Arbor Technology ITX-i87H0 User manual

I
ITX-i87H0
User’s Manual
Version 1.0
Mini-ITX Industrial Motherboard
2015.04

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Revision History
Version Release Time Description
1.0 April, 2015 Initial release

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Contents
Table of Contents
Revision History .................................................................................i
Table of Contents .............................................................................iii
Preface................................................................................................v
Copyright Notice ..................................................................................... v
Declaration of Conformity ....................................................................... v
CE.................................................................................................... v
FCC Class A ................................................................................... vi
RoHS .............................................................................................. vi
SVHC / REACH ..............................................................................vii
Warning..................................................................................................vii
Replacing Lithium Battery ......................................................................vii
Technical Support ..................................................................................vii
Warranty................................................................................................viii
Chapter 1 - Introduction....................................................................1
1.1. Product Highlights............................................................................2
1.2. About this Manual ............................................................................2
1.3. Specications...................................................................................3
1.4. Inside the Package ..........................................................................4
1.5. Ordering Information ........................................................................5
1.6. RAM Installation...............................................................................6
1.7. CPU Installation ...............................................................................7
Chapter 2 - Getting Started...............................................................9
2.1. Board Dimensions..........................................................................10
2.2. Block Diagram................................................................................ 11
2.3. Jumpers & Connectors ..................................................................12
2.3.1. Layout .................................................................................. 12
2.3.2. Jumpers ............................................................................... 13
2.3.3. Connectors .......................................................................... 16
2.4. Driver Installation Notes.................................................................37
Chapter 3 - BIOS..............................................................................39
3.1. Main ............................................................................................... 41
3.2. Advanced .......................................................................................42
3.2.1. LAN Conguration ...............................................................43
3.2.2. Power Management Setup ..................................................44
3.2.4. ACPI Settings.......................................................................46
3.2.5. CPU Conguration...............................................................47
3.2.6. SATA Conguration.............................................................. 49
3.2.7. USB Conguration ...............................................................50
3.2.8. Trusted Computing ..............................................................51

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Contents
3.2.9. Intel(R) Rapid Start Technology...........................................52
3.2.10. Intel(R) Smart Connect Technology...................................53
3.2.11. Super IO Conguration ...................................................... 54
3.2.12. Intel ME BIOS Extension Conguration.............................55
3.3. Chipset...........................................................................................56
3.3.1. System Agent Conguration ................................................57
3.3.2. PCH Information ..................................................................58
3.3.3. ME Information ....................................................................59
3.4. Tweak.............................................................................................60
3.4.1. CPU OverClocking Conguration ........................................61
3.4.2. North Bridge Conguration ..................................................63
3.5. Boot...............................................................................................64
3.6. Security .......................................................................................... 66
Appendices ......................................................................................69
Appendix A. I/O Port Address Map ......................................................70
Appendix B. Interrupt Request Lines (IRQ) ..........................................73
Appendix C. BIOS Memory Map...........................................................74

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Preface
Preface
Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.
This document contains proprietary information protected by copyright. All rights
are reserved. No part of this manual may be reproduced by any mechanical,
electronic, or other means in any form without prior written permission of the
manufacturer.
Declaration of Conformity
CE
The CE symbol on your product indicates that it is in compliance with the
directives of the Union European (EU). A Certicate of Compliance is available
by contacting Technical Support.
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. We recommend the use of shielded
cables. This kind of cable is available from ARBOR. Please contact your local
supplier for ordering information.
This product has passed the CE test for environmental specications. Test
conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by ESD
(Electrostatic Discharge) and EMI leakage, we strongly recommend the use of
CE-compliant industrial enclosure products.
Warning
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.

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Preface
FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference
that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the
interference at his own expense.
RoHS
ARBOR Technology Corp. certies that all components in its products are
in compliance and conform to the European Union’s Restriction of Use of
Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main purpose
of the directive is to prohibit the use of lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that exceed
a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is dened as
a substance or mixture of substances with uniform composition (such as solders,
resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-96.5%),
Ag(3.0-3.5%) and Cu(0.5%)).

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Preface
SVHC / REACH
To minimize the environmental impact and take more responsibility to the earth
we live, Arbor hereby conrms all products comply with the restriction of SVHC
(Substances of Very High Concern) in (EC) 1907/2006 (REACH --Registration,
Evaluation, Authorization, and Restriction of Chemicals) regulated by the
European Union.
All substances listed in SVHC < 0.1 % by weight (1000 ppm)
Warning
Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow the
following precautions when handling it :
1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or
circuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.
Replacing Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.
Technical Support
If you have any technical difculties, please do not hesitate to call or e-mail our
customer service.
http://www.arbor.com.tw
E-mail:[e-mail]

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Preface
Warranty
This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any
other incidental or consequential damage resulting from the use, misuse of, or
inability to use this product. Vendor will not be liable for any claim made by any
other related party.
Vendors disclaim all other warranties, either expressed or implied, including but
not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and written materials, and any accompanying hardware. This limited
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned
merchandise will be accepted. Authorization can be obtained by calling or
faxing the vendor and requesting a Return Merchandise Authorization (RMA)
number. Returned goods should always be accompanied by a clear problem
description.

