Arbor Technology ITX-i2203 User manual

I
ITX-i2203
User’s Manual
Version 1.2
Mini-ITX Industrial Motherboard
2020.04

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Revision History
Version Release Time Description
1.0 Aug, 2016 Initial release
1.1 Jun, 2017 Update “A.2 BIOS Update using ACT Utility”
1.2 Apr, 2020 Added “OEM request” to SIM socket

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Contents
Table of Contents
Revision History .................................................................................i
Table of Contents ..............................................................................ii
Preface...............................................................................................iv
Copyright Notice .................................................................................... iv
Declaration of Conformity ...................................................................... iv
CE................................................................................................... iv
FCC Class A .................................................................................... v
RoHS ............................................................................................... v
SVHC / REACH .............................................................................. vi
Warning.................................................................................................. vi
Replacing Lithium Battery ...................................................................... vi
Technical Support .................................................................................. vi
Warranty.................................................................................................vii
Chapter 1 - Introduction....................................................................1
1.1. Product Highlights............................................................................ 2
1.2. About this Manual ............................................................................ 2
1.3. Specications................................................................................... 3
1.4. Inside the Package .......................................................................... 4
1.5. Ordering Information ........................................................................4
1.6. RAM Installation............................................................................... 5
Chapter 2 - Getting Started...............................................................7
2.1. Board Dimensions............................................................................8
2.2. Block Diagram..................................................................................9
2.3. Jumpers & Connectors .................................................................. 10
2.3.1. Layout .................................................................................. 10
2.3.2. Jumpers ............................................................................... 12
2.3.3. Connectors .......................................................................... 16
2.4. Driver Installation Notes................................................................. 37
Chapter 3 - BIOS..............................................................................39
3.1. Main ............................................................................................... 41
3.2. Advanced ....................................................................................... 42
3.2.1. ACPI Settings....................................................................... 43
3.2.2. CPU Conguration............................................................... 44
3.2.3. PPM Conguration............................................................... 45
3.2.4. USB Conguration ...............................................................46
3.2.5. SATA Conguration..............................................................47
3.2.6. LPSS & SCC Conguration .................................................48
3.2.7. F81801 Super IO Conguration........................................... 49
3.2.8. Hardware Monitor ................................................................50

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Contents
3.2.9. S5 RTC Wake Settings ........................................................ 51
3.2.10. CSM Conguration ........................................................... 52
3.2.11. SDIO Conguration ........................................................... 53
3.3. Chipset........................................................................................... 54
3.3.1. North Bridge.........................................................................55
3.3.2. South Bridge ........................................................................58
3.4. Security .......................................................................................... 60
3.5. Boot................................................................................................61
3.6. Save & Exit .................................................................................... 62
Appendices ......................................................................................63
Appendix A. Anti-Crash Technology for BIOS Recovering................... 64
A.1 Auto Recovery .........................................................................64
A.2 BIOS Update using ACT Utility................................................65
A.3 How to Get ACT Utility.............................................................67
Appendix B. I/O Port Address Map ...................................................... 68
Appendix C. Interrupt Request Lines (IRQ) ..........................................70
Appendix D. BIOS Memory Map........................................................... 71
Appendix E. Watchdog Timer (WDT) Setting.......................................72

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Preface
Preface
Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.
This document contains proprietary information protected by copyright. All rights
are reserved. No part of this manual may be reproduced by any mechanical,
electronic, or other means in any form without prior written permission of the
manufacturer.
Declaration of Conformity
CE
The CE symbol on your product indicates that it is in compliance with the
directives of the Union European (EU). A Certicate of Compliance is available
by contacting Technical Support.
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. We recommend the use of shielded
cables. This kind of cable is available from ARBOR. Please contact your local
supplier for ordering information.
This product has passed the CE test for environmental specications. Test
conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by ESD
(Electrostatic Discharge) and EMI leakage, we strongly recommend the use of
CE-compliant industrial enclosure products.
Warning
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.

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Preface
FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference
that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the
interference at his own expense.
RoHS
ARBOR Technology Corp. certies that all components in its products are
in compliance and conform to the European Union’s Restriction of Use of
Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main purpose
of the directive is to prohibit the use of lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that exceed
a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is dened as
a substance or mixture of substances with uniform composition (such as solders,
resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-96.5%),
Ag(3.0-3.5%) and Cu(0.5%)).

