Bungard Splash User manual

splash-and-splashcenter-manual-en Page 1 / 19
Splash / Splash-Center + XL-Versions
Etching machine
Translation of the original instructions
Content
General.......................................................2
Technical Data............................................3
EG-Declaration of Conformity.....................4
Intended Use..............................................5
afety Instructions......................................5
hort instructions........................................6
Composition................................................7
etup..........................................................8
Operation..................................................11
Maintenance/Cleaning..............................14
pare part list...........................................15
Guarantee.................................................19
Disclaimer of Warranty.............................19
Copyright..................................................19
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 2 / 19
General
The plash is a laboratory spray etching machine with integrated rinse. The machine is suitable for
single and double-sided copper-clad base material. This equipment is designed with a special focus
on ergonomic, clean and low carryover etching and rinsing.
Areas of application:
•acid or aqueous-alkaline etching of circuit boards.
•Developing of positive or negative-working photoresists or laminates (aqueous-alkaline process-
able - add anti foam if necessary).
•Alkaline resist stripping.
•In the plash Center all wet process steps of photo positive pcb production can be processed in
a single machine, without having to carry the dripping board to the next machine. In the spray
chamber the pcb is etched, tank 1 and 2 include a cascade rinsing, tank 3 is used for alkaline
developing and in tank 4 the etched circuit board can be tinned.
Features:
•maintenance-free spray etching system with special jet nozzles
•Etch rate of approximately 70 s in 35 micron Cu in fresh, warm FeCL3
•large window to the etching chamber made of transparent PVC
•maximum board size 210 x 300 mm ( plash XL 300 x 400mm)
•Resolution down to 0.1 mm
•suitable for all common acid etchants
•Opening door for etching zone with safety switch
•removable, etching shadow free titanium plate holders, can be locked in drip off position
•easy access to the interior, no tools needed, therefore easy to clean
•heated by quartz heater 1000 W
•thermostatically controlled etchant temperature
•Etching time is set by digital timer 1 s - 99 min., with count-down, end alarm and auto-reset func-
tion
•Overtemperature protection, response temperature 72 ° C
•tand alone unit with integrated static rinse and drip off frame
•plash Center with static rinse and a combined static and spray rinse activated by foot switch
•All tanks can be easily emptied by ball valves
Splash Center:
• A spray etching or spray developing chamber and 4 more treatment tanks
•Cascade rinsing with a static and a combined static / spray rinse; foot switch activated
•Tank 4 with magnetic coupled pump for revolving e.g. stripper
•integrated squeeze-off-dryer
•Collecting tray included in delivery
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 3 / 19
Technical Data
Splash Splash Center
LxWx 60x66x120cm
XL: 80x77x120cm
LxWx 100x67x121 cm
XL: 116x77x120 cm
Weight 35 kg / XL: 40 kg Weight 46 kg / XL: 56 kg
Tank capacity 23 L / XL: 35 L Tank capacity 23 L / XL: 35 L
Power Supply 230 V 50 Hz 1500 W Power Supply 230 V 50 Hz 1500 W
Materials PVC, Titan, PP, Viton Materials PVC, Titan, PP, Viton
Maxi. Board size 210 x 300 mm / XL: 300
x 400 mm
Maxi. Board size 210 x 300 mm / XL: 300
x 400 mm
eater 1000 W Quarz heater eater 1000 W Quarz heater
Water in 3/4” pipe thread
Water out spout ID16 / AD20mm
Tanks
Splash Center Splash Center XL
Nr
.
Name Cont
.
Mixture Cont
.
Mixture
1 pray Chamber 23 L 23 L of liquid ferric-III-chloride
(or if used for developing: 23 L
water and 230 g neg. de-
veloper). With use of ferric-III-
chloride granulees take 13 kg
FE3 and 16.5 L water )
35 L 23 L of liquid ferric-III-chloride
(or if used for developing: 23 L
water and 230 g neg. de-
veloper). With use of ferric-III-
chloride granulees take 13 kg
FE3 and 16.5 L water )
2 tatic Rinse 8 L water (possible 250g RX3) 15 L water (possible 250g RX3)
3 Combined
static/spray rinse
12 L water 22 l water
4 trip tank 8 L 8 L water and 400 g NaOH 15 L 15 L water and 450 g NaOH
(when stripping negative ma-
terial; 30g NaOH per Litre.
