ASRock Industrial SBC-371 User manual

SBC-371
User Manual
Version 1.0
Published July 18, 2023
Copyright©2023 ASRockInd INC. All rights reserved.

Version 1.0
Published July, 2023
Copyright©2023 ASRockInd INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated
in any language, in any form or by any means, except duplication of documentation by the
purchaser for backup purpose, without written consent of ASRockInd Inc.
Products and corporate names appearing in this documentation may or may not be
registered trademarks or copyrights of their respective companies, and are used only for
identication or explanation and to the owners’ benet, without intent to infringe.
Disclaimer:
Specifications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRockInd. ASRockInd assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRockInd does not provide
warranty of any kind, either expressed or implied, including but not limited to the implied
warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRockInd, its directors, officers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for loss
of profits, loss of business, loss of data, interruption of business and the like), even if
ASRockInd has been advised of the possibility of such damages arising from any defect or
error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
1. this device may not cause harmful interference, and
2. this device must accept any interference received, including interference that may cause
undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRockInd Website: http://www.asrockind.com

e terms HDMI®and HDMI High-Denition Multimedia Interface, and the HDMI logo
are trademarks or registered trademarks of HDMI Licensing LLC in the United States and
other countries.
CAUTION:
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS.

Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 4
1.4 I/O Panel 7
1.5 Block Diagram 8
Chapter 2 Installation 9
2.1 Screw Holes 9
2.2 Pre-installation Precautions 9
2.3 Installation of Memory Modules (SO-DIMM) 10
2.4 Expansion Slots 11
2.5 Jumpers Setup 13
2.6 Onboard Headers and Connectors 16
Chapter 3 UEFI SETUP UTILITY 21
3.1 Introduction 21
3.1.1 Entering BIOS Setup 21
3.1.2 UEFI Menu Bar 22
3.1.3 Navigation Keys 23
3.2 Main Screen 24
3.3 Advanced Screen 25
3.3.1 CPU Conguration 26
3.3.2 Chipset Conguration 29

3.3.3 Storage Conguration 31
3.3.4 Super IO Conguration 33
3.3.5 AMT Conguration 34
3.3.6 ACPI Conguration 36
3.3.7 USB Conguration 37
3.3.8 Trusted Computing 38
3.4 Hardware Health Event Monitoring Screen 40
3.5 Security Screen 41
3.6 Boot Screen 42
3.7 Exit Screen 43

1
SBC-371
Chapter 1 Introduction
ank you for purchasing ASRockInd SBC-371 motherboard, a reliable motherboard pro-
duced under ASRockInd’s consistently stringent quality control. It delivers excellent perfor-
mance with robust design conforming to ASRockInd’s commitment to quality and endur-
ance.
In this manual, chapter 1 and 2 contain introduction of the motherboard and step-by-step
guide to the hardware installation. Chapter 3 contains the conguration guide to BIOS setup.
Because the motherboard specications and the BIOS soware might be updated, the
content of this manual will be subject to change without notice. In case any modica-
tions of this manual occur, the updated version will be available on ASRockInd website
without further notice. You may nd the latest CPU support lists on ASRockIndind
website as well.
ASRockIndind website https://www.asrockind.com/
If you require technical support related to this motherboard, please visit our website for
specic information about the model you are using.
https://www.asrockind.com/support/index.asp
1.1 Package Contents
ASRockInd SBC-371 Motherboard (3.5”SBC (5.8-in x 4-in x 0.94-in, 14.7 cm x 10.2 cm x 2.40
cm))
ASRockInd SBC-371 Jumper Setting Instruction
Gi Package:
1 x Heat Spreader 102.22*147.01mm
3 x SCREW M2*2, D=5
2 x COM Cable
1 x SATA Data Cable
1 x SATA Power Cable
1 x DC-in Cable
Bulk Package:
3 x SCREW M2*2, D=5

