operate according to the user
manual.
–The equipment has been dropped and damaged.
–The equipment shows obvious signs of breakage.
15. Do not leave the equipment in an environment with a storage temperature of
below -20 °C (-4 °F) or above 60 °C (140 °F) as this may damage the compo-
nents. The equipment should be kept in a controlled environment.
16. CAUTION: Batteries are at risk of exploding if incorrectly replaced. Replace only
with the same or equivalent type as recommended by the manufacturer. Discard
used batteries according to the manufacturer’s instructions.
17. In accordance with IEC 704-1:1982 specifications, the sound pressure level at
the operator’s position does not exceed 70 dB (A).
DISCLAIMER: These instructions are provided according to IEC 704-1 standards.
Advantech disclaims all responsibility for the accuracy of any statements contained
herein.

SOM-6872 User Manual vi
Safety Precautions - Static Electricity
Follow these simple precautions to protect yourself from harm and the products from
damage.
To avoid electrical shock, always disconnect the power from the PC chassis
before manual handling. Do not touch any components on the CPU card or
other cards while the PC is powered on.
Disconnect the power before making any configuration changes. A sudden rush
of power after connecting a jumper or installing a card may damage sensitive
electronic components.

vii SOM-6872 User Manual
Table of Contents
Chapter 1 General Information ............................1
1.1 Introduction ............................................................................................... 2
1.2 Functional Block Diagram ......................................................................... 3
Figure 1.1 Functional block diagram............................................ 3
1.3 Product Specifications............................................................................... 4
1.3.1 Compliance ................................................................................... 4
1.3.2 Feature List ................................................................................... 4
1.3.3 Processor System......................................................................... 5
1.3.4 Graphics/Audio ............................................................................. 6
1.3.5 Expansion Interfaces .................................................................... 6
1.3.6 Serial Bus...................................................................................... 7
1.3.7 I/O ................................................................................................. 7
1.3.8 Power Management...................................................................... 9
1.3.9 Environment................................................................................ 10
1.3.10 Power Consumption.................................................................... 11
1.3.11 Performance ............................................................................... 11
1.3.12 Selection Guide w/ P/N............................................................... 11
1.3.13 Packing List................................................................................. 11
1.3.14 Development Board .................................................................... 12
1.3.15 Optional Accessories .................................................................. 12
1.3.16 Pin Description............................................................................ 12
Chapter 2 Mechanical Information ....................13
2.1 Board Information.................................................................................... 14
Figure 2.1 Board chip identification – front ................................ 14
Figure 2.2 Board chip location – rear......................................... 14
2.1.1 Connector List............................................................................. 15
Table 2.1: SFAN1 Fan............................................................... 15
2.2 Mechanical Diagram ............................................................................... 15
Figure 2.3 Board mechanical diagram - front ............................ 15
Figure 2.4 Board mechanical diagram - rear ............................. 16
Figure 2.5 Board mechanical diagram - side ............................. 16
2.3 Assembly Drawing .................................................................................. 17
Figure 2.6 Assembly diagram .................................................... 17
Figure 2.7 AMD FP6 height and tolerance ................................ 17
Chapter 3 AMI BIOS ............................................19
3.1 Introduction ............................................................................................. 20
Figure 3.1 Setup program initial screen..................................... 20
3.2 Entering Setup ........................................................................................ 20
3.3 Main Setup.............................................................................................. 21
Figure 3.2 Main setup screen .................................................... 21
3.4 Advanced BIOS Features Setup ............................................................. 22
Figure 3.3 Advanced BIOS features setup screen .................... 22
3.4.1 Trusted Computing ..................................................................... 23
Figure 3.4 Trusted computing screen ........................................ 23
3.4.2 ACPI Settings.............................................................................. 24
Figure 3.5 ACPI settings screen ................................................ 24
3.4.3 Embedded Controller .................................................................. 25
Figure 3.6 Embedded controller screen..................................... 25
Figure 3.7 Serial port 1 configuration screen............................. 26