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Preface
SVHC / REACH
To minimize the environmental impact and take more responsibility to the earth
we live, Arbor hereby conrms all products comply with the restriction of SVHC
(Substances of Very High Concern) in (EC) 1907/2006 (REACH --Registration,
Evaluation, Authorization, and Restriction of Chemicals) regulated by the
European Union.
All substances listed in SVHC < 0.1 % by weight (1000 ppm)
Warning
Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow the
following precautions when handling it :
1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or
circuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.
Replacing Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.
Technical Support
If you have any technical di󰀩culties, please do not hesitate to call or e-mail our
customer service.
http://www.arbor-technology.com/
E-mail:[e-mail]

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Preface
Warranty
This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any
other incidental or consequential damage resulting from the use, misuse of, or
inability to use this product. Vendor will not be liable for any claim made by any
other related party.
Vendors disclaim all other warranties, either expressed or implied, including but
not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and written materials, and any accompanying hardware. This limited
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned
merchandise will be accepted. Authorization can be obtained by calling or
faxing the vendor and requesting a Return Merchandise Authorization (RMA)
number. Returned goods should always be accompanied by a clear problem
description.

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1Chapter 1
Introduction
Chapter 1 - Introduction

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Introduction
1.1. Product Highlights
• Low prole design
• Soldered onboard Intel®Celeron®Processor N3160
• Dual Gigabit Ethernet ports
• 2 x HDMI ports, dual Channel 24-bit LVDS
• Dual independent displays supported
• Anti-Crash Technology (ACT) for automatical system
BIOS recovering
1.2. About this Manual
This manual is intended for experienced users and integrators with hardware
knowledge of computers. If you are not sure about the description in this manual,
consult your vendor before further handling.
We recommend that you keep one copy of this manual for the quick reference
for any necessary maintenance in the future. Thank you for choosing ARBOR
products.

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Introduction
1.3. Specications
Processor Soldered onboard Intel®Celeron®Processor N3160 1.6GHz
Memory 1 x DDR3L SO-DIMM socket, supporting up to 8GB
1333/1600MT/s SDRAM
BIOS AMI BIOS
Watchdog Timer 1~255 levels reset
Super I/O Fintek F81801
Serial Port 1 x Serial Port, RS-232/422/485 selectable
Keyboard & Mouse 6-pin wafer connector for PS/2 keyboard/ mouse
via Y-cable
USB 2.0 4 x USB 2.0 ports
USB 3.0/2.0 4 x USB 3.0/2.0 ports
Expansion
1 x PCIe x1 slot
1 x NGFF M.2 E-key socket for Wireless
1 x micro SIM socket (OEM request)
Storage
1 x Serial ATA port with 600MB/s HDD transfer rate
1 x NGFF M.2 B-key socket for SSD
Soldered onboard up to 32GB eMMC (OEM request)
Ethernet Chipset 2 x Intel®i210AT PCIe GbE controllers
Audio Interface Realtek®ALC269 5.1 Channel HD Audio CODEC, Mic-in/ Line-
in/ Line-out with Amplifier
Graphic Chipset Integrated Intel®HD Graphics
Graphic Interface 2 x HDMI ports
1 x Dual channels 24-bit LVDS via PTN3460BS
OS Support Windows 8.1 64-bit
Power Input DC 24V
Power
Consumption
0.56A@+24V (max.)
0.36A@+24V (min.)
Operating Temp. -20 ~ 70ºC (-4 ~ 158ºF)
Operating Humidity 10 ~ 95% @ 70ºC (non-condensing)
Dimension (L x W) 170 x 170 mm (6.7” x 6.7”)

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Introduction
1.4. Inside the Package
Before starting to install the single board, make sure the following items are
shipped:
1 x ITX-i2203 Industrial Motherboard w/ Heatsink
1 x Driver CD
1 x Quick Installation Guide
If any of the aforelisted items is damaged or missing, contact your vendor
immediately.
1.5. Ordering Information
ITX-i2203-N3160 Intel®Celeron®Processor N3160 Embedded Mini-ITX motherboard
w/ ACT
CBK-04-2203-00
Cable Kit
1 x SATA and SATA power cable
1 x Keyboard/ mouse cable
1 x Audio cable
1 x USB cable