2
1.2 Specications
Form
Factor Dimensions 3.5” SBC (5.8-in x 4-in x 0.94-in, 14.7 cm x 10.2 cm x 2.40 cm)
Processor
System
CPU
Intel® 13th Gen (Raptor Lake-P) Core™ Processors
SBC-371P (i7-1365UE, 2P+8E)
SBC-371M (i5-1335UE, 2P+8E)
SBC-371V (i3-1315UE, 2P+4E)
Chipset MCP
BIOS AMI SPI 256 Mbit
Memory
Technology Dual Channel DDR4 3200 MHz
Capacity 64GB (32GB per DIMM)
Socket 2 x 260-pin SO-DIMM
Graphics
Controller Intel® Iris® Xe Graphics
HDMI HDMI 2.0b
Max resolution up to 4096 x 2160@60Hz
DisplayPort DP 1.4a
Max resolution up to 4096 x 2160@60Hz
LVDS Dual channel 24 bit up to 1920 x 1200@60Hz
(connector shared with eDP)
eDP Max resolution up to 1920 x 1080@60Hz
(connector shared with LVDS)
Multi Display Quad display (Included 2 output from Type-C)
Expansion
Slot
PCIe 1 x PCIe x1 Gen3 (supports up to 10W)
M.2
1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and
CNVi for Wireless
1 x M.2 (Key B, 3042/3052) with PCIe x1 or SATA3,
USB 3.2, USB 2.0 and SIM for 4G/5G
SIM Socket 1 x SIM socket connected to M.2 key B
Audio Interface Realtek ALC256 HD, High Denition Audio. Line-
out, Mic-in
Ethernet
Controller/
Speed
SBC-371P/SBC-371M
LAN1: Intel® I226LM with 10/100/1000/2500 Mbps,
supports vPro
LAN2: Intel® I226V with 10/100/1000/2500 Mbps
SBC-371V
LAN1: Intel® I226LM with 10/100/1000/2500 Mbps
LAN2: Intel® I226V with 10/100/1000/2500 Mbps
Controller 2 x RJ-45

3
SBC-371
Rear I/O
HDMI 1 x HDMI 2.0b
DisplayPort 1 x DP 1.4++
Ethernet 2 x 2.5 Gigabit LAN
USB
2 x USB 3.2 Gen2
2 x USB 3.2 Gen2x2 (Type-C, 5V/3A, support
DP 1.4a display output)
Internal
Connector
USB 1 x USB 3.2 Gen 2
2 x USB 2.0 (1 x 2.54 pitch header)
COM COM1, COM3, COM4 (RS-232/422/485)
GPIO 4 x GPI, 4 x GPO
LVDS 1 (connector with LVDS/eDP signal, switch by
BIOS)
SATA PWR
Output 1
Speaker
Header 1
Storage
M.2 1 x M.2 (Key M, 2242/2260/2280) with PCIe x4
for SSD
SATA 1 x SATA3 (6Gb/s)
RAID
Intel® VMD RAID 0/1
** supported by PCIE interface
PCIE interface: M.2 Key B + M.2 Key M
Security TPM TPM 2.0 onboard IC
Watchdog
Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, ...255 Sec
Power
Requirements
Input PWR
12~36V DC-In with 4-pin wafer PWR cable or
DC Jack
12V DC-In only (BOM option)
Power On
AT/ATX Supported
-AT: Directly PWR on as power input ready
-ATX: Press button to PWR on aer power input
ready
Environment
Operating
Temp -20ºC - 70ºC
Storage Temp -40ºC - 85ºC
Operating
Humidity 5% - 90%
Storage
Humidity 5% - 90%

4
1.3 Motherboard Layout
Top:
CPU_FAN1
JGPIO1
SPEAKER1
BLT_VOL1
SATA_PWR1
BLT_PWR1
JGPIO_PWR1
1
1
PNL_PWR1
USB 3.2 Gen2
T: USB3_2
B: USB3_TC_2
LAN2
1
DC_IN1
1
HD_AUDIO1
DDR4_B1 (Support DDR4 Only)
DDR4_A1 (Support DDR4 Only)
SBC-371
Industrial
M2_B1
PCIE_ISOLATION1
1
CLRMOS1
1
USB2_5_6
1
1
11
DACC1 CI1SIO_AT1
1
CLRMOS2BLT_PWM2
1
RoHS
M2_M1
M2_E1
COM3COM4
PWR_COM3PWR_COM4
BUZZ2
PWR_COM1
1
COM1
USB3_3
LAN1
USB 3.2 Gen2
T: USB3_1
B: USB3_TC_1
14
20
1
16
11
12
2
15
456
13
18
25 24
28 27
78
23 22
26
17
19
21
29
39
10
30
SATA3_1
BLT_PWM1
1
BKT_PWR1
1
31
1
CI2
1
BAT1
HDMI
DP1
LVDS1
JGPIO_SET1
1
1
111
1
1
1
1
1
1
1
1
1
1
1
1
1
1
HDLED RESET
PLED PWRBTN
PANEL1
1

