Cypress Semiconductor CY7C1020BN User manual

32K x 16 Static RAM
CY7C1020BN
Cypress Semiconductor Corporation • 198ChampionCourt • San Jose,CA 95134-1709 • 408-943-2600
Document #: 001-06443 Rev. ** Revised February 1, 2006
Features
•Highspeed
—t
AA = 12, 15 ns
• CMOS for optimum speed/power
• Low active power
— 825 mW (max.)
• Low CMOS standby power (L version only)
— 2.75 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in 44-pin TSOP II and 400-mil SOJ
Functional Description
The CY7C1020BN is a high-performance CMOS static RAM
organized as 32,768 words by 16 bits. This device has an
automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9through I/O16) is written into the location
specified on the address pins (A0through A15).
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O1to I/O8. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O9to I/O16. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O1through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
aredisabled(BHE,BLEHIGH), orduring awrite operation(CE
LOW, and WE LOW).
The CY7C1020BN is available in standard 44-pin TSOP Type
II and 400-mil-wide SOJ packages.
WE
Logic Block Diagram Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
14 31
32
36
35
34
33
37
40
39
38
Top View
SOJ / TSOP II
12
13
41
44
43
42
16
15 29
30
VCC
A15
A14
A13
A12
NC
NC
A3
OE
VSS
A5
I/O16
A2
CE
I/O3
I/O1
I/O2
BHE
NC
A1
A0
18
17
20
19
I/O4
27
28
25
26
22
21 23
24 NC
VSS
I/O7
I/O5
I/O6
I/O8
A6
A7
BLE
VCC
I/O15
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
A8
A9
A10
A11
32K x 16
RAM Array I/O1–I/O8
ROW DECODER
A7
A6
A5
A4
A3
A0
COLUMN DECODER
A9
A10 A11 A12
A13 A14
SENSE AMPS
DATA IN DRIVERS
OE
A2
A1
I/O9–I/O16
CE
WE
BLE
BHE
A8
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 2 of 8
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on VCC to Relative GND[1] ....–0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[1] ......................................–0.5V to VCC+0.5V
DC Input Voltage[1]...................................–0.5V to VCC+0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.....................................................>200 mA
Selection Guide
7C1020BN-12 7C1020BN-15
Maximum Access Time (ns) 12 15
Maximum Operating Current (mA) 140 130
Maximum CMOS Standby Current (mA) 3 3
L0.5 0.5
Operating Range
Range Ambient Temperature[2] VCC
Commercial 0×C to +70×C 5V ± 10%
Industrial –40×C to +85×C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions 7C1020BN-12 7C1020BN-15 UnitMin. Max. Min. Max.
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 0.4 V
VIH Input HIGH Voltage 2.2 6.0 2.2 6.0 V
VIL Input LOW Voltage[1] –0.5 0.8 –0.5 0.8 V
IIX Input Load Current GND < VI< VCC –1 +1 –1 +1 µA
IOZ Output Leakage Current GND < VI <VCC, Output Disabled –1 +1 –1 +1 µA
IOS Output Short Circuit Current[3] VCC = Max., VOUT = GND –300 –300 mA
ICC VCC Operating Supply Current VCC =Max.,IOUT =0mA,f=fMAX =1/tRC 140 130 mA
ISB1 Automatic CE Power-Down
Current—TTL Inputs Max. VCC, CE > VIH
VIN > VIH or VIN < VIL, f = fMAX 20 20 mA
ISB2 Automatic CE Power-Down
Current—CMOS Inputs Max. VCC, CE > VCC – 0.3V,
VIN > VCC – 0.3V, or VIN < 0.3V,
f = 0
3 3 mA
L0.5 0.5 mA
Capacitance[4]
Parameter Description Test Conditions Max. Unit
CIN Input Capacitance TA= 25°C, f = 1 MHz,
VCC = 5.0V 8pF
COUT Output Capacitance 8pF
Notes:
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. TAis the case temperature.
3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 3 of 8
AC Test Loads and Waveforms
Switching Characteristics[5] Over the Operating Range
Parameter Description
7C1020BN-12 7C1020BN-15
UnitMin. Max. Min. Max.
