CIS DCC-HD3 Quick start guide

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
3G-SDI/HD-SDI
CMOS Color Camera
Camera Assembly Unit
DCC-HD3
Product Specification
& Operational Manual
CIS Corporation
English

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
1
Table of Contents
PAGE
1. Handling Precautions..................................................................................................................................3
2. Product Outline..........................................................................................................................................3
3. Bundled Items...........................................................................................................................................3
3.1. Standard Bundled items.......................................................................................................................3
3.2. Packaging..........................................................................................................................................4
3.3. Optional Accessories ...........................................................................................................................4
4. Specifications ............................................................................................................................................4
4.1. General Specifications .........................................................................................................................4
5. Parts Name and Functions...........................................................................................................................6
6. External Connector Specifications.................................................................................................................7
6.1. PD-HD1X CN1 (6pins)..........................................................................................................................7
6.2. PD-HD1X CN2 (BNC)...........................................................................................................................7
6.3. PD-VC01 CN4 (4 pins).........................................................................................................................7
6.4. PD-VC01 CN5 φ3.5mm 4 poles (RS-232C) Connector...............................................................................7
7. Guideline for Thermal design.......................................................................................................................8
7.1. Operating temperature of main parts.....................................................................................................8
7.2. How to measure the temperature of the device surface............................................................................8
7.3. <Reference> surface temperature of each device in the CIS chassis (29mm×29mm×77mm).........................9
8. GenLock...................................................................................................................................................9
9. LTC (Longitudinal Time code).......................................................................................................................9
10. Defective Pixel Correction..........................................................................................................................10
10.1. Precautions......................................................................................................................................10
10.2. How to execute “Defective Pixel Correction”..........................................................................................10
11. Serial Communication...............................................................................................................................10
11.1. Serial communication settings.............................................................................................................10
11.2. Command........................................................................................................................................10
11.3. Command List..................................................................................................................................12
11.4. Quick Reference Matrix for Settings.....................................................................................................18
11.4.1 Gain Settings................................................................................................................................18
11.4.2 Shutter Settings............................................................................................................................19
11.4.3 Actual Shutter Values Limited by Video Output Format........................................................................20
12. How to Operate the Camera with OSD Function............................................................................................21
12.1. Switch Operation of OSD Menu by Remote Controller.............................................................................21
12.2. Indication of OSD Menu.....................................................................................................................21
12.3. OSD Menu.......................................................................................................................................21
13. Factory Settings.......................................................................................................................................27
14. Dimensions .............................................................................................................................................28
15. Cases for Indemnity (Limited Warranty) ......................................................................................................29
16. CMOS Pixel Defect....................................................................................................................................29

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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17. Product Support.......................................................................................................................................29

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
3
1. Handling Precautions
The camera module must not be used for any nuclear equipments or aerospace equipments with which
mechanical failure or malfunction could result in serious bodily injury or loss of human life. Our warranty does
not apply to damages or defects caused by irregular and/or abnormal use of the product.
Please observe all warnings and cautions stated below.
Our warranty does not apply to damages or malfunctions caused by neglecting these precautions.
Do not use or store the camera module in the dusty or humid places.
Do not apply excessive force or static electricity that could damage the camera module.
Do not shoot direct images that are extremely bright (e.g., light source, sun, etc). When the camera is not
in use, please put the protection cap on.
Follow the instructions in Chapter 6, “External Connector Pin Assignment” for connecting the camera
module. Improper connection may cause damages not only to the camera module but also to the
connected devices.
Confirm the mutual ground potential carefully and then connect the camera module to monitors or
computers. AC leaks from the connected devices may cause damages or destroy the camera module.
Do not apply excessive voltage. (Use only the specified voltage.) Unstable or improper power supply
voltage may cause damages or malfunction of the camera assembly.
DCC-HD3 is an assembly unit for camera modules. It is designed based on the premise of embedding it in
a camera casing. Therefore, appropriate heat dissipation needs to be fully considered when embedding it.
Assembly without appropriate heat dissipation may cause damages or malfunction.
2. Product Outline
DCC-HD3 is provided as an assembly unit that is a part of CIS full HD color camera module with Gen Lock
function, VCC-HD3, utilizing a 1/3 type MOS image sensor.
Video output, 108060p/59.94p/50p (3G-SDI), 1080 60i/59.94i/50i/30p/29.97p/25p/24p/23.97p (HD-SDI),
and 720 60p/59.94p/50p (HD-SDI) are corresponded.
Features
□Features CIS original ISP, state-of-the-art “ClairvuTM” for superb imaging quality.
□Sensor board 25.4mm×25.4mm, Main board 25.4mm×38mm, Driver board 25.4mm×43mm.
□GenLock (3-value analog signals or Black burst )
□Camera can be controlled via RS-232C.
□LTC (Longitudinal Time code)
□With connecting the optional remote controller, camera settings can be set on OSD (On Screen
Display).
3. Bundled Items
3.1. Standard Bundled items
□Sensor board (BI-HD3), Main board (MB-HD2X), Driver board (PD-HD1X)
*Boards are connected with FPC cable (51 pins) at the time of delivery.
□6 pins connector (power, external trigger, and LTC)
□4 pins connector (DC IRIS)