5
SBC-371
Bottom:
BIOS
ROM
SIM1
32
34
33
35
1
1
PCIE1
ESPI1

6
1 : 3W Audio AMP Output Wafer
2 : PCIE_ISOLATION1
3 : Front Panel Audio Header
4 : DACC1
5 : Chassis Intrusion Headers (CI1, CI2)
6 : ATX/AT Mode Jumper (SIO_AT1)
7 : Clear CMOS Headers (CLRMOS1, CLRMOS2)
8 : CON_LBKLT_CTL Voltage Level (BLT_PWM2)
9 : Panel Power Select (LCD_VCC) (PNL_PWR1)
10 : Backlight & Amp Volume Control (BLT_VOL1)
11 : Inverter Power Control Wafer (BLT_PWR1)
12 : LVDS Panel Connector
13 : Brightness Control Mode (BLT_PWM1)
14 : Backlight Power Select (LCD_BLT_VCC) (BKT_PWR1)
15 : 4-Pin CPU FAN Connector (+12V)
16 : M.2 Key-B Socket (M2_B1)
17 : SATA3 Connector (SATA3_1)
18 : M.2 Key-E Socket (M2_E1)
19 : M.2 Key-M Socket (M2_M1)
20 : GPIO Default Setting (JGPIO_SET1)
21 : SATA Power Output Connector
22 : Digital Input / Output Power Select (JGPIO_PWR1)
23 : Digital Input / Output Pin Header (JGPIO1)
24 : System Panel Header
25 : USB 2.0 Connector (USB2_5_6)
26 : USB 3.2 Gen2 Port (USB3_3)
27 : COM1, 3, 4 Headers (COM1, 3, 4) (RS232/422/485)
28 : Buzzer
29 : Battery Connector
30 : COM Port Pin9 PWR Setting Jumpers
PWR_COM1 (For COM Port1)
PWR_COM3 (For COM Port3)
PWR_COM4 (For COM Port4)
31 : ATX Power Connector (Input 9V-36V (Default); 12V only (by BOM option))
Back Side:
32 : SIM Card Socket (SIM1)
33 : ESPI Connector (ESPI1)
34 : PCIE Connector (PCIE1)
35 : BIOS ROM Socket

7
SBC-371
1.4 I/O Panel
1 USB 3.2 Gen2 Port (USB3_1)
2 USB 3.2 Gen2 Port (USB3_2)
3 DisplayPort (DP1)
4 RJ45 LAN Port (LAN2)*
5 RJ45 LAN Port (LAN1)* (supports vPro)
6 HDMI Port (HDMI)
7 USB 3.2 Gen2x2 Type-C Port (USB3_TC_2)
8 USB 3.2 Gen2x2 Type-C Port (USB3_TC_1)
* ere are two LEDs next to the LAN port. Please refer to the table below for the LAN ports
LED indications.
LAN Ports LED Indications
ACT/LINK
LED
SPEED
LED
LAN Port
13 2
4
56
7
8
Status Description
O 10Mbps/100Mbps connection
Orange 1Gbps connection
Green 2.5Gbps connection
Activity/Link LED SPEED LED
Status Description
O No Link
Blinking Data Activity
On Link

