Digi ConnectCore 6 Plus Quick user guide

ConnectCore 6 Plus
Hardware Reference Manual

Revision history—900002278
Revision Date Description
A April 2018 First release
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© 2018 Digi International Inc. All rights reserved.
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ConnectCore 6 Plus Hardware Reference Manual 2

Contents
About the ConnectCore 6 Plus
Features and functionality 6
Block diagram 7
Power supply architecture 8
Bootstrap 13
Wireless interfaces 14
WLAN IEEE 802.11a/b/g/n/ac 15
Modulation and data rates 15
RF channels 17
Receive sensitivity 19
Transmit power 19
Bluetooth 20
MCA hardware 20
Supported devices 20
MCA pinout 22
Shared I2C bus 31
Shared SPI bus 32
CryptoAuthentication device 33
Module pinout 34
Signal usage limitations 84
Specifications for the ConnectCore 6 Plus
Electrical characteristics 87
Voltage supplies 87
Power consumption 87
Power consumption use cases 87
Global power consumption 88
Mechanical specifications 88
Host PCB footprint 90
Environmental specifications 90
Linux - Android users 91
Assembly instructions
Moisture sensitivity and shelf life 93
Mounting 93
Solder Paste 93
Solder paste print 93
Stencil 93
ConnectCore 6 Plus Hardware Reference Manual 3

ConnectCore 6 Plus Hardware Reference Manual 4
Coplanarity 94
SMT pick and place 94
SMT process parameter reference 94
Reflow profile 94
Regulatory information and certifications
United States FCC 97
Labeling requirements 97
Maximum power and frequency specifications (FCC) 98
FCC notices 99
FCC-approved antennas 99
RF exposure 100
Canada (ISED) 100
Maximum power and frequency specifications 100
Labeling requirements 100
Transmitters with detachable antennas 101
Europe ETSI 101
Maximum power and frequency specifications (Europe ETSI) 102
OEM labeling requirements 104
CE labeling requirements 104
Declarations of Conformity 104
Approved antennas 104
Bluetooth SIG-qualified hardware and firmware 104

About the ConnectCore 6 Plus
The ConnectCore 6 Plus is an ultra-compact and highly integrated system-on-module solution based
on the NXP i.MX6QP Cortex-A9 processor family.
With processor speed up to 1.0 GHz, the ConnectCore 6 Plus offers a truly future-proof platform
solution with scalable performance and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with
Bluetooth 4.2 dual mode connectivity.
Its innovative and scalable design maximizes integration flexibility and significantly reduces design
risk in a highly cost-effective, reliable, low-profile surface mount form factor with optimal thermal
management even in the most demanding quad-core system configurations.
Seamless Cloud Connector integration as part of the Digi Linux and Android software platform support
offers secure remote management and web services capabilities through the scalable Digi Remote
Manager.
In addition, Digi offers custom Remote Manager hardware and wireless design services as well as end-
to-end solutions services for cloud integration and app development.
This System-On-Module aims to be the next generation of the ConnectCore 6 Plus for i.MX6 family
modules and is pin-to-pin compatible with them.
Features and functionality 6
Block diagram 7
Power supply architecture 8
Bootstrap 13
Wireless interfaces 14
MCA hardware 20
CryptoAuthentication device 33
Module pinout 34
Signal usage limitations 84
ConnectCore 6 Plus Hardware Reference Manual 5

About the ConnectCore 6 Plus Features and functionality
ConnectCore 6 Plus Hardware Reference Manual 6
Note To serve our customers most effectively, Digi International Inc. has consolidated our cloud
services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased
process does not affect device functionality or the functionality of the web services and other
features. However, you will find instances of both Device Cloud and Digi Remote Manager in some
documentation, firmware, and user interfaces.
Features and functionality
The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a
high number of interfaces. Most of these interfaces are multiplexed and are not available
simultaneously. The module has the following features:
ni.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz
l32 Kbytes L1 Instruction cache
l32 Kbytes L1 Data cache
lUp to 1 MB unified Instruction/Data L2 cache
lNEON MPE (Media Processing Engine) co-processor
nGraphical hardware accelerators:
lIPU (Image Processing Unit)
lVPU (Video Processing Unit)
l3D GPU (Graphics Processing Unit) version 6
l2D GPU (Graphics Processing Unit) version 3
lGPU (OpenVG 1.1 Graphics Processing Unit)
lPrefetch and Resolve Engine
lPrefetch and Resolve Gasket
lASRC (Asynchronous Sample Rate Converter)
n64-bit DDR3-1066 memory interface with a density up to 2 GBytes
n8-bit eMMC support
nDialog DA9063 power management IC (PMIC)
l6x DC/DC buck converters
l11x LDO regulators
lRTC with rechargeable coin cell battery support
l10-bit ADC channels
lGPIO pins
nIEEE 802.11 a/b/g/n/ac WLAN interface
nBluetooth version 4.2 dual mode
nCortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

