BenQ S80 Setup guide

Release 1.0
Technical Documentation 10/2005
TD_Repair_L2.5L_S80_R1.0.pdf Page 1 of 18
Service Repair Documentation
Level 3 (basic)
S80/82/SFG75
Release Date Department Notes to change
R 1.0 22.12.2005 BenQ CC S CES New document
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Table of Content
1Introduction ...............................................................................................................................3
1.1 PURPOSE ...............................................................................................................................3
1.2 SCOPE ...................................................................................................................................3
1.3 TERMS AND ABBREVIATIONS ...................................................................................................3
2List of available level 3 basic parts..........................................................................................4
3Hardware requirements ............................................................................................................4
4S80 Board layout.......................................................................................................................5
5SIM Card Problems ...................................................................................................................7
6IO Connector Problems ............................................................................................................8
7B to B connector (upper slider part) problems.....................................................................10
8Main keypad illumination problems.......................................................................................11
9Connector Battery...................................................................................................................12
10 Connector RF Internal Antenna .............................................................................................13
11 Connector Mini SD ..................................................................................................................14
12 Connector Vibra ......................................................................................................................15
13 Fuse..........................................................................................................................................16
14 Connector Sidekeys................................................................................................................17
15 Connector MMI ........................................................................................................................18
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1 Introduction
This document describes the performance description for Siemens service partners.
1.1 Purpose
This Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3
basic. The described failures shall be repaired in Siemens authorized local workshops only,
The level 3(former Level 2.5e) partners are obliged to repair level 2 classified boards, up to their
repair level, under consideration of the information given by level 3 repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest S80 Level 2 repair documentation.
It has to be ensured that every repaired mobile Phone is checked according to the latest released
General Test Instruction document (both documents are available in the Technical Support section
of the C-market).
Check at least weekly C-market for updates and consider all S80 related Customer Care Information
S80 Part number on IMEI label:
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules (available in the communication
market), avoid excessive heat.
1.2 Scope
This document is the reference document for all BenQ mobile authorised Service Partners which are
released to repair BenQ mobile phones up to level 2.5 light.
1.3 Terms and Abbreviations
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2 List of available level 3 basic parts
(According to Component Matrix V1.11 - check C-market for updates)
Product ID Order Number Description CM
S80 J200 L50334-Z97-C522
CONNECT SKT60P AXK7L60227
BQ20.L1096.060
S80 U800 L50851-Z1901-A62 ANT 3*5.1*5 56E12 BQ20.M0007.021
S80 J302 L50334-Z97-C523
CONNECTOR DC PWR 2P
BQ20.N2002.021
S80 J301 L50334-Z97-C524
CON BATT3P CBE-4517-2904H
BQ21.N0036.011
S80 U852 L50334-Z97-C525
CONN SPRING SBS23-2K30F00
BQ21.N0045.011
S80 J250 L50334-Z97-C526
CONN I/O 10P ACT/916-2941
BQ2K.N0083.001
S80 J351 L50334-Z97-C527
CONN SIM 6P D2.54 302-368
BQ21.N0050.001
S80 J350 L50334-Z97-C528
CONN MINI SD 9P 500525
BQ21.N0058.011
S80 J201 L50334-Z97-C529 CONN BTB D1.5 18P BQ21.N1003.011
S80 J202 L50315-Z77-C261 SWI VOLUME KEY 5P BQ21.P0004.005
S80 J300 L50158-A185-A16-1
ASS LOUD SPEAK. CONN.