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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3.2. Packaging
□Individual carton
□Master carton (10pcs/carton)
*Master carton may change depends on the quantity to be shipped per delivery.
3.3. Optional Accessories
□RU-100 remote controller (OSC Control, RS-232 ―USB conversion)
4. Specifications
4.1. General Specifications
Note: The specification below is based on a chassis typed camera, VCC-HD1X.
(1) Image Sensor
Device Type 1/1.8 type CMOS sensor (color)
Effective Pixel Numbers 2064(H) × 1544(V)
Unit Cell Size 3.45μm(H) ×3.45μm(V)
Chip Size 7.121mm(H) × 5.327mm(V) (Entire pixels area)
6.624mm(H) × 3.726mm(V) (Video output area)
(2) Resolution 1080p,1080i : 1920(H) ×1080(V)
720p : 1280(H) × 720(V)
(3) Aspect Ratio 16 : 9
(4) Video Output Format 1920 x 1080p @60fps(Level A) 3G-SDI
1920 x 1080p @60fps(Level B) 3G-SDI
1920 x 1080p @59.94fps(Level A) 3G-SDI
1920 x 1080p @59.94fps(Level B) 3G-SDI
1920 x 1080p @50fps(Level A) 3G-SDI
1920 x 1080p @50fps(Level B) 3G-SDI
1920 x 1080i @60fps HD-SDI
1920 x 1080i @59.94fps HD-SDI
1920 x 1080i @50fps HD-SDI
1920 x 1080ｐ@30fps HD-SDI
1920 x 1080ｐ@29.97fps HD-SDI
1920 x 1080ｐ@25fps HD-SDI
1920 x 1080ｐ@24fps HD-SDI
1920 x 1080ｐ@23.97fps HD-SDI
1280 x 720p @60fps HD-SDI
1280 x 720p @59.94fps HD-SDI
1280 x 720p @50fps HD-SDI
(5) Sync. System Internal /External sync. system
(6) Video Output Standard 3G-SDI/HD-SDI : Y/Pb/Pr (4:2:2 10bit) BNC 75Ω termination
(7) Sensitivity F5.6 2000lx
(8) Minimum illumination F1.4 3.5lx
Conditions : VIDEO 50%, AGC 30dB, Electric Shutter OFF
(9) Power Requirements DC+9～+15V
(10) Power Consumption (typ) 4.0 W at DC+12V IN
(11) Dimensions Refer to overall dimension drawing.
(12) Weight Approx. 26g
(13) Lens Mount None. OLPF and a filter on a sensor board are attached at the time of delivery.
(14) Gain Setting AGC (Max. Gain : 0dB~48dB) ※Some noises might be
noticeable when
gain setting is set to high.
MANUAL: 0dB~48dB