SOM-6872 User Manual viii
Figure 3.8 Serial port 2 configuration screen............................. 27
Figure 3.9 Hardware monitor screen ......................................... 28
Figure 3.10ACPI Report method configuration screen............... 29
3.4.4 Serial Port Console Redirection.................................................. 30
Figure 3.11Serial port console redirection screen ...................... 30
Figure 3.12Console redirection Settings screen......................... 31
3.4.5 CPU Configuration...................................................................... 32
Figure 3.13CPU configuration screen ........................................ 32
Figure 3.14Socket0 screen......................................................... 33
3.4.6 SATA Configuration .................................................................... 34
Figure 3.15SATA configuration screen....................................... 34
3.4.7 USB Configuration ...................................................................... 35
Figure 3.16USB configuration screen......................................... 35
3.4.8 AMI ROM Dispatch Policy .......................................................... 36
Figure 3.17AMI ROM dispatch policy screen ............................. 36
Figure 3.18AMI PCI driver version screen.................................. 37
3.4.9 Network Stack............................................................................. 38
Figure 3.19Network stack screen ............................................... 38
Figure 3.20Network stack screen ............................................... 38
3.4.10 NVMe Configuration ................................................................... 39
Figure 3.21NVMe configuration screen ...................................... 39
3.4.11 AMD CBS ................................................................................... 40
Figure 3.22CPU Common options screen.................................. 40
Figure 3.23CPU Common options screen.................................. 41
Figure 3.24NBIO Common options screen................................. 42
Figure 3.25Audio configuration screen....................................... 43
Figure 3.26SMU Common options screen ................................. 44
Figure 3.27CPPC screen............................................................ 45
Figure 3.28FCH Common options screen .................................. 46
Figure 3.29SATA Configuration options screen ......................... 47
Figure 3.30USB Configuration options screen ........................... 48
Figure 3.31Combo PHY static configuration screen................... 49
Figure 3.32Ac Power loss options screen .................................. 50
3.4.12 AMD PBS.................................................................................... 51
Figure 3.33AMD PBS screen ..................................................... 51
3.4.13 NIC Configuration ....................................................................... 52
Figure 3.34NIC configuration screen.......................................... 52
Figure 3.35Link speed screen .................................................... 53
3.5 Chipset Settings...................................................................................... 54
3.5.1 South Bridge ............................................................................... 54
Figure 3.36South bridge screen ................................................. 54
Figure 3.37SB USB Configuration screen .................................. 55
Figure 3.38XHCI0/XHCI1 screen ............................................... 55
3.5.2 NXP3460 Configuration .............................................................. 56
Figure 3.39NXP3460 Configuration screen................................ 56
3.5.3 North Bridge................................................................................ 57
Figure 3.40North bridge screen.................................................. 57
Figure 3.41Socket 0 information screen..................................... 58
3.5.4 PCIE Lanes Configuration .......................................................... 58
Figure 3.42PCIE Lanes Configuration screen ............................ 58
3.6 Security Settings ..................................................................................... 60
Figure 3.43Security setting screen ............................................. 60
3.6.1 Secure Boot ................................................................................ 61
Figure 3.44Secure boot screen .................................................. 61
3.6.2 Vendor Keys ............................................................................... 62
Figure 3.45Vendor keys screen.................................................. 62
3.6.3 Boot Configuration ...................................................................... 63
Figure 3.46Boot Configuration screen........................................ 63
3.7 Save & Exit ............................................................................................. 64
Figure 3.47Security setup........................................................... 64

ix SOM-6872 User Manual
Chapter 4 S/W Introduction and Installation ....65
4.1 S/W Introduction...................................................................................... 66
4.2 Driver Installation .................................................................................... 66
4.2.1 Windows Driver Setup ................................................................ 66
4.2.2 Other OS..................................................................................... 66
4.3 Advantech iManager ............................................................................... 67
Appendix A Pin Assignment .................................69
A.1 SOM-6872 Type 6 Pin Assignment......................................................... 70
Appendix B Watchdog Timer ................................75
B.1 Programming the Watchdog Timer ......................................................... 76
Appendix C Programming GPIO ...........................77
C.1 GPIO Register......................................................................................... 78
Appendix D System Assignments ........................79
D.1 System I/O Ports ..................................................................................... 80
Table D.1: System I/O ports....................................................... 80
D.2 Interrupt Assignments ............................................................................. 81
Table D.2: Interrupt Assignments............................................... 81
D.3 1st MB Memory Map ............................................................................... 83
Table D.3: 1st MB Memory Map ................................................ 83

SOM-6872 User Manual x

Chapter 1
1General Information
This chapter details background
information on the SOM-6872 CPU
Computer on Module.
Sections include:
Introduction
Functional Block Diagram
Product Specification