S80_BQ60.H0916.001
S80 J251 L50158-A185-A17-1
ASSY CONN. MIC WHITE
S80_BQ65.G0101.004
S80 MMI
board L50840-L2133-D670 DISDIODE LED BL-HB536G
BQ83.00536.071
S80 MMI
board L50810-U6228-D670 IC PER HALL A3212ELH BQ74.03212.09Y
S80 F250
F300 L50145-A820-Y23 FUSE 1A 24V F0603 1608FF
BQ69.41004.001
S80 U801 L50145-K280-Y415
SWITCH ANT MS-147 HIROSE
BQ69.50017.001
S80 L50851-Z1901-A63
ANT 2.4GHz AT5020-B2R8HAA
BQ69.F0005.021
3 Hardware requirements
(According to General soldering information V1.3 - check C-market for updates)
Jigs, Tools and working materials for all described repairs:
 hot air blower
 soldering gun
 tweezers
 flux
 solder
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4 S80 Board layout
Upper board side
Lower board side
J350:
Mini SD
Connector
J250:
IO Connector
J302:
Connector
DC Power
J201
MMI
Connector
J251:
Micro
p
hone
J200:
Connector
BTB
J351:
SIM Card
U801:
Antenna
Switch
Switch
volume Keys
J301:
Battery
Connector
U800:
Antenna
Contact
Fuse 1A
U852:
Bluetooth
Antenna
Contact
J300:
Vibra Contact
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MMI Board
Disdiode
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5 SIM Card Problems
Fault Symptoms
Customer: GRT:
Handset does not accept SIM card SIM Card Problems
SIM Card Problems
Watch for oxidation and
damaged pads of the
SIM Card reader
Caused by customer
SCRAP - has to be send
separately to WSC
Okay Not
oka
y
Check the status of the
EMI Filter visually
Check the status of the
SIM Card reader visually
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts.
The value must be ~0
Exchange
SIM Card reade
r
Continue with
higher repair level
Exchange the
damaged Filter
Okay
Okay
Okay
Not
oka
y
Not
oka
y
- check for twisted or
bent contacts
- check for dry joints
Back to customer
without repair
Connector SIM Card Reader
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.
E-commerce order number: L50634-Z97-C406
E-commerce order name: CONNECTOR SIM CARD READER R65 (B)
Soldering temperature: ~ 360°C TIP Temp.
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6 IO Connector Problems
Fault Symptoms
Customer: GRT:
Charging Problems No connection to GRT
Problems with external loudspeaker or microphone when using a
car kit
Problems with accessories connected at the IO connector
Connector IO Jack
IO connector Problems
Watch for oxidation and
damaged pads of the
IO connector
Caused by customer
SCRAP - has to be send
separately to WSC
Okay Not
oka
y
Check the dust inside
the IO connector
Check the status of the
IO connector visually
Use the resistor test
function of a multimeter
to check connection
between spring
contacts and soldering
contacts.
The value must be ~0
Exchange
IO connecto
r
Continue with
higher repair level
Clean IO connector
Okay
Okay
Not
oka
y
Not
oka
y
- check for twisted or
bent contacts
- check for dry joints
Back to customer
without repair
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.
E-commerce order number: L50334-Z97-C526
E-commerce order name: CONN I/O 10P ACT/916-2941 BQ2K.N0083.001
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage
47300 Interface/Data Interface/Mechanical Damage
4B100 Interface/Headset Connector/Mechanical Damage
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Important additional soldering hints
The MMC Reader is located on the opposite of the SLIM-Lumberg connector.
Therefore the risk to damage the plastic material of this MMC-Reader is potentially high if excessive
heat is used while removal or soldering of the SLIM-Lumberg connector.
Please follow these instructions:
a) Remove the SLIM-Lumberg connector with a soldering iron and Resolder Wick
b) Clean the Pads afterwards
c) Solder the new connecter by using soldering iron under consideration of the max. allowed
temperature range.
Samples of critical area:
Lock mechanism damaged Lock mechanism OK
Lock mechanism damaged Lock mechanism OK
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7 B to B connector (upper slider part) problems
Fault Symptoms
Customer: GRT:
Upper slider keyboard malfunction Keyboard malfunction
Upper slider keypad illumination does not work Current measured failed
Display problems
B to B connector problems
Watch for oxidation and
damaged pads of the
B to B connector
Caused by customer
SCRAP - has to be send
separately to WSC
Okay
Check the status of the
B to B connector visually
Exchange
B to B
connector
Continue with
higher repair level
Okay
Not
oka
y
Not
oka
y
- check for twisted or
bent contacts
- check for dry joints
Back to customer
without repair
Connector Board to Board
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding
components! Resolder new component afterwards.
E-commerce order number: L50334-Z97-C529
E-commerce order name: CONN BTB D1.5 18P BQ21.N1003.011
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 32100 Keys / Main / No Function
32200 Keys / Main / Reduced Functionality
36000 Keys / Illumination
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