About the ConnectCore 6 Plus Block diagram
ConnectCore 6 Plus Hardware Reference Manual 7
nDebug interfaces:
lStandard JTAG controller IEEE 1149.1
lETM/ETB support
nSupport of i.MX6QP typical interfaces:
l16/32-bit data/address bus
lSATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)
lDisplay support
oHDMI
o24-bit parallel bus
oDual LVDS
oMIPI/DSI
l2x camera (20-bit parallel bus, MIPI/CSI)
lMMC/SD/SDIO
l1x USB OTG with integrated PHY
l3x USB Host
lPCI Express Gen 2.0 lane
l10/100/1000 M Ethernet MAC
lUART, SPI, I2C, PWM, CAN, I2S and GPIO
nUltra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads
nSecurity accelerators:
lARMTrustZone
lCAAM (cryptographic acceleration and assurance module)
lSNVS (secure non-volatile storage)
lCSU (central security unit)
lA-HABv4 (advanced high-assurance boot)
Block diagram
The figure below shows the block diagram of the NXP i.MX6QP application processor.

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 8
Power supply architecture
The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power
domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required
supply voltages for the module components as well as the carrier board.
The module provides support for a backup battery (coin-cell or super cap) powering the real-time
clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also
supported.
The PMIC generates the following power domains that are available on the module pads:
nOne PMIC switching regulator:
lVGEN_3V3

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 9
nFive PMIC LDO:
lVLDO2
lVLDO3_MCA
lVLDO4
lVLDO6
lVLDO8
lVDD_SD2
lVDD_WLAN_SD1
Signal
name
PMIC
regulator
Output
voltage
Output
accuracy
Maximum
current
Dropout
voltage
(MAX)
Turn on
time
(MAX)
Turn
off
time
(MAX)
Quiescent
current in
OFF mode
(TYP)
VGEN_
3V3
BUCKPERI 3.3 V +/-3% 1500 mA - 1 µA 1.2 ms -
Note The maximum current consumption mentioned in the previous table is a combination of the
current consumed by the module (max 500mA) and by the carrier board for external use (1000mA).
The table below provides the characteristics of the optional LDO outputs:
Signal
name
PMIC
regulator
Output
voltage
Output
accuracy
Default
voltage
Maximum
current
Drop output
voltage
(MAX)
Quiescent current
in OFF mode
(TYP)
VLDO2 LDO2 0.6-
1.86 V
+/-3% 1.8 V 200 mA 150 mV 1 µA
VLDO3_
MCA
LDO3 0.9-
3.44 V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VLDO4 LDO4 0.9-
3.44 V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VLDO6 LDO6 0.9-3.6
V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VLDO8 LDO8 0.9-3.6
V
+/-3% 3.3 V 200 mA 150 mV 1 µA
VDD_
SD2
LDO9 0.95 -
3.6 V
+/-1% 3.3 V 200 mA 150 mV 1 µA
VDD_
WLAN_
SD1
LDO10 0.9 - 3.6
V
+/-3% 3.3 V 300 mA 150 mV 1 µA

