Digi XBee User manual

XBee/XBee-PRO S1 802.15.4 (Legacy)
RF Modules
User Guide

Revision history—90000982
Revision Date Description
S February2015 Updated European restrictions for transmitting below 10 dBm. Updated
the warranty and certification information. Updated programming
examples section. Corrected the maximum value of the IT command.
Corrected P1 command parameters.
T December
2015
Corrected RESET pin information.
U May 2016 Noted that bit 13 of the SC parameter is not available for XBee-PRO
devices. Corrected an error in the I/O line passing parameters table.
Added S1 and Legacy to the product name. Updated the certifications.
V October 2016 Updated and rebranded the documentation.
W June 2017 Modified regulatory and certification information as required by RED
(Radio Equipment Directive).
Trademarks and copyright
Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United
States and other countries worldwide. All other trademarks mentioned in this document are the
property of their respective owners.
© 2017 Digi International Inc. All rights reserved.
Disclaimers
Information in this document is subject to change without notice and does not represent a
commitment on the part of Digi International. Digi provides this document “as is,” without warranty of
any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or
merchantability for a particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.
Warranty
To view product warranty information, go to the following website:
www.digi.com/howtobuy/terms
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 2

XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 3
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Contents
About the XBee/XBee-PRO S1 802.15.4 (Legacy) RF Modules
Technical specifications
Electrical characteristics 10
DC Characteristics (VCC = 2.8 - 3.4 VDC) 10
ADC timing/performance characteristics1 11
Performance specifications 12
Power requirements 12
General specifications 13
Networking and security specifications 13
Regulatory conformity summary 13
Hardware
XBee/XBee-PRO S1 802.15.4 (Legacy) Antenna options 16
XBee/XBee-PRO S1 802.15.4 (Legacy) Mechanical drawings 16
Mounting considerations 16
Pin signals 17
Design notes 19
Power supply design 19
Board layout 19
Antenna performance 19
Pin connection recommendations 20
Keepout area 20
Operation
Serial communications 23
UART data flow 23
Transparent operating mode 24
API operating mode 24
Flow control 25
ADC and Digital I/O line support 26
I/O data format 27
API support 27
Sleep support 27
DIO pin change detect 28
Sample rate (interval) 28
I/O line passing 28
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 4

XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 5
Configuration example 29
Networks 29
Peer-to-peer networks 30
NonBeacon (with coordinator) 30
Association 30
Addressing 33
Unicast mode 33
Broadcast mode 34
Modes of operation 34
Idle mode 35
Transmit/Receive modes 35
Sleep modes 37
Multiple AT commands 40
Parameter format 40
Configuration
Programming the RF module 43
Setup 43
Remote configuration commands 44
Send a remote command 44
Apply changes on remote devices 44
Remote command responses 45
AT commands
Special commands 47
WR (Write) 47
RE (Restore Defaults) 47
FR (Software Reset) 47
Networking and security commands 48
CH (Channel) 48
ID (PAN ID) 48
DH (Destination Address High) 48
DL command 49
MY (16-bit Source Address) 49
SH (Serial Number High) 49
SL (Serial Number Low) 49
RR (XBee Retries) 50
RN (Random Delay Slots) 50
MM (MAC Mode) 51
NI (Node Identifier) 51
ND command 52
NT (Node Discover Time) 53
NO (Node Discovery Options) 53
CE (Coordinator Enable) 54
SC (Scan Channels) 54
SD (Scan Duration) 55
A1 (End Device Association) 56
A2 (Coordinator Association) 57
AI (Association Indication) 57
DA (Force Disassociation) 58
FP (Force Poll) 59
AS (Active Scan) 59

XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 6
EE (AES Encryption Enable) 60
KY (AES Encryption Key) 61
RF interfacing commands 61
PL (Power Level) 62
CA (CCA Threshold) 62
Sleep commands (low power) 63
SM (Sleep Mode) 63
SO (Sleep Options) 63
ST (Time before Sleep) 64
SP (Cyclic Sleep Period) 64
DP (Disassociated Cyclic Sleep Period) 65
Serial interfacing commands 65
BD (Interface Data Rate) 65
RO (Packetization Timeout) 67
API Enable 67
NB (Parity) 67
PR (Pull-up/Down Resistor Enable) 67
I/O settings commands 68
D0 (DIO0 Configuration) 68
D1 (DIO1 Configuration) 69
D2 (AD2/DIO2 Configuration) 69
D3 (DIO3 Configuration) 70
D4 (DIO4 Configuration) 70
D5 (DIO5 Configuration) 71
D6 (DIO6 Configuration) 71
D7 (DIO7 Configuration) 72
D8 (DIO8 Configuration) 72
IU (I/O Output Enable) 73
IT (Samples before TX) 73
IS (Force Sample) 74
IO command 74
IC (DIO Change Detect) 75
IR (Sample Rate) 75
IA (I/O Input Address) 75
T0 (D0 Output Timeout) 76
T1 (D1 Output Timeout) 76
T2 (D2 Output Timeout) 76
T3 (D3 Output Timeout) 77
T4 (D4 Output Timeout) 77
T5 (D5 Output Timeout) 77
T6 (D6 Output Timeout) 78
T7 (D7 Output Timeout) 78
P0 (PWM0 Configuration) 78
P1 (PWM1 Configuration) 79
M0 (PWM0 Output Level) 79
M1 (PWM1 Output Level) 80
PT (PWM Output Timeout) 80
RP (RSSI PWM Timer) 80
Diagnostic commands 81
VR (Firmware Version) 81
VL (Version Long) 81
HV (Hardware Version) 82
DB (Last Packet RSSI) 82
EC (CCA Failures) 82
EA (ACK Failures) 83

XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 7
Command mode options 83
CT (Command Mode Timeout) 83
CN (Exit Command mode) 84
AC (Apply Changes) 84
GT (Guard Times) 84
CC (Command Sequence Character) 85
API operation
API frame specifications 87
API operation (AP parameter = 1) 87
API operation-with escaped characters (AP parameter = 2) 87
Calculate and verify checksums 88
Example 88
API types 89
Modem Status frame - 0x8A 89
AT Command Frame - 0x08 90
AT Command - Queue Parameter Value frame - 0x09 91
AT Command Response frame - 0x88 91
Remote AT Command Request frame - 0x17 92
Remote Command Response frame - 0x97 92
TX Request: 64-bit address frame - 0x00 93
TX Request: 16-bit address - 0x01 94
TX Status frame - 0x89 94
RX (Receive) packet: 64-bit address frame - 0x80 95
RX (Receive) packet 16-bit address frame - 0x81 95
RX (Receive) Packet: 64-bit address IO frame- 0x82 96
RX Packet: 16-bit address I/O frame - 0x83 97
Regulatory information
United States (FCC) 99
OEM labeling requirements 99
FCC notices 99
FCC-approved antennas (2.4 GHz) 100
RF exposure 106
Europe (CE) 106
Maximum power and frequency specifications 106
OEM labeling requirements 106
Declarations of conformity 107
Antennas 107
Canada (IC) 108
Labeling requirements 108
Japan 108
Labeling requirements 108
Brazil ANATEL 108

About the XBee/XBee-PRO S1 802.15.4 (Legacy) RF
Modules
The XBee and XBee-PRO RF Modules were engineered to meet IEEE 802.15.4 standards and support
the unique needs of low-cost, low-power wireless sensor networks. The devices require minimal
power and provide reliable delivery of data between devices.
The devices operate within the ISM 2.4 GHz frequency band and are pin-for-pin compatible with each
other.
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 8

Technical specifications
Electrical characteristics 10
Performance specifications 12
Power requirements 12
General specifications 13
Networking and security specifications 13
Regulatory conformity summary 13
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 9

Technical specifications Electrical characteristics
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 10
Electrical characteristics
The following tables list the electrical characteristics of the XBee/XBee-PRO XBee/XBee-PRO S1
802.15.4 (Legacy) RF Modules.
DC Characteristics (VCC = 2.8 - 3.4 VDC)
Symbol Characteristic Condition Min Typical Max Unit
VIL Input low voltage All Digital Inputs - - 0.35 *
VCC
V
VIH Input high voltage All Digital Inputs 0.7 *
VCC
- - V
VOL Output low voltage IOL = 2 mA, VCC >= 2.7 V - - 0.5 V
VOH Output high
voltage
IOH = -2 mA, VCC >= 2.7
V
VCC
- 0.5
- - V
IIIN Input leakage
Current
VIN = VCC or GND, all
inputs, per pin
- 0.025 1 µA
IIOZ High impedance
leakage current
VIN = VCC or GND, all
I/O High-Z, per pin
- 0.025 1 µA
TX Transmit current VCC = 3.3 V - 45 (XBee)
215, 140 (XBee-PRO,
International)
- mA
RX Receive current VCC = 3.3 V - 50 (XBee)
55 (XBee-PRO)
- mA
PWR-
DWN
Power-down
current
SM parameter = 1 - <10 - µA
ADC characteristics (operating)
Symbol Characteristic Condition Min Typical Max Unit
VREFH VREF - analog-to-digital converter
reference range
2.08 - VDDAD1V
IREF VREF - reference supply current Enabled - 200 - µA
Disabled or
Sleep Mode
- <0.01 0.02 µA
VINDC Analog input voltage2VSSAD -
0.3
VDDAD +
0.3
V
1. VDDAD is connected to VCC.
2. Maximum electrical operating range, not valid conversion range.