8
1.5 Block Diagram
Intel
Raptor Lake-P
FCBGA 1493
Package(35*24mm)
DDI
LVDS/eDP
LVDS/
By pass mode
eSPI
Type-C
TCP
Rear
2x USB 3.2 Gen2
Connector
2 x USB 3.2 Gen2
RJ45
Connector
2.5G Intel
I226-LM
PCIe x1
Channel A DDR4 3200MHZ SO-DIMM
Line out & Mic in
& Speaker out
Connector
Audio Realtek
ALC256 HDA
Internal
USB 3.2 Gen2
Connector
Internal
2x USB 2.0
Connector
FINTEK
F81966AB-I
COM
232/422/485*3
UART *3
CPU FAN1
DGIO header
FAN
SATA SATA Por t
PCIe Gen3 x1
M.2 Key E
CNVi
USB 2.0
PCIe Gen3 x 1/SATA
M.2 Key B
USB 3.2 Gen2
USB 2.0
PCIe Gen4 x4
M.2 Key M
SIM Card
SIM
SPI INFINEON
SLB9670XQ2.0
2 x USB 2.0
SBC-371
HDMI
Connector
HDMI TCP
Type-C
TCP
TCP
Display
Connector
RJ45
Connector
2.5G Intel
I226-V
PCIe x1
Channel B DDR4 3200MHZ SO-DIMM
USB 3.2 Gen2
USB 2.0
2 x USB 2.0
USB 2.0
USB 2.0
GPIO
GPIO
ITE
IT66318
Chrontel
CH7513A

9
SBC-371
Chapter 2 Installation
is is a 3.5” SBC (5.8-in x 4-in x 0.94-in, 14.7 cm x 10.2 cm x 2.40 cm) form factor mother-
board. Before you install the motherboard, study the conguration of your chassis to ensure
that the motherboard ts into it.
2.1 Screw Holes
Place screws into the holes to secure the motherboard to the chassis.
2.2 Pre-installation Precautions
Take note of the following precautions before you install motherboard components or change
any motherboard settings.
1. Unplug the power cord from the wall socket before touching any component.
2. To avoid damaging the motherboard components due to static electricity, NEVER place
your motherboard directly on the carpet or the like. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle components.
3. Hold components by the edges and do not touch the ICs.
4. Whenever you uninstall any component, place it on a grounded antistatic pad or in the
bag that comes with the component.
5. Heatsink (e thermal solution of whole system needs to be designed additionally.)
Make sure to unplug the power cord before installing or removing the motherboard. Failure to
do so may cause physical injuries to you and damages to motherboard components.
Do not over-tighten the screws! Doing so may damage the motherboard.
Before you install or remove any component, ensure that the power is switched o or the
power cord is detached from the power supply. Failure to do so may cause severe damage to
the motherboard, peripherals, and/or components.

10
2.3 Installation of Memory Modules (SO-DIMM)
SBC-371 provides two 260-pin DDR4 (Double Data Rate 4) SO-DIMM slots, and supports
Dual Channel Memory Technology.
Step 1. Align a SO-DIMM on the slot such that the notch on the SO-DIMM matches the
break on the slot.
Step 2. Firmly insert the SO-DIMM into the slot until the retaining clips at both ends fully
snap back in place and the SO-DIMM is properly seated.
1. e SO-DIMM only ts in one correct orientation. It will cause permanent damage to
the motherboard and the SO-DIMM if you force the SO-DIMM into the slot at incor-
rect orientation.
2. Please do not intermix dierent voltage SO-DIMMs on this motherboard.

11
SBC-371
2.4 Expansion Slots
ere are 1 PCI Express slot, 3 M.2 sockets and 1 SIM socket on this motherboard.
PCIE slot: PCIE1 (PCIE 3.0 x1 slot) is used for PCI Express x1 lane width cards.
* Supports PCIE devices up to 10W
SIM socket: 1 x SIM socket connected to M.2 key B.
Pin Signal Name
20 +12V
19 +12V
18 +12V
17 +12V
16 +12V
15 GND
14 CLKREQ#
13 GND
12 PCIE_RXN
11 PCIE_RXP
10 GND
9PCIE_TXN
8PCIE_TXP
7GND
6CLKN
5CLKP
4GND
3PLT_RST#
2+12V
1+12V