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 10
Signal name Turn on time (MAX) Turn off time (MAX)
VLDO2 150 µs 1 ms
VLDO3_MCA 300 µs 1 ms
VLDO4 300 µs 1 ms
VLDO6 200 µs 1 ms
VLDO8 300 µs 1 ms
VDD_SD2 200 µs 1 ms
VDD_WLAN_SD1 200 µs 1 ms
Note For information about using the LDO options, please contact Digi.
VLDO3 is used for supplying MCA processor on the module.
The power management IC located on the module is responsible for generating all required i.MX6QP
processor supply voltages. The following i.MX6QP supplies are available on the module pads:
nNVCC_ENET
nNVCC_EIM
nNVCC_LCD
nNVCC_CSI
nNVCC_RGMII
Some of the I/O supplies are set on the module. See the following table:
Power domain Connection
NVCC_GPIO VGEN_3V3
NVCC_JTAG VGEN_3V3
NVCC_NANDF VGEN_3V3
NVCC_SD1 VDD_WLAN_SD1
NVCC_SD2 VDD_SD2
NVCC_SD3 VGEN_3V3
PCIE_VPH 2.5V (VDDHIGH_CAP_2V5)
The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus
module. See the following table for operating ranges of the remaining I/O supplies.
Power domain Min Max
NVCC_ENET 1.65 V 3.6 V

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 11
Power domain Min Max
NVCC_EIM 1.65 V 3.6 V
NVCC_LCD 1.65 V 3.6 V
NVCC_CSI 1.65 V 3.6 V
NVCC_RGMII in HSIC 1.2 V mode 1.15 V 1.30 V
NVCC_RGMII in RGMII 1.5 V mode 1.43 V 1.58 V
NVCC_RGMII in RGMII 1.8 V mode 1.70 V 1.90 V
NVCC_RGMII in RGMII 2.5 V mode 2.25 V 2.625 V
As shown in the table above, the supplies have a wide operating range. In order to provide the most
cost-effective and flexible solution for a given use-case, the supplies listed in the table need to be
provided by the carrier board integrating the ConnectCore 6 Plus module. However, PMIC power
domains 3.3 V—and LDO2/3/4/6/8 options—are dedicated power sources for supplying i.MX6QP power
domains.
The MCU - assist specific power domain (VLDO3_MCA) available on the ConnectCore 6 Plus LGA pads is
a power supply output powering the on-module Kinetis processor.

About the ConnectCore 6 Plus Power supply architecture
ConnectCore 6 Plus Hardware Reference Manual 12
The following diagram outlines the power supply approach of the ConnectCore 6 Plus. Inputs are
marked red, blue marks are outputs.

About the ConnectCore 6 Plus Bootstrap
ConnectCore 6 Plus Hardware Reference Manual 13
Bootstrap
The ConnectCore 6 Plus module can be configured to boot from different devices and interfaces
determined by the Boot ROM. The configuration of the CPU booting process is done through:
nBOOT_MODE register, which selects the boot mode of the processor
neFUSEs and/or GPIOs, which determine the boot configuration
Four boot modes are available on the i.MX6QP processor. Selection between them is done through
BOOT_MODE[1:0] bits. The bits are externally configurable on two processor IOs, whose values are
latched during boot-up:
BOOT_MODE [1:0] Boot type
00 Boot from fuses
01 Serial downloader
10 Internal boot (default)
11 Reserved
BOOT_MODE[0] and BOOT_MODE[1] are available on dedicated pads on the module.
Note BOOT_MODE[1:0] is set internally to [10] through 10K pull-up and 10K pull-down resistors. So, by
default, the SOM is configured to Internal boot.
Boot from fuses
Boot from fuses is the recommended boot mode for production purposes. When this boot mode is
selected, you must configure several parameters in order to select and configure the system boot
device. These parameters are configured through fuses, which are burned in order to set their values.
This means that the configuration is irreversible.
BOOT_CFG1 register selects the boot device through BOOT_CFG1[7:4] bits:
BOOT_CFG1[7:4] Boot device
0000
NOR/OneNAND (EIM)
0001 Reserved
1xxx Raw NAND
0010 SSD/Hard Disk (SATA)
010x SD/eSD/SDXC
0011 Serial ROM (I2C/SPI)
011x MMC/eMMC