Technical specifications Electrical characteristics
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 11
ADC timing/performance characteristics1
Symbol Characteristic Condition Min Typical Max Unit
RAS Source impedance at input2- - - kW
VAIN Analog input voltage3- VREFL - VREFL V
RES Ideal resolution (1 LSB)42.08V < VDDAD < 3.6V 2.031 - 3.516 mV
DNL Differential non-linearity5- - ±0.5 ±1.0 LSB
INL Integral non-linearity6- - ±0.5 ±1.0 LSB
EZS Zero-scale error7- - ±0.4 ±1.0 LSB
FFS Full-scale error8- - ±0.4 ±1.0 LSB
EIL Input leakage error9- - ±0.05 ±5.0 LSB
ETU Total unadjusted error10 - - ±1.1 ±2.5 LSB
1. All accuracy numbers are based on the processor and system being in WAIT state (very little
activity and no I/O switching) and that adequate low-pass filtering is present on analog input
pins (filter with 0.01 µF to 0.1 µF capacitor between analog input and VREFL). Failure to
observe these guidelines may result in system or microcontroller noise causing accuracy errors
which will vary based on board layout and the type and magnitude of the activity. Data
transmission and reception during data conversion may cause some degradation of these
specifications, depending on the number and timing of packets. We advise testing the ADCs in
your installation if best accuracy is required.
2. RAS is the real portion of the impedance of the network driving the analog input pin. Values
greater than this amount may not fully charge the input circuitry of the ATD resulting in
accuracy error.
3. Analog input must be between VREFL and VREFH for valid conversion. Values greater than VREFH
will convert to $3FF.
4. The resolution is the ideal step size or 1LSB = (VREFH–VREFL)/1024.
5. Differential non-linearity is the difference between the current code width and the ideal code
width (1LSB). The current code width is the difference in the transition voltages to and from
the current code.
6. Integral non-linearity is the difference between the transition voltage to the current code and
the adjusted ideal transition voltage for the current code. The adjusted ideal transition voltage
is (Current Code–1/2)*(1/((VREFH+EFS)–(VREFL+EZS))).
7. Zero-scale error is the difference between the transition to the first valid code and the ideal
transition to that code. The Ideal transition voltage to a given code is (Code–1/2)*(1/(VREFH–
VREFL)).

Technical specifications Performance specifications
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 12
8. Full-scale error is the difference between the transition to the last valid code and the ideal
transition to that code. The ideal transition voltage to a given code is (Code–1/2)*(1/(VREFH–
VREFL)).
9. Input leakage error is error due to input leakage across the real portion of the impedance of
the network driving the analog pin. Reducing the impedance of the network reduces this error.
10. Total unadjusted error is the difference between the transition voltage to the current code and
the ideal straight-line transfer function. This measure of error includes inherent quantization
error (1/2LSB) and circuit error (differential, integral, zero-scale, and full-scale) error. The
specified value of ETU assumes zero EIL (no leakage or zero real source impedance).
Performance specifications
The following table describes the performance specifications for the devices.
Specification XBee XBee-PRO
Indoor/urban range Up to 100 ft (30 m) Up to 300 ft. (90 m)
Up to 200 ft (60 m)
International variant
Outdoor RF line-of-sight range Up to 300 ft (90 m) Up to 1 mile (1600 m)
Up to 2500 ft (750 m)
international variant
Transmit power output (software
selectable)
1 mW (0 dBm) 63 mW (18 dBm)*
10 mW (10 dBm) for
international variant
RF data rate 250,000 b/s 250,000 b/s
Serial interface data rate
(software selectable)
1200 b/s - 250 kb/s
(non-standard baud rates also
supported)
1200 bps - 250 kb/s
(non-standard baud rates also
supported)
Receiver sensitivity (typical) -92 dBm
(1% packet error rate)
100 dBm
(1% packet error rate)
Power requirements
The following table describes the power requirements for the XBee/XBee-PRO S1 802.15.4 (Legacy).
Specification XBee XBee-PRO
Supply voltage 2.8 - 3.4 V 2.8 - 3.4 V
Transmit current
(typical)
45 mA
(@3.3 V)
n250 mA (@3.3 V) (150 mA for international variant)
RPSMA module only.
n340 mA (@3.3 V) (180 mA for international variant)