SOM-6872 User Manual 2
1.1 Introduction
Advantech’s SOM-6872 COM Express Type 6 module is equipped with an AMD
Ryzen™ Embedded V2000 SoC. This module delivers excellent performance and
supports 8 x cores, 16 x threads, turbo boost (up to 4.25GHz), and 4 x independent
4K displays. Advantech’s SOM-6872 features built-in I/O interfaces and facilitates
excellent graphic performance without requiring additional graphics cards.
This small (95 x 95 mm/3.74 x 3.74 in) module delivers superior performance via
54W high TDP, and uses 24% less space compared to COMe Basic models. Despite
being small, it delivers a high CPU Mark score and was tested by PASSMARK Per-
formance Test V10.1, 21716.This solution supports diverse I/O interfaces — includ-
ing USB 3.2 Gen 2, PCIe Gen 3, GbE, SATA 3, and 4K display interfaces (DP++,
HDMI, VGA, and LVDS). In addition, the on board TPM and 64GB ECC/Non-ECC
memory improves both security and reliability
Advantech iManager (SUSI4) satisfies diverse embedded application requirements
— including multi-level watchdog timer, voltage and temperature monitoring, thermal
protection and mitigation through processor throttling, LCD backlight on/off and
brightness control, embedded storage for customized information.
Acronyms
Term Definition
AC’97 Audio CODEC (Coder-Decoder)
ACPI Advanced Configuration Power Interface – standard to implement power saving
modes in PC-AT systems.
BIOS Basic Input Output System – firmware in PC-AT system used to initialize sys-
tem components before handing control over to the operating system.
CAN
Controller-area network (CAN or CAN-bus) is a vehicle bus standard designed
to allow microcontrollers to communicate with each other within a vehicle with-
out a host computer.
DDI Digital Display Interface – containing Display Port, HDMI/DVI, and SDVO.
EAPI
Embedded Application Programmable Interface.
Software interface for COM Express® specific industrial function:
System information
Watchdog timer
I2C Bus
Flat Panel brightness control
User storage area
GPIO
GbE Gigabit Ethernet
GPIO General purpose input output
HDA
Intel High Definition Audio (HD Audio) refers to the specification released by
Intel in 2004 for delivering high definition audio that is capable of playing back
more channels at higher quality than AC'97
I2C
Inter Integrated Circuit – 2 wire (clock and data) signaling scheme allowing
communication between integrated circuit, primarily used to read and load reg-
ister values.
ME Management Engine
PC-AT “Personal Computer – Advanced Technology” – an IBM trademark term used to
refer to Intel based personal computer in 1990s.

3 SOM-6872 User Manual
Chapter 1 General Information
1.2 Functional Block Diagram
Figure 1.1 Functional block diagram
PEG PCI Express Graphics
RTC Real Time Clock – battery backed circuit in PC-AT systems that keeps system
time and date as well as certain system setup parameters.
SPD Serial Presence Detect – refers to serial EEPROM on DRAMs that has DRAM
Module configuration information.
TPM Trusted Platform Module, chip to enhance the security features of a computer
system.
UEFI Unified Extensible Firmware Interface
WDT Watch Dog Timer
Connector Row C,D
Connector Row A,B
2-CH DDR4 3200
SODIMM
Max. 64GB (w/ECC)
TPM 2.0
SPI BIOS
eDPto LVDS
DDI 1
LVDS
eDP(Option)
DP 3
DP 0
EIO-211
LPCLPC
DP to VGA
GbE
VGA
HD Audio
8x PCIex1 (max. 5 devices)
Bifurcate to x4, x2, x1
GPP #4-11
2x SATAIII
8x USB 2.0
I2C (Option)
SMBUS
I2C (default),
2 COM/1 CAN(option),
WDT, 8x GPIO, Smart Fan
GPP #2-3
GPP #0
DDI 2 DP 1
DDI 3 (Option , co-lay with VGA) DP 2
1x PEGx8 (max. 2 devices) GFX #0-7
SPI
2x USB 3.2 Gen 2
SOM-6872
COMeType 6
Compact (95x95)
AMD Ryzen
Embedded V2000

SOM-6872 User Manual 4
1.3 Product Specifications
1.3.1 Compliance
PICMG COM Express R3.0 Compact module
Compact Size – 95 x 95 mm (3.73 x 3.74 in)
Pin-out Type 6 compatible
1.3.2 Feature List
Feature Type Connector Row Feature
Type 6 Define
SOM-6872
Max. Min.
Display
A-B LVDS Channel A
(18/24-bit) 101
A-B LVDS Channel B
(18/24-bit) 101
A-B eDP (muxed on
LVDS Channel A) 101
A-B VGA 1 0 1
Expansion A-B PCI Express x1 6 1 6
A-B LPC 1 1 1
Serial
A-B SMBus 1 1 1
A-B I2C Bus 1 1 1
A-B Serial Port 2 0 2
A-B CAN Bus (muxed on
SER1) 101

