Ebyte E79-900DM2005S User manual

1
E79-900DM2005S User Manual
CC1352P Dual Band SoC Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd E79-900DM2005S User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd
2
CONTENTS
1.Overview..............................................................................................................................................................................3
1.1 Introduction............................................................................................................................................................... 3
1.2 Main Features:........................................................................................................................................................... 3
1.3 Applications:..............................................................................................................................................................3
2. Parameters:......................................................................................................................................................................... 4
2.1 Limit Parameters:...................................................................................................................................................... 4
2.2 Working Parameters:................................................................................................................................................. 4
3. Sizes and Pins Definition....................................................................................................................................................5
4. Programming and Testing:................................................................................................................................................. 7
5. User Guide.......................................................................................................................................................................... 7
5.1 Notice for Hardware.................................................................................................................................................. 7
5.2 Programming............................................................................................................................................................. 8
6. FAQ.................................................................................................................................................................................. 10
6.1 Communication range is too short...........................................................................................................................10
6.2 Module is easy to damage....................................................................................................................................... 10
6.3 BER (Bit Error Rate) is high................................................................................................................................... 11
7.Production Guidance......................................................................................................................................................... 11
7.1 Reflow Soldering Temperature............................................................................................................................... 11
7.2 Reflow soldering curve............................................................................................................................................12
8.Package for Batch Order....................................................................................................................................................12
9.Revision History................................................................................................................................................................ 13
About us................................................................................................................................................................................13

Chengdu Ebyte Electronic Technology Co.,Ltd E79-900DM2005S User Manual
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1.Overview
1.1 Introduction
Based on TI CC1352P chip, E79-900DM2005S is a dual-band ARM-based RF SoC
Module designed by Ebyte, with max transmitting power of 20dBm at SUB-1GHz and 5dBm
at 2.4GHz. The module integrates a high-performance wireless transceiver and a low
temperature drift industrial crystal oscillator.
Presenting all the IO interfaces of the micro-controller and integrating a powerful 48
MHz Arm ® Cortex ® -M4F processor, high-performance power amplifier, powerful
peripherals and up to 26 GPIOs for multi-faceted development, The module can be developed
into many application fields. It is an excellent choice for wireless micro-controller for Smart home, IoT upgrading and industrial
automation etc.
The module is a hardware platform and cannot be used directly. Users need to conduct secondary development.
1.2 Main Features:
Built-in high-performance low-power Arm ® Cortex ® -M4F processor with clock speeds up to 48MHz;
Rich resources, 352KB FLASH, 80KB RAM;
2.1~3.8V power supply voltage, Above 3.3V can guarantee the best performance;
Maximum transmitting power 20dBm@ SUB-1GHz/5dBm@ 2.4GHz, multi-level adjustable from software;
Under ideal conditions, the communication distance can reach 1.5km@SUB-1GHz/[email protected];
Module contains 48M high speed crystal / 32.768k low speed crystal;
Industrial grade standard design, support long-term use from -40 to +85 °C;
Double antennas are optional (IPEX/stamp hole), users can choose according to your own needs;
2 pin cJTAG and JTAG debugging;
Wireless upgrade (OTA);
Dual-band sub-1GHz and 2.4GHz RF transceivers compatible with Bluetooth 5 and IEEE 802.15.4 PHY and MAC
standards;
Excellent receiver sensitivity: –122dBm (SimpleLink long-distance), –110dBm (50kbps), –103dBm (Low-Power
Bluetooth 5 encoding).
1.3 Applications:
Smart grid and automatic meter reading
– water meters, gas meters and electricity meters
– heat distribution table
– gateway
Wireless sensor network
– Remote sensor security system, positioning system
Industry
– Asset tracking and management
– Factory automation
– remote display