About the ConnectCore 6 Plus Wireless interfaces
ConnectCore 6 Plus Hardware Reference Manual 14
There are many other registers that configure the different boot devices. For a complete description
of the booting configuration, refer to the NXP i.MX6QP Applications Processor Reference Manual
(Chapter 8: System Boot).
Internal Boot
Internal boot is the recommended boot mode for development purposes. When this boot mode is
selected, the selection and configuration of the booting process is done through the same registers
used when booting from fuses. However, this time the values of some registers are overridden using
multiple GPIOs—which are latched during power-up.
The following configuration is done internally in the ConnectCore 6 Plus module in order to enable
booting from the internal eMMC memory:
Bootstrap register bit Corresponding GPIO
Default
configuration
BOOT_CFG1[4] EIM_DA4 10K pull-down
BOOT_CFG1[5] EIM_DA5 10K pull-up
BOOT_CFG1[6] EIM_DA6 10K pull-up
BOOT_CFG1[7] EIM_DA7 10K pull-down
BOOT_CFG2[3] EIM_DA11 10K pull-up
BOOT_CFG2[4] EIM_DA12 10K pull-up
BOOT_CFG2[5] EIM_DA13 10K pull-down
BOOT_CFG2[6] EIM_DA14 10K pull-up
By default, the system is configured to boot from MMC/eMMC (BOOT_CFG1[7:5] = 011). You can
externally change the configuration of these lines to select between different boot devices. To see a
detailed implementation of the boot configuration, check the ConnectCore 6 Plus carrier board
reference design.
CAUTION! Make sure that EIM_EB3 (pad AA18) is not pulled high during boot. Pulling this
signal high enables an infinite loop at start of boot ROM. This feature is exclusively used
for debugging purposes.
Wireless interfaces
The ConnectCore 6 Plus system-on-module combines a wireless local area network (WLAN) and
Bluetooth dual solution to support IEEE802.11 a/b/g/n/ac WLAN standards and Bluetooth 4.2, enabling
seamless integration of WLAN/Bluetooth and Low Energy technology.
The following sections include specifications for the wireless interfaces available on the i.MX6QP
module.

About the ConnectCore 6 Plus Wireless interfaces
ConnectCore 6 Plus Hardware Reference Manual 15
WLAN IEEE 802.11a/b/g/n/ac
The 2.4 GHz band on the ConnectCore 6 Plus module supports 20/40 MHz bandwidths, and the 5 GHz
band supports 20/40/80 MHz bandwidths.
The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the
ConnectCore 6 Plus module.
Modulation and data rates
The following tables list modulation values for ConnectCore 6 Plusmodule supports the following
WLAN standards.
Mode Modulation & coding Rate
802.11b DBPSK 1 Mbps
DQPSK 2 Mbps
CCK 5.5 Mbps
CCK 11 Mbps
802.11ga BPSK-1/2 6 Mbps
BPSK-3/4 9 Mbps
QPSK-1/2 12 Mbps
QPSK-3/4 18 Mbps
16QAM-1/2 24 Mbps
16QAM-3/4 36 Mbps
64QAM-2/3 48 Mbps
64QAM-3/4 54 Mbps
802.11n BPSK-1/2 MCS0
QPSK-1/2 MCS1
QPSK-3/4 MCS2
16QAM-1/2 MCS3
16QAM-3/4 MCS4
64QAM-2/3 MCS5
64QAM-3/4 MCS6
64QAM-5/6 MCS7

About the ConnectCore 6 Plus Wireless interfaces
ConnectCore 6 Plus Hardware Reference Manual 16
Mode Modulation & coding Rate
802.11ac BPSK-1/2 MCS0
QPSK-1/2 MCS1
QPSK-3/4 MCS2
16QAM-1/2 MCS3
16QAM-3/4 MCS4
64QAM-2/3 MCS5
64QAM-3/4 MCS6
64QAM-5/6 MCS7
256QAM-3/4 MCS8
256QAM-5/6 MCS9
Data rate (Mbps) - Non Short Guard Interval (Non-SGI)
Data rate
(Mbps) 802.11b 802.11ga 802.11n 802.11ac
Modulation DBPSK CCK BPSK-
1/2
64QAM-
3/4
BPSK-
1/2
64QAM-
5/6
BPSK-
1/2
64QAM-
5/6
256QAM-
5/6
1
Mbps
11
Mbps
6
Mbps
54
Mbps
MCS0 MCS7 MCS0 MCS7 MCS9
2.4
GHz
HT20 1 11 6 54 6.5 65 6.5 65
HT40 13.5 135 13.5 135 180
5 GHz HT20 6 54 6.5 65 6.5 65
HT40 13.5 135 13.5 135 180
HT80 29.3 292.5 390
Data rate (Mbps) - Short Guard Interval (SGI)
Mode 802.11b 802.11ga 802.11n 802.11ac
Modulation DBPSK CCK BPSK-
1/2
64QAM-
3/4
BPSK-
1/2
64QAM-
5/6
BPSK-
1/2
64QAM-
5/6
256QAM-
5/6
1
Mbps
11
Mbps
6
Mbps
54
Mbps
MCS0 MCS7 MCS0 MCS7 MCS9
2.4
GHz
HT20 1 11 6 54 7.2 72.2 7.2 72.2
HT40 15 150 15 150 200

