Aetina Geforce gtx10 series User manual

AETINA CONFIDENTIAL

UM-M3N1060-MN-v05

User Manual

GeForce GTX10 series MXM GRAPHICS BOARD

Aetina M3N1060-MN

Aetina M3N1070-NN

UM-M3N970M-MN-V2

AETINA CONFIDENTIAL

UM-M3N1060-MN-v05

Document Change History

Version

Date

Description

Authors

2017, 1, 6

Initial Release

2017, 2, 7

Add description for the system battery module

enabled.

v03

2017, 2, 21

Remove JTAG support.

v04

2017/6/26

Update chapter 6 Thermal specifications

Jackal

v05

2017/12/13

Correct memory part number

Jackal

AETINA CONFIDENTIAL

UM-M3N1060-MN-v05

Contents

1. General Overview.......................................................................................................................................- 2 -

1.1 Features................................................................................................................................................- 2 -

1.1.1 GPU................................................................................................................................................- 2 -

1.1.2 Board .............................................................................................................................................- 3 -

1.1.3 Memory Configuration..................................................................................................................- 3 -

1.1.4 Support..........................................................................................................................................- 3 -

1.1.5 Display Support .............................................................................................................................- 4 -

1.1.6 Cooling System ..............................................................................................................................- 4 -

1.1.7 Operating System Support ............................................................................................................- 4 -

1.2 Configuration........................................................................................................................................- 5 -

2. Display Options ..........................................................................................................................................- 6 -

3. Functional Description ...............................................................................................................................- 7 -

3.1 Board Architecture ...............................................................................................................................- 7 -

3.2 General Purpose Graphics Processing Unit..........................................................................................- 8 -

3.2.1 Gpu Resoures ................................................................................................................................- 8 -

3.3 Display Interface (Optional) .................................................................................................................- 8 -

3.3.1 Graphics Output channels.............................................................................................................- 9 -

3.3.2 Digital Output................................................................................................................................- 9 -

3.3.3 Analog Output ...............................................................................................................................- 9 -

3.3.4 AUX................................................................................................................................................- 9 -

3.3.5 Hot Plug .........................................................................................................................................- 9 -

3.4 PCI Express .........................................................................................................................................- 10 -

4. Pin Definition............................................................................................................................................- 11 -

4.1 Board Interface...................................................................................................................................- 11 -

4.2 Supplementary Power Connector Pin Assignments...........................................................................- 12 -

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4.2.1 Supplementary Power Connector.............................................................................................- 12 -

4.2.2 Connector Pinout ........................................................................................................................- 12 -

4.3 MXM Pin Assignments........................................................................................................................- 13 -

4.3.1 MXM Connector ..........................................................................................................................- 13 -

4.3.2 MXM connector Pinout ...............................................................................................................- 13 -

4.3.3 MXM OEM and GPIO Pin Assignment .........................................................................................- 16 -

5. Mechanical Specifications ........................................................................................................................- 17 -

5.1 Dimensions.........................................................................................................................................- 17 -

6. Thermal Specifications .............................................................................................................................- 18 -

6.1 Thermal Policy....................................................................................................................................- 18 -

6.2 Component Thermal and Mechanical Specifications.........................................................................- 19 -

7. System Requirements ..............................................................................................................................- 25 -

7.1 Power Sequencing..............................................................................................................................- 25 -

7.2 Module Power Down and Power Up..................................................................................................- 26 -

7.3 Reset Requirements ...........................................................................................................................- 26 -

7.4 DisplayPort Interface..........................................................................................................................- 27 -

7.5 Embedded DisplayPort (eDP) .............................................................................................................- 27 -

7.6 DVI/HDMI on DP Interface .................................................................................................................- 27 -

7.7 Thermal and Power Management Interface......................................................................................- 29 -

7.8 PWR_LEVEL Signal ..............................................................................................................................- 29 -

8. Certificates and Agencies .........................................................................................................................- 31 -

8.1 Certifications ......................................................................................................................................- 31 -

8.2 Agencies .............................................................................................................................................- 31 -

9. Appendix ..................................................................................................................................................- 32 -

9.1 Order Information..............................................................................................................................- 32 -

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UM-M3N1060-MN-v05

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1. General Overview

The GeForce GTX10 MXM series are powered by the next-generation NVIDIA

Pascal™ architecture, which delivers blazing-fast performance, advanced graphics

technologies, and improved battery life. Now you can take on your PC games with

faster, smoother gameplay at ultra-settings. Game advanced, unplugged.

The Aetina GTX10 MXM module is the compact, thinnest graphics module solution

based on the industrial standard Mobile PCI Express Module Version 3.1

specification, delivering the latest and leading-edge GPU benefits for your

embedded system. It’s superior graphics performance, GPU computing and video

capabilities are the ideal solution for performance demanding systems such as

digital signage, medical image, defense and aerospace applications.

1.1 Features

Powered by NVIDIA Pascal ™ architecture GPU GeForce GTX 1060/1070.

Featuring thousand optimal CUDA cores.

Support optimal resolution 8K UHD at 60Hz.

