Ebyte E78-900M22S1A User manual

Chengdu Ebyte Electronic Technology Co.,Ltd E78-900M22S1A user manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd
E78-900M22S1A
ASR6505 868/915MHz LoRaWAN RF Module

Chengdu Ebyte Electronic Technology Co.,Ltd E78-900M22S1A user manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd
1
Contents
1.OVERVIEW..............................................................................................................................................................................................3
1.1 INTRODUCTION.............................................................................................................................................................. 3
2 PARAMETERS.........................................................................................................................................................................................4
2.1 LIMIT PARAMETERS:...................................................................................................................................................... 4
2.2 OPERATING PARAMETERS:............................................................................................................................................. 4
3. SIZE AND PIN DEFINITION.................................................................................................................................................................6
3.1 SIZE AND PIN DEFINITION..............................................................................................................................................6
3.2 PIN DEFINITION.............................................................................................................................................................. 7
4 HARDWARE AND SOFTWARE GUIDE............................................................................................................................................... 8
4 PROGRAMMING DIAGRAM AND GUIDE......................................................................................................................................... 9
4.1 E78-900M22S1A BURNING INTERFACE.........................................................................................................................9
5. PRODUCTION GUIDANCE................................................................................................................................................................ 10
5.1 REFLOW SOLDERING TEMPERATURE............................................................................................................................ 10
5.2 REFLOW SOLDERING CURVE........................................................................................................................................ 10
6.FAQ......................................................................................................................................................................................................... 11
6.1 COMMUNICATION RANGE IS TOO SHORT...................................................................................................................... 11
6.2 MODULE IS EASY TO DAMAGE..................................................................................................................................... 11
6.3 BER (BIT ERROR RATE)IS HIGH................................................................................................................................. 11
REVISION HISTORY............................................................................................................................................................................... 12
ABOUT US................................................................................................................................................................................................ 12

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
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Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no liability
for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, Please visit www.ebyte.com

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
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1.Overview
1.1 Introduction
The E78 series products are radio frequency transceiver modules with
multiple frequency bands designed and produced by Ebyte, with long
communication distance and extremely low current consumption in low
power consumption mode. This module is a small-volume patch type (pin
spacing 1.1mm).
The E78 series products use ASR's ASR6505 chip, which is a single-chip
SoC integrated with ultra-low power LoRa, using Semtech's advanced
low-power LoRa Transceiver SX1262, and integrates a STM8L152 low-power MCU, Flash capacity 64kB, SRAM
Capacity 4kB, EEPROM capacity 2K, small size, ultra-low power consumption, support LoRaWAN, LinkWAN
multiple protocol standards, suitable for a variety of Internet of Things application scenarios, is currently the best
choice for LPWAN application chips.
The E78 series products are hardware platforms and cannot be used independently. Users need to carry out
secondary development. (We can customize standard LoRaWan and Ali linkWan nodes)
Features:
Under ideal test conditions, the communication distance can reach 5.5km;
The maximum transmit power is 22dBm, and the software is multi-level adjustable;
Support license-free ISM 868/915MHz frequency band;
Support multiple modulation modes (GFSK Mode, LoRa);
Support 1.8～3.7V power supply, power supply greater than 3.3V can guarantee the best performance;
Industrial standard design, supporting long-term use at -40～+85℃;
Dual antennas are optional (IPX/PCB), which is convenient for users to develop and integrate;
Based on the ASR6505 chip development, users can directly use it for secondary development.
Applications:
Smart home and industrial sensors, etc.;
Security system, positioning system;
Wireless remote control, UAV;
Wireless game remote control;
Healthcare products;
Wireless voice, wireless headset;
Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd
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2 Parameters
2.1 Limit Parameters:
Main Parameters
Value
Notice
Min.
Max.
Power supply voltage (V)
0
3.9
Over 3.9V will permanently burn the module
Blocking power (dBm)
-
10
The probability of burning is small when used at
close range
Working temperature (℃)
-40
+85
Industrial grade
2.2 Operating Parameters:
Main Parameters
Value
Notice
Min.
Typical
Max.
Working voltage (V)
1.8
3.3
3.7
≥3.3V can guarantee output power
Communication level (V)
-
3.3
-
Using 5V TTL is risky to burn
Working temperature (℃)
-40
-
+85
Industrial design
Working frequency (MHz)
850
868/915
925
Support ISM frequency band
Power
Emission current (mA)
-
145
-
Instantaneous power consumption
Receiving current (mA)
-
13
-
-
Sleep current (μA)
-
2.0
-
Software shutdown
Maximum transmit power (dBm)
-
21.5
22
-
Receiving sensitivity (dBm)
-122
-123
-126
The air rate is 595kbps
Air rate
LoRa（bps）
-
-
62.5K
User programmable customization
GFSK（bps）
-
-
300K
User programmable customization
Parameters
Value
Notice
Ideal Range
5500m
At Max TX power and 2.4kbps air rate, Two modules in a line of
sight, clear weather, with 5dbi antennas at 2.5meters.
Crystal frequency
32MHz
TXCO
Modulation
LoRa(recommended)
GFSK ，LoRa
Encapsulation method
SMA
-
Interface method
Stamp-hole
Diameter 1.1mm
Dimensions
26*16mm
-
RF interface
IPEX/stamp-hole
Equivalent impedance is about 50Ω

