Digi ConnectCore 6 Plus Quick user guide

ConnectCore 6 Plus
Hardware Reference Manual

Revision history—900002278
Revision Date Description
A April 2018 First release
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ConnectCore 6 Plus Hardware Reference Manual 2

Contents
About the ConnectCore 6 Plus
Features and functionality 6
Block diagram 7
Power supply architecture 8
Bootstrap 13
Wireless interfaces 14
WLAN IEEE 802.11a/b/g/n/ac 15
Modulation and data rates 15
RF channels 17
Receive sensitivity 19
Transmit power 19
Bluetooth 20
MCA hardware 20
Supported devices 20
MCA pinout 22
Shared I2C bus 31
Shared SPI bus 32
CryptoAuthentication device 33
Module pinout 34
Signal usage limitations 84
Specifications for the ConnectCore 6 Plus
Electrical characteristics 87
Voltage supplies 87
Power consumption 87
Power consumption use cases 87
Global power consumption 88
Mechanical specifications 88
Host PCB footprint 90
Environmental specifications 90
Linux - Android users 91
Assembly instructions
Moisture sensitivity and shelf life 93
Mounting 93
Solder Paste 93
Solder paste print 93
Stencil 93
ConnectCore 6 Plus Hardware Reference Manual 3

ConnectCore 6 Plus Hardware Reference Manual 4
Coplanarity 94
SMT pick and place 94
SMT process parameter reference 94
Reflow profile 94
Regulatory information and certifications
United States FCC 97
Labeling requirements 97
Maximum power and frequency specifications (FCC) 98
FCC notices 99
FCC-approved antennas 99
RF exposure 100
Canada (ISED) 100
Maximum power and frequency specifications 100
Labeling requirements 100
Transmitters with detachable antennas 101
Europe ETSI 101
Maximum power and frequency specifications (Europe ETSI) 102
OEM labeling requirements 104
CE labeling requirements 104
Declarations of Conformity 104
Approved antennas 104
Bluetooth SIG-qualified hardware and firmware 104

About the ConnectCore 6 Plus
The ConnectCore 6 Plus is an ultra-compact and highly integrated system-on-module solution based
on the NXP i.MX6QP Cortex-A9 processor family.
With processor speed up to 1.0 GHz, the ConnectCore 6 Plus offers a truly future-proof platform
solution with scalable performance and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with
Bluetooth 4.2 dual mode connectivity.
Its innovative and scalable design maximizes integration flexibility and significantly reduces design
risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal thermal
management even in the most demanding quad-core system configurations.
Seamless Cloud Connector integration as part of the Digi Linux and Android software platform support
offers secure remote management and web services capabilities through the scalable Digi Remote
Manager.
In addition, Digi offers custom Remote Manager hardware and wireless design services as well as end-
to-end solutions services for cloud integration and app development.
This System-On-Module aims to be the next generation of the ConnectCore 6 Plus for i.MX6 family
modules and is pin-to-pin compatible with them.
Features and functionality 6
Block diagram 7
Power supply architecture 8
Bootstrap 13
Wireless interfaces 14
MCA hardware 20
CryptoAuthentication device 33
Module pinout 34
Signal usage limitations 84
ConnectCore 6 Plus Hardware Reference Manual 5

About the ConnectCore 6 Plus Features and functionality
ConnectCore 6 Plus Hardware Reference Manual 6
Note To serve our customers most effectively, Digi International Inc. has consolidated our cloud
services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased
process does not affect device functionality or the functionality of the web services and other
features. However, you will find instances of both Device Cloud and Digi Remote Manager in some
documentation, firmware, and user interfaces.
Features and functionality
The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a
high number of interfaces. Most of these interfaces are multiplexed and are not available
simultaneously. The module has the following features:
ni.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz
l32 Kbytes L1 Instruction cache
l32 Kbytes L1 Data cache
lUp to 1 MB unified Instruction/Data L2 cache
lNEON MPE (Media Processing Engine) co-processor
nGraphical hardware accelerators:
lIPU (Image Processing Unit)
lVPU (Video Processing Unit)
l3D GPU (Graphics Processing Unit) version 6
l2D GPU (Graphics Processing Unit) version 3
lGPU (OpenVG 1.1 Graphics Processing Unit)
lPrefetch and Resolve Engine
lPrefetch and Resolve Gasket
lASRC (Asynchronous Sample Rate Converter)
n64-bit DDR3-1066 memory interface with a density up to 2 GBytes
n8-bit eMMC support
nDialog DA9063 power management IC (PMIC)
l6x DC/DC buck converters
l11x LDO regulators
lRTC with rechargeable coin cell battery support
l10-bit ADC channels
lGPIO pins
nIEEE 802.11 a/b/g/n/ac WLAN interface
nBluetooth version 4.2 dual mode
nCortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

