Allen-Bradley 1769-ASCII User manual

Publication 1769-IN068B-EN-P - May 2005
Installation Instructions
Compact 1769-ASCII Module
Cat. No. 1769-ASCII
Inside…
About the Module ............................................................................................4
Install the Module.............................................................................................5
Assemble the System........................................................................................6
Mount Expansion I/O ....................................................................................8
Ground the Module........................................................................................12
Connect the D-sub Connector Pins ............................................................13
I/O Memory Mapping...................................................................................16
Configure the 1769-ASCII Module .............................................................25
Specifications...................................................................................................29
Status Indicators..............................................................................................32
Troubleshoot with Error Codes ...................................................................33

2Compact 1769-ASCII Module
Publication 1769-IN068B-EN-P - May 2005
Important User Information
Because of the variety of uses for the products described in this publication,
those responsible for the application and use of these products must satisfy
themselves that all necessary steps have been taken to assure that each
application and use meets all performance and safety requirements, including
any applicable laws, regulations, codes and standards. In no event will
Rockwell Automation be responsible or liable for indirect or consequential
damage resulting from the use or application of these products.
Any illustrations, charts, sample programs, and layout examples shown in this
publication are intended solely for purposes of example. Since there are many
variables and requirements associated with any particular installation,
Rockwell Automation does not assume responsibility or liability (to include
intellectual property liability) for actual use based upon the examples shown in
this publication.
Allen-Bradley publication SGI-1.1, Safety Guidelines for the Application,
Installation and Maintenance of Solid-State Control (available from your local
Rockwell Automation office), describes some important differences between
solid-state equipment and electromechanical devices that should be taken into
consideration when applying products such as those described in this
publication.
Reproduction of the contents of this copyrighted publication, in whole or
part, without written permission of Rockwell Automation, is prohibited.
Throughout this publication, notes may be used to make you aware of safety
considerations. The following annotations and their accompanying statements
help you to identify a potential hazard, avoid a potential hazard, and recognize
the consequences of a potential hazard:
WARNING Identifies information about practices or circumstances that can
cause an explosion in a hazardous environment, which may lead
to personal injury or death, property damage, or economic loss.
ATTENTION Identifies information about practices or circumstances that can
lead to personal injury or death, property damage, or economic
loss.

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IMPORTANT Identifies information that is critical for successful application
and understanding of the product.
ATTENTION Environment and Enclosure
This equipment is intended for use in a Pollution Degree 2
industrial environment, in overvoltage Category II applications
(as defined in IEC publication 60664-1), at altitudes up to 2000
meters without derating.
This equipment is considered Group 1, Class A industrial
equipment according to IEC/CISPR Publication 11. Without
appropriate precautions, there may be potential difficulties
ensuring electromagnetic compatibility in other environments
due to conducted as well as radiated disturbance.
This equipment is supplied as “open type” equipment. It must
be mounted within an enclosure that is suitably designed for
those specific environmental conditions that will be present and
appropriately designed to prevent personal injury resulting from
accessibility to live parts. The interior of the enclosure must be
accessible only by the use of a tool. Subsequent sections of this
publication may contain additional information regarding
specific enclosure type ratings that are required to comply with
certain product safety certifications.
NOTE: See NEMA Standards publication 250 and IEC
publication 60529, as applicable, for explanations of the degrees
of protection provided by different types of enclosure. Also, see
the appropriate sections in this publication, as well as the
Allen-Bradley publication 1770-4.1 (“Industrial Automation
Wiring and Grounding Guidelines”), for additional installation
requirements pertaining to this equipment.