tripping of positive material
takes 50 g per Litre; adds up
to 750 g of NaOH)
5 Reserve tank 8 L e.g. f. chem. tinning 15 L e.g. f. chem. tinning
plash / plash XL only pray Chamber + tatic Rinse
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 4 / 19
EG-Declaration of Conformity
EG-Konformitätserklärung/Declaration of Conformity
Hersteller / upplier: Bungard Elektronik GmbH & Co. KG
Rilkestraße 1
51570 Windeck Germany
Bevollmächtigte Person für die Zusammenstellung
der technischen Unterlagen:
Person in charge
Jürgen Bungard, Geschäftsführer /general director
Rilkestraße 1
51570 Windeck Germany
Produkt: pray Etching or Developing Machine plash, plash Center
and XL-Versions
Hiermit erklären wir, dass die oben beschriebenen Maschinen allen einschlägigen Bestimmungen der Maschinen-
richtlinie 2006/42/EG entspricht.
Die oben genannte Maschine erfüllt die Anforderungen der nachfolgend genannten Richtlinien und Normen:
We hereby declare that the machines described above complies with all relevant provisions of the Machinery Direct -
ive 2006/42/EC.
The above machine meets the requirements of the following guidelines and standards:
–Maschinenrichtlinie 2006/42/EG / Machinery Directive 2006/42/EC
–EMV-Richtlinie 2014/30/EG / EMC Directive 2014/10830EC
–Niederspannungsrichtlinie 2014/35/EG / Low Voltage Directive 2014/35/EC
–DIN EN 60204-1 icherheit von Maschinen - Elektrische Ausrüstung von Maschinen - Teil 1: Allge-
meine Anforderungen / afety of machinery - Electrical equipment of machines - Part 1: General
requirements
–DIN EN ISO 14121-1 icherheit von Maschinen - Risikobeurteilung - Teil 1: Leitsätze / afety of
machinery - Risk assessment - Part 1: Principles
–DIN EN ISO 12100-1 icherheit von Maschinen - Allgemeine Gestaltungsleitsätze, Risikobeur-
teilung und Risikominderung / afety of machinery - Basic concepts, risk assessment and risk re-
duction
–DIN EN 55014-1 2012-05 Elektromagnetische Verträglichkeit, Anforderungen an Haushaltsgeräte,
Elektrowerkzeuge und ähnliche Elektrogeräte, Teil 1: töraussendung / Electromagnetic compat-
ibility Requirements for household appliances, electric tools and similar electrical appliances Part
1: Emission
–DIN EN 55014-2-2009-06 Elektromagnetische Verträglichkeit - Anforderungen an Haushaltgeräte,
Elektro-werkzeuge und ähnliche Geräte - Teil 2: törfestigkeit - / Electromagnetic compatibility -
Requirements for household appliances, electric tools and similar apparatus - Part 2: Immunity
–Niederspannungsrichtlinie / Low Voltage Directive 2014/35/EG
–Maschinenrichtlinie / Machinery Directive 2006/42/EG/37/EG
Windeck, 10.1.2021
Jürgen Bungard Geschäftsführer
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 5 / 19
Intended Use
The machines are intended for the chemico-physical treatment of printed circuit boards.
All other application need our written consent or happen on risk of the operator.
The Bungard GmbH & Co. KG accepts no liability for damages incurred in non-authorised use or
application of the machine.
Safety Instructions
Read all safety and operating instructions thoroughly before using the unit for the first time. Keep this
manual at a safe place in case you need to refer to it again in the future.
The machines are not intended to be integrated or connected with other machines or plants. They may be
operated only in appropriate areas and run only by qualified technical personnel. Children and domestic
animals are to be kept away!
Electrical connection
The machine is manufactured using certified parts according to the usual guidelines for electrical security.
This does not release the user however of his duty to exercise diligence while handling electrically oper-
ated devices.
Before all maintenance work on the machine (filling, emptying, cleaning etc.) switch off the machine and
pull power supply plugs.
Pay increased attention to electrical defects because of the conductivity of etching solution containing
metal salts. In this case pull the plug of the machine and replug only after professional repair. This is also
valid for spilled etching agent. As protection against unintentional contact with chemicals, the machines
are equipped with a cover protection (door contact switch). This switch is connected to the timer and stops
the pump. Note: For job safety examine occasionally the correct functioning of the cover protection. Doing
so wear protective clothing and eye protection.
The machine may be switched on only with filled etching agent chamber. The quartz heater must be al-
ways sufficiently covered with etching agent! Uncovered glow bar may cause destruction of machine! The
correct filling is on height of the sieve.
Never run machine without the sieve over heater, thermostat and and thermal fuse.
