Dalsa Genie Nano-CXP Series User manual

Genie Nano-CXP Series™
Camera User’s Manual
CoaXPress™ Monochrome and Color Area Scan
February 14, 2020
Rev: 0002
P/N: G3-CX0M-USR00
www.teledynedalsa.com
sensors | cameras | frame grabbers | processors | software | vision solutions

Notice
© 2019-2020 Teledyne Digital Imaging Inc.
All information provided in this manual is believed to be accurate and reliable. No responsibility is
assumed by TeledyneDALSA forits use. Teledyne DALSA reservesthe right to make changesto
this information without notice.Reproduction of this manual in whole or in part, by any means, is
prohibited without priorpermission having been obtained fromTeledyne DALSA.
Microsoft and Windows are registered trademarks of Microsoft Corporation in the United States and
othercountries. Windows,Windows 10 are trademarks of Microsoft Corporation.
All othertrademarks or intellectualpropertymentioned hereinbelong to theirrespective owners.
Document Date: February 14, 2020
Document Number: G3-CX0M-USR00
FCC Statements
Caution: The user that changesor modifications not expressly approved by the partyresponsible
for compliance could void the user's authority to operatethe equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to Part 15of the FCC Rules. These limits are designedto provide reasonable
protectionagainst harmful interferencewhen the equipment is operated in a commercial
environment. This equipment generates,uses, and can radiateradio frequency energyand, if not
installed and used in accordance with theinstruction manual, may cause harmful interferenceto
radio communications. Operation of this equipment in a residential area is likely to cause harmful
interference inwhichcasethe userwill be required to correct theinterferenceat his own expense.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:(1) this device may not causeharmful interference, and (2) this device must accept any
interference received,including interference that may cause undesired operation.
About Teledyne DALSA, a business unit of Teledyne Digital Imaging Inc.
Teledyne DALSA is an international high performance semiconductorand Electronics Company that
designs, develops,manufactures, and markets digital imaging products and solutions, in addition
to providing wafer foundry services.
Teledyne DALSA DigitalImaging offers the widest range of machine vision components inthe
world. From industry-leading image sensors through powerfulandsophisticated cameras, frame
grabbers, vision processors and software to easy-to-use vision appliances and customvision
modules.

Genie Nano-CXP Series™ Contents
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1
Contents
NANO-CXP SERIES OVERVIEW 5
DESCRIPTION 5
Genie Nano-CXP Overview 5
Camera Firmware 5
MODEL PART NUMBERS 6
Monochrome Cameras 6
Color Cameras 6
Accessories 7
HARDWARE AND SOFTWAR E ENVIRONMENTS 8
Mounting 8
Frame Grabbers and Cabling 8
Software Platforms 8
Development Software for Camera Control 8
NANO-CXP SPECIFICATIONS 9
COMMON SPECIFICATIONS 9
Sensor Cosmet ic Spec ificat ions 10
Dynamic Range & Signal to Noise Ratio Test Conditions 11
EMI, Shock and Vibration Certifications 11
Mean Time between Failure (MTBF) 12
NANO-CXP SPECIFICATIONS:M5100, C5100, M4090, C4090 13
Spectral Response 14
Defective Pixel Specification for Models 5100/4090 15
Firmware Files for These Models 16
NANO-CXP INSTALLATION 17
QUICK START (USING A TELEDYNE DALSA FRAME GRABBER) 17
GENERAL INSTALLATION OVER VI EW 17
Camera Firmware Updates 17
THE CAM ER A WOR KS —NOW WHAT 18
NANO-CXP CONNECTORS AND STATUS LED OVERVIEW 18
Connectors 18
LED Indicators 19
Camera Status LED Indicator 19
PREVENTING OPERATIO NAL FAULTS DUE TO ESD 20
OPERATIONAL REFERENCE 21
USING CAMEXPERT WITH NANO CXP CAMERAS 21
CamExpert Panes 21
CamExpert View Parameters Option 22
CAMERA INFORMAT IO N CATEGORY 23
Camera Information Feature Descriptions 23
Power-up Configuration Dialog 27
Camera Power-up Configuration 27
Load / Save Configuration 27
SENSOR CONTROL CATEGORY 28
Sensor Control Feature Descriptions 28
Black Level/Gain Control Details (On-Semi Python sensors) 31
On-Semi Python Sensors Gain Stage Diagram 31
OnSemi Sensor Artifacts with Fast Readout Mode 31