About the ConnectCore 6 Plus Block diagram
ConnectCore 6 Plus Hardware Reference Manual 7
nDebug interfaces:
lStandard JTAG controller IEEE 1149.1
lETM/ETB support
nSupport of i.MX6QP typical interfaces:
l16/32-bit data/address bus
lSATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)
lDisplay support
oHDMI
o24-bit parallel bus
oDual LVDS
oMIPI/DSI
l2x camera (20-bit parallel bus, MIPI/CSI)
lMMC/SD/SDIO
l1x USB OTG with integrated PHY
l3x USB Host
lPCI Express Gen 2.0 lane
l10/100/1000 M Ethernet MAC
lUART, SPI, I2C, PWM, CAN, I2S and GPIO
nUltra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads
nSecurity accelerators:
lARMTrustZone
lCAAM (cryptographic acceleration and assurance module)
lSNVS (secure non-volatile storage)
lCSU (central security unit)
lA-HABv4 (advanced high-assurance boot)
Block diagram
The figure below shows the block diagram of the NXP i.MX6QP application processor.

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 8
Power supply architecture
The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power
domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required
supply voltages for the module components as well as the carrier board.
The module provides support for a backup battery (coin-cell or super cap) powering the real-time
clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also
supported.
The PMIC generates the following power domains that are available on the module pads:
nOne PMIC switching regulator:
lVGEN_3V3

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 9
nFive PMIC LDO:
lVLDO2
lVLDO3_MCA
lVLDO4
lVLDO6
lVLDO8
lVDD_SD2
lVDD_WLAN_SD1
Signal
name
PMIC
regulator
Output
voltage
Output
accuracy
Maximum
current
Dropout
voltage
(MAX)
Turn on
time
(MAX)
Turn
off
time
(MAX)
Quiescent
current in
OFF mode
(TYP)
VGEN_
3V3
BUCKPERI 3.3 V +/-3% 1500 mA - 1 µA 1.2 ms -
Note The maximum current consumption mentioned in the previous table is a combination of the
current consumed by the module (max 500mA) and by the carrier board for external use (1000mA).
The table below provides the characteristics of the optional LDO outputs:
Signal
name
PMIC
regulator
Output
voltage
Output
accuracy
Default
voltage
Maximum
current
Drop output
voltage
(MAX)
Quiescent current
in OFF mode
(TYP)
VLDO2 LDO2 0.6-
1.86 V
+/-3% 1.8 V 200 mA 150 mV 1 µA
VLDO3_
MCA
LDO3 0.9-
3.44 V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VLDO4 LDO4 0.9-
3.44 V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VLDO6 LDO6 0.9-3.6
V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VLDO8 LDO8 0.9-3.6
V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VDD_
SD2
LDO9 0.95 -
3.6 V
+/-1% 3.3 V 200 mA 150 mV 1 µA
VDD_
WLAN_
SD1
LDO10 0.9 - 3.6
V
+/-3% 3.3 V 300 mA 150 mV 1 µA

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 10
Signal name Turn on time (MAX) Turn off time (MAX)
VLDO2 150 µs 1 ms
VLDO3_MCA 300 µs 1 ms
VLDO4 300 µs 1 ms
VLDO6 200 µs 1 ms
VLDO8 300 µs 1 ms
VDD_SD2 200 µs 1 ms
VDD_WLAN_SD1 200 µs 1 ms
Note For information about using the LDO options, please contact Digi.
VLDO3 is used for supplying MCA processor on the module.
The power management IC located on the module is responsible for generating all required i.MX6QP
processor supply voltages. The following i.MX6QP supplies are available on the module pads:
nNVCC_ENET
nNVCC_EIM
nNVCC_LCD
nNVCC_CSI
nNVCC_RGMII
Some of the I/O supplies are set on the module. See the following table:
Power domain Connection
NVCC_GPIO VGEN_3V3
NVCC_JTAG VGEN_3V3
NVCC_NANDF VGEN_3V3
NVCC_SD1 VDD_WLAN_SD1
NVCC_SD2 VDD_SD2
NVCC_SD3 VGEN_3V3
PCIE_VPH 2.5V (VDDHIGH_CAP_2V5)
The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus
module. See the following table for operating ranges of the remaining I/O supplies.
Power domain Min Max
NVCC_ENET 1.65 V 3.6 V