Chemicals
If the etching agent is prepared by release from salts or mixing li uids, this must always take place out-
side of the machine! Pay attention to the safety references of the chemical manufacturer as well.
Personal protection equipment
While handling etching agents, thus in particular when filling and emptying the machine, wear usual pro-
tection equipment, like apron, gloves and eye protection.
Place of operation
Requirement according to WHG and/or supervision of trade: In order to prevent the penetration of etching
agent into the ground, the machine must be installed a) in a sufficiently large area with chemical-firm, wa-
terproof ground lining (no tiles, no concrete!) or b) in a chemical resistance, waterproof collecting tray (we
offer this as option), which takes up the entire volume of the etching liquid.
We recommend to install an exhaust above the machine for eventual etching steams. This recommenda-
tion is however purely precautionary. Leakage of aggressive steams could not be proven in two independ-
ent investigations. (It escapes water vapour, the salts of the etching agent remains in the solution). An ex-
haust connected firmly to the machine is not possible - risk of damage by negative pressure.
Environmental protection
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 6 / 19
Used up etching agent is special refuse. It must be handed over to certified disposal enterprises under in-
dication of the waste key number. Pay attention to the refuse laws and regulations of your country. We are
not authorized to redemption.
Prior to operating the machine, be informed on all applying environmental protection legislation of your
country. Used etching liquid contains copper and must be treated as special waste. In most countries, this
applies also for the rinse water. We recommend that you collect dirty rinse water and use it to set up fresh
etching liquid or to compensate evaporations losses. In accordance to anti pollution laws, the final clean-
ing of the boards normally requires a cascade rinsing unit, or further wet process steps, like chem. tinning
or resist stripping. Any attempt to neutralize the etchant or the rinse water is NOT recommendable to other
than approved chemists.
If you do not have an appropriate water purification for the rinse water in your facility, we recommend
our waste water processing facility Ionex for this task.
Short instructions
Upon reception examine the machine for any apparent
damage, and if so inform your shipping agent and us
immediately.
Please read the manual carefully and follow the safety
instructions.
Transport the machine to its place by lifting it up at two
legs on each side.
The floor must be level. Underlay the legs if necessary.
Make sure the drain valves are closed.
plash Center: Connect the combined
spray/static rinse inlet to your water supply
and the drain to the sewer system. The inlet
has a ¾ inch screw and the outlet a 20 mm
drain spout. Choose the appropriate hoses
and clamps. Please understand that we can-
not supply these hoses due to different con-
nection standards worldwide.
Mount the sieve into the spray chamber, if ne-
cessary.
For a first test of the machine fill the spray
chamber up to the sieve with water. Fill the
rinse and treatment tank, each with about 10
liters of water.
Connect the machine to the mains (we as-
sume that your electric system is protected by
RCD according to your local regulations).
Turn the main switch and the switch for the
heater. In operation, the switch lights and the
heating element changes to an orange-red
color.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 7 / 19
et the plate holder vertical, select etching time on the timer to approx. 10 seconds and remove
the air from the
pump. Turn the
pump on for about
10 seconds and turn
off again. Repeat
this process if neces-
sary at intervals of
30 seconds, two or
three times. The
pump must not run
dry for long periods.
Check operation of
door safety switch by
lifting the plate
holder. The pump
must turn off, when
the lid is lifted for ap-
prox. 5mm.
Turn off the machine,
let it cool down and
then remove the wa-
ter. Now fill in the
etchant (13.5 kg fer-
ric chloride and 17 l
of water give 24l caustics) or the developer (24 l water and 240 g neg developer). Please prepare
all chemicals outside of machine!
We generally recommend the use of ferric chloride as etchant. The etching of 35μm copper takes
about 1 minute (etch rate of 0.5 micron/s) with fresh and warm ferric chloride. The etching times
are prolonged with increasing copper saturation. At an etching time > 4 minutes, we recommend
to change the etchant.
Composition
The machine body consists of light-grey PVC and transparent PVC at the front. The interior of the
machine is divided into the spray zone and the medium container. They are divided by a removable
and punched sieve.
The two full jet nozzles are arranged diagonally in the spray zone. Their spraying angle and their ar-
rangement ensure that the foremost and back of the entire effective area are shade-free covered.