5 SOM-6872 User Manual
Chapter 1 General Information
1.3.3 Processor System
*TDP can be configured up to 25W or down to 12.5W.
I/O
A-B LAN Port 0 (Gigabit
Ethernet) 111
A-B SATA 4 1 2
A-B USB 2.0 8 4 8
A-B USB Client 1 0 0
A-B HD Audio 1 0 1
A-B SPI Bus 2 1 1
A-B General Purpose I/O
(GPIO) 888
A-B SDIO (muxed on
GPIO) 100
A-B Express Card Sup-
port 210
A-B Watchdog Timer
Output 101
A-B Speaker Out 1 1 1
A-B External BIOS ROM
Support 202
A-B Power Button Sup-
port 111
A-B Power Good 1 1 1
A-B VCC_5V_SBY Con-
tacts 444
A-B Sleep 1 0 1
A-B Thermal Protection 1 0 1
A-B Lid Input 1 0 1
A-B Battery Low Alarm 1 0 1
A-B Suspend/Wake Sig-
nals 303
A-B Fan PWM / Tachom-
eter 202
A-B Trusted Platform
Modules 101
Display C-D Digital Display Inter-
faces 1 - 3 303
I/O
C-D PEG (PCI Express
x16) 1 0 1(X8)
C-D PCI Express x1 2 0 2
C-D USB 3.0 (Gen2,
10Gbps) 402
C-D Rapid Shutdown 1 0 1
CPU Std. Freq. 1T Boost Freq. Core/Thread L2C/L3C TDP(W)
V2748 2.9GHz 4.25GHz 8/16 4M/8M 35-54W
V2546 3.0GHz 3.95GHz 6/12 3M/8M 35-54W
V2718 1.7GHz 4.15Ghz 8/16 4M/8M 10-25W
V2516 2.1GHz 3.95GHz 6/12 3M/8M 10-25W

SOM-6872 User Manual 6
1.3.4 Graphics/Audio
AMD Radeon Graphics core with up to 7 x GPU compute units.
Performance upgrades from V1000 with faster frequency and clocking
HVEC and H.264 (10-bit) decode and encode support, VP9 Decode
4 x Display Pipes supporting up to 4K Resolution
Up to 4 x DisplayPort 1.4, HDMI™ 2.1 (HDMI 6G), eDP 1.3
V2000 Graphics Implementation • 1 x sDMA Engine • Up to 7 x cores, 2 x Rendered
Backend+ (RB+) • 1 MB L2 Cache • System resources are shared. No dedicated
memory for the Graphics • Up to 1.43 TFLOPS (FP32) or 2.87 TFLOPS (FP16)
Dual Display:
–LVDS/eDP + VGA
–LVDS/eDP + DP (1/2)
–VGA + DP (1/2)
–DP1 + DP2
Triple Display:
–LVDS/eDP + VGA + DP (1/2)
–LVDS/eDP + DP1 + DP2
–VGA + DP1 + DP2
Quad Display:
–LVDS/eDP + VGA + DP1 + DP2
1.3.5 Expansion Interfaces
1.3.5.1 PCIe x1
PCI Express x1: Supports default 5 x ports PCIe x1 compliant to PCIe Gen 3 (8.0 GT/
s) specifications, configurable to PCIe x4 or PCIe x2. Several configurable combina-
tions may need BIOS modifiers. Please contact the Advantech sales team or FAE for
further details.
CPU Graphic Core Max Freq.
V2748 Radeon 7 units 1.6GHz
V2546 Radeon 6 units 1.5GHz
V2718 Radeon 7 units 1.6GHz
V2516 Radeon 6 units 1.5GHz
Type 6
Row A,B Row C,D
P0 P1 P2 P3 P4 P5 P6 P7
Default
Config.
X1 X1 X1 X1 X4
Option X1 X1 X2 X4
Option X2 X1 X1 X4
Option X2 X2 X4
Option X4 X4
Option X4 X1 X1 X1 X1