Read Cycle
tRC Read Cycle Time 12 15 ns
tAA Address to Data Valid 12 15 ns
tOHA Data Hold from Address Change 3 3 ns
tACE CE LOW to Data Valid 12 15 ns
tDOE OE LOW to Data Valid 6 7 ns
tLZOE OE LOW to Low Z[6] 0 0 ns
tHZOE OE HIGH to High Z[6, 7] 6 7 ns
tLZCE CE LOW to Low Z[6] 3 3 ns
tHZCE CE HIGH to High Z[6, 7] 6 7 ns
tPU CE LOW to Power-Up 0 0 ns
tPD CE HIGH to Power-Down 12 15 ns
tDBE Byte Enable to Data Valid 6 7 ns
tLZBE Byte Enable to Low Z 0 0 ns
tHZBE Byte Disable to High Z 6 7 ns
Write Cycle[8]
tWC Write Cycle Time 12 15 ns
tSCE CE LOW to Write End 910 ns
tAW Address Set-Up to Write End 810 ns
tHA Address Hold from Write End 0 0 ns
tSA Address Set-Up to Write Start 0 0 ns
tPWE WE Pulse Width 810 ns
tSD Data Set-Up to Write End 6 8 ns
tHD Data Hold from Write End 0 0 ns
tLZWE WE HIGH to Low Z[6] 3 3 ns
tHZWE WE LOW to High Z[6, 7] 6 7 ns
tBW Byte Enable to End of Write 8 9 ns
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
7. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state
voltage.
8. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate
a write, and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal
that terminates the write.
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
5V
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
5V
OUTPUT
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R 481ΩR 481Ω
R2
255ΩR2 255Ω
167 Equivalent to: THÉVENIN
EQUIVALENT 1.73V
30 pF
Rise Time: 1 V/ns Fall Time: 1 V/ns
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 4 of 8
Switching Waveforms
Read Cycle No. 1[9, 10]
Read Cycle No. 2 (OE Controlled)[10, 11]
Notes:
9. Device is continuously selected. OE, CE, BHE and/or BHE = VIL.
10.WE is HIGH for read cycle.
11.Address valid prior to or coincident with CE transition LOW.
PREVIOUS DATA VALID DATA VALID
tRC
tAA
tOHA
ADDRESS
DATA OUT
50%
50%
DATA VALID
tRC
tACE
tDOE
tLZOE
tLZCE
tPU
HIGH IMPEDANCE
tHZOE
tHZBE
tPD
HIGH
OE
CE
ICC
ISB
IMPEDANCE
ADDRESS
DATA OUT
VCC
SUPPLY
tDBE
tLZBE
tHZCE
BHE,BLE
CURRENT
ICC
ISB
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 5 of 8
Write Cycle No. 1 (CE Controlled)[12, 13]
Write Cycle No. 2 (BLE or BHE Controlled)
Notes:
12.Data I/O is high impedance if OE or BHE and/or BLE= VIH.
13.If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Switching Waveforms (continued)
tHD
tSD
tSCE tSA
tHA
tAW
tPWE
tWC
BW
DATA I/O
ADDRESS
CE
WE
BHE,BLE
t
tHD
tSD
tBW tSA
tHA
tAW
tPWE
tWC
tSCE
DATA I/O
ADDRESS
BHE,BLE
WE
CE
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 6 of 8
Write Cycle No. 3 (WE Controlled, OE LOW)
Truth Table
CE OE WE BLE BHE I/O1–I/O8I/O9–I/O16 Mode Power
H X X X X High Z High Z Power-Down Standby (ISB)
L L H L L Data Out Data Out Read – All bits Active (ICC)
L H Data Out High Z Read – Lower bits only Active (ICC)
H L High Z Data Out Read – Upper bits only Active (ICC)
L X L L L Data In Data In Write – All bits Active (ICC)
L H Data In High Z Write – Lower bits only Active (ICC)
H L High Z Data In Write – Upper bits only Active (ICC)
L H H X X High Z High Z Selected, Outputs Disabled Active (ICC)
L X X H H High Z High Z Selected, Outputs Disabled Active (ICC)
Ordering Information
Speed
(ns) Ordering Code Package Diagram Package Type Operating Range
12 CY7C1020BN-12VC 51-85082 44-Lead (400-Mil) Molded SOJ Commercial
CY7C1020BN-12VXC 51-85082 44-Lead (400-Mil) Molded SOJ (Pb-free) Commercial
CY7C1020BN-12ZC 51-85087 44-pin TSOP Type II Commercial
CY7C1020BN-12ZXC 51-85087 44-pin TSOP Type II (Pb-free) Commercial
15 CY7C1020BN-15ZC 51-85087 44-pin TSOP Type II Commercial
CY7C1020BN-15ZXC 51-85087 44-pin TSOP Type II (Pb-free) Commercial
Please contact local sales representative regarding availability of these parts.
Switching Waveforms (continued)
tHD
tSD
tSCE
tHA
tAW
tPWE
tWC
tBW
DATA I/O
ADDRESS
CE
WE
BHE,BLE
tSA
tLZWE
tHZWE
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 7 of 8
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
All product and company names mentioned in this document may be the trademarks of their respective holders.
Package Diagrams
51-85082-*B
44-Lead (400-Mil) Molded SOJ (51-85082)
51-85087-*A
44-Pin TSOP II (51-85087)
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 8 of 8
Document History Page
Document Title: CY7C1020BN 32K x 16 Static RAM
Document #: 001-06443
REV. ECN NO. Issue Date Orig. of Change Description of Change
** 426812 See ECN NXR New Data Sheet
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