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1Chapter 1
Introduction
Chapter 1 - Introduction

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Introduction
1.1. Product Highlights
• 4th Generation Intel®Core™ Processor supported
• Gigabit Ethernet Port
• Dual Channel 24-bit LVDS, DisplayPort, HDMI_IN and
HDMI_OUT
• Dual Independent Displays supported
1.2. About this Manual
This manual is intended for experienced users and integrators with hardware
knowledge of computers. If you are not sure about the description in this manual,
consult your vendor before further handling.
We recommend that you keep one copy of this manual for the quick reference
for any necessary maintenance in the future. Thank you for choosing ARBOR
products.

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Introduction
1.3. Specications
Form Factor Mini-ITX industrial motherboard
CPU Intel®4th Generation CoreTM Family processors in LGA1150
socket
Chipset Intel®PCH H87
System Memory 2 x 204-pin DDR3 SO-DIMM socket supporting 1600/1333
MHz SDRAM up to 16GB
Graphic Chipset Integrated Intel®HD Graphics
Graphic Interface
1 x HDMI_OUT port
1 x HDMI_IN port
1 x Displayport
LCD: Daul Channels 24-bit LVDS
Ethernet 1 x Realtek RTL8111G Gigabit Ethernet controllers
BIOS AMI BIOS with 64Mb SPI Flash ROM
Audio Realtek ALC662 + ALC113 HD Audio Codec, Mic-in/Line-out
Storage 2 x Serial ATA ports with 600MB/s HDD transfer rate
1 x mSATA socket
USB 5 x USB 2.0 ports
6 x USB 3.0/2.0 ports
Expansion Bus 1 x Mini card socket (half size)
Power Require-
ment 19V DC Jack
Operation Temp. 0 ~ 60°C (32 ~ 140°F) w/ cooling fan
Operating Humid-
ity 10 ~ 60% @ 60°C (non-condensing)
Dimension (L xW) 170 x 170 mm (6.7” x 6.7”)

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Introduction
Recommended CPU List:
Intel®Core™ i7-4790S quad-core 3.2GHz / i7-4770S quad-core 3.1GHz
Intel®Core™ i7-4770TE quad-core 2.3GHz
Intel®Core™ i5-4570S quad-core 2.9GHz / i5-4590S quad-core 3.0GHz
Intel®Core™ i5-4570TE dual-core 2.7GHz
Intel®Core™ i3-4330 dual-core 3.6GHz / i3-4350T dual-core 3.1GHz
Intel®Core™ i3-4330TE dual-core 2.4GHz
Intel®Pentium®Processor G3420 dual-core 3.2GHz
Intel®Pentium®Processor G3320TE dual-core 2.3GHz
Intel®Celeron®Processor G1820 dual-core 2.7GHz
Intel®Celeron®Processor G1820TE dual-core 2.2GHz
1.4. Inside the Package
Before starting to install the single board, make sure the following items are
shipped:
1 x ITX-i87H0 Industrial Motherboard
1 x Driver CD
1 x Quick Installation Guide
1 x I/O bracket
1 x DC 2.5 Jack to 7.4 Plug Cable
If any of the aforelisted items is damaged or missing, contact your vendor
immediately.

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Introduction
1.5. Ordering Information
ITX-i87H0 Socket LGA1150 for 4th Generation Intel®Core™ Processor
i7/ i5/ i3, Pentium®/ Celeron®/ H87 Mini-ITX motherboard
Optional Accessories
CPF-67Q0-C1 CPU cooler for Intel LGA1155/1156 processor
CBK-07-87H0-00
Cable kit
2 x Two Ports USB2.0 cables
1 x One Port USB2.0 cable
1 x Two Ports USB3.0 cable
1 x Two Ports SATA Power cable
2 x SATA cables

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Introduction
1.6. RAM Installation
The main board has one memory module (SO-DIMM) sockets. Load the
computer with a memory module of higher capacity to make programs run faster.
The memory module for the computer’s SO-DIMM socket should be a DDR3L
with a “key notch” off the centre among the pins, which enables the memory
module for particular applications. There are another two notches at each left
and right side of the memory module to help x the module in the socket.
key notch
side notch
side notch
To install the memory module:
1. Find the SO-DIMM socket on the board as marked in the illustration below.
The SO-DIMM socket is horizontal type, and it has two spring-loaded locks
to x the memory module.
2. Confront the memory module’s edge connector with the SO-DIMM slot
connector. Align the memory module’s key notch at the break on the SO-
DIMM slot connector.
3. Fully plug the memory module until it gets auto-locked in place.
To uninstall the memory module:
1. Pull back the locks from both sides of the SO-DIMM socket.
The memory module will be auto-released from the socket.
2. Remove the memory module.

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1.7. CPU Installation
The LGA1150 processor socket comes with a lever to secure the processor.
Please refer to the pictures step by step as below and note that the cover of
the LGA1150 socket must always be installed during transportation to avoid
damage to the socket.
1 32
456
7
Make sure that heat sink putting on the CPU’s top surface is in complete contact
to avoid overheating problem.
If not, it would cause your system or CPU hanged, unstable or damaged.

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2Chapter 2
Getting
Started
Chapter 2 - Getting Started

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Getting Started
2.1. Board Dimensions