DFI KM266Pro-MLV User manual

KM266Pro-MLV
Rev. A+
System Board
User’s Manual
80500409

Copyright
This publication contains information that is protected by copyright.
No part of it may be reproduced in any form or by any means or
used to make any transformation/adaptation without the prior writ-
ten permission from the copyright holders.
This publication is provided for informational purposes only. The
manufacturer makes no representations or warranties with respect
to the contents or use of this manual and specifically disclaims any
express or implied warranties of merchantability or fitness for any
particular purpose. The user will assume the entire risk of the use
or the results of the use of this document. Further, the manufac-
turer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person
or entity of such revisions or changes.
2004. All Rights Reserved.
Trademarks
Windows® 98, Windows® 98 SE, Windows® ME, Windows® 2000,
Windows NT® 4.0 and Windows® XP are registered trademarks of
Microsoft Corporation. AMD, AthlonTM XP and AthlonTM are regis-
tered trademarks of Advanced Micro Devices, Inc. VIA® is a regis-
tered trademark of VIA Technologies, Inc. Award is a registered
trademark of Award Software, Inc. Other trademarks and registered
trademarks of products appearing in this manual are the properties
of their respective holders.
Caution
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis
cover for installation or servicing. After installation or servicing,
cover the system chassis before plugging the power cord.

Battery:
• Danger of explosion if battery incorrectly replaced.
• Replace only with the same or equivalent type recommend by
the manufacturer.
• Dispose of used batteries according to the battery manufactur-
er’s instructions.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the
limits for a Class B digital device, pursuant to Part 15 of the FCC
rules. These limits are designed to provide reasonable protection
against harmful interference when the equipment is operated in a
residential installation. This equipment generates, uses and can radi-
ate radio frequency energy and, if not installed and used in accord-
ance with the instruction manual, may cause harmful interference to
radio communications. However, there is no guarantee that inter-
ference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the re-
ceiver.
• Connect the equipment into an outlet on a circuit different
from that to which the receiver is connected.
• Consult the dealer or an experienced radio TV technician for
help.
Notice:
1. The changes or modifications not expressly approved by the
party responsible for compliance could void the user's authority
to operate the equipment.
2. Shielded interface cables must be used in order to comply with
the emission limits.

Notice
This user’s manual contains detailed information about the system
board. If, in some cases, some information doesn’t match those
shown in the multilingual manual, the multilingual manual should al-
ways be regarded as the most updated version. The multilingual
manual is included in the system board package.
To view the user’s manual, insert the CD into a CD-ROM drive.
The autorun screen (Mainboard Utility CD) will appear. Click the
“TOOLS” icon then click “Manual” on the main menu.

Table of Contents
Chapter 1 - Introduction
1.1 Features and Specifications...................................................................
1.2 Package Checklist.......................................................................................
Chapter 2 - Hardware Installation
2.1 System Board Layout .............................................................................
2.2 System Memory..........................................................................................
2.3 CPU...................................................................................................................
2.4 Jumper Settings...........................................................................................
2.5 Rear Panel I/O Ports................................................................................
2.6 I/O Connectors..........................................................................................
Chapter 3 - BIOS Setup
3.1 Award BIOS Setup Utility.....................................................................
3.2 Updating the BIOS....................................................................................
Chapter 4 - Supported Softwares
4.1 Desktop Management Interface........................................................
4.2 Drivers, Utilities and Software Applications................................
4.3 6-Channel Audio Output via Software.........................................
4.4 Installation Notes.......................................................................................
7
14
45
83
15
16
18
22
26
36
85
88
96
98

Introduction
1
6
Appendix A - Usin the Suspend to RAM
Function
A.1 Using the Suspend to RAM Function.............................................
Appendix B - System Error Messa es
B.1 POST Beep....................................................................................................
B.2 Error Messages.............................................................................................
Appendix C - Troubleshootin
C.1 Troubleshooting Checklist......................................................................
103
103
99
105