High-end DirectX12 compatible graphics module.

Unrivaled Graphics Computing performance and superbly-detailed image

quality.

Ideal for medical imaging, gaming, defense and aerospace applications.

1.1.1 GPU

GeForce GTX 1060

CUDA cores: 1280

Core clock: 1404MHz (Boost: 1670MHz)

Voltage: Variable

Package size: 37.5 mm x 37.5 mm, 2152 ball flip-chip, plastic ball grid array

(FCPBGA)

GeForce GTX 1070

CUDA cores: 2048

Core clock: 1442MHz (Boost: 1645MHz)

Voltage: Variable

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UM-M3N1060-MN-v05

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Package size: 37.5 mm x 37.5 mm, 2152 ball flip-chip, plastic ball grid array

(FCPBGA)

1.1.2 Board

GeForce GTX 1060

12-layer printed circuit board (PCB)

16-lanes PCI Express 3.0 capable (x16/x8)

MXM3.1 Type B form factor

Physical dimensions: 105mm x 82mm (single width)

Board power : 78 W

High-Bandwidth Digital Content Protection (HDCP) support

GeForce GTX 1070

12-layer printed circuit board (PCB)

16-lanes PCI Express 3.0 capable (x16/x8)

MXM3.1 form factor

Physical dimensions: 113mm x 82mm (single width)

Board power : 115 W

High-Bandwidth Digital Content Protection (HDCP) support

1.1.3 Memory Configuration

GeForce GTX 1060

Memory clock: 4004 MHz (8 Gbps)

Interface: 192-bit

Local frame buffer: 6 GB (6pieces 256M x 32 GDDR5, FBGA-170 package)

GeForce GTX 1070

Memory clock: 4004 MHz (8 Gbps)

Interface: 256-bit

Local frame buffer: 8 GB (6pieces 256M x 32 GDDR5, FBGA-170 package)

1.1.4 Support

NVIDIA CUDA Technology (Compute capability 6.1)

NVIDIA Optimus Technology

NVIDIA Ansel

NVIDIA GPU Boost 3.0

Microsoft DirectX 12

Vulkan

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OpenCL

OpenGL 4.5

VR Ready

1.1.5 Display Support

LCD –eDP 1.4

Maximum resolution over eDP 1.4 port: 4096 x 2160 at 60Hz

DisplayPort 1.2 (DisplayPort 1.3/1.4 Ready)

Maximum resolutions RBG 8-bit with dual-DisplayPort connector: 7680 x

4320 at 60Hz

Maximum resolution YUV420 8-bit with one DisplayPort connector: 7680 x

4320 at 60 Hz

HDMI 2.0

Maximum resolution over HDMI: 4096 x 2160 at 60Hz

HDCP Support 1.3 and 2.2

1.1.6 Cooling System

N/A

1.1.7 Operating System Support

Windows® 7 - 10

Linux

Note:

1. Windows10 requires November 2015 update or newer.

2. The WINDOWS operating system requires “Battery Module Enabled” (NOT RTC). If the battery module enabled,

you can find the battery icon on the right side of the taskbar, as the below figure.

※Please contact your system BIOS vendor to get help.

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1.2 Configuration

Table 1.1 lists the SKU configuration currently available for the GeForce GTX

1060/1070 MXM graphics module.

Table 1.1: Board configuration

Specification

M3N1060-MN Description

M3N1070-NN Description

Chip

GeForce GTX 1060

GeForce GTX 1070

Core clock

1404MHz (Boost: 1670MHz)

1442MHz (Boost: 1645MHz)

Memory clock

4004MHz (8.0 Gbps)

Frame buffer

6 GB GDDR5

8 GB GDDR5

Memory interface

192-bit

256-bit

Memory type

256M x 32 GDDR5 FBGA-170

package

256M x 32 GDDR5 FBGA-170

package

Memory AVL

Samsung K4G80325FB-HC25

Maximum board power

78 W

115 W

Connectors

MXM 3.0 Connector

Interoperability

MXM 3.0 Connector

Interoperability

HDCP support

Yes

Supplementary Power

Connector

N/A

4-pins (PWR_SRC)

Operating Temperature

Standard: 0°C to +55°C

Extreme temperature: Optional

Standard: 0°C to +55°C

Storage Temperature

-40°C to 125°C

Operating Humidity

10~90%, No Condensation.

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2. Display Options

Table 2.1 list the GeForce GTX10 MXM graphics module display options.

Table 2.1: Display Options

Displays Supported for Each Interface

DP_A

DP_B

DP_C

DP_D

DP_E

DP_F

DisplayPort,

HDMI

DisplayPort

DisplayPort,

HDMI

eDP only

DisplayPort,

DVI (single-link

or dual-link with

DP_F)

DisplayPort,

DVI (dual-link

with DP_E)

Note:

1. DP_P cannot be used for driving an external display.

2. System without Dual-link display can be supported up to four digital displays at the same time.

3. All display interfaces that support DisplayPort can be support dual-mode DisplayPort.

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Aetina GeForce GTX10 series User manual

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