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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(15)
Shutter Speed Variable
Range MANUAL: 1/13600s～1/25s *Shutter speed slower than 1/60s will be limited by the frame rate corresponding to the video
output format.
AUTO: 1/13600s～1/25s (Upper limit and lower limit can be set.)
*Same as MANUAL, shutter speed slower than 1/60s will be limited by the frame rate
corresponding to the video output format.
(16) White Balance Adjustment
Range
AUTO, AUTO (Outdoor), ATW, 7 different Preset, MANUAL, User Preset 1~5, and One Push
Preset:
Daylight (5500K), Cloudy (6500K), Shade (8000K), Tungsten (3200K), Fluorescent (White),
Fluorescent (Neutral White), Fluorescent (Daylight)
(17) AE Photometric System Average/Center-Weighted/Spot/Backlight Compensation
(18) Flicker Cancel ON,OFF(typ.) *Valid when 60fps,59.94fps,30fps,29.97fps
(19) Edge Enhancement OFF, 1~7 (typ. 3)
(20) Color Correction Standard, Fluorescent Light, Tungsten Lamp
(21) Color Saturation Adjustment 0% (B/W)~100% (typ.)~200%
(22) Color Compression OFF, 1~7 (typ. 5)
(23) Noise Reduction ON, OFF
(24) Contrast / D range Contrast-2, Contrast-1, Standard, Contrast+1, Contrast+2, D-range Extension
(25) Master Pedestal -100 ~ 0 ~ +100
(26) Pedestal (R, G, B) RGB: -100 ~ 0 (typ.) ~ +100 each
(27) Color Balance RGB: 50 ~ 100 (typ.) ~ 150 each
(28) Pixel Defect (White spot)
Correction Corrected at factory setting.
(29) LTC OFF, ON. The external SMPTE Time code can be input to LTC IN terminal (internal self-running
time code is resettable).
(30) Preset (Camera settings) 1, 2, 3, and 4 (4 presets can be set.)
(31) DC IRIS output Auto/Open Selectable. Can be used with electric shutter (With priority to electric shutter).
(32) Remote Control Operation The camera can be controlled via RS-232C communications with φ3.5 plug (4poles). Camera
settings can be controlled by control software via PC. With connecting to the optional remote
controller, camera settings can be set on OSD (On Screen Display).
(33) Safety/Quality standards UL: Conform to UL Standard including materials and others.
RoHS: Conform to RoHS
CE and FCC are acquired as VCC-HD3 (chassis typed camera).
(34) Durability Vibration Acceleration 98m/s2 (10G)
Frequency
20～200 Hz
Direction X,Y, and Z, 3 directions
Testing time 120min for each direction
Shock No malfunction shall be occurred with 980m/s2(100G) for ±X,±Y, and ±Z,
6 directions.
(35) Operation environment Performance
guaranteed 0 ~ + 40℃ Humidity 20 ~ 80%RH with no condensation
Operation
guaranteed -5 ~ +45℃Humidity 20 ~ 80%RH with no condensation
※Performance guaranteed: All the specifications specified in this manual is guaranteed under
performance guaranteed temperature.
※Operation guaranteed: All the camera functions operate normally under operation guaranteed
temperature.
(36) Storage Environment Storage Temperature: -25 ~ + 60℃, Humidity: 20 ~ 80%RH with no condensation.
(*1) Applied when embedded in VCC-HD3, chassis typed camera.

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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<3G-SDI output Level A and Level B>
A difference between Level A and Level B is a way of mapping Y signal and Cb/Cr signal onto 3G-SDI standard signal. The
difference does not affect the resolution of the video signal. Some 3G-SDI receivers correspond to either Level A or B,
whereas other receivers correspond to both Levels, so please set the camera mode to match your 3G-SDI receiver.
5. Parts Name and Functions
1. Sensor board (BI-HD3)
OLPF and a filter case are attached to the sensor board.
Protect the OLPF from dusts.
It has the same serial number as the one on the main board
2. Main board (MB-HD2X)
On-board FPGA and CPU are mainly on this board.
It has the same serial number as the one on the sensor board.
3. Driver board (PD-HD1X)
On-board 3G-SDI, HD-SDI drive, and power circuit are mainly on this board.
It has the same serial number as the one on the sensor board.
4. FPC cables (51 pins)
FPC cables which connect each boards.
Boards are connected at the time of delivery.
The sensor board and the main board should be paired up because the correction data of the sensor is saved
in the main board.
5. Power connector (6 pins)
This connector is for power input (DC+12V), external sync, and LTC signal input..
Use the bundled 6pins cable to connect.
6. 3G-SDI/HD-SDI output connector (BNC)
This connector is for 3G-SDI/HD-SDI video-out signals.
Connect to a 3G-SDI/HD-SDI monitor and others using a BNC cable.
7. DC IRIS LENS connector (4 pins)
This connector is for DC IRIS LENS signals.
Use the bundled 4pins cable to connect to the DC IRIS LENS. No connection is needed when DC IRIS is not
in use.
8. RS-232C I/F jack. (φ3.5mm 4pins)
This jack is for RS-232C signals.
Use a 4 pins plug of your own to connect to the RS-232C signals. (Please be noted no 4 pins plug is bundled.)
With connecting to the optional remote controller, OSD (On Screen Display) operation will be enabled.
BI-HD1X Board
MB-HD1X Board
PD-HD1X Board
OLP F
Filter Case
CN2
CN1CN4 CN5
1
2
3
4
6
57
CN1
CN1 CN2
CN3
8

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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6. External Connector Specifications
6.1. PD-HD1X CN1 (6pins)
6.2. PD-HD1X CN2 (BNC)
6.3. PD-VC01 CN4 (4 pins)
6.4. PD-VC01 CN5 φ3.5mm 4 poles (RS-232C) Connector
Model: BM6B-SRSS-TB (JST)
Pin No.
1 Power IN DC+12V
2 GND
3 N.C.
4 EXT_SYNC IN
5 LTC IN
6 GND
Model: BCJ-BPLHA (CANARE)
Pin No.
1 3G-SDI/HD-SDI output
2 GND
Model: BM4B-SRSS-TB (JST)
Pin No.
1 IRIS_DUMP+
2 IRIS_DUMP-
3 IRIS_DRIVE-
4 IRIS_DRIVE+
Model: MJ
Pin No.
1 Power(+5V) *For optional
2 TXD(Camera)
3 RXD(Camera)
4 GND
16
1
2
1 4
1
2
3
4