About the ConnectCore 6 Plus Wireless interfaces
ConnectCore 6 Plus Hardware Reference Manual 17
Mode 802.11b 802.11ga 802.11n 802.11ac
5 GHz HT20 6 54 7.2 72.2 7.2 72.2
HT40 15 150 15 150 200
HT80 32.5 325 433.3
RF channels
The ConnectCore 6 Plus module supports the following frequency bands.
RF band Ch. BW
Ch.
spacing Channel number (Center freq. MHz)
2.4 GHz 20 MHz 5 MHz 1(2412), 2(2417), 3(2422), 4(2427), 5
(2432), 6(2437), 7(2442), 8(2447), 9
(2452), 10(2457), 11(2462), 12(2467),
13(2472), 14(2484)
40 MHz 5 MHz 3(2422), 11(2462)
5 GHz 20 MHz 20 MHz 36(5180), 40(5200), 44(5220), 48
(5240), 52(5260), 56(5280), 60(5300),
64(5320), 100(5500), 104(5520), 108
(5540), 112(5560), 116(5580), 120
(5600), 124(5620), 128(5640), 132
(5660), 136(5680), 140(5700), 144
(5720), 149(5745), 153(5765), 157
(5785), 161(5805), 165(5825)
40 MHz 40 MHz 38(5190), 46(5230), 54(5270), 62
(5310), 102(5510), 110(5550), 118
(5590), 126(5630), 134(5670), 142
(5710), 151(5755), 159(5795)
80 MHz 80 MHz 42(5210), 58(5290), 106(5530), 122
(5610), 138(5690), 155(5775)
Note See Regulatory information and certifications for further details about available RF channels and
their maximum transmit power.
2.4 GHz
2.4 GHz band
channel #
Center frequency
(MHz)
EUROPE
(ETSI)
NORTH AMERICA
(FCC) JAPAN
1 2412 ✔ ✔ ✔
2 2417 ✔ ✔ ✔
3 2422 ✔ ✔ ✔

About the ConnectCore 6 Plus Wireless interfaces
ConnectCore 6 Plus Hardware Reference Manual 18
2.4 GHz band
channel #
Center frequency
(MHz)
EUROPE
(ETSI)
NORTH AMERICA
(FCC) JAPAN
4 2427 ✔ ✔ ✔
5 2432 ✔ ✔ ✔
6 2437 ✔ ✔ ✔
7 2442 ✔ ✔ ✔
8 2447 ✔ ✔ ✔
9 2452 ✔ ✔ ✔
10 2457 ✔ ✔ ✔
11 2462 ✔ ✔ ✔
12 2467 ✔No ✔
13 2472 ✔No ✔
14 2484 No No 802.11b only
5 GHz
5 GHz band
channel # Center frequency (MHz) EUROPE (ETSI) NORTH AMERICA (FCC) JAPAN
36 5180 Indoors ✔ ✔
40 5200 Indoors ✔ ✔
44 5220 Indoors ✔ ✔
48 5240 Indoors ✔ ✔
52 5260 Indoors / DFS / TPC DFS DFS / TPC
56 5280 Indoors / DFS / TPC DFS DFS / TPC
60 5300 Indoors / DFS / TPC DFS DFS / TPC
64 5320 Indoors / DFS / TPC DFS DFS / TPC
100 5500 DFS / TPC DFS DFS / TPC
104 5520 DFS / TPC DFS DFS / TPC
108 5540 DFS / TPC DFS DFS / TPC
112 5560 DFS / TPC DFS DFS / TPC
116 5580 DFS / TPC DFS DFS / TPC
120 5600 DFS / TPC No Access DFS / TPC
124 5620 DFS / TPC No Access DFS / TPC