12
M.2 sockets:
1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless.
1 x M.2 (Key B, 3042/3052) with PCIe x1 or SATA3, USB 3.2, USB 2.0 and SIM
for 4G/5G.
1 x M.2 (Key M, 2242/2260/2280) with PCIe x4 for SSD
M.2 Key-E Socket M.2 Key-B Socket M.2 Key-M Socket
(M2_E1) (M2_B1) (M2_M1)
Pin Signal Name Signal Name Pin
2 +3VSB GND 1
4 +3VSB LP+10 3
6 N/C LP-10 5
8 M.2_BT_PCMCLK GND 7
10 M.2_BT_PCMFRM_CRF_
RST_N CNV_WR_D1# 9
12 M.2_BT_PCMIN CNV_WR_D1 11
14 MODEM_CLKREQ_R N/C 13
16 N/C CNV_WR_D0# 15
18 GND CNV_WR_D0 17
20 VRALERT# N/C 19
22 CNV_BRI_RSP CNV_WR_CLK# 21
CNV_WR_CLK 23
32 CNV_RGI_DT
34 CNV_RGI_RSP GND 33
36 CNV_BRI_DT PCH_PE_TXP6 35
38 CL_RST# PCH_PE_TXN6 37
40 CL_DATA GND 39
42 CL_CLK PCH_PE_RXP6 41
44 CNV_PA_BLANKING PCH_PE_RXN6 43
46 CNV_MFUART2_TXD GND 45
48 CNV_MFUART2_RXD PCH_ECLK_WLAN1 47
50 SUS_CLK PCH_ECLK_WLAN1# 49
52 BUF_PLT_RST_N GND 51
54 BT_RF_KILL_N CLKREQ1_WLAN_N 53
56 WIFI_RF_KILL_N N/A 55
58 SMB_DATA_M2 GND 57
60 SMB_CLK_M2 CNV_WT_D1# 59
62 N/C CNV_WT_D1 61
64 N/C GND 63
66 N/C CNV_WT_D0# 65
68 N/C CNV_WT_D0 67
70 N/C GND 69
72 +3VSB CNV_WT_CLK# 71
74 +3VSB CNV_WT_CLK 73
76 N/C GND 75
78 N/C N/C 77
N/C 79
Pin Signal Name Signal Name Pin
2 +3V_M2B CONFIG_3 1
4 +3V_M2B GND 3
6 Full_Card_Power_O# GND 5
8 W_DISABLE1_B# LP+4 7
10 WWAN_LED# LP-4 9
GND 11
20 N/C
22 N/C N/C 21
24 N/C WAKE_ON_WAN# 23
26 W_DISABLE2_B# DPR 25
28 N/C GND 27
30 UIM1_RESET USB3_RX4_N 29
32 UIM1_CLK USB3_RX4_P 31
34 UIM1_DATA GND 33
36 +UIM1_PWR USB3_TX4_N 35
38 N/A USB3_TX4_P 37
40 N/A GND 39
42 N/A PERn0/SATA-B+ 41
44 N/C PERp0/SATA-B- 43
46 N/C GND 45
48 N/C PETn0/SATA-A- 47
50 BUF_PLT_RST# PETp0/SATA-A+ 49
52 PCIECLKRQ4# GND 51
54 N/A M2B_CLK4N 53
56 N/A M2B_CLK4P 55
58 N/A GND 57
60 N/C N/C 59
62 N/C N/C 61
64 N/C N/C 63
66 SIM_DETECT_1 N/C 65
68 SUS_CLK BUF_PLT_RST_N 67
70 +3V_M2B CONFIG_1 69
72 +3V_M2B GND 71
74 +3V_M2B GND 73
76 N/C N/C 75
78 N/C N/C 77
N/C 79
Pin Signal Name Signal Name Pin
2 +3V GND 1
4 +3V GND 3
6 N/C M2M_RXN3 5
8 N/C M2M_RXP3 7
10 M2_LED GND 9
12 +3V M2M_TXN3 11
14 +3V M2M_TXP3 13
16 +3V GND 15
18 +3V M2M_RXN2 17
20 N/C M2M_RXP2 19
22 N/C GND 21
24 N/C M2M_TXN2 23
26 N/C M2M_TXP2 25
28 N/C GND 27
30 N/C M2M_RXN1 29
32 N/C M2M_RXP1 31
34 N/C GND 33
36 N/C M2M_TXN1 35
38 N/C M2M_TXP1 37
40 SMB_CLK_M GND 39
42 SMB_DATA_M M2M_RXN0 41
44 N/C M2M_RXP0 43
46 N/C GND 45
48 N/C M2M_TXN0 47
50 BUF_PLT_RST_N M2M_TXP0 49
52 CLKREQ0_M2M GND 51
54 N/A M2M_CLK0N 53
56 N/C M2M_CLK0P 55
58 N/C GND 57
68 SUS_CLK N/C 67
70 +3V +3V 69
72 +3V GND 71
74 +3V GND 73
76 N/C GND 75
78 N/C N/C 77
N/C 79