The cover of the machine is removable and carries the diagonally arranged pcb holder. On the up-
per left the tiltable control console is attached. On the back of the machine is a maintenance-free,
magnet coupled centrifugal pump.
plash:
At the right side of the machine is the rinsing zone.
elect language:
German or English
Welcome creen
Bungard BEL and
software version
Temperature menu
to adjust target
temperature
Wait till target
temperature is
reached or press
“enter” (green)
Menu: tart
countdown or set
timer
et countdown time
tart countdown
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 8 / 19
plash-Center:
Beside the spray chamber there are 4 vertical treatment basins with each having approx. 10 l (16l
XL) content. The first tank from left is the first (static) rinsing zone. Then follows the combined
static/spray rinse with two horizontally attached nozzle tubes, which are activated by single magnetic
valve and foot switch. This rinse has a floor drain and an adjustable overflow.
The third basin serves for developing positive coated plates or for stripping negative laminate. The
liquid herein is rolled over by a small centrifugal pump when the machine is switched on. Note! This
pump may not run dry! Therefore this bath must be always filled at least with water. In this basin is
a lifting device which enables to take out pcbs out of the tank without having contact to the caustic
solution. A sifter prevents parts from getting into the pump.
The drain valves for the etching agent and the rinse water are well accessible below the respective
containers.
In the rinsing zones are short pipes in the floor drains. These are to hold back possible slugde sedi-
ments when emptying. If you want to completely empty the tanks, just pull up the pipes with a plier.
plash-Center: The machine is supplied with a safety catch pan. This tub is so dimensioned that it
can take up the entire liquid in the accident.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 9 / 19
Setup
Take over from the transport agent
After receiving and unpacking, check the machine for possible transport damages. In case of trans -
port damage, please inform your insurance, the transport company and the manufacturer / supplier.
Transport to the place of installation
Only use suitable lifting and transport equipment such as forklifts or pallet lifts. ecure the machine
against sliding / tilting.
Place of installation
The machine must be standing level and around the machine there has to be sufficient space for
operation and maintenance work (approx 1m on all sides). To prevent the penetration of chemicals
into the ground, set up the machine either in a room with solid, waterproof and chemical resistant
floor (no tiles or concrete!) or in a chemical resistant waterproof collection tray which can take the
whole filling volume.
Connections
Connect the overflow of freshwater rinse ( pout D20) with your rinse water treatment. Make a con -
nection to the fresh water inlet (thread 3/4”). Finally connect the machine to the mains (220V /
50Hz). We presuppose an on site fuse protection of the electric circuit.
Test run
To check for leaks and function, first run the machine with water only. Open the lid to the etching
chamber and fill in water from above. The sieve of the etching chamber must be covered with liquid.
After the first filling, the pump must be aired out. Run it for approximately 10 seconds. Repeat this
procedure if necessary after 30 seconds two or three times. The pump may not dry run for longer
time.
Fill the static rinse of the plash so far with water that a plate, which is immersed with the plate
holder, dives in completely.
Fill the two rinsing chambers of the plash-Center with water until the upper board holder bar of the
board holder is covered with water
The tank next to the two rinsing tanks has a centrifugal pump and can be used for developer (pho -
topositive process) or stripper (negative process). The tank on the right you may use for tinning. If
you do not want to use a developer nor tin, please fill the tanks in any case with water. The pump in
the developer basin may not dry run, empty tanks can deform.
Note: The level and temperature must always be monitored by the operator.
Adding the Etching Liquid
The machine can be operated with all usual etching agents. We recommend to use as etching
agents ferric-III-chloride (FeCl3). Using ferric-III-chloride you will obtain a substantially higher etch-
ing achievement and precision than e.g. with sodium persulfate. It can be also used much longer
than most other etching liquids and so meets the requirement to reduce special refuse. You can
purchase ferric-III-chloride from us.
Be cautious with all regeneration-needing etching agents. They can overheat by chemical re-
action. Prepare fresh etching agent outside of the machine. Fill in only completely dissolved
etching agent! If incompletely dissolved etching agent comes into the pump, it can block
and damage the pump.
The etching agent is filled from above into the machine. In order to remove the cover, first carefully
raise the surrounding rim on all sides evenly and remove it. The cover including the pcb holder can
now be lifted.
The filling amounts to approx. 24 l (36 l XL), the correct level is reached when the sieve is covered.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 10 / 19
Etchants
Ferric-III-chloride is very easy to handle, has very good etching quality and broad band of applica-
tion. That is why it is the most popular etching agent for laboratory uses. Ferric-III-chloride has a
high etching speed and ensures perpendicular copper walls after etching. We strongly recommend
to use ferric-III-chloride with our machines.
Mix 800 g Granulate per litre water. This will be 1.4 l of ready solution. Ferric-III-chloride etches
warm and cold. The optimum temperature is approx. 45°C.