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd
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Hardware Notice:
When designing the power supply circuit for the module, it is recommended to reserve more than 30% of
the remaining amount, and the whole machine is beneficial for long-term stable operation;；
The current required for the moment of launch is large but often because the launch time is extremely
short, the total energy consumed may be smaller;
When the customer uses an external antenna, the impedance matching degree between the antenna and
the module at different frequency points will affect the magnitude of the emission current to varying
degrees;
The current consumed by the RF chip in the pure receiving state is called the receiving current. Some RF
chips with communication protocols or developers have loaded some self-developed protocols on the
whole machine, which may cause the receiving current of the test to be too large；
When the customer uses an external antenna, the impedance matching degree between the antenna and
the module at different frequency points will affect the magnitude of the emission current to varying
degrees；
The shutdown current is often much smaller than the current consumed by the power supply part of the
whole machine at no load, without excessive demand;
Due to the inherent error of the material itself, a single LRC component has an error of ±0.1%, but
hesitant to use multiple LRC components in the entire RF loop, there will be accumulation of errors,
resulting in differences in the emission current and the receiving current of different modules；
Reducing the transmit power can reduce power consumption to a certain extent, but reducing the transmit
power transmission for many reasons will reduce the efficiency of the internal PA.

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd
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3. Size and Pin definition
3.1 Size and Pin definition

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3.2 Pin definition
No.
Name
Direction
Function
1
GND
-
Ground wire, connected to the power reference ground
2
LCD-SEG10
Input/Output
MCU GPIO
3
LCD-SEG11
Input/Output
MCU GPIO
4
LCD-SEG12
Input/Output
MCU GPIO
5
LCD-SEG13
Input/Output
MCU GPIO
6
LCD-SEG14
Input/Output
MCU GPIO
7
LCD-SEG15
Input/Output
MCU GPIO
8
LCD-SEG16
Input/Output
MCU GPIO
9
LCD-SEG17
Input/Output
MCU GPIO
10
I2C-SDA
Input/Output
I2C-SDA pin
11
I2C-SCL
Input/Output
I2C-SCL pin
12
ADC-IN0
Input
ADC input pin
13
ADC-IN1
Input
ADC input pin
14
GPIO2
Input/Output
MCU GPIO
15
GPIO3
Input/Output
MCU GPIO
16
GPIO4
Input/Output
MCU GPIO
17
ADC_IN2
Input
ADC input pin
18
GND
-
Ground wire, connected to the power reference ground
19
ANT
Output
Antenna interface, stamp hole (50 ohm characteristic impedance)
20
GND
-
Ground wire, connected to the power reference ground
21
GND
-
Ground wire, connected to the power reference ground
22
GND
-
Ground wire, connected to the power reference ground
23
GND
-
Ground wire, connected to the power reference ground
24
SPI-NSS
Input
SPI selection pin, external SPI can be selected
25
SPI-SCK
Input
SPI-SCK pin, can be used as external SPI
26
SPI_MISO
Output
SPI_MISO pin, can be used as external SPI
27
SPI_MOSI
Input
SPI MOSI pin, can be used as external SPI
28
LCD-SEG1
-
MCU GPIO
29
LCD-SEG2
Input/Output
MCU GPIO
30
SWIM
Input/Output
Programming pin
31
NRST
Input
External reset pin
32
LCD-COM0
Input/Output
MCU GPIO
33
LCD-COM1
Input/Output
MCU GPIO
34
LCD-COM2
Input/Output
MCU GPIO
35
VREFP
Input
ADC reference voltage input
36
UART1-RX
Input
UART1-RX pin
37
UART1-TX
Output
UART1-TX pin
38
VLCD
Input
VLCD pin