Technical specifications General specifications
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 13
Specification XBee XBee-PRO
Idle/receive current
(typical)
50 mA
(@3.3 V)
55 mA (@ 3.3 V)
Power-down current < 10 uA < 10 uA
General specifications
The following table describes the general specifications for the devices.
Specification XBee XBee-PRO
Operating
frequency
band
ISM 2.4 GHz ISM 2.4 GHz
Dimensions 0.960 in x 1.087 in (2.438 cm x 2.761 cm) 0.960 in x 1.297 in (2.438 cm x 3.294 cm)
Operating
temperature
-40 to 85ºC (industrial) -40 to 85ºC (industrial)
Antenna
options
Integrated whip antenna, embedded
PCB antenna, U.FL connector, RPSMA
connector
Integrated whip antenna, embedded
PCB antenna, U.FL connector, RPSMA
connector
Networking and security specifications
The following table describes the networking and security specifications for the devices.
Specification XBee XBee-PRO
Supported network topologies Point-to-point, point-to-multipoint and
peer-to-peer
Number of channels (software
selectable)
16 direct sequence channels 12 direct sequence
channels
Addressing options PAN ID, channel and addresses PAN ID, channel and
addresses
Regulatory conformity summary
This table describes the agency approvals for the devices.
Specification XBee XBee-PRO
United States (FCC
Part 15.247)
OUR-XBEE OUR-XBEEPRO
Industry Canada (IC) 4214A-XBEE 4214A-XBEEPRO

Technical specifications Regulatory conformity summary
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 14
Specification XBee XBee-PRO
Europe (CE) Yes Yes (Maximum 10 dBm transmit power output)1
Japan R201WW07215214 R201WW08215111
(Maximum 10 dBm transmit power output)*
Wire, chip, RPMSA, and U.FL versions are certified for
Japan. PCB antenna version is not.
Australia/New
Zealand
RCM/R-NZ RCM/R-NZ
Brazil ANATEL 0369-15-
1209
ANATEL 0378-15-1209
1See Regulatory information or region-specific certification requirements.

Hardware
XBee/XBee-PRO S1 802.15.4 (Legacy) Antenna options 16
XBee/XBee-PRO S1 802.15.4 (Legacy) Mechanical drawings 16
Mounting considerations 16
Pin signals 17
Design notes 19
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 15

Hardware XBee/XBee-PRO S1 802.15.4 (Legacy) Antenna options
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 16
XBee/XBee-PRO S1 802.15.4 (Legacy) Antenna options
The ranges specified are typical for the integrated whip (1.5 dBi) and dipole (2.1 dBi) antennas. The
printed circuit board (PCB) antenna option provides advantages in its form factor; however, it typically
yields shorter range than the whip and dipole antenna options when transmitting outdoors. For more
information, see XBee and XBee-PRO OEM RF Module Antenna Considerations Application Note.
XBee/XBee-PRO S1 802.15.4 (Legacy) Mechanical drawings
The following graphics show the mechanical drawings of the XBee / XBee-PRO OEM RF Modules. The
XBee and XBee-PRO RF Modules are pin-for-pin compatible.
Note The antenna options not shown.
Mounting considerations
We design the through-hole module to mount into a receptacle so that you do not have to solder the
module when you mount it to a board. The development kits may contain RS-232 and USB interface
boards that use two 20-pin receptacles to receive modules.
The following illustration shows the module mounting into the receptacle on the RS-232 interface
board.

Hardware Pin signals
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 17
Century Interconnect manufactures the receptacles used on Digi development boards. Several other
manufacturers provide comparable mounting solutions; however, Digi currently uses the following
receptacles:
nThrough-hole single-row receptacles: Samtec part number: MMS-110-01-L-SV (or equivalent)
nSurface-mount double-row receptacles: Century Interconnect part number: CPRMSL20-D-0-1
(or equivalent)
nSurface-mount single-row receptacles: Samtec part number: SMM-110-02-SM-S
Note We recommend that you print an outline of the module on the board to indicate the
correct orientation for mounting the module.
Pin signals
The following image shows the pin numbers; it shows the device's top sides, the shields are on the
bottom.
The following table describes the pin assignments for the devices. A horizontal line above the signal
name indicates low-asserted signals.
Pin Name Direction Description
1VCC - Power supply
2DOUT Output UART data out

