Ebyte E72-2G4M20S1C User manual

E72-2G4M20S1C User Manual
CC2674P10 Multi-Function SoC Wireless Module

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Contents
Disclaimer ...........................................................................................................................................................................................................1
1 Product Overview ..........................................................................................................................................................................................1
1.1 Introduction........................................................................................................................................................................................1
1.2 Features ............................................................................................................................................................................................... 1
1.3 Application ......................................................................................................................................................................................... 1
2.Specification and parameter ........................................................................................................................................................................1
2.1 Limit parameter .................................................................................................................................................................................1
2.2 Operating parameter .........................................................................................................................................................................1
3 Size and pin definition ..................................................................................................................................................................................2
4 Development ...................................................................................................................................................................................................4
5 Basic operation ...............................................................................................................................................................................................4
5.1 Hardware Design .............................................................................................................................................................................. 4
5.2 Software edit ...................................................................................................................................................................................... 6
5.3 Environmental construction ........................................................................................................................................................... 6
6 FAQ ................................................................................................................................................................................................................16
6.1 Communication range is too short ............................................................................................................................................. 16
6.2 Module is easy to damage............................................................................................................................................................16
6.3 BER(Bit Error Rate) is high ........................................................................................................................................................ 16
7 Production guidance ...................................................................................................................................................................................17
7.1 Reflow soldering temperature .....................................................................................................................................................17
7.2 Reflow soldering curve.................................................................................................................................................................18
8 Package for batch order .............................................................................................................................................................................19
Revision history.............................................................................................................................................................................................. 19

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Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
third parties of this document or any part thereof without the express permission of
EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no
liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.cdebyte.com.

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1 Product Overview
1.1 Introduction
E72-2G4M20S1C is a multi-protocol 2.4GHz wireless chip on chip system module
independently developed based on CC2674P10 produced by TI, with a transmission
power of 20dBm. It integrates an ARM microcontroller and high-performance wireless
transceiver internally, and uses an industrial grade 48MHz high-precision
low-temperature drift crystal oscillator.
The module leads out all IO ports of the microcontroller, and the chip comes with a
powerful 48 MHz Arm ® Cortex ®- M33 processor, internal integrated power amplifier, powerful peripherals, and up to 26 GPIOs
allow for multi-dimensional development. CC2674P has great potential to become the preferred wireless microcontroller for future
smart furniture, IoT transformation, and industrial automation.
As this module is a pure hardware SoC module, it requires users to program it before use.
1.2 Features
Built-in high-performance low-power Arm ® Cortex ® - M33 processor with a clock speed of up to 48MHz;
Rich resources, 1024KB FLASH, 256KB RAM;
Support 1.9-3.8V power supply, with power supply greater than 3.3V ensuring optimal performance;
Transmitting power of 20dBm;
Under ideal conditions, the communication distance can reach 620m;
The module includes a 48M high-speed crystal oscillator/32.768k low-speed crystal oscillator;
Industrial grade standard design, supporting long-term use at -40~+85 ℃;
2-pin cJTAG and JTAG debugging
Wireless protocol: Thread, Zigbee ®，Bluetooth ® 5.3 Low Energy,
IEEE 802.15.4, 6LoWPAN, proprietary systems,
SimpleLink ™ TI 15.4-Stack (2.4 GHz),
Dynamic Multiprotocol Manager (DMM) driver
Receiving sensitivity: -105 dBm for 802.15.4 (2.4 GHz), -104 dBm for Bluetooth 125-kbps (LE Coded PHY)
1.3 Application
Building automation
Building Security System - Motion Detectors, Electronic Intelligent Door Locks, Door and Window Sensors, Garage Door
Systems, Gateways
HVAC - Thermostat, Wireless Environment, Sensors, HVAC System Controller, Gateway
Fire Safety System - Smoke and Temperature Detectors, Fire Alarm Control Panel (FACP)
Video surveillance - IP network camera

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Elevators and escalators - elevator main, elevator and escalator control panel;
Grid infrastructure
Smart electricity meters - water meters, gas meters, electricity meters, and heat cost allocators
Grid communication - wireless communication. Remote sensor application
Other alternative energy sources - energy collection
Industrial transportation - asset tracking
Factory automation and control
Medical equipment
Electronic Point of Sale (EPOS) - Electronic Shelves
Label (ESL)

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2. Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Notes
Min.
Max.
Power supply（V）
0
3.8
Voltage over 3.8V will cause permanent
damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules
are used in short distance
Operating temperature（℃）
-40
85
2.2 Operating parameter
Main parameter
Performance
Remark
Min
Typ.
Max.
Operating voltage（V）
1.9
3.3
3.8
≥3.3 V ensures output power
Communication level（V）
-
3.3
-
For 5V TTL, it may be at risk of burning down
Operating temperature（℃）
-40
-
+85
Industrial design
Operating frequency（MHz）
2400
-
2480
-
Power
consum
ption
Transmitting current
[mA]
-
76.3
-
Instant power consumption@20dBm
Receiving current [mA]
-
9.51
-
-
Turn-off current [μA]
-
1.4
-
-
Max Tx power（dBm）
19
19.5
20
-
Receiving sensitivity（dBm）
-
-105
-
Bluetooth 125-kbps (LE Coded PHY)
Main parameter
Description
Remark
Distance for reference
620m
Test condition：clear and open area, antenna gain:
2dBi，antenna height: 2m，air data rate: 1Mbps
Crystal frequency
48MHz/32.768k
High speed 48MHz/low speed 32.768k
Supported protocol
Bluetooth 5.3 Low Energy
Zigbee
Thread
-
Package
SMD
-
Interface
1.27mm
Stamp hole
IC full name
CC2674P106T0RGZ
-
FLASH
1024KB
-
RAM
256KB
-