13
SBC-371
2.5 Jumpers Setup
The illustration shows how jumpers are setup.
When the jumper cap is placed on pins, the
jumper is “Short.” If no jumper cap is placed
on pins, the jumper is “Open.” The illustration
shows a 3-pin jumper whose pin1 and pin2 are
“Short” when jumper cap is placed on these 2
pins.
Jumper Setting Description
DACC1
(2-pin DACC1)
(see p. 4 No. 4)
Auto clear CMOS when system boot improperly.
Chassis Intrusion Jumpers (CI1, CI2)
(2-pin CI1, CI2)
(see p. 4 No. 5)
is motherboard supports CASE OPEN detection feature that detects if the chassis cover has
been removed. is feature requires a chassis with chassis intrusion detection design.
Open : No ACC
ACC Short : ACC
CI1 :
Open : Normal
Short : Active Case Open
CI2 :
Open : Active Case Open
Short : Normal
ATX/AT Mode Jumper Open : ATX Mode
(2-pin SIO_AT1)
Short : AT Mode
(see p. 4, No. 6)
1 2
1 2
1 2

14
Panel Power Select (LCD_VCC)
(5-pin PNL_PWR1)
(see p. 4 No. 9)
Use this to set up the VDD power of the LVDS connector.
Clear CMOS Jumpers CLRMOS1 :
(3-pin CLRMOS1) 1-2 : Normal (Default)
(see p. 4, No. 7) 2-3 : Clear CMOS
NOTE: CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system param-
eters to default setup, please turn o the computer and unplug the power cord from the power
supply. Aer waiting for 15 seconds, use a jumper cap to short pin2 and pin3 on CLRMOS1
for 5 seconds. However, please do not clear the CMOS right aer you update the BIOS. If you
need to clear the CMOS when you just nish updating the BIOS, you must boot up the system
rst, and then shut it down before you do the clear-CMOS action. Please be noted that the
password, date, and time will be cleared only if the CMOS battery is removed.
(2-pin CLRMOS2) CLRMOS2 :
(see p. 4, No. 7) Open : Normal
Short : Auto Clear CMOS
(Power O)
NOTE: CLRMOS2 allows you to clear the data in CMOS automatically when AC power on.
e data in CMOS includes system setup information such as system password, date, time,
and system setup parameters. To clear and reset the system parameters to default setup, please
turn o the computer and unplug the power cord, then use a jumper cap to short the pins on
CLRMOS2.
CON_LBKLT_CTL Voltage Level
(3-pin BLT_PWM2)
(see p. 4 No. 8)
1-2 : 3V Level
2-3 : 5V Level
1-2: +3V
2-3: +5V
3-4: +5V
4-5: +12V
1 5
1 2
1 2 3
1 2 3

15
SBC-371
Brightness Control Mode
(3-pin BLT_PWM1)
(see p. 4 No. 13)
Please set to 1-2 when adjusting brightness by Brightness Control bar under OS.
Please set to 2-3 when adjusting brightness by BLT_VOL1.
Backlight Power Select Use this to set up the backlight
(LCD_BLT_VCC) power of the LVDS connector.
(3-pin BKT_PWR1) 1-2: +5V
(see p. 4 No. 14) 2-3: +12V
GPIO Default Setting 1-2: Pull-High
(3-pin JGPIO_SET1) 2-3: Pull-Low
(see p. 4 No. 20)
Digital Input / Output Power Select 1-2 : +12V
(3-pin JGPIO_PWR1)
2-3 : +5V
(see p. 4 No. 22)
COM Port Pin9 PWR Setting Jumpers 1-2: +5V
(3-pin PWR_COM1, 4, 3) 2-3: +12V
(see p. 4 No. 30)
1-2 : From eDP PWM to
CON_LBKLT_CTL
2-3 : From LVDS PWM to
CON_LBKLT_CTL
1
2
3
1
2
3
1
2
3
1 2 3
1 2 3