1
Introduction
7
1.1 Features and Specifications
1.1.1 Features
Chipset
•VIA
® chipset
- North bridge: VIA® KM266Pro
- South bridge: VIA® VT8235
Processor
The system board is equipped with Socket-A for installing one of
the following supported processors.
• AMD AthlonTM XP 266/333MHz FSB
• AMD AthlonTM 266MHz FSB
• AMD DuronTM 200/266MHz FSB
Important:
To ensure proper boot up and operation of your system, you
must power-off the system then turn off the power supply’s
switch or unplug the AC power cord prior to replacing the CPU.
System Memory
• Two 184-pin DDR SDRAM DIMM sockets
• Supports up to 2GB memory using PC2100 (DDR266) and
PC2700 (DDR333) DDR SDRAM DIMM, 2.5V type
Chapter 1 - Introduction
DIMMs
2MBx64
4MBx64
8MBx64
Memory Size
16MB
32MB
64MB
DIMMs
16MBx64
32MBx64
64MBx64
Memory Size
128MB
256MB
512MB

Introduction
1
8
Expansion Slots
• 1 AGP slot
• 3 PCI slots
AGP (Accelerate Graphics Port)
AGP is an interface designed to support high performance 3D
graphics cards. It utilizes a dedicated pipeline to access system
memory for texturing, z-buffering and alpha blending. The universal
AGP slot supports AGP 4x with up to 1066MB/sec. bandwidth for
3D graphics applications. AGP in this system board will deliver
faster and better graphics to your PC.
Onboar Graphics Features
• Integrated S3 2D/3D/Video accelerator
- Shares 8MB to 64MB of the system memory
- Optimized Shared Memory Architecture (SMA)
- High quality DVD video playback
• 3D rendering features
- 32-bit true color rendering
- MPEG-2 video textures
• 2D hardware acceleration features
• Motion video architecture
• Software drivers
- Windows® 98/2000/ME/XP
Onboar LAN Features
• Phy fast ethernet controller
• Integrated IEEE 802.3, 10BASE-T and 100BASE-TX compatible
PHY
• PCI master interface
• Full duplex support at both 10 and 100 Mbps
• Supports IEEE 802.3u auto-negotiation
• Supports wire for management

1
Introduction
9
Onboar Au io Features
• Realtek 6-channel codec
• AC’97 2.2 extension compliant codec
• Supports Microsoft® DirectSound / DirectSound 3D
• AC’97 supported with full duplex, independent sample rate con-
verter for audio recording and playback
• S/PDIF-out interface
• 6-channel audio output via software
S/PDIF-out
S/PDIF is a standard audio file transfer format that transfers digital
audio signals to a device without having to be converted first to an
analog format. This prevents the quality of the audio signal from
degrading whenever it is converted to analog. S/PDIF is usually
found on digital audio equipment such as a DAT machine or audio
processing device. The S/PDIF connector on the system board
sends surround sound and 3D audio signal outputs to amplifiers
and speakers and to digital recording devices like CD recorders.
6-channel Au io
The 6-channel audio output function is supported by configuring
the audio software application program.
PCI Bus Master IDE Controller
• Supports ATA/33, ATA/66, ATA/100 and ATA/133 hard drives
• UDMA Modes 3, 4, 5 and 6 Enhanced IDE (data transfer rate
up to 133MB/sec.)
• Bus mastering reduces CPU utilization during disk transfer
• Supports ATAPI CD-ROM, LS-120 and ZIP

Introduction
1
10
USB Ports
The system board supports USB 2.0 and USB 1.1. USB 1.1 sup-
ports 12Mb/second bandwidth while USB 2.0 supports 480Mb/sec-
ond bandwidth providing a marked improvement in device transfer
speeds between your computer and a wide range of simultaneously
accessible external Plug and Play peripherals.
BIOS
• Award BIOS, Windows® 98/2000/ME/XP Plug and Play compat-
ible
• Supports SCSI sequential boot-up
• Flash EPROM for easy BIOS upgrades
• Supports DMI 2.0 function
• 2Mbit flash memory
Desktop Management Interface (DMI)
The system board comes with a DMI 2.0 built into the BIOS. The
DMI utility in the BIOS automatically records various information
about your system configuration and stores these information in the
DMI pool, which is a part of the system board's Plug and Play BIOS.
DMI, along with the appropriately networked software, is designed
to make inventory, maintenance and troubleshooting of computer
systems easier. Refer to chapter 4 for instructions on using the DMI
utility.
Rear Panel I/O Ports (PC 99 color-co e connectors)
• One mini-DIN-6 PS/2 mouse port
• One mini-DIN-6 PS/2 keyboard port
• One DB-9 serial port
• One DB-15 VGA port
• One DB-25 parallel port
• Four USB 2.0/1.1 ports
• One RJ45 LAN port
• Three audio jacks: line-out, line-in and mic-in