With our etching machine JET 34 a fresh solution of ferric-III-chloride etches 35 µm Cu in approx.
70 seconds. With increasing saturation etching time goes up to 3 Min for 35 µm Cu. Under-etching
increases only slightly.
Ferric-III-chloride can take up to 50 g Cu per Litre. In reality you will not reach that limit, because
etching time will take too long. Recognize the saturated solution from its milky look.
Experienced users add small portions of 15% Hydrochloride acid (HCl) to the used solution to pre -
vent copper mud and Ferric stain in the machine. We will supply further information on request.
The used etching agent has to be disposed according to your national legislation.
We do not recommend to neutralize the used etchant, because you have to precisely analyse the
copper concentration after neutralisation. In Germany copper concentration in waste water has to be
less than 0.5 mg Cu/l.
Your Disposal administration will advice you on how to dispose the used etchant. Additional informa -
tion you will find in the material safety data sheet (M D ).
By the way: the brown spots on clothing and items caused by Ferric-III Chloride are easily removed
by our stain remover RX3.
Other Etchants:
Etchants Pros Cons
Ferric-III-Chloride Cheap, high copper capacity (50g/l)
good etching rate (0,5µm/s), stable,
good sharpness, low underetching, not
considered as a dangerous good, stains
easily removable with RX3
sludge formation
Regeneration only difficult
ammonium persulfate „clean“, good etching rate (8-30µm/min)
and copper capacity (30-40 g/l)
Forms complex salts (including double salts of
copper sulphate and ammonium sulphate), dis-
posal 10 times as expensive as Fe3Cl, corrosive
fumes, Crystalline deposits at temperatures be-
low 30 ° C, which are sharp as glass and can
damage pumps and cut moveable machine
parts,
odium persulfate no sludge, suitable for metal, copper
can be deposited electrolytically
Low etch rate (0.1-0.2 micron/s), does not etch in
cold state, decomposes when heated (especially
in the vicinity of the heating rod), catalyst (mer-
cury) is toxic.
copper chloride Regenerable, good capacity (100g / l)
and etching rate (30μm/min)
Bath control is very complicated, fumes are
toxic/aggressive
ammonia suitable for metal resist, good copper
capacity (up to 200g / l)
bath control difficult, exothermic reactions, toxic
fumes, complex salts, crystallization risk
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 11 / 19
Operation
The control panel is protected by an upward tiltable, transparent cover
against contamination. The grasp to open the cover serves at the same time
as actuator for the start-stop tracer of the timer.
Main Switch
The button on the upper left of the control panel switches the electric circuit
for the pump and the heating.
eating
The switch down right on the control panel controls the heating. A thermostat
regulates the temperature on 2 degrees exactly. As additional security
against overheating the machine is equipped with a not resetable temperat-
ure protection in the heater circuit.
Timer features:
a) Adjustable timer up to max. 99 minutes 59 seconds
b) continuously adjustable temperature control from 30-45°C with a visual display of current temperature
and the activity of the heating (displayed "H")
c) audible and visual alarms for over temperature (T > = 55°C)
d) Door witch monitoring with visual display and waiting call
e) elect of language English or German (other languages are possible)
f) automatically stores the last set parameters: language, set temperature, time.
After switching on the mains the welcome screen "Bungard BEL"
appears on the LCD and the software version
Then the temperature control starts, and on the LCD appears the
"current" temperature as well as a H for heating (if the machine
has not yet reached the target temperature) and menu "ok". When
the set temperature is reached, the timer automatically switches to
the main menu. If the user does not want to wait for reaching the
target temperature, he gets directly to the main menu by pressing
the Enter key (green).
In the main menu the LCD shows:
Time: xx: xx (adjusted value) start = ok; Timer = arrow.
Pressing the Enter key the machine starts. Pressing the arrow key
you can enter a new time value.
Control panel with new
timer
Bungard BEL
VERS.:07022012
temperature: 25 °C
menu → ok
timer: 01:30
start=ok timer= ↑
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 12 / 19
If you want to change the time, then press the arrow key. The dis-
play shows Time: 00:00 arrow up/down ok. The cursor jumps to the
first 00:00. Now use the arrow keys to adjust the desired value.
Pressing the Enter key you confirm the value and the cursor
moves to the next digit (10:00). Now enter the remaining digits in
the same way. Pressing "enter" you confirm the setting and you
jump back to the main menu.
If you press Enter in the main menu, the timer starts and the pump
switches on. On the LCD the remaining time, the current temperat-
ure and the activity of the heating (H) are shown.