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Contents Genie Nano-CXP Series™
Fast Readout Mode Artifacts Correction 32
Exposure Alignment: Overview 32
Synchronous Exposure Alignment 33
Reset Exposure Alignment 33
Sensor Exposure Timing: OnSemi Python Models 33
Trigger Characteristics: Start of Exposure 33
I/O CONTROL CATEGORY 34
I/O Control Feature Descriptions 35
I/O Module Block Diagram 37
Trigger Mode Details 37
Trigger Source Types (Trigger Mode=On) 37
Trigger Overlap: Feature Details 38
COUNTER AND TIMER CONTROL CATEGORY 41
Counter and Timer Control Feature Description 42
Counter and Timer Group Block Diagram 45
Example: Counter Start Source = OFF 45
Example: Counter Start Source = CounterEnd (itself) 46
Example: CounterStartSource = EVENT or Signal (Edge Base) 46
Example: CounterStartSource = Line (Edge Base) Example 47
Example: Counting Elapse Time 48
ADVANCED PROCESSING CONTROL CATEGORY 49
Notes about Lens Shading Calibration 50
Advanced Processing Control Feature Descriptions 51
Advanced Processing Group 51
Flat Field Correction Group 52
Lens Shading Correction Group 53
Defective Pixel Replacement 55
Example User Defective Pixel Map XML File 55
Monochrome Defective Pixel Replacement Algorithm Description 56
Color Defective Pixel Replacement Algorithm Description 57
IMAGE FORMAT CONTROL CATEGORY 58
Image Format Control Feature Description 59
Width and Height Features for Partial Scan Control 60
Vertical Cropping (Partial Scan) 61
Maximum Frame Rate Examples (Nano-CXP M/C 5100) 61
Maximum Frame Rate Examples (Nano-CXP M/C 4090) 62
Horizontal Cropping (Partial Scan) 62
Internal Test Pattern Generator 63
ACQUISITION CONTROL CATEGORY 64
Acquisition Control Feature Descriptions 65
Acquisition Buffering 66
Features that cannot be changed during a Transfer 66
TRANSPORT LAYER CONTROL 67
CoaXpress Transport Layer Feature Description 68
FILE ACCESS CO NTROL CATEGORY 70
File Access Control Feature Descriptions 70
Updating Firmware via File Access in CamExpert 73
Overview of the deviceUserBuffer Feature 73
IMPLEMENTING TRIGGER-TO-IMAGE RELIABILITY 74
OVER VI EW 74
T2IR with Genie Nano 74
NANO FEATURES FOR T2IR MONITORING 75

Genie Nano-CXP Series™ Contents
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TECHNICAL SPECIFICATIONS 76
NOTES ON GENIE NANO IDENTIFICATION AND MECHANICAL 76
Temperature Management 76
MECHANICAL SPECIFICATIONS WITH M42 MO U NT : 77
SENSOR ALI G NM ENT SPECIFICATION 78
CONNECTORS 79
10-pin I/O Connector Details 79
Camera DC Power Characteristics 80
I/O Mating Connector Specifications & Sources 80
EMC DECLARATIO N OF CONFORMITY 82
EU DECLARATION OF CONFORMITY 83
DECLARATION OF REACH 84
ADDITIONAL REFERENCE INFORMATION 85
CHOOSING A LENS WITH THE CORR ECT IMAGE CIRCLE 85
Lens Options for CXP Models with M42 Mounts 85
Additional Lens Parameters (application specific) 86
OPTICAL CONSIDERATIO NS 86
Illumination 86
Light Sources 87
IR Cut-off Filters for Color Cameras 87
Nano Models with Built-in IR Cut-off Filters 87
Guidelines for Choosing IR Cut-off Filters 88
Back Focal Variance when using any Filter 89
LENS MODELING 90
Magnification and Resolution 90
SENSOR HANDLING INSTRUCTIONS 91
Electrostatic Discharge and the Sensor 91
Protecting Against Dust, Oil and Scratches 91
Cleaning the Sensor Window 92
RUGGEDIZED I/O CABLE ACCESSORIES 92
Cable Manufactures Contact Information 92
Cable Assembly G3-AIOC-BLUNT1M 93
Cable Assembly G3-AIOC-BLUNT2M 94
Cable Assembly G3-AIOC-BRKOUT2M 96
Nano Generic Power Supply with no I/O 98
Components Express Right-Angle Cable Assemblies 99
Cable Assembly: Right-Angle I/O Bunt End 99
Cable Assembly: Right-Angle I/O to Euro Block 100
TROUBLESHOOTING 101
OVER VI EW 101
Problem Type Summary 101
Before Contacting Technical Support 101
DEVICE AVAILABLE WITH OPERATIONAL ISSUES 101
Firmware Updates 101
Power Failure during a Firmware Update–Now What? 102
Cabling and Communication Issues 102
Camera is functional, frame rate is as expected, but image is black 102
REVISION HISTORY 103
CONTACT INFORMATION 104
SALES INFORMATIO N 104

