Ebyte E220-900M30S User manual

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
0
E220-900M30S
LLCC68 868/ 915MHz 1W SPI SMD Lora Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
2
Contents
Disclaimer...............................................................................................................................................................................3
Features...........................................................................................................................................................................4
1 Introduction..........................................................................................................................................................................5
1.1 Brief Introduction..................................................................................................................................................... 5
1.2 Application................................................................................................................................................................5
2 Specification and parameter................................................................................................................................................ 5
2.1 limit parameters........................................................................................................................................................ 5
2.2 Operating parameter................................................................................................................................................. 6
3 Size and pin definition......................................................................................................................................................... 7
4 Basic operation.................................................................................................................................................................... 8
4.1 Hardware design....................................................................................................................................................... 8
4.2 Programming............................................................................................................................................................ 9
5 Basic application................................................................................................................................................................10
5.1 Basic circuit............................................................................................................................................................ 10
6 FAQ....................................................................................................................................................................................10
6.1 Communication range is too short..........................................................................................................................10
6.2 Module is easy to damage...................................................................................................................................... 11
6.3 BER(Bit Error Rate) is high................................................................................................................................... 11
7 Production guidance.......................................................................................................................................................... 12
7.1 Reflow soldering temperature................................................................................................................................ 12
7.2 Reflow soldering curve...........................................................................................................................................12
8 E220 series.........................................................................................................................................................................13
9 Antenna recommendation.................................................................................................................................................. 13
9.1 Recommendation.................................................................................................................................................... 13
10. Packing method for batch order......................................................................................................................................13
Revision history....................................................................................................................................................................14
About us................................................................................................................................................................................14

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no
liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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Features
Compared with the SX1276 module, the LLCC68 module has significant advantages of lower power consumption,
faster speed and longer distance;
The measured distance can reach 10km;
Built-in PA+LNA, greatly improving the communication distance and stability;
The maximum transmitting power is 1W, software is multi-level adjustable;
Support global license free ISM 868 / 915MHz band;
In LoRaTM mode, the data transmission rate is 1.76kbps ~ 62.5kbps;
FSK mode supports up to 300kbps data transmission rate;
FIFO has large capacity and supports 256 byte data cache;
Support spread spectrum factor SF5, SF6, SF7, SF8, SF9, SF10, SF11;
Support 3 ~ 5.5V power supply, more than 3.3V power supply can guarantee the best performance;
Industrial standard design, support - 40 ~ 85 ° C long-term use;
Dual RF interface is optional (IPEX / stamp hole), which is convenient for secondary development and integration.

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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1 Introduction
1.1 Brief Introduction
E220-900M30S is 1W module developed independently based
on new generation of LoRaTM RF chip LLCC68 from Semtech.
LLCC68 is suitable for 868MHz/915MHz SMD wireless module and
uses industrial 32mhz crystal oscillator.
The original imported LLCC68 is used as the core of the
module, a power amplifier (PA) and a low noise amplifier (LNA) are
built on the original basis, so that the maximum transmission power
reaches 1W and the receiving sensitivity is further improved. In the
overall communication Compared with products without power
amplifier and low noise amplifier, the stability is greatly improved.
Compared with the previous generation of LoRaTM transceivers, the
anti-interference performance and communication distance have
been improved, further opening the gap with FSK and GFSK
modulation products. The product can cover an ultra-wide frequency range of 850~930MHz.
Because the module is a pure RF transceiver module, it needs to use MCU driver or special SPI debugging tool.
1.2 Application
Home security alarm and remote keyless entry;
Smart home and industrial sensors, etc;
Wireless alarm security system;
Building automation solutions;
Wireless industrial remote controller;
Health care products;
Advanced meter reading architecture (AMI);
Automotive industry applications.
2 Specification and parameter
2.1 limit parameters

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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Main parameter
Performance
Remarks
Min
Max
Supply voltage (V)
0
5.5
Over 5.5V permanently burned module
Blocking power (DBM)
-
10
The burning probability is small in close range use
Working temperature (℃)
-40
+85
Industrial grade
2.2 Operating parameter
Main parameter
Performance
Remarks
Min
Type
Max
Working voltage (V)
3
5
5.5
≥5 V ensures output power
Communication level (V)
3.3
Probably burnout when using 5V TTL
Working temperature (℃)
-40
-
+85
Industrial Design
Operating frequency band (MHz)
850
868/915
930
Support ISM band
Power
Consumption
TX current（mA）
700
Instantaneous power consumption
RX current（mA）
14
-
Sleep current （μA）
0.7
Software shutdown
Max TX power（dBm）
29.5
30
30.5
-
Receiving sensitivity（dBm）
-129
-124dbm,BW_L=125kHz,SF = 7,LORATM;
-129dbm,BW_L=125kHz,SF = 9,LORATM;
-121dbm,BW_L=250kHz,SF = 7,LORATM;
-129dbm,BW_L=250kHz,SF =10,LORATM;
-117dbm,BW_L=500kHz,SF = 7,LORATM;
-127dbm,BW_L=500kHz,SF =11,LORATM;
Air data rate
GFSK（bps）
0.6k
300k
User programming control
LoRa（bps）
1.76k
62.5k
User programming control
Main parameter
Description
Remark
Reference distance
10km
In clear and open environment, the antenna gain is 5dBi, the antenna
height is 2.5m, and the air speed is 2.4kbps.
FIFO
256Byte
Maximum length of single transmission
Crystal frequency
32MHz
Passive crystal oscillator, 24pF is recommended
Modulation mode
LoRa
Lora modulation is recommended
Packaging method
SMD
-
Interface mode
Stamp hole
The spacing is 2.54mm
Communication interface
SPI
0-10Mbps
Dimension
38.5*24 mm
Including shield
RF interface
Stamp hole / IPEX
-