If you open the lid, the timer and the pump stop. The display shows
„stop → cap open.
If you close the lid again, the job continuous.
When the job is finished, you will hear a beep and on the LCD ap-
pears "done → ok". Pressing the Enter key, you return to the main
menu.
When the temperature of the etchant reaches 55°C (eg by exo-
thermic reaction), an audible alarm sounds and the display shows the
message "Attention temperature too high".
If the temperature is getting too high during the etching process, the
pump will continue to support the cooling.
Now, the operator must take measures to lower the temperature.
As long as the temperature is > 55°C, the alarm remains, and only by
turning off mains the machine can be stopped.
If the temperature falls below the threshold temperature, the alarm
can be cancelled by pressing the Enter key. In stand-by mode (ma-
chine is turned on, but no etching process is taking place) the temperature is still monitored and an aud-
ible and visual alarm is displayed when reaching the threshold temperature of 55°C. The pump will start if
lid is closed and will stop when lid is opened. If the temperature falls below the threshold temperature
and the alarm is cancelled the pump turns off again.
Setting the target temperature: To set the target temperature,
press both arrow keys, during the welcome screen, until the tem-
perature menu appears. Then set the desired temperature with the
arrow keys and press Enter.
timer: 01:30
↓↑ ok
timer: 01:30
temperature: 25°C
STOP → cap open
temperature: 45 °C
done → ok
attention
temp. too high
set temperature
45 °C
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 13 / 19
Setting the language is similar. Press both "C" and the "Enter"
key during the welcome screen until the language menu opens.
Then use the arrow keys to select the desired language and con-
firm with Enter.
Additional protection function: if temperature sensor is not connec-
ted or the wire is interrupted, then an audible alarm can be heard
and a message: Warning: temperature is too high is displayed
on the screen.
Feeding the etching chamber
The machine can take at a time either 1 board of 210 x 300
mm or e.g. 3 boards of 100 x 160 mm. The left side of the
board holder is fixed to the machine's cover. This pivot al-
lows to either put the board holder in it's horizontal operation
position or to put it vertically for feeding/discharging boards.
We have chosen this principle to allow that the liquid can
easily drop off from the boards (saving rinse water) and that
the dropped of liquid immediately returns into the machine.
The board holder has two bars mounted on titanium pins.
They can be adjusted in height and thus allow adaptation to
different board sizes.
One of the bars carries three clamps. These allow to mount the boards to the holder without neces-
sity to slide the entire bars for and back. To feed a board, proceed
as follows: Keep the board with your right hand, insert it into the
clamp(s), keep it there with your left hand and make it snap into
the right bar's PVC teeth. To dismount, proceed in reverse order.
On the surrounding frame the plash-Center has two small pieces
of dark grey PVC in front of the tanks. These provide a stand for
the board holder, so you have both hands free for placing the
PCBs in the holder.
Rinsing - Splash
After retracting the boards from the holder, immerse them into the
rinsing tank and move them slightly for and back. On the upper
right of the rinsing tank, there is a slotted bar. Put the rinsed boards there to allow them to drip off.
We recommend that you wear thin latex gloves when handling the boards. There is space to put the
gloves on the frontal or the right side of the rinsing tank's surrounding.
Rinsing - Splash-Center
The machine provides multiple rinse technique. The first tank is a static rinse that accepts most of
the metal salts sitting on the board after etching. The next tank is a combined static and spray rinse.
Here you immerse the board into the rinse water, then you press the foot switch and while pulling
the PCB upwards, the spray rinse gives it a final cleaning. What you get is a triple rinse in two tanks.
This allows to reach the minimum requirements for environmentally safe rinse techniques: Each
rinse step dilutes the remaining copper concentration by a factor of 10, so the water going through
the overflow is purified by a factor of 1000.
language ↓↑ ok
English
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
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splash-and-splashcenter-manual-en Page 14 / 19
Maintenance/Cleanin
Changing of the etching agent
The etching agent is discharged over a ball valve, which is under the machine body. As described
above, you have access to the etching chamber when you remove the cover. This makes it easy to
remove any sediments manually. If you use ferric-III-chloride and consider the following proposal,
you can change the etching agent without large cleaning expenditure: With increasing saturation fer-
ric-III-chloride tends to deposit surplus cuprous salts as mud. The solution changes its colour from a
initially transparent to a milky green-brown. At this time usually the etching time doubles in compar-
ison to the beginning. If you change the etching agent at this time, then the mud formation can be
stopped and mud already set off will be brought back into solution.