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Contents Genie Nano-CXP Series™
TECHNICAL SUPPORT 104

Genie Nano-CXP Series™ Nano-CXP Series Overview
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5
Nano-CXP Series Overview
Description
The Genie Nano-CXP (CoaXPress) series provides affordable easy to use digital cameras specifically
engineered for industrial imaging applications by using the industries’latest leading sensors such
as the On-SemiPythonseries of global shutter active pixel-typeCMOS image sensors. Cameras are
available in a number of models implementing different sensors,image resolutions and feature
sets, eitherin monochrome or monochrome NIR.
Nano-CXP supports the TeledyneDALSA Trigger-to-Image-Reliability framework to dependably
captureand transferimages from the camera to the host PC.
Genie Nano-CXP Overview
•CoaXPress 6Gbps interface
•Supports (PoCXP) Power over CoaXPress or an auxiliary power input
•Supports the CoaXPress device discoverymethodologyproviding plug and play capability
•Implements GenICam andassociated GenCP compatible with Teledyne DALSA or third party
CoaXPress frame grabbers
•Optimized, rugged design with a wider operating temperature
•Available in multiple resolutions –Monochrome and Color
•Visual camera multicolor status LED on back plate
•Uses 4 x 75 ohm coaxcable connections(DIN 1.0/2.3 Coaxial)
•Flexible generalpurpose Counterand Timer functions available for internal and external
controls
•Defective Pixelreplacement & Flat Field correction available
•Lens Shading Correction Maps for lens vignetting
•Application development withthe freely available Sapera™ LT software libraries
•Native TeledyneDALSA Trigger-to-Image Reliability design framework
•Refer to the Operation Referenceand Technical Specifications sectionof the manual forfull
details
•CoaXPress is hosted by the Japan Industrial Imaging Association(JIIA)
Camera Firmware
Teledyne DALSA Genie Nano camera firmware contains opensource software providedunder
different opensource software licenses.More informationabout theseopensource licensescan be
found in the documentation that accompanies the firmware, which is available on the Teledyne
DALSA website at www.teledynedalsa.com.
Firmware updates for Genie Nano are available fordownload fromthe Teledyne DALSA web site
www.teledynedalsa.com/imaging/support/downloads.Choose Genie Nano-CXPFirmware from the
available download sections,then choosethe zip file download specific to your camera model.
When using Sapera LT, updatethe camera firmware using CamExpert (see Updating Firmware via
File Access in CamExpert). The Camera firmware canalso be easily upgrade/downgrade withinyour
own application via the API. The camera has a failsafe scheme which preventsunrecoverable
camera errors even in the case of a powerinterruption.

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Nano-CXP Series Overview Genie Nano-CXP Series™
Model Part Numbers
This manual covers thereleasedGenie Nano-CXPmonoc hrome and color models summarized in
the table below. Nano-CXP c ommon specifications and details follow this section.
Monochrome Cameras
Nano-CXP Model
Full Resolution Sensor Size/Model Lens Part Number
M4090
4096 x 4096 On-Semi 16M (Python 16K) M42 mount G3-XM30-M4095
M4090-NIR
4096 x 4096 On-Semi 16M (Python 16K) M42 mount G3-XM32-M4095
M5100
5120 x 5120 On-Semi 25M (Python 25K) M42 mount G3-XM30-M5105
M5100-NIR
5120 x 5120 On-Semi 25M (Python 25K) M42 mount G3-XM32-M5105
Color Cameras
Nano-CXP Model
Full Resolution Sensor Size/Model Lens Part Number
C4090
4096 x 4096 On-Semi 16M (Python 16K) M42 mount G3-XC30-C4095
C5100
5120 x 5120 On-Semi 25M (Python 25K) M42 mount G3-XC30-C5105