4Compact 1769-ASCII Module
Publication 1769-IN068B-EN-P - May 2005
About the Module
The 1769-ASCII module provides a flexible network interface to a wide
variety of RS-232, RS-485, and RS-422 ASCII devices. The module provides
the communication connections to the ASCII device.
Item Description
1a Upper DIN rail latch
1b Lower DIN rail latch
2a Upper tongue-and-groove slots
2b Lower tongue-and-groove slots
3a Channel 0 isolated ASCII
connector
3b Channel 1 isolated ASCII
connector
4Stationary bus connector with
male pins
1a
2a
3a
3b
1b
2b
2a
2b
4

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Publication 1769-IN068B-EN-P - May 2005
Install the Module
Compact I/O is suitable for use in an industrial environment when installed
in accordance with these instructions. Specifically, this equipment is intended
for use in clean, dry environments (Pollution Degree 2(1)) and to circuits not
exceeding Over Voltage Category II(2) (IEC 60664-1).(3)
(1) Pollution Degree 2 is an environment where, normally, only non-conductive pollution occurs except
that occasionally a temporary conductivity caused by condensation shall be expected.
ATTENTION Preventing Electrostatic Discharge
This equipment is sensitive to electrostatic discharge, which can
cause internal damage and affect normal operation. Follow these
guidelines when you handle this equipment:
•Touch a grounded object to discharge potential static.
•Wear an approved grounding wriststrap.
•Do not touch connectors or pins on component boards.
•Do not touch circuit components inside the equipment.
•If available, use a static-safe workstation.
When not in use, store the equipment in appropriate static-safe
packaging.
WARNING If you connect or disconnect the serial cable with power applied
to this module or the serial device on the other end of the cable,
an electrical arc can occur. This can cause an explosion in
hazardous locations. Be sure that power is removed or the area is
nonhazardous before proceeding.
(2) Over Voltage Category II is the load level section of the electrical distribution system. At this level
transient voltages are controlled and do not exceed the impulse voltage capability of the product’s
insulation.
(3) Pollution Degree 2 and Over Voltage Category II are International Electrotechnical Commission (IEC)
designations.

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Publication 1769-IN068B-EN-P - May 2005
Assemble the System
Attach the module to the controller or an adjacent I/O module before or
after mounting. For mounting instructions, see the Panel Mount or Mount on
the DIN Rail sections. To work with a system that is already mounted, see
Replace a Single Module Within a System section.
ATTENTION This product is grounded through the DIN rail to chassis
ground. Use zinc-plated, yellow-chromate steel DIN rail to
assure proper grounding. The use of other DIN rail materials
(e.g., aluminum, plastic, etc.), which can corrode, oxidize, or are
poor conductors, can result in improper or intermittent
grounding.
6
5
4
3
1
1
2

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1. Disconnect power.
2. Check that the bus lever of the module to be installed is in the
unlocked (fully right) position.
3. Use the upper and lower tongue-and-groove slots (1) to secure the
modules together or to a controller.
4. Move the module back along the tongue-and-groove slots until the
bus connectors (2) line up with each other.
5. Use your fingers or a small screwdriver to push the bus lever back
slightly to clear the positioning tab (3).
6. To enable communication between the controller and module, move
the bus lever fully to the left (4) until it clicks.
Ensure it is locked firmly in place.
ATTENTION Remove power before removing or inserting this module. When
you remove or insert a module with power applied, an electrical
arc may occur. An electrical arc can cause personal injury or
property damage by:
•sending an erroneous signal to your system’s field devices,
causing unintended machine motion
•causing an explosion in a hazardous environment
Electrical arcing causes excessive wear to contacts on both the
module and its mating connector. Worn contacts may create
electrical resistance.
ATTENTION When attaching I/O modules, it is very important that the bus
connectors are securely locked together to ensure proper
electrical connection.

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7. Attach an end-cap terminator (5) to the last module in the system by
using the tongue-and-groove slots as before.
8. Lock the end-cap bus terminator (6).
Mount Expansion I/O
Minimum Space
Maintain spacing from enclosure walls, wireways, adjacent equipment, etc.
Allow 50 mm (2 in) of space on all sides for adequate ventilation.
IMPORTANT You must use a 1769-ECR or -ECL right- or left-end cap to
terminate the end of the serial communication bus.
ATTENTION During panel or DIN rail mounting of all devices, be sure that all
debris (metal chips, wire strands, etc.) is kept from falling into
the module. Debris that falls into the module could cause
damage on power up.
IMPORTANT When mounting the CompactLogix system, either use screws
to panel mount the system OR use DIN rail. Do NOT use
both. Use of both mounting methods may cause hardware
damage and cause the system to fail.
Controller
Compact I/O Compact I/O Compact I/O Compact I/O Compact I/O
End Cap
Top
Bottom
Side Side