Dismantling
For cleaning and repair works, it may be necessary to dismantle the inner parts of the spray cham -
ber. To do this, follow these steps:
1. Remove the lid frame 4. Dismount the sieve
2. Remove the board
holder from its hinge
5. Discharge the
etching or developing
liquid
3. Lift the lid of the spray
chamber
6. Now you have ac-
cess to e.g. the etch-
ing nozzles adjust-
ment
Cleaning of the machine in use of FeCl3:
Equipment: Apron, eye protector, (Latex) gloves, 2 plastic scrapers, 2 plastic sponges, 2 buckets,
paper cleaning cloths, plastic foil, container from plastic for used etching agent
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
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splash-and-splashcenter-manual-en Page 15 / 19
Chemicals: Hydrochloric acid HCl technically, concentration approx. 15%, quantity approx.: 24 l,
stain remover RX3
Proceed: Cut the plastic foil in the double size of the utility space of the machine. Put on protective
clothing. Discharge etching agents from the machine into suitable container. Take up existing
sludges with scraper mechanically and give it to the etching agent. Lift the machine and set it on the
foil. If you do not have an exhaust move the machine to proper ventilated room or outside.
Fill the machine with 15%iger HCl. Close the cover. Run the machine with heating switched on for
several hours. Repeat if necessary the cleaning run the next day.
To Clean from the outside give warm water into a bucket. Add stain remover on a wet sponge and
use it like abrasive powder. Let the paste act on the surface, if necessary moisten again with
sponge. Repeat this procedure, until the marks are faded. Particularly persistent deposits carefully
dab with HCl. To clear rinses thoroughly wipe of machine with a not dripping sponge and clean this
sponge in a second bucket.
Discharge HCl from the machine and store to re-use it again. Close drain valve. If the machine is
not filled again, Wipe off the inside of the machine beginning from the top and working your way
down. Clean sponge in second buck. Do not touch the uncleaned parts of the machines, wear long
sleeved gloves if necessary. Give the contents of the second bucket to the used up etching agent.
Alternatively clean the machine from the inside by test run with water.
Return the machine to its location. Examine whether the glow bare is intact (do not switch on, only
visual check.) If necessary remove the electric case and pull back the rubber seal of the glow bare
to check for any penetrated liquid. In this case you have to exchange the glow bare. Fill the machine
with water and perform for a test run and then exchange the water with fresh FeCl3.
The hydrochloric acid can be used later, in order to dissolve sludge sediments in etching agent. Give
HCl in portions of approx. 0.5l to the dirtily brown etching agent and let the machine run briefly. Do
this so long, until the solution is to a large extent clear again. But: NEVER give Hydrochloric acid to
fresh ferric iii-chloride ! Dispose possible surplus of HCl with used etching agent.
This guidance represents only the fundamental procedure in standard situations. Mistake and
change reserved. Handling the chemicals takes at one`s own risk. Regard safety regulations!
Against FeCl3 marks on clothes, smooth and porous surfaces we supply a highly effective stain re-
mover on organic basis.
Drain the dirty rinse water from floor drain of the rinsing zone. The waste laws demand economical
handling of rinse water. We advise to collect the water from the first rinse a) to compensate evapor-
ation losses of the etching liquid and b) for new FeCl3 solution! After discharging the water sedi-
ment remains in the basins. Take up mechanically and give these it to the used up etching agent.
Dispose surplus rinse water together with the used up etching agent.
Spare part list
Artikelnr. Langtext Deutsch Langtext Englisch Bild
699300 Kugelhahn DN15 f. Ätzmaschine cog valve DN15 f. etching
machines
699301 Kugelhahn DN25 f. Ätzmaschine cog valve DN25 f. etching
machines
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 16 / 19
699303 Heizung komplett f. Ätzmaschine Complete heater for etching
machine
699304 chalter beleuchtet f.