Genie Nano-CXP Series™ Nano-CXP Series Overview
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7
Accessories
Nano Accessories&Cables (sold separately) Order Number
Mounting Bracket Plate
(2 or 3 screw camera mount),
with ¼ inch external device screw mount
(also known as a tripod mount)
G3-AMNT-BRA01
I/O Blunt End Cable
(1 meter ScrewRetention to Flying Leads)
(2 meter ScrewRetention to Flying Leads)
G3-AIOC-BLUNT1M
G3-AIOC-BLUNT2M
I/O Breakout Cable
(2 meter ScrewRetention to Euroblock connector)
G3-AIOC-BRKOUT2M
Generic 12 volt power supply for Genie Nano–Aux
connector (Samtec 10-Pin) – 4 Meter length G3-APWS-S10S04M
Nano-CL — M42 to F-mount (Nikon) adapter
(same adapter as used with Genie TS)
Note that there is no support for Nikon lens features
such as focus and aperture motor controls.
G2-AM42-MOUNT4
Cables are available directly from our preferred source:
(see Components Express Right-Angle Cable Assemblies).

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Nano-CXP Series Overview Genie Nano-CXP Series™
Hardware and Software Environments
The following describessuggested hardwareand supportedsoftware forsuccessfulimaging
systems using the Nano-CXP.
Mounting
The Nano-CXPrequires a mounting platform which includes camera heatsinking. Thermal
management and heat dissipation is mandatory to ensure the camera remains within the stated
operating temperature specification. Seesection Mechanical Specifications with M42 Mount: for the
location of the camera mounting screw holes.
Frame Grabbersand Cabling
The TeledyneDALSA Xtium-CXP PX8 frame grabber is recommended for error free acquisitions with
the Nano-CXP camera (contact sales for additional information).
See Cable Manufactures Contact Information forcontact information forinformation on CXP cable
suppliers and various I/O solutions for your imaging solution.
Software Platforms
Platform Notes
Support of GenICam GenCP Camera setting, acquisition and other controls
Support of GenICam File access implementation File access support for firmware update
Support of GenICam XML schema version 1.1
Support of CoaXPress v1.1
GenICam™ support — XML camera description file Embedded within Genie Nano-CXP
Development Software for Camera Control
Teledyne DALSA Software Platform for Microsoft Windows
Sapera LT for Windows — version 8.41 or later
Includes Sapera Runtime and CamExpert.
Provides everything you will need to develop imaging applications
Sapera documentation provided in compiled HTML help,
and Adobe Acrobat® (PDF)
Available for download
http://www.teledynedalsa.com/imaging/support/
Third Party Software Platforms
GenICam GenCP Compliant Software And Tools Contact your supplier

Genie Nano-CXP Series™ Nano-CXP Specifications
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9
Nano-CXP Specifications
The Nano-CXPcommon specifications listed first are followed by model specific tables of functional
features and timing details.
Common Specifications
CameraControls
Communication Protocol GenCP over CoaXPress (GenICam GenCP compliant software)
Synchronization Modes Free running, External triggered
Exposure Control Internal – Programmable via the camera API
External – Timed Trigger or Trigger Width modes supported
Exposure Time Maximum 10 sec
Exposure Modes Programmable in increments of 1µs
minimum time (in µs) is model specific
Pulse controlled via external Trigger pulse width.
Features
Reserved Private User Buffer 4 kB flash memory for OEM usage (deviceUserBuffer)
Flash memory 32 MB flash memory
Gain In Sensor gain
Defective Pixel Replacement Up to 4096 entries
CounterandTimer 1 Counter and 1 Timer. User programmable, acquisition independent, with event
generation, and can control Output I/O pins
Test image Internal generator with choice of static and shifting patterns
User settings Select factory default or either of two user saved camera configurations
CoaXPress Link Speed 6.25 Gb/s - 4 Data Lanes
Back Focal Distance
12 mm (M42 mount)
Mechanical Interface
Camera (L x H x W)
see Mechanical Specifications XL Case: 38.3 mm x 59 mm x 59 mm
Mass XL Case: ~ 163g
CoaXPress Connector Type DIN1.0/2.3connector (CXP-6 maximum speed rating)
Power connector Camera power via PoCXP orby the power pins on the 10-pin I/O connector
Electrical Interface
Input Voltage +24V nominal (+12 to +26 Volts DC maximum range)
Supports the Power Over CXP standard (PoCXP)
PowerDissipation (typical) 12W @ 24Vdc aux. (for the XL case)
EnvironmentalConditions