1
Introduction
11
I/O Connectors
• One connector for 2 additional external USB 2.0/1.1 ports
• One front audio connector for external line-out and mic-in jacks
• One CD-in internal audio connector
• One S/PDIF-out connector
• Two IDE connectors
• One floppy connector
• Two ATX power supply connectors
• Two fan connectors
1.1.2 Intelligence
CPU Protection
• Monitors CPU temperature during system boot-up
• Supports shutdown temperature - automatic shutdown upon
system overheat
Dual Function Power Button
Depending on the setting in the “Soft-Off By PWRBTN” field of the
Power Management Setup, this switch will allow the system to
enter the Soft-Off or Suspend mode.
Wake-On-Ring
This feature allows the system that is in the Suspend mode or Soft
Power Off mode to wake-up/power-on to respond to calls coming
from an external modem or respond to calls from a modem PCI
card that uses the PCI PME (Power Management Event) signal to
remotely wake up the PC.
Important:
If you are using a modem add-in card, the VSB power source
of your power supply must support a minimum of ≥ 720mA.

Introduction
1
12
Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power
Down (Soft-Off) PC. It is supported via the onboard LAN port or
via a PCI LAN card that uses the PCI PME (Power Management
Event) signal. However, if your system is in the Suspend mode, you
can power-on the system only through an IRQ or DMA interrupt.
Important:
The VSB power source of your power supply must support
≥ 720mA.
Wake-On-PS/2 Keyboar /Mouse
This function allows you to use the PS/2 keyboard or PS/2 mouse
to power-on the system.
Important:
The VSB power source of your power supply must support
≥ 720mA.
Wake-On-USB
This function allows you to use a USB device to wake up the sys-
tem.
Important:
• If you are using the Wake-On-USB function for 2 USB ports,
the VSB power source of your power supply must support
≥ 1. A.
• If you are using the Wake-On-USB function for 3 or more
USB ports, the VSB power source of your power supply
must support ≥ 2A.
RTC Timer to Power-on the System
The RTC installed on the system board allows your system to auto-
matically power-on on the set date and time.

1
Introduction
13
AC Power Failure Recovery
When power returns after an AC power failure, you may choose to
either power-on the system manually or let the system power-on
automatically.
ACPI
The system board is designed to meet the ACPI (Advanced Con-
figuration and Power Interface) specification. ACPI has energy saving
features that enables PCs to implement Power Management and
Plug-and-Play with operating systems that support OS Direct Power
Management. Currently, only Windows® 98/2000/ME/XP supports
the ACPI function allowing you to use the Suspend to RAM func-
tion.
With the Suspend to RAM function enabled, you can power-off the
system at once by pressing the power button or selecting “Standby”
when you shut down Windows® 98/2000/ME/XP without having to
go through the sometimes tiresome process of closing files, applica-
tions and operating system. This is because the system is capable of
storing all programs and data files during the entire operating ses-
sion into RAM (Random Access Memory) when it powers-off. The
operating session will resume exactly where you left off the next
time you power-on the system.
Important:
The VSB power source of your power supply must support
≥ 1A.
Virus Protection
Most viruses today destroy data stored in hard drives. The system
board is designed to protect the boot sector and partition table of
your hard disk drive.

Introduction
1
14
1.2 Packa e Checklist
The system board package contains the following items:
The system board
A user’s manual
One IDE cable for ATA/33/66/100/133 IDE drives
One 34-pin floppy disk drive cable
One I/O shield
One “Mainboard Utility” CD
If any of these items are missing or damaged, please contact your
dealer or sales representative for assistance.