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Panel Mount
Mount the module to a panel by using two screws per module. Use M4 or #8
panhead screws. Mounting screws are required on every module.
Panel Mount Procedure With the Dimensional Template
Panel Mount Procedure With Modules as a Template
The following procedure lets you use the assembled modules as a template for
drilling holes in the panel. Due to module mounting hole tolerance, it is
important to follow these procedures.
1. On a clean work surface, assemble no more than three modules.
2. Using the assembled modules as a template, carefully mark the center
of all module-mounting holes on the panel.
3. Return the assembled modules to the clean work surface, including
any previously mounted modules.
4. Drill and tap the mounting holes for the recommended M4 or #8
screw.
Host Controller
Compact I/O Compact I/O Compact I/O
Right End Cap
NOTE: All dimensions
are in mm (inches). Ho
le
spacing tolerance:
±0.4 mm (0.016 in.)
F
or more than 2 modules: (number of modules - 1) X 35 mm (1.38 in.)
Refer to host controller documentation for this dimension.
132
(5.197)
122.6±0.2
(4.826±0.008)
35
(1.38)
28.5
(1.12)

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5. Place the modules back on the panel, and check for proper hole
alignment.
6. Attach the modules to the panel using the mounting screws.
If mounting more modules, mount only the last one of this group and
put the others aside. This reduces remounting time during drilling and
tapping of the next group.
7. Repeat steps 1 to 6 for any remaining modules.
Mount on the DIN Rail
The module can be mounted on these DIN rails:
•35 x 7.5 mm (EN 50022 - 35 x 7.5)
•35 x 15 mm (EN 50022 - 35 x 15)
Before mounting the module on a DIN rail, close the DIN rail latches. Press
the DIN rail mounting area of the module against the DIN rail. The latches
will momentarily open and lock into place.

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Replace a Single Module Within a System
The module can be replaced while the system is mounted to a panel or DIN
rail.
1. Remove power.
2. On the module to be removed, remove the upper and lower mounting
screws from the module (or open the DIN latches using a flat-blade
or Phillips-style screwdriver).
3. Move the bus lever to the right to disconnect (unlock) the bus.
4. Move the bus lever on the right-side adjacent module to the right
(unlock) to disconnect it from the module to be removed.
5. Gently slide the disconnected module forward.
If you feel excessive resistance, check that the module has been
disconnected from the bus, and that both mounting screws have been
removed (or DIN latches opened).
You may need to rock the module slightly from front to back to
remove it, or, in a panel-mounted system, to loosen the screws of
adjacent modules.
ATTENTION Remove power before removing or inserting this module. When
you remove or insert a module with power applied, an electrical
arc may occur. An electrical arc can cause personal injury or
property damage by:
•sending an erroneous signal to your system’s field devices,
causing unintended machine motion
•causing an explosion in a hazardous environment
Electrical arcing causes excessive wear to contacts on both the
module and its mating connector. Worn contacts may create
electrical resistance.

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6. Before installing the replacement module, be sure that the bus lever
on the module to be installed and on the right-side adjacent module
are in the unlocked (fully right) position.
7. Slide the replacement module into the open slot.
8. Connect the modules together by locking (fully left) the bus levers on
the replacement module and the right-side adjacent module.
9. Replace the mounting screws (or snap the module onto the DIN rail).
Ground the Module
This product is intended to be mounted to a well-grounded mounting surface
such as a metal panel. Additional grounding connections from the module’s
mounting tabs or DIN rail (if used) are not required unless the mounting
surface cannot be grounded. Refer to Industrial Automation Wiring and
Grounding Guidelines, publication 1770-4.1, for additional information.