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Nano-CXP Specifications Genie Nano-CXP Series™
Operating Temperature
(at camera front plate) All Models: -20°C to +65°C (-4°F to +149°F) Any metallic camera mounting provides
heat-sinking therefor reducing the internal temperature.
Operating Relative Humidity 10% to 80% non-condensing
Storage -40°C to +80°C (-4°F to +176°F) temperature at 20% to 80% non-condensing
relative humidity
Conformity CoaXPress (JIIA), EU and REACH
Sensor Cosmetic Specifications
After FactoryCalibrationand/or Correctionsare applied (if applicable — dependent on sensor)
Blemish Specifications Maximum Number of
Defects Blemish Description
Hot/Dead Pixel defects Typical 0.0025%
Max 0.005% Any pixel that deviates by ±20% from the average of
neighboring pixels at 50% saturation including pixel stuck at 0
and maximum saturated value.
Spot defects none Grouping of more than 8 pixel defects within a sub-area of 3x3
pixels,to a maximum spot size of 7x7 pixels.
Clusters defects none Grouping of more than 5 single pixel defects in a 3x3 kernel.
Column defects none Vertical grouping of more than 10 contiguous pixel defects
along a single column.
R o w defects none Horizontal grouping of more than 10 contiguous pixel defects
along a single row.
•Test conditions
•Nominal light = illumination at 50% of saturation
•Temperature of camera is 45°C
•At exposures lower than 0.25 seconds
•At nominal sensor gain (1x)

Genie Nano-CXP Series™ Nano-CXP Specifications
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11
Dynamic Range & Signal to Noise Ratio Test Conditions
Dynamic Range Test Conditions
•Exposure 100µs
•0% Full Light Level
SNR Test Conditions
•Exposure 2000µs
•80% saturation
Specifications calculated according to EMVA-1288 standard, using white LED light
•For On-semi Python
•Max saturated values: up to 10 millisecond (Gain1.0) for the 16M to 25M
•ForSony
•Max saturated values: MaxPixel format bit depth - 1DN
EMI, Shock and Vibration Certifications
Compliance Directives Standards ID Overview
CE
EN61000-4-2 : 2008 Electrostatic discharge immunity test
EN61000-4-3: 2006 A1 : 2007 A2 :
2010 Radiated, radio-frequency, electromagnetic field immunitytest
EN61000-4-4 : 2004 Electrical fast transient/burst immunity test
EN61000-4-5 : 2005 Surge immunity
EN61000-4-6 : 2008 Immunity to conducted disturbances, induced by
radio-frequency fields
EN61000-4-8 : 2009 Power frequency magnetic field immunity
EN61000-4-11 : 2004 Voltage variations immunity
EN61000-6-2 : 2005 Electromagnetic immunity
EN61000-6-4: 2007 Electromagnetic emissions
CISPR 11: 2009 A1 :
group 1 FCC, part 15, subpart B:2010 Limit: class A Conducted Emissions
CISPR 22: 2008Limit: class A LAN port Conducted Emissions
FCC Part 15, class A
RoHS Compliancy as per European directive 2011/65/EC
Vibration& Shock Tests Test Levels (while operating) TestParameters
Random vibrations Level 1:2 grms 60 min.
Level 2:4 grms 45 min.
Level 3:6 grms 30 min.
Frequency range: 5 to 2000 Hz
Directions: X, Y, and Z axes
Shocks Level 1:20 g / 11 ms
Level 2:30 g / 11 ms
Level 3:40 g / 60 ms
Shape: half-sine
Number: 3 shocks (+) and 3 shocks (-)
Directions: ±X, ±Y, and ±Z axes
Additional informationconcerningtestconditions andmethodologiesis available on request.