15
2
Hardware Installation
2.1 System Board Layout
Chapter 2 - Hardware Installation
KB/Mouse
COM 1
VGA
Parallel
1
+12V power
USB 1-2
LAN
USB 3-4
Line-out
Line-in
Mic-in
1
ATX power
Socket A
1
CPU fan
VIA
KM266Pro
DDR 2
DDR 1
LAN Phy
I/O
chip
VIA
VT8235
BIOS
1CD-in
Audio
Codec
1
Front audio
11
1
USB 5-6
1
IDE 1
1
IDE 2
Battery
1
HD-LED RESET SPEAKER
PWR-LED
ATX-SW
AGP slot
PCI slot 1
PCI slot 2
PCI slot 3
FDD
1
USB 1-4
power select (JP2)
1
1
S/PDIF-out System fan
1
Clear CMOS
(JP1)
USB 5-6
power select (JP3)
1
CPU FSB
(JP16)

16
2Hardware Installation
System fan
2.2 System Memory
Warning:
Electrostatic discharge (ESD) can damage your system board, proces-
sor, disk drives, add-in boards, and other components. Perform the
upgrade instruction procedures described at an ESD orkstation only.
If such a station is not available, you can provide some ESD protection
by earing an antistatic rist strap and attaching it to a metal part
of the system chassis. If a rist strap is unavailable, establish and
maintain contact ith the system chassis throughout any procedures
requiring ESD protection.
The system board supports DDR SDRAM DIMM. Double Data
Rate SDRAM (DDR SDRAM) is a type of SDRAM that doubles the
data rate through reading and writing at both the rising and falling
edge of each cloc . This effectively doubles the speed of operation
therefore doubling the speed of data transfer.
Refer to chapter 1 (System Memory section) for detailed specifica-
tion of the memory supported by the system board.
BIOS Setting
Configure the system memory in the Advanced Chipset Features
submenu (“DRAM Cloc /Drive Control” section) of the BIOS.
.
.
.
.
.
.
.
.
DDR 1
DDR 2

17
2
Hardware Installation
2.2.1 Installing the DIM Module
A DIM module simply snaps into a DIMM soc et on the system
board. Pin 1 of the DIM module must correspond with Pin 1 of the
soc et.
1. Pull the “tabs” which are at the ends of the soc et to the side.
2. Position the DIMM above the soc et with the “notch” in the
module aligned with the “ ey” on the soc et.
3. Seat the module vertically into the soc et. Ma e sure it is
completely seated. The tabs will hold the DIMM in place.
Pin 1
Notch
Key
Tab Tab

18
2Hardware Installation
2.3 CPU
2.3.1 Overview
The system board is equipped with a surface mount Soc et A CPU
soc et. This soc et is exclusively designed for installing an AMD
CPU.
2.3.2 Installing the CPU
1. Ma e sure the PC and all other peripheral devices connected to
it has been powered down.
2. Disconnect all power cords and cables.
3. Locate Soc et A on the system board.
4. Unloc the soc et by pushing the lever sideways, away from the
soc et, then lifting it up to a 90o angle. Ma e sure the soc et is
lifted to at least this angle otherwise the CPU will not fit in prop-
erly.
Lever

19
2
Hardware Installation
5. Position the CPU above the soc et then align the gold mar on
the corner of the CPU (designated as pin 1) with pin 1 of the
soc et.
Important:
Handle the CPU by its edges and avoid touching the pins.
6. Insert the CPU into the soc et until it is seated in place. The
CPU will fit in only one orientation and can easily be inserted
without exerting any force.
Important:
Do not force the CPU into the socket. Forcing the CPU into
the socket may bend the pins and damage the CPU.
Gold mar
Pin 1

20
2Hardware Installation
7. Once the CPU is in place, push down the lever to loc the
soc et. The lever should clic on the side tab to indicate that
the CPU is completely secured in the soc et.
Lever loc
2.3.3 Installing the Fan and Heat Sink
The CPU must be ept cool by using a CPU fan with heat sin .
Without sufficient air circulation across the CPU and heat sin , the
CPU will overheat damaging both the CPU and system board.
1. Before you install the fan / heat sin , you must apply a thermal
paste onto the top of the CPU. The thermal paste, which is
usually supplied together with the CPU, loo s somewhat similar
to the one shown below. Do not spread the paste all over the
surface. When you later place the heat sin on top of the CPU,
the compound will disperse evenly.