About the ConnectCore 6 Plus Wireless interfaces
ConnectCore 6 Plus Hardware Reference Manual 19
5 GHz band
channel # Center frequency (MHz) EUROPE (ETSI) NORTH AMERICA (FCC) JAPAN
128 5640 DFS / TPC No Access DFS / TPC
132 5660 DFS / TPC DFS DFS / TPC
136 5680 DFS / TPC DFS DFS / TPC
140 5700 DFS / TPC DFS DFS / TPC
149 5745 SRD ✔No Access
153 5765 SRD ✔No Access
157 5785 SRD ✔No Access
161 5805 SRD ✔No Access
165 5825 SRD ✔No Access
Note
DFS = Dynamic Frequency Selection
TPC = Transmit Power Control
SRD = Short Range Devices 25 mW max power
Receive sensitivity
The following table lists typical receive sensitivity values for the ConnectCore 6 Plus module.
Mode 802.11b 802.11ga 802.11n 802.11ac
Modulation DBPSK CCK BPSK-
1/2
64QAM-
3/4
BPSK-
1/2
64QAM-
5/6
BPSK-
1/2
64QAM-
5/6
256QAM-
5/6
1
Mbps
11
Mbps
6 Mbps 54 Mbps MCS0 MCS7 MCS0 MCS7 MCS9
2.4
GHz
HT20 -90 -88 -90 -75 -82 -64 -82 -64 -
HT40 - - - - -79 -61 -79 -61 -54
5 GHz HT20 - - -90 -75 -82 -64 -82 -64 -
HT40 - - - - -79 -61 -79 -61 -54
HT80 - - - - - - -76 -58 -51
Note Specification is subject to change.
Transmit power
The following table lists nominal transmit power values for the ConnectCore 6 Plus module.

About the ConnectCore 6 Plus MCA hardware
ConnectCore 6 Plus Hardware Reference Manual 20
RF Band Channel BW Standard Output Power (dBm)
2.4 GHz 20 MHz 802.11b 18 (1Mbps) - 18 (11Mbps)
20 MHz 802.11g 18 (6Mbps) - 16 (54Mbps)
20 MHz 802.11n 18 (MCS0) - 15 (MCS7)
40 MHz 802.11n 17 (MCS0) - 15 (MCS7)
40 MHz 802.11ac 17 (MCS0) - 13 (MCS9)
5 GHz 20 MHz 802.11a 13 (6Mbps) - 11 (54Mbps)
20 MHz 802.11n 13 (MCS0) - 10 (MCS7)
40 MHz 802.11n 12 (MCS0) - 9 (MCS7)
40 MHz 802.11ac 12 (MCS0) - 5 (MCS9)
80 MHz 802.11ac 11 (MCS0) - 4 (MCS9)
Note See Regulatory information and certifications for further details about available RF channels and
their maximum transmit power.
Note Due to manufacturing tolerance these nominal output powers may be reduced up to 3 dB.
Bluetooth
The ConnectCore 6 Plus module supports both Bluetooth and Bluetooth Low Energy protocols:
nBluetooth 4.2; backwards compatible with Bluetooth 1.X, 2.X + Enhanced Data Rate, Bluetooth
3.X, Bluetooth 4.0 and Bluetooth 4.1 Bluetooth class 1 and class 2 power-level transmissions
nIntegrated WLAN-Bluetooth coexistence
Note See Bluetooth SIG-qualified hardware and firmware for more information.
MCA hardware
Supported devices
The ConnectCore 6 Plus module is designed to support a Kinetis processor in a QFN48 package. See
below for a list of compatible Kinetis processors that can be used in this package size:
nMKL14Z32VFT4
nMKL14Z64VFT4
nMKL15Z128VFT4
nMKL15Z32VFT4
nMKL15Z64VFT4
nMKL24Z32VFT4