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Nano-CXP Specifications Genie Nano-CXP Series™
Mean Time between Failure (MTBF)
The analysis was carried out for operating temperatures varying from-40 to 100ºC. The following
table presentsthe predicted MTBFand Failure Rate Values (FIT).
*FIT calculations are based on the Bellcore/Telcordia SR-332—Method 1—Case3standards.
CameraAssembly
Temperature (°C) MTBF (hours) MTBF (years) Failure Rate (FIT)
*
-40 15,401,201 1,758 64.93
-20 9,292,817 1,061 107.61
0 4,770,992 545 209.6
20 2,066,329 236 483.95
40 812,486 93 1230.79
60 315,604 36 3168.53
80 127,279 15 7856.77
100 54,362 6 18395.1
MTBF versus temperature shown graphically

Genie Nano-CXP Series™ Nano-CXP Specifications
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13
Nano-CXP Specifications: M5100, C5100, M4090,
C4090
Modelspecific specifications and responsegraphicsforthe On-Semi Python (25K & 16K) series are
provided here. The response curves describe the sensor, excludinglens andlight source
characteristics.
Supported Features M5100 & C5100 M4090 & C4090
Resolution 5120 x 5120 4096 x 4096
Sensor On-Semi Python25K (25M) On-Semi Python16K (16M)
Pixel Size 4.5 µm x 4.5 µm
Shutter Type Full frame electronic global shutter function
Full Wellcharge 12ke (max)
Mode Option Normal Readout
Mode Fast Readout Mode Normal Readout Mode Fast Readout Mode
Maximum Frame Rate (8-bit) 46.8 fps 80.0 fps 65.4 fps 120 fps
Pixel Format (Mono) Mono 8
Pixel Format (Color) Bayer 8 bit
Trigger to Exposure Minimum
delay (Synchronous Exposure) 9 µs
Trigger to Exposure Minimum
delay (Reset Exposure) 9 µs
Trigger to Exposure Start jitter
(Synchronous Exposure) Up to 1 line time
Trigger to Exposure Start jitter
(Reset Exposure) 0 µs
Exposure Time Minimum
(see “exposureTimeActual” in
Sensor Control) 34 µs
Horizontal Line Time 4.14 µs 2.42 µs 3.70 µs 1.97 µs
Min. Time from End of Exposure to
Start of Next Exposure 101 µs 68 µs 101 µs 68 µs
Re adout Time (Horizontal Line Time * NB Lines) +
( 2 * Horizontal Line Time at Maximum Sensor Width ), in μs
Auto-Brightness No
Black offset control Yes (in DN)
Gain Control In-sensor Analog Gain (1.0x to 3.17x) in 4 steps
(1.0x, 1.26x, 2.87x, 3.17x)
Binning Support No
Decimation Support No
DefectivePixel Replacement Yes, up to 2048 pixel positions
Image Correction Flat Line Correction (Factory and 4 User Defined entries – Monochrome Only)
Lens Shading correction (Factory and 2 User Defined entry)
Noise Reduction
Image Flip support No
Multi-ROI Support No
Output Dynamic Range (dB) 55.3
SNR (dB) 39.5

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Nano-CXP Specifications Genie Nano-CXP Series™
Spectral Response
On-SemiPythonSeries — Monochrome and NIR
On-SemiPythonSeries — BayerColor

Genie Nano-CXP Series™ Nano-CXP Specifications
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15
Defective Pixel Specification for Models 5100/4090
These defective pixel specifications in the following table are as published by the sensor
manufacturer.Genie Nano cameras apply defectivepixel corrections to improve the camera
performance.
Defective Pixels
(max: 1000)
Number of defective pixels allowed in the full windowsize of 5120 x 5120
(i.e. model 5100).
For mono devices: A defective pixel is defined as a pixel which has a response that
deviates 102 LSB10 in a dark image or a corrected gray image, or a saturated image,
from the local median of the neighboring pixels in a 7 x 7 block.
The defective pixels in dark, gray and saturated images are stored a in a global defect
map. The limit is applied to the global defect map.
Defective Column
0 defective columns allowed
Number of defective columns in the full windowsize of 5120 x 5120 derived from dark,
half scaleandsaturated image.
For Mono devices: A bad column is defined as a column which has a response that
deviates 48 LSB10 in a dark image, or a corrected gray or a saturated image, from the
local median of 11 neighboring columns (+/- 5 left/right columns).
Defective Row
0defective rows allowed
Number of defective rows in the full windowsize of 5120 x 5120 derived from dark,
half scaleandsaturated image.
For Mono devices: A bad row is defined as a rowwhich has a response that deviates 48
LSB10 in a dark image, or a corrected gray or a saturated image, from the local
median of 11 neighboring rows (+/- 5 top/bottom rows).
continued nextpage