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Connect the D-sub Connector Pins
All pins are active at all times.
IMPORTANT Pins unused for a particular physical network must not be
connected via the serial cable to any other device. In
particular, do not use cables 1747-CP3 and 1756-CP3.
Pin RS-232 RS-422 RS-485
1Do Not Connect Transmit Data - Transmit/Receive Data -
2Receive Data Do Not Connect Do Not Connect
3Transmit Data Do Not Connect Do Not Connect
4Do Not Connect Receive Data - Do Not Connect
5Common Common Common
6Do Not Connect Receive Data + Do Not Connect
7Request To Send Request To Send Request To Send
8Clear To Send Clear To Send Clear To Send
9Do Not Connect Transmit Data + Transmit/Receive Data +

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Figure 1 RS-232 Wiring Diagram - Module to DTE Device
(Hardware Handshaking Disabled)
(1) Connect to the shield of the cable.
Figure 2 RS-232 Wiring Diagram - Module to Printer
(Hardware Handshaking Enabled, Standard Printer Adapter Cable)
NC1
RXD2
TXD3
NC4
COM5
NC6
RTS7
CTS8
NC9
DCD
TXD
RSD
DSR
COM
DTR
CTS
RTS
GND
8
2
3
6
7
20
5
4
1
1
3
2
6
5
4
8
7
(1)
ASCII DTE DTE 9-pin 25-pin
NC
NC
NC
1
RXD2
TXD3
4
COM5
6
RTS7
CTS8
N.C.9
CD
TXD
RXD
DSR
COM
DTR
CTS
RTS
RI
8
2
3
6
7
20
5
4
22
1
3
2
6
5
4
8
7
9
GND 1
ASCII DTE DTE 9-pin 25-pin

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Figure 3 RS-422 Wiring Diagram
Figure 4 RS-485 Wiring Diagram
TXD-
NC
NC
1
2
3
4
COM5
RXD+
RTS
CTS
6
7
8
TXD+9
RXD-
TXD-
COM
TXD+
RXD+
RXD-
ASCII
TRXD-
NC
NC
NC
NC
1
2
3
4
COM
RTS
CTS
5
6
7
8
TRXD+9
TRXD-
COM
TRXD+
ASCII

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I/O Memory Mapping
The 1769-ASCII module supports an input assembly that is accessible
through the Assembly Object (Class 4), Instance 101. The input assembly is
up to 108 words. The module supports an output assembly that is accessible
through the Assembly Object (Class 4), Instance 100. The output assembly is
up to 108 words.
Alternate Mode (One Channel at a Time) Output File
Maximum size is shown below. Refer to the Compact I/O 1769-ASCII
Module User Manual, publication 1769-UM012, to use smaller output files.
•Tx = Transmit
•Rx = Receive
•CNI = Channel number of requested input data. This bit is set by the
PLC controller or other user program to tell the ASCII module which
data to produce.
Word
Bit Position
15 14 13 12 11 10 9876543210
0Reserved Tx Transaction ID Ch0
1Reserved Rx Transaction ID Request Ch0
2Reserved Tx Transaction ID Ch1
3Reserved Rx Transaction ID Request Ch1
4Reserved CNI
5Reserved CNO
6Reserved
7Length (Number of Bytes)
8Character 1 Character 0
9Character 3 Character 2
…Character … Character …
106 Character 197 Character 196
107 Character 199 Character 198

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•CNO = Channel number of the output data being sent. This bit is set
by the PLC controller or other user program to tell the ASCII module
which port’s data is being sent to the ASCII module.
•Reserved bits should be set to 0.
Alternate Mode (One Channel at a Time) Input File
Maximum size is shown below. Refer to the Compact I/O 1769-ASCII
Module User Manual, publication 1769-UM012, to use smaller input files.
•Tx = Transmit
•Rx = Receive
•TS = Transmit sent. Indicates the ASCII module has sent the data
indicated by the Tx Transaction ID and can accept more transmit
data.
•ND = New data. Only used for Handshake mode.
•HE = Handshake error. Only used for Handshake mode.
Word
Bit Position
15 14 13 12 11 10 987654321 0
0Tx ID 0 Acknowledged Rx Transaction ID Ch0
115 14 13 12 11 10 TG0 TS0 ND
0
HE0 NR
0
RF0 TF0 PA0 RO0 TO0
2Tx ID 1 Acknowledged Rx Transaction ID Ch1
315 14 13 12 11 10 TG1 TS1 ND
1
HE1 NR
1
RF1 TF1 PA1 RO1 TO1
4Reserved CNI
5Reserved CNO
6Firmware Revision, Major Firmware Revision, Minor
7Length (Number of Bytes)
8Character 1 Character 0
9Character 3 Character 2
…Character … Character …
106 Character 197 Character 196
107 Character 199 Character 198