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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Connection of φ3.5 (4 poles) Connector (RS-232C)
7. Guideline for Thermal design
This camera module is designed for embedding into a chassis. Therefore, operating the board itself without heat dissipation
will exceed the tolerance of the operation temperature of component parts. The operation temperature will reach 130℃
when operating the FPGA without casing. Never leave it operating without casing as it may cause burn injury and damages
to the camera. Please refer to the guideline below for designing heat dissipation.
7.1. Operating temperature of main parts
Board (ref) Data sheet value Upper limit temperature of
IC package surface
Image sensor BI-HD3(IC1) ta=75℃85℃
FPGA MB-HD2X(IC1) tj=85℃80℃
CPU MB-HD2X(IC4) ta=85℃95℃
SDI IC PD-HD1X(IC3) ta=85℃95℃
The upper limit temperature of the package is ta+10℃for parts defined as “ta” on a data sheet.
As the data sheet value of FPGA is defined as “tj,” the upper limit temperature of FPGA shall be 80℃based on the
thermal conductivity of the package and power consumption.
Please dissipate heat so that the surface temperature of the IC package on a board in the chassis will not exceed the
upper limit temperature. Please measure the temperature in the usage environment.
Give the first priority of heat dissipation to the FPGA because it is the major heat source.
7.2. How to measure the temperature of the device surface
Tape a thermocouple on the device surface, make a slit in the heat conducting sheet, and then make the heat-sink be
appressed onto it to measure temperature.
(E.g.：Temperature measurement of the FPGA surface)
N.C.
RXD
T XD
GND
123 4
1
2
3
4
5
6
7
8
9
9pin D-Sub(female)
RXD
T XD
GND
1
2
3
4
N.C.
1
2
3 4
PC

DCC-HD3 Rev. 905-0118-00
©2017 CIS Corporation. All rights reserved.
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7.3. <Reference> surface temperature of each device in the CIS chassis (29mm×29mm×77mm)
Ambient
temperature 25℃40℃45℃
Image sensor 58 73 78
FPGA 55.7 70.7 75.7
CPU 51.7 66.7 71.7
SDI IC 55.1 70.1 75.1
8. GenLock
Input analog external sync signals (black burst or 3-value SYNC) to the EXT SYNC IN terminal of 6pins connector to
enable Gen Lock function.
The external sync signals to be supplied shall depend on its video output format, therefore, please refer to the chart
below and input appropriate signals.
EXT SYNC IN
CAMERA FORMAT
1080p60A 1080i60 720p60 1080p30
1080p59.9A NTSC 1080i59.9 720p59.9 1080p29.9
1080p50A PAL 1080i50 720p50 1080p25
1080p60B 1080i60 720p60 1080p30
1080p59.9B NTSC 1080i59.9 720p59.9 1080p29.9
1080p50B PAL 1080i50 720p50 1080p25
1080i60 1080i60 720p60 1080p30
1080i59.94 NTSC 1080i59.9 720p59.9 1080p29.9
1080i50 PAL 1080i50 720p50 1080p25
1080p30 1080i60 720p60 1080p30
1080p29.9 NTSC 1080i59.9 720p59.9 1080p29.9
1080p25 PAL 1080i50 720p50 1080p25
1080p24 1080p24
1080p23 1080p23.9
720p60 1080i60 720p60 1080p30
720p59.9 NTSC 1080i59.9 720p59.9 1080p29.9
720p50 PAL 1080i50 720p50 1080p25
・Input Black Burst signals for NTSC/PAL signal.
・Input 3-value SYNC signals for other than NTSC/PAL signal.
・EXT SYNC IN is terminated with 75Ω. (It becomes high impedance when camera power is OFF).
・When the external signals specified above are input, the camera becomes external sync mode automatically.
・When no external signal is input, the camera operates in internal sync mode.
・The image may be disturbed right after the external signal is input, but this is not malfunction.
・When a signal other than specified above combination is input to the EXT SYNC IN terminal, the image might be
disturbed or no image might be output.
9. LTC (Longitudinal Time code)
Time code can be inserted into 3G/HD SDI signals.
Input LTC signals (time code) to the LTC IN terminal of the 6pins connector to insert external time code.
And, when no signal is input into the LTC IN terminal, internal time code can be inserted.
Internal time code starts with 00:00:00. 00 when power is ON, and when any signals are input into the LTC IN terminal,
it will be switched to the external time code.
With this situation, if no signal is input into the LTC IN terminal, it starts self-running from the set time code.
Signal Format: SMPTE Time code Signal Level: 0.5 ~ 2[Vp-p]