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Core
Arm ® Cortex ® -M33
-
Size
28.7*17.5mm
-
RF antenna
PCB antenna
The equivalent impedance is about 50 Ω. The factory
defaults to onboard PCB antennas. If you have any
IPEX antenna requirements, please consult online
customer service.
Product weight
1.9±0.1g
-
3 Size and pin definition
No.
Name
Direction
Function
1
GND
-
Ground, connecting to power reference ground
2
DIO_7
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
3
DIO_8
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
4
DIO_9
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
5
DIO_10
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
6
DIO_11
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
7
DIO_12
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
8
DIO_13
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
9
DIO_14
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
10
DIO_15
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
11
GND
-
Ground, connecting to power reference ground

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12
GND
-
Ground, connecting to power reference ground
13
JTAG_TMSC
Input/Output
JTAG_TMSC
14
JTAG_TCKC
Input/Output
JTAG_TCKC
15
DIO_16
Input/Output
Configurable GPIO,JTAG_TDO(refer to CC2674P106T0RGZ datasheet)
16
DIO_17
Input/Output
Configurable GPIO,JTAG_TDI(refer to CC2674P106T0RGZ datasheet)
17
DIO_18
Input
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
18
DIO_19
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
19
GND
Input/Output
Ground, connecting to power reference ground
20
VCC
-
Module power supply positive reference voltage, voltage range 1.9～3.8V
21
DIO_20
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
22
DIO_21
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
23
GND
Input/Output
Ground, connecting to power reference ground
24
RESET_N
Input
Reset pin, low level active
25
DIO_22
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
26
DIO_23
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
27
DIO_24
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
28
DIO_25
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
29
DIO_26
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
30
DIO_27
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
31
DIO_28
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
32
DIO_29
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
33
DIO_30
Input/Output
Configurable GPIO(refer to CC2674P106T0RGZ datasheet)
34
GND
Input/Output
Ground, connecting to power reference ground

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4 Development
No.
Keyword
Notice
1
Programming
The module is an SOC module with its own GPIO port, you can use an XDS100 dedicated downloader to
download program
2
Test board
Not available
5 Basic operation
5.1 Hardware Design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded.；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged；
Please check the stability of the power supply, the voltage can not be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding
can be done.
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

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antenna extension cable to extend the antenna to the outside；
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.

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5.2 Software edit
The core of this module is CC2674P, and users can fully operate according to the CC2674P chip manual
Attention: The chip used in the module is in DC/DC mode internally
The module comes with our own RF switch, please strictly follow the truth table for operation
Truth Table
DIO_6
DIO_5
Transmit(TX)
Receive(RX)
Low
High
ON
OFF
High
Low
OFF
ON
Burning program: The module is an SOC module with a built-in GPIO port, and the program is downloaded using an XDS100
dedicated downloader.
Program Download Interface Definition：
E72 pin
XDS100 port
JATG_TMSC
TMS
JTAG_TCKC
TCK
RESET_N
SRSTN
GND
DGND
VCC
TVD
5.3 Environmental construction
5.3.1 Installation preparation
Need to prepare SDK 7.10.01.24,CCS 12.3.0
5.3.2 Installation step
1. Download the SDK from the CC2674P10 chip introduction interface on TI's official website.

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Choose 7.10.01.24 version.
1. The downloaded SDK package is directly installed in the default path.
5.3.3 CCS Operation Step
1. Import SDK project, open CCS, and select Import in the project.

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1. Taking the recipient as an example for import, select the model LP_EM_CC1354P10_1
2. Choose tirtos here. If you choose freertos, you need to go to the next freertos on the internet and configure the compilation
environment, which is not used in this document.

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2. After importing, click on compile
5.3.4 Code Migration
This section is for reference only. For code migration details, please refer to the TI official migration guide：
https://dev.ti.com/tirex/explore/content/simplelink_cc13xx_cc26xx_sdk_7_10_01_24/docs/thread/html/cc13xx_cc26xx/software-on-cc
13x4-26x4.html

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1. First, change the board introduction to the CC2674P10 chip model
2. Continue to modify the project name
3 Modify device series

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4 Modify device view

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5 Modify to settings below
After modification, it will be found that syscfg reports an error, which is a normal phenomenon
First, select Accept on the RF Design interface

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Return to Custom, check BLE, 1 Mbps, LE 1M, and then click here

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Afterwards, you can choose to check PA to increase power, but this area is only checked and needs to be used in conjunction with the
pin control PA pin during normal use. So far, if compiling, errors will still be reported because there are problems with the function
name and structure of the RF file. It needs to be modified again in order to use it properly. It is recommended to change the Symbol
Name to Legacy in the screenshot below, or it can be left unchanged.
If using the rfPacket routine, it is also necessary to use the main_ Add a function to the tirtos. c file

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5.3.5 Firmware position
1. The firmware location is in the Debug section of the project directory.