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
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3 Size and pin definition
Pin No.
Item
Direction
Description
1
GND
Ground, connect to power reference ground
2
GND
Ground, connect to power reference ground
3
GND
Ground, connect to power reference ground
4
GND
Ground, connect to power reference ground
5
GND
Ground, connect to power reference ground
6
RXEN
Input
RF switch receive control pin, connect external MCU IO, high level
effective
7
TXEN
Input
RF switch emission control pin, connected to external MCU IO or dio2,
high level effective
8
DIO2
Input / output
Configurable universal IO port (see llcc68 manual for details)
9
VCC
Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter
capacitor externally)
10
VCC
Power supply, range 3V ~ 5.5V (it is recommended to add ceramic filter
capacitor externally)
11
GND
Ground, connect to power reference ground
12
GND
Ground, connect to power reference ground

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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13
DIO1
Input / output
Configurable universal IO port (see LLCC68 manual for details)
14
BUSY
Output
For status indication (see LLCC68 manual for details)
15
NRST
Input
Chip reset trigger input pin, low level effective
16
MISO
Output
SPI data output pin
17
MOSI
Input
SPI data input pin
18
SCK
Input
SPI clock input pin
19
NSS
Input
The module chip selection pin is used to start a SPI communication
20
GND
Ground, connect to power reference ground
21
ANT
RF interface, stamp hole
22
GND
Ground, connect to power reference ground
For the pin definition, software driver and communication protocol of the module, please refer to the official LLCC68
datasheet of Semtech.
4 Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply, such as reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that it is between the recommended supply voltage. If it exceeds the
maximum value, the module will be permanently damaged;
Please check the stability of the power supply. The voltage should not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to keep more than 30% margin,
which is conducive to the long-term stable operation of the whole machine;
The module should be far away from the power supply, transformer, high frequency wiring and other parts with
large electromagnetic interference;
The high-frequency digital wiring, high-frequency analog wiring and power wiring must avoid the lower part of the
module. If it is necessary to pass through the lower part of the module, it is assumed that the module is welded on
the top layer, and the copper is laid on the top layer of the module contact part (all copper is laid and well grounded),
which must be close to the digital part of the module and laid on the bottom layer;
Assuming that the module is welded or placed in the top layer, it is also wrong to route at will in the bottom layer or
other layers, which will affect the spurious and receiving sensitivity of the module in different degrees;
Assuming that there are large electromagnetic interference devices around the module will greatly affect the
performance of the module, it is recommended to keep away from the module according to the intensity of
interference, and appropriate isolation and shielding can be done if the situation permits;
Assuming that there are lines (high-frequency digital, high-frequency analog and power lines) with large
electromagnetic interference around the module, the performance of the module will be greatly affected. According
to the intensity of interference, it is recommended to keep away from the module. If the situation permits,
appropriate isolation and shielding can be done;
If 5V level is used for communication line, 1k-5.1k resistor must be connected in series (not recommended, there is

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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still risk of damage);
The antenna installation structure has a great influence on the module performance, so it is necessary to ensure that
the antenna is exposed, preferably vertically upward. When the module is installed inside the housing, the
high-quality antenna extension line can be used to extend the antenna to the outside of the housing;
The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance.
4.2 Programming
This module is LLCC68+PA+LNA, and its driving method is completely equivalent to LLCC68, and users can
operate in accordance with the LLCC68 chipset datasheet;
DIO1, DIO2 and DIO3 are common IO ports, which can be configured into multiple functions. DIO2 can be
connected to TXEN, not to IO port of MCU, and is used to control RF switch emission. See LLCC68 manual for
details, and can be suspended if not used;
The internal use of 32mhz passive crystal oscillator, without pin control, software program control can be;
The differences between LLCC68 and SX1262 / SX1268 were as follows
1. SX1262 / SX1268 supports spread spectrum factors SF5, SF6, SF7, SF8, SF9, SF10, SF11 and SF12;
LLCC68 supports spread spectrum factors SF5, SF6, SF7, SF8, SF9, SF10 and SF11.
2. LLCC68 can set the spread spectrum factor and receive bandwidth:
LoRa® Rx/Tx, BW = 125 – 250 – 500 kHz
LoRa®，SF = 5 - 6 - 7 - 8 - 9 for BW = 125 kHz ，
LoRa®，SF = 5 - 6 - 7 - 8 - 9 - 10 for BW = 250 kHz ，
LoRa®，SF = 5 - 6 - 7 - 8 - 9 - 10 - 11 for BW = 500 kHz；

Chengdu Ebyte Electronic Technology Co.,Ltd. E220-900M30S User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
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5 Basic application
5.1 Basic circuit
6 FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power;
Due to antenna quality or poor matching between antenna and module.