Digi XBee3-PRO Micro Quick user guide

XBee3™
RF Module
Hardware Reference Manual

Revision history—900001543
Revision Date Description
A October 2017 Initial release.
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XBee3™ RF Module Hardware Reference Manual 2

Contents
XBee3™ RF Module Hardware Reference Manual
General XBee3 specifications
General specifications 7
Regulatory conformity summary 7
Serial communication specifications 8
UART pin assignments 8
GPIO specifications 8
802.15.4-specific specifications
Performance specifications 10
Power requirements 10
Networking and security specifications 10
Communication interface specifications 10
Hardware
Mechanical drawings 12
XBee3 surface-mount (U.FL/RF Pad) 12
XBee3 surface-mount (embedded antenna) 13
XBee3 micro (U.FL/RF Pad) 14
XBee3 micro (chip antenna) 15
Pin signals for the XBee3 surface-mount module 15
Pin signals for the XBee3 micro module 18
Design notes 21
Power supply design 21
Board layout 21
Antenna performance 22
Recommended pin connections 22
Design notes for surface mount PCB antenna and micro footprint chip antenna devices 22
Design notes for RF pad devices 24
Regulatory information
United States (FCC) 28
OEM labeling requirements 28
FCC notices 28
XBee3™ RF Module Hardware Reference Manual 3

XBee3™ RF Module Hardware Reference Manual 4
FCC-approved antennas (2.4 GHz) 29
RF exposure 35
Europe (CE) 35
Maximum power and frequency specifications 36
OEM labeling requirements 36
Declarations of conformity 37
Antennas 37
IC (Industry Canada) 37
Labeling requirements 37
For XBee3: 37
RF Exposure 38
Manufacturing information
Recommended solder reflow cycle 40
Handling and storage 40
Recommended footprint 41
Flux and cleaning 44
Reworking 44

XBee3™ RF Module Hardware Reference Manual
This manual provides information for the XBee3 RF Module hardware. The XBee3 RF Module can be
either the micro or the surface-mount form factor.
For more information about the operation and programming functions of the device, see the XBee3®
Zigbee® User Guide.
XBee3™ RF Module Hardware Reference Manual 5

General XBee3 specifications
The following tables provide general specifications for the hardware.
General specifications 7
Regulatory conformity summary 7
Serial communication specifications 8
GPIO specifications 8
XBee3™ RF Module Hardware Reference Manual 6

General XBee3 specifications General specifications
XBee3™ RF Module Hardware Reference Manual 7
General specifications
The following table describes the general specifications for the devices.
Specification XBee3/XBee3-PRO Micro XBee3/XBee3-PRO surface-mount
Operating frequency
band
ISM 2.4 - 2.5 GHz
Form factor Micro Surface-mount
Dimensions Micro: 1.36 cm x 1.93 cm x 0.241 cm
(0.534 in x 0.760 in x 0.095 in)
Surface-mount: 2.199 x 3.4 x 0.368
cm (0.866 x 1.33 x 0.145 in)
Operatingtemperature -40 to 85 °C (industrial)
Antenna options RF pad, chip antenna, or U.FL
connector
RF pad, embedded antenna, or
U.FL connector
Regulatory conformity summary
This table describes the agency approvals for the devices.
Approval XBee3 XBee3-PRO
United States (FCC Part 15.247) FCC ID: MCQ-XBEE3 FCC ID: MCQ-XBEE3
Industry Canada (IC) IC: 1846A-XBEE3 IC: 1846A-XBEE3
FCC/IC Test Transmit Power Output range -6.8 to +19.9 dBm -6.8 to +19.9 dBm
Europe (CE) Yes
RoHS Compliant

General XBee3 specifications Serial communication specifications
XBee3™ RF Module Hardware Reference Manual 8
Serial communication specifications
The XBee3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART).
UART pin assignments
Specifications Device pin number
UART pins XBee3 Micro XBee3 Surface-mount
DOUT/DIO13 3 3
DIN / CONFIG/DIO14 4 4
CTS / DIO7 24 25
RTS/ DIO6 27 29
GPIO specifications
XBee3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available. The exact list
depends on the device configuration as some GPIO pads are used for purposes such as serial
communication.
GPIO electrical specification Value
Voltage - supply 2.1 - 3.6 V
Low switching threshold 0.3 x VCC
High switching threshold 0.7 x VCC
Input pull-up resistor value 40 kΩ(typical)
Input pull-down resistor value 40 kΩ(typical)
Output voltage for logic 0 0.2 x VCC (maximum)
Output voltage for logic 1 0.8 x VCC (minimum)
Output source/sink current 50 mA (maximum)
Total output current (for GPIO pads) 200 mA (maximum)

802.15.4-specific specifications
The following tables provide specifications specific to the XBee3 RF Module when using the 802.15.4
physical layer, for example: Zigbee, DigiMesh, and so forth.
Performance specifications 10
Power requirements 10
Networking and security specifications 10
Communication interface specifications 10
XBee3™ RF Module Hardware Reference Manual 9

802.15.4-specific specifications Performance specifications
XBee3™ RF Module Hardware Reference Manual 10
Performance specifications
The following table describes the performance specifications for the devices.
Specification XBee3 XBee3-PRO
Indoor/urban range Up to 60 m (200 ft) Up to 90 m (300 ft)
Outdoor RF line-of-sight range Up to 1200 m (4000 ft) Up to 3200 m (2 mi)
Transmit power output (maximum) 6.3 mW (+8 dBm) 79 mW (+19 dBm)
RF data rate 250,000 b/s
Receiver sensitivity -103 dBm
Power requirements
The following table describes the power requirements for the XBee3 RF Module.
Specification XBee3 XBee3-PRO
Adjustable power Yes
Supply voltage 2.1 - 3.6 V
Operating current (transmit) 40 mA @ +3.3 V, +8 dBm 135 mA @ +3.3 V, +19 dBm
Operating current (receive) 15 mA
Power-down current 1.7 µA @ 25° C
Networking and security specifications
The following table describes the networking and security specifications for the devices.
Specification XBee3/XBee3-PRO
Supported network topologies Point-to-point, point-to-multipoint, peer-to-peer, and DigiMesh
Number of channels 16 Direct sequence channels
Interface immunity Direct Sequence Spread Spectrum (DSSS)
Channels 11 to 26
Addressing options PAN ID and addresses, cluster IDs and endpoints (optional)
Communication interface specifications
The following table provides the device's communication interface specifications.
Interface options
UART 250 Kb/s maximum