7 SOM-6872 User Manual
Chapter 1 General Information
1.3.5.2 LPC
Supports Low Pin Count (LPC) 1.1 specification, without DMA or bus mastering. Sup-
ports connection to Super I/O, embedded controller, or TPM. LPC clock is 24MHz.
1.3.6 Serial Bus
1.3.6.1 SMBus
Supports SMBus 2.0 specification with Alert pin.
1.3.6.2 I2C Bus
Supports I2C bus 7-bit and 10-bit address modes.
1.3.7 I/O
1.3.7.1 Gigabit Ethernet
Ethernet: Intel® I210IT/AT Gigabit LAN supports 10/100/1000Mbps Speed.
1.3.7.2 SATA
Support up to 2 x ports SATA Gen 3 (6.0 Gb/s), backward compliant to SATA Gen 2
(3.0 Gb/s) and Gen 1 (1.5 Gb/s). Maximum data rate of 600 MB/s. Supports AHCI 1.3
and 1.3.1 modes.
1.3.7.3 USB 3.0 (3.2 Gen2)/USB 2.0
Supports 2 x ports USB 3.2 Gen2 (10 Gbps) and 8 x ports USB 2.0 (480 Mbps) which
are backward compatible to USB 1.x. Supports LPM (U0, U1, U2, and U3) manage-
ability that saves USB 3.1 power.
1.3.7.4 USB 3.2
1.3.7.5 SPI Bus
Supports BIOS flash only. SPI clock can be 17, 30, or 48MHz, capacity up to 16MB.
1.3.7.6 GPIO
4 x programmable general purpose input or output (GPIO).
1.3.7.7 Watchdog
Supports multi-level watchdog time-out output.
Provides 1-65536 level, from 0~65535 sec intervals.
Note! Notice: We strongly recommend using a certified cable to meet USB 3.2
Gen 2 performance requirements.
Type 6 P0 P1 P2 P3
SoC P0 P1 NA NA
Type 6 OC_01 OC_23
SoC USB_OC# OC_0 NA

SOM-6872 User Manual 8
1.3.7.8 Serial Ports
2 x ports, 2-wire serial port (Tx/Rx) supports 16550 UART compliance.
Programmable FIFO or character mode
16-byte FIFO buffer on transmitter and receiver in FIFO mode
Programmable serial-interface characteristics: 5, 6, 7, or 8-bit character
Even, odd, or no parity bit selectable
1, 1.5, or 2 stop bit selectable
Baud rate up to 115.2K
1.3.7.9 TPM
Supports TPM 2.0 module by default.
1.3.7.10 Smart Fan
Support 2 x Fan PWM control signal and 2 x tachometer input for fan speed detec-
tion. Provides 1 x on module with connector and the other to carrier board followed
by PICMG COM Express R3.0 specification.
1.3.7.11 BIOS
The BIOS chip is on module by default. This device also allows users to place BIOS
chips on the carrier board with appropriate design and jumper settings on
BIOS_DIS#[1:0].
Clear CMOS
BIOS_DIS0# BIOS_DIS#1 Boot up destination/function
Open Open Boot from Module’s SPI BIOS
Open GND SPI_CS0# to Carrier Board, SPI_CS1# to
Module
GND GND SPI_CS0# to Module, SPI_CS1# to Carrier
Board
Note! If the system COMS is cleared, we strongly suggest entering the BIOS
setup menu and loading default settings on the first boot up
Setting Type Jumper Setting Clear RTC CMOS
(Time & Date)
BIOS Setting Load
Default
Default Setting Without jumper V N/A
Optional Setting Jumper 1-2 V V

9 SOM-6872 User Manual
Chapter 1 General Information
Purpose: The standard module has no jumper at CN1, so BIOS settings are main-
tained without a RTC coin battery. If you need to restore BIOS default settings,
please follow the steps below:
1. Remove the Coin Battery
2. Put the jumper on CN1 pin1-2
3. Turn on the power supply
4. The System will boot up a few times
5. BIOS will be load default settings successfully
1.3.8 Power Management
1.3.8.1 Power Supply
Supports both ATX and AT power modes. The VSB is for optional suspend power if
the user does not require standby (suspend-to-RAM) support. The RTC Battery is
optional if keeping the time/date function is not required.
VCC: 8.5 ~ 20V
VSB: 4.75 ~ 5.25V (Suspend power)
RTC Battery Power: 2.0 ~ 3.3V
1.3.8.2 PWROK
Power OK uses the main power supply. A high value indicates that the power supply
is adequate. This signal can be used to hold off module startup and allow carrier
based FPGAs or other configurable devices time to be programmed.
1.3.8.3 Power Sequence
According to PICMG COM Express R3.0 specifications.
1.3.8.4 Wake Event
Supports various wake-up events enabling users to apply solution in different scenar-
ios.
Wake-on-LAN(WOL): Wake to S0 from S3/S4/S5
USB Wake: Wake to S0 from S3/S4
PCIe Device Wake: Depends on user inquiry and may need customized BIOS
LPC Wake: Depends on user inquiry and may need customized BIOS
&1