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd
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39
LCD-SEG0
Input/Output
MCU GPIO
40
GND
-
Ground wire, connected to the power reference ground
41
LCD-SEG3
Input/Output
MCU GPIO
42
LCD-COM3
Input/Output
MCU GPIO
43
LCD-SEG4
Input/Output
MCU GPIO
44
LCD-SEG5
Input/Output
MCU GPIO
45
UART0-RX
Input
UART0-RX pin
46
UART0-TX
Output
UART0-TX pin
47
LCD-SEG6
Input/Output
MCU GPIO
48
LCD-SEG7
Input/Output
MCU GPIO
49
LCD-SEG8
Input/Output
MCU GPIO
50
LCD-SEG9
Input/Output
MCU GPIO
51
VCC
-
Power supply, range 1.8V~3.7V (recommend to add ceramic filter capacitor)
52
GND
-
Ground wire, connected to the power reference ground
For more information about module pin definition, software driver and communication protocol, please see ASR6505 Datasheet
4 Hardware and Software Guide
4.1 Hardware Design
It is recommended to use a DC stabilized power supply to supply power to the module, and the power ripple
coefficient should be as small as possible, and the module should be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the
maximum value, it will cause permanent damage to the module;
Please check the stability of the power supply, and the voltage should not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is conducive to long-term stable operation;
The module should be as far away as possible from the power supply, transformer, high-frequency wiring and other
parts with large electromagnetic interference;
High-frequency digital wiring, high-frequency analog wiring, and power wiring must avoid the bottom of the
module. If it is necessary to pass under the module, assume that the module is soldered to the Top Layer, and the top
layer of the contact part of the module is covered with copper (all copper And well grounded), it must be close to
the digital part of the module and routed in the Bottom Layer;
Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route the wires on
the Bottom Layer or other layers, which will affect the stray and receiving sensitivity of the module to varying
degrees;
Assuming that there are devices with large electromagnetic interference around the module, it will greatly affect the
performance of the module. According to the intensity of the interference, it is recommended to stay away from the
module. If the situation permits, proper isolation and shielding can be done;
Assuming that there are traces with large electromagnetic interference around the module (high-frequency digital,

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd
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high-frequency analog, power wiring), it will also greatly affect the performance of the module. According to the
intensity of the interference, it is recommended to stay away from the module. Isolation and shielding;
If the communication line uses 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage);
Try to stay away from part of the physical layer that is also 2.4GHz TTL protocol, for example: USB3.0;
The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna
is exposed, preferably vertically upward. When the module is installed inside the case, a high-quality antenna
extension cable can be used to extend the antenna to the outside of the case;
The antenna must not be installed inside the metal shell, which will greatly reduce the transmission distance.
4.1 Software Writing
This module is SX1262+STM8L152 integrated, and its driving method is completely equivalent to SX1262, and users can
operate according to SX1262 or ASR6505 chip book;
At the same time, please refer to the E78-900M22S1A and E78-900TBL-01A pin corresponding STM8 data provided by our
company during the secondary development.
The voltage range of the active crystal oscillator is 1.8V to 3V. 2.2V is recommended. 3.3V may be damaged.
4 Programming Diagram and Guide
4.1 E78-900M22S1A burning interface
Connect the module pins 30 and 31, and use ST-LINK or STM8 debugging tools to download the program.
For secondary development, you are recommended to use test kit E78-900TBL-01A. It is convenient and efficient. First,
power the module through the serial port of the test kit, and then connect the NRST pin and SWIM pin of ST-LINK to
the test kit to download the program. As shown above.

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
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5. Production guidance
5.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time(tL)Maintained Above(TL)
Time below liquid phase
line
60-90 sec
30-90 sec
Peak temperature(Tp)
Peak temp.
220-235℃
230-250℃
Average ramp-down rate(Tp to Tsmax)
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature
for 25℃
6 minutes max
8 minutes max
5.2 Reflow soldering curve

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6.FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER (Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;

Chengdu Ebyte Electronic Technology Co., Ltd. E78-900M22S1A User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd
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Revision history
Version
Date
Description
Issued by
1.0
2021-03-1
Initial version
Linson
About us
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Tel: [phone] Ext. 812 Fax: [phone]
Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China