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Nano-CXP Specifications Genie Nano-CXP Series™
Defective Cluster Definition
Number of clusters allowed in the full windowsize of 5120 X 5120. A cluster is defined
as a group of neighboring defective pixels (top, Bottom side, not diagonal), derived
from the global defect map.
For color devices: The pixels are divided per color channels (R, G1, G2, B) and then
calculated with the same methodology as mono devices.
Refer to the graphic below:
The number of defective pixels in one cluster is the class (F) of the cluster:
F2 (max 5): 2 defective pixels in the cluster
F3 (max 4): 3 defective pixels in the cluster
F4 (max 3): 4 defective pixels in the cluster
F5 (max 0): 5 or more defective pixels in the cluster
Firmware Files for These Models
The latestfirmware files for all Nano models are available onthe Teledyne DALSA support website:
http://www.teledynedalsa.com/imaging/support/downloads/firmware/
The firmware files for currently available models are listedbelow. The xx variable denotesthe
current build number.
M4090, M5100 Monochrome CXP models – 4 Lane CoaXPress 6Gbps Interface
•Genie_Nano-CXP_OnSemi_Python_25M_HSD_Firmware_1CA23.xx.cbf

Genie Nano-CXP Series™ Nano-CXP Installation
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Nano-CXP Installation
If you are familiar with CoaXPress cameras and TeledyneDALSA frame grabbers, follow these steps
to quickly install and acquire images with Genie Nano-CXP and the CamExpert tool provided with
Sapera LT in a Windows OS system.
Quick Start (using a Teledyne DALSA Frame Grabber)
•InstallSapera 8.41 (or later). Use the FullSDK versionwith support forTeledyneDALSA frame
grabberboards.
•Installthe Teledyne DALSA CoaXPress frame grabber board along with its driver.
•Start CamExpert. The plug-and-play feature of CXP frame grabber and camera will
automatically configure frame buffer, data lanes,andframe rate parameterstomatchthe
Nano-CXP modelbeing used. At thistime do not configure for an external trigger.
•Connect the Nano-CXP with 4 camera cables.The Teledyne DALSA CXP frame grabbersupports
PoCXP (poweroverCoaXPress)fora simple camera powersolution.
•Enable PoCXP by its frame grabberfeature. If not using PoCXP connect a powersupply tothe
Nano-CXP via its I/O connector.
•When the Nano-CXP boots, CamExpert will read and display the camera features available with
that model.
•The Nano-CXPstatus LED has changed to flashing green, indicating it is in free running
acquisition mode. See LEDStateson Power Up for all status LEDconditions.
•From the Nano-CXPImage Format Feature Category, select the Moving Grey Diagonal Ramp
test pattern fromthe Test ImageSelector Parameter.
•Click grab. You will see the moving pattern in the CamExpert display window.
•If a camera lens is attached, turn off the testpatternandgrab live again. Adjust the lens
aperture plus Focus,and/oradjust the Nano Exposure Time and frame rate as required.
General Installation Overview
Connecting a Nano-CXPto a frame grabberis similar whetherusinga Teledyne DALSA frame
grabber board with Sapera LT SDK or a third party frame grabberwith its own SDK.
Camera Firmware Updates
Under Windows, the usercan upload new firmware, using the File Access Control features provided
by the Sapera CamExpert tool.
Download the latest firmware version released forany Nano-CL model from the TeledyneDALSA
support web page: http://www.teledynedalsa.com/imaging/support/downloads/firmware/

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Nano-CXP Installation Genie Nano-CXP Series™
The Camera Works — Now What
Consult this manual for detailed Nano-CXPfeature descriptions, as you write, debug and optimize
your imaging application. Consult the frame grabber manual for all board control features.
Nano-CXP Connectors and Status LED Overview
Connectors
The Nano-CXPhas a connectorfor I/O and four CoaXPress data lane links:
•A 10 pin I/O connector for camera power, plus trigger, strobe and generalI/O signals. The
connectorsupportsa retention latch, while alternatelythe Nano-CXPcase supportsusing an I/O
cable with thumbscrews. Teledyne DALSA provides optional cablesfor purchase (see
Ruggedized Cable Accessories). Also see 10-pin I/O Connector Details for pin out specifications.
•FourCoaXPress Link connectors are available fordata output. Use a CoaXPress frame grabber
with the Nano-CXP. See Components Express Contact Information for a variety of CoaXPress
cables.
The following figure of the Genie Nano-CXP back showsconnectorand LED locations along with
identification labels. See Mechanical Specifications — Nano-CXPfor details on the connectorsand
camera mounting dimensions.
Genie Nano-CXP – Rear View