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•NR = Non-delimited record. An input record is received and sent to
the Compact bus interface that was not triggered by a delimiter
character. This occurs when either the buffer is filled to its maximum
receive size or a Message Timeout has occurred.
•RF = Data in the receive FIFO. The FIFO is not empty. The input
FIFO has not sent all of its data to the Compact bus interface.
•TF = Data in transmit FIFO. The FIFO is not empty. The output
FIFO has not sent all of its data to the ASCII device.
•PA = Parity error. A parity error has occurred with the received data
string. This usually indicates a mismatch in the serial port set-up of the
ASCII device and the Compact module. It could also indicate that
noise has occurred on the line and degraded the signal. This bit is set
when the receive FIFO contains a message in which a parity error
occurred in one of the incoming bytes. This bit is reset when the
receive FIFO is emptied or when a new message is received with no
parity error.
•RO = Receive buffer overflow. Some input data has been lost.
•TG = Transmit greater than Max Error. Transmit length in the output
file is greater than the maximum transmit character length in the
configuration file.
•TO = Transmit buffer overflow. Some output data has been lost.
•CNI = Channel number of the input data. This bit is set by the ASCII
module to tell the user program from which port the data was
received.
•CNO = Channel number of the output data most recently received.
This bit is set by the ASCII module to tell the user program that it has
received the data to transmit out the specified port.

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Simultaneous Mode (Two Channels) Input File
Maximum size is shown below. Refer to the Compact I/O 1769-ASCII
Module User Manual, publication 1769-UM012, to use smaller output files.
•Tx = Transmit
•Rx = Receive
•TG = Transmit greater than Max Error. Transmit length in the output
file is greater than the maximum transmit character length in the
configuration file.
Word
Bit Position
15 14 13 12 11 10 9876543210
Channel 0 Data
0Tx ID Acknowledged Rx Transaction ID
1Reserved TG TS ND HE NR RF TF PA RO TO
2Firmware Revision, Major Firmware Revision, Minor
3Length (Number of Bytes)
4Character 1 Character 0
5Character 3 Character 2
…Character … Character …
x(1)
(1) X is calculated based on the size of Channel 0 data as specified in the input file. Both channels
cannot contain 200 characters as the total configuration file size can be only 108 words.
Last Character Character …
Channel 1 Data
x+1 Tx ID Acknowledged Rx Transaction ID
x+2 Reserved TG TS ND HE NR RF TF PA RO TO
x+3 Firmware Revision, Major Firmware Revision, Minor
x+4 Length (Number of Bytes)
x+5 Character 1 Character 0
x+6 Character 3 Character 2
…Character … Character …
y(2)
(2) Y is equal to the connection size minus 1, with a maximum value of 107 for a buffer size of 108.
Last Character Character …

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•TS = Transmit sent. Indicates the ASCII module has sent the data
indicated by the Tx Transaction ID and can accept more transmit
data.
•ND = New data. Only used for Handshake mode.
•HE = Handshake error. Only used for Handshake mode.
•NR = Non-delimited record. An input record is received and sent to
the Compact bus interface that was not triggered by a delimiter
character. This occurs when either the buffer is filled to its maximum
receive size or a Message Timeout has occurred.
•RF = Data in the receive FIFO. The FIFO is not empty. The input
FIFO has not sent all of its data to the Compact bus interface.
•TF = Data in transmit FIFO. The FIFO is not empty. The output
FIFO has not sent all of its data to the ASCII device.
•PA = Parity error. A parity error has occurred with the received data
string. This usually indicates a mismatch in the serial port set-up of the
ASCII device and the Compact module. It could also indicate that
noise has occurred on the line and degraded the signal. This bit is set
when the receive FIFO contains a message in which a parity error
occurred in one of the incoming bytes. This bit is reset when the
receive FIFO is emptied or when a new message is received with no
parity error.
•RO = Receive buffer overflow. Some input data has been lost.
•TO = Transmit buffer overflow. Some output data has been lost.