Ätzmaschine
witch illuminated
699305 Quarzrohr f. Heizung Ätzmaschine quartz tube for heater element
699306 Heizelement 1000W f.
Ätzmaschine
Heater element 1000W f.
etching machine
699615 Thermostat f. Ätzmaschine Thermostat f. Etching machine
699617 Temperatursicherung f.
Ätzmaschine
Thermal fuse for etching m/cs
JET/ PLA H
699616 Timer mit integriertem Thermostat
f. Ätzmaschine Jet/ plash ab
2011/2012
Timer with built-in thermostat
f. Jet/ plash etching machines
later 2011/2012
6000 ensor für Temperatur und Zeit-
steuerung
ensor for temperature and
time controller
6000 Frontplatte Jet, plash, DL Front panel Jet, plash, DL
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
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splash-and-splashcenter-manual-en Page 17 / 19
6000 Plexiglasplatte für Jet und plash plexi cover for the control
panel
690651 Vollkegeldüse f. plash mit tock spray nozzle f. plash with
arm
6000 Vollkegeldüse f. plash spray nozzle f. plash
690652 Ätzmittelpumpe f. PLA H Ätzmittelpumpe f. PLA H
690653 Plattenhalter f. PLA H Board holder f. plash
6000 Plattenhalter plash Oberteil mit
Federbügeln ; Unterteil ohne Fed-
erbügeln inkl. chrauben
Upper/Lowerpart of board
holder plash/ plash-Center.
Upper part with spring clamps,
lower part without spring
clamps
690655 Impeller f. Ätzmittelpumpe
PLA H
impeller for PLA H etchant
pump
690656 Auffangwanne für PLA H,
Format ca.
anti pollution tray for PLA H,
size:
690656 Auffangwanne für PLA H/Jet,
Format ca. 670mmx670m-
mx125mm (außen) ca. 8 kg, ca.
56 L
anti pollution tray for
PLA H/Jet, size: 670m-
mx670mmx125mm, about 8
kg, approx. 56 L
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 18 / 19
690658 Deckel für PLA H top cover for PLA H
690659 Abschlussrahmen für plash ealing Frame for Top
Cover / plash
690670 Keramik Impellerachse für Pumpe
PLA H
ceramic impelleraxis f.
PLA H pump
6000 Deckelschalter Lid safety switch
6000 atz Trockentücher et of drying cloths
6000 Tropftablett Dripping tablet (Center)
6000 Platinenretter pcb-rescuer
6000 iebboden Floor sieve
6000 Abeckplatte Kugelhähne Cover ball valves
6000 Deckel Tank 1 Lid tank 1
6000 Deckel Tank 3+4 Lid tank 3+
6000 Abquetschtrockner queeze off dryer
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]

splash-and-splashcenter-manual-en Page 19 / 19
Guarantee
All machines are submitted before distribution to examination on function and continuous operation
firmness. On the machine we grant a work warranty of 12 months to our customers starting from
purchase date on accuracy in material and processing. We warrant at our choice by exchange of in-
correct parts or by repair of the machine in our house. Old parts change into our possession.
Disclaimer of Warranty
Bungard GmbH & Co.KG reserves the right to change or enhance its machines or machine specifications
according to its judgement, if necessary. Bungard cannot be held responsible to implement aforesaid
changes into machines sold already.
Bungard products and services are liable to the current prices and conditions, which are subject to
change.
The instructions and definitions in this document are also subject to change and mark no assurance on
the part of Bungard.
This manual contains informations of the Bungard Compacta and is the translated English version.
Please regard the “ ales terms and delivery conditions”. These are available after fulfilment of the con-
tract. We don't furnish a guarantee or warranty in cause of damages at material or hurts of people be-
cause of
Incorrect use of the machine
Wrong setup, installing and operating of the machine or incapable service
Use of the machine with defective safety equipment
Non-observance of the service manual in regard to transport, stocking, setup, installation and service of
the machine
Unlicensed modifications at the machine
Incorrect or incomplete repairs
Destructive force effect at the machine in cause of foreign objects or external use of force
Use of non-original spare parts
normal wear parts.
We cannot accept subsequent claims from damage or destruction of work pieces worked on in the ma-
chine, because we have no knowledge or control over the operating conditions at your site. This is valid in
a general manner also for requirements from damage to articles, buildings and persons as well as the en-
vironment.
We do not warrant that the function of the machine will meet the customer's requirements or that the oper-
ation of the machine will to this regard be error free.
In no event will we be liable to the customer for any incidental, consequential, or indirect damages of any
kind, including loss of profit and prosecution for environmental pollution, even if we could have been
aware of the possibility of such damages.
All information was arranged with great care. We reserve ourselves however mistake and technical
changes without previous announcement.
Running the machine in corroding, humid, dusty, extremely hot or explosive atmosphere happens at the
operator's own risk and responsibility.
We explicitly exclude any warranty for damages resulting from running the machine in in corroding, hu -
mid, dusty, extremely hot or explosive atmosphere.
Copyri ht
© 2021 Bungard Elektronik GmbH & Co. KG
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: [phone] - 0, Fax: [phone] - 29, E-mail: [e-mail]