Hardware Pin signals
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 18
Pin Name Direction Description
3 DIN/CONFIG Input UART data In
4DO81Either Digital output 8
5 RESET Input/Open
drain output
Device reset (reset pulse must be at least 200 ns). This
must be driven as an open drain/collector. The device
drives this line low when a reset occurs. Never drive this
line high.
6PWM0/RSSI Either PWM output 0 / RX signal strength indicator
7PWM1 Either PWM output 1
8[reserved] - Do not connect
9 DTR/SLEEP_RQ/DI8 Either Pin sleep control line or digital input 8
10 GND - Ground
11 AD4/DIO4 Either Analog input 4 or digital I/O 4
12 CTS /DIO7 Either Clear-to-send flow control or digital I/O 7
13 ON/SLEEP Output Device status indicator
14 VREF Input Voltage reference for A/D inputs
15 Associate/AD5/DIO5 Either Associated indicator, analog input 5 or digital I/O 5
16 RTS/DIO6 Either Request-to-send flow control, or digital I/O 6
17 AD3/DIO3 Either Analog input 3 or digital I/O 3
18 AD2/DIO2 Either Analog input 2 or digital I/O 2
19 AD1/DIO1 Either Analog input 1 or digital I/O 1
20 AD0/DIO0 Either Analog input 0, digital I/O 0
Notes:
nMinimum connections: VCC, GND, DOUT and DIN
nMinimum connections for updating firmware: VCC, GND, DIN, DOUT, RTS and DTR
nSignal direction is specified with respect to the module
nThe module includes a 50 kΩ pull-up resistor attached to RESET
nYou can configure several of the input pull-ups using the PR command
nLeave any unused pins disconnected
1Function is not supported at the time of this release.

Hardware Design notes
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 19
Design notes
The XBee modules do not specifically require any external circuitry specific connections for proper
operation. However, there are some general design guidelines that we recommend for help in
troubleshooting and building a robust design.
Power supply design
A poor power supply can lead to poor device performance, especially if you do not keep the supply
voltage within tolerance or if it is excessively noisy. To help reduce noise, place a 1.0 μF and 8.2 pF
capacitor as near as possible to pin 1 on the PCB. If you are using a switching regulator for the power
supply, switch the frequencies above 500 kHz. Limit the power supply ripple to a maximum 100 mV
peak to peak.
Board layout
We design XBee devices to be self sufficient and have minimal sensitivity to nearby processors,
crystals or other printed circuit board (PCB) components. Keep power and ground traces thicker than
signal traces and make sure that they are able to comfortably support the maximum current
specifications. There are no other special PCB design considerations to integrate XBee devices, with
the exception of antennas.
Antenna performance
Antenna location is important for optimal performance. The following suggestions help you achieve
optimal antenna performance. Point the antenna up vertically (upright). Antennas radiate and receive
the best signal perpendicular to the direction they point, so a vertical antenna's omnidirectional
radiation pattern is strongest across the horizon.
Position the antennas away from metal objects whenever possible. Metal objects between the
transmitter and receiver can block the radiation path or reduce the transmission distance. Objects
that are often overlooked include:
nmetal poles
nmetal studs
nstructure beams
nconcrete, which is usually reinforced with metal rods
If you place the device inside a metal enclosure, use an external antenna. Common objects that have
metal enclosures include:
nvehicles
nelevators
nventilation ducts
nrefrigerators
nmicrowave ovens
nbatteries
ntall electrolytic capacitors
Do not place XBee devices with the chip or integrated PCB antenna inside a metal enclosure.
Do not place any ground planes or metal objects above or below the antenna.

Hardware Design notes
XBee/XBee-PRO S1 802.15.4 (Legacy) User Guide 20
For the best results, mount the device at the edge of the host PCB. Ensure that the ground, power,
and signal planes are vacant immediately below the antenna section.
Pin connection recommendations
The only required pin connections are VCC, GND, DOUT and DIN. To support serial firmware updates,
you should connect VCC, GND, DOUT, DIN, RTS, and SLEEP (DTR).
Leave all unused pins disconnected. Pull all inputs on the device high with internal pull-up resistors
using the PR command. You do not need a specific treatment for unused outputs.
Other pins may be connected to external circuitry for convenience of operation including the Associate
LED pin (pin 15). The Associate LED flashes differently depending on the state of the device.
If analog sampling is desired, attach the VRef (pin 14) to a voltage reference.
Keepout area
We recommend that you allow a “keepout” area, as shown in the following drawing.