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Introduction
1.6. RAM Installation
The main board has one memory module (SO-DIMM) sockets. Load the
computer with a memory module of higher capacity to make programs run faster.
The memory module for the computer’s SO-DIMM socket should be a DDR3L
with a “key notch” o󰀨 the centre among the pins, which enables the memory
module for particular applications. There are another two notches at each left
and right side of the memory module to help x the module in the socket.
key notch
side notch
side notch
To install the memory module:
1. Find the SO-DIMM socket on the board as marked in the illustration below.
The SO-DIMM socket is horizontal type, and it has two spring-loaded locks
to x the memory module.
2. Confront the memory module’s edge connector with the SO-DIMM slot
connector. Align the memory module’s key notch at the break on the SO-
DIMM slot connector.
3. Fully plug the memory module until it gets auto-locked in place.
To uninstall the memory module:
1. Pull back the locks from both sides of the SO-DIMM socket.
The memory module will be auto-released from the socket.
2. Remove the memory module.

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2Chapter 2
Getting
Started
Chapter 2 - Getting Started

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Getting Started
2.1. Board Dimensions
17,2
40 12
107,07
127,5 18,5
170
1,3
40,07
20
33.02
6.33 157.48
10.16
132.08
154.94
170
170
Ø4*Ø9
1 1
10
9
2
109
21
1
10
9
2
1
5.3mm
Heat sink(16.5)
(16.5)
Heat sink(16.5)
Unit:mm

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Getting Started
2.2. Block Diagram
Board Block Diagram
UART TTL level
DDI2
Asmedia
ASM1442
Asmedia
ASM1442
DDI1 HDMI
HDMI
HDMI1
HDMI connector
NXP
PTN3460BS
DDI0 Dual channels 24-bit LVDS LVDS1
ACES 87209-304*-06
HDMI2
HDMI connector
PCIex1 lane0
Giga LAN
Intel i210AT
GbE LAN1
LAN1
RJ-45 w/ transformer
PCIex1 Lane1
GbE LAN2 Giga LAN
Intel i210AT
LAN2
RJ-45 w/ transformer
PCIex1 Lane2
1 x USB 2.0 port
WIFI1
E-key socket
PCIex1 Line3
PCIE1
PCIex1 slot
USB 2.0 port 0 -3, USB SS port 0 - 3 USB1,2
Stacked USB 3.0
Type A connector
SATA0
SATA1
SATA connector
SAPO1
SATA power connector
DDR3L-1333/1600MHz
SODIMM1
SO-DIMM socket
SATA1
SSD1
B-key socket
2 x USB 2.0 Ports USB4
2.0mm pitch
2x5 pin wafer
connector
2 x USB 2.0 Ports USB3
Stacked USB 2.0
Type A Connector
HD Audio
ALC269
eMMC 4.5 (optional)
up to 32GB
(OEM request)
SPI
Line-out/ Line-in/MIC-in
Amplifier
USB 2.0 port4
Intel®
Celeron
N3160
1.6GHz
Processor
USB Hub
GL854G
(1 to 7 ports)
+24V DC input
PWR1, ATX-. R/A
PWR2, DC-jack connector
PS/2 KBMS
Fintek
SIO
F81801
LPC
1 x RS-232/422/485 selectable
KBMS1
6-pin wafer conn.
COM1
DB-9 male connector
AUDIO1
2x5-pin wafer conn.
SPKR1,2
1x2-pin wafer conn.
SIM1
Micro SIM socket
(OEM request)
1 x USB 2.0 Port
Realtek
Anti-Crash Technology (ACT)
•BIOS Monitoring
•BIOS Recovery Automatically
•BIOS & MCU Flash Synchronous Upgrade
ACT Block Diagram
System BIOS
Flash
BIOS ACT
RS232
SPI
SPI
Embedded
Board
External Flash
MCU
PIC32MX220F032C

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Getting Started
2.3. Jumpers & Connectors
The board comes with some connectors to join some devices and also some
jumpers to alter the hardware conguration. The following in this chapter will
explicate each of these components one-by-one.
2.3.1. Layout
This section will provide an overview of this board.
Board Top
1 1
10
9
2
109
21
1
10
9
2
1
1.2mm
JINV1
➊
JBAT1
➌
JLCD1
➋
JPIC2
➍
①FAN1
②SAPO1
④24VIN1
⑤DCIN1
⑥FP1
⑦INV1
⑧LVDS1
⑨SPKR1
⑩SPKR2
⑪AUDIO1
⑫KBMS1
⑬COM1
⑮HDMI2
⑯USB1
⑰USB2 ⑲USB4
⑱USB3
⑭HDMI1
③SATA1
LAN1
20
LAN2
21
PCIE1
22
SSD1
24
23 WIFI1