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Wireless healthcare application
Energy harvesting application
Electronic shelf label (ESL)
Home and building automation
– Wireless alert and security system
– Security lock
– Lighting control
– Motion detector
– Household appliances
– HVAC
– Garage door opener wireless remote control, drone
2. Parameters:
2.1 Limit Parameters:
Main Parameters
Value
Remarks
Min.
Max
Input Voltage(V)
0
3.8
Permanent damage occurred when
voltage is over 3.8V
Blocking Power(dBm)
-
10
Low chance to be damaged for
short-distance transceiving
Working Temp.(℃)
-40
+85
Industrial Grade
2.2 Working Parameters:
SUB-1GHz Parameters:
Main Parameters
Value
Remarks
Min.
Typical
Max.
Working Voltage(V)
2.1
3.3
3.8
Voltage above 3.3V can guaranty Max TX power
Tx Electrical Level(V)
3.3
5V TTL could cause permanent damage
Working Temp (℃)
-40
-
+85
Industrial Grade
Working Frequency (MHz)
861
-
941
Applicable for ISM channel
Power
Consumption
TX Current(mA)
75
Instantaneous power
RX Current(mA)
6.5
/
Sleeping Current(μA)
2
Software off
Max TX Power(dBm)
19
20.0
20.5
/
RX Sensitivity(dBm)
-122
At 2.5 kbps air rate
2.4G Parameters:

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Main Parameters
Value
Remarks
Min.
Typic
al
Max.
Working Voltage(V)
1.8
3.3
3.8
Voltage above 3.3V can guaranty Max TX power
Tx Electrical Level(V)
3.3
5V TTL could cause permanent damage
Working Temp (℃)
-40
-
+85
Industrial Grade
Working Frequency (MHz)
2360
-
2500
Applicable for ISM channel
Power
Consumption
TX Current(mA)
/
10.5
/
Instantaneous power
RX Current(mA)
/
7.5
/
Max TX Power(dBm)
4
4.5
5
/
RX Sensitivity(dBm)
/
-103
/
BLE 5 Coding
Parameters
Value
Remarks
Reference Range
1500m@SUB-1GHz
Conditions: Clear Sky, Antenna Gain 5dBi,
Antenna Height 2.5m, Air rate 1kbps
[email protected]
Conditions: Clear Sky, Antenna Gain 5dBi,
Antenna Height 2.5m, Air rate 1Mbps
TCXO Frequency
48MHz/32.768k
High rate at 48MHz/Low Rate at 32.768k
Protocol
GFSK
/
Encapsulation
SMD
/
Interface Type
1.27mm Stamp Hole
/
IC Model
CC1352P1F3RGZ
/
FLASH
352KB
/
RAM
80KB
/
Core
Arm ® Cortex ® -M4F
/
Size
32*20mm
/
Antenna Interfaces
IPEX/Stamp Hole@sub-1G,
PCB [email protected]
Equivalent Impedance is around 50Ω
3. Sizes and Pins Definition

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No.
Name
Type
Functions
1
GND
Input/Output
Ground wire, connected to the power reference ground
2
ANT
Input/Output
Antenna interface, stamp hole (50 ohm characteristic impedance)
3
GND
Input/Output
Ground wire, connected to the power reference ground
4
GND
Input/Output
Ground wire, connected to the power reference ground
5
DIO_7
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
6
DIO_8
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
7
DIO_9
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
8
DIO_10
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
9
DIO_11
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
10
DIO_12
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
11
DIO_13
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
12
DIO_14
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
13
DIO_15
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
14
GND
Input/Output
Ground wire, connected to the power reference ground
15
GND
Input/Output
Ground wire, connected to the power reference ground
16
JTAG_TMSC
Input/Output
JTAG_TMSC
17
JTAG_TCKC
Input
JTAG_TCKC

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18
DIO_16
Input/Output
Configurable universal IO, JYAG Port (see CC1352P1F3RGZ Manual)
19
DIO_17
Input/Output
Configurable universal IO, JYAG Port (see CC1352P1F3RGZ Manual)
20
DIO_18
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
21
DIO_19
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
22
DIO_20
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
23
DIO_21
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
24
DIO_22
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
25
RESET_N
Input
Reset Pin
26
GND
Input/Output
Ground wire, connected to the power reference ground
27
GND
Input/Output
Ground wire, connected to the power reference ground
28
DIO_23
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
29
DIO_28
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
30
DIO_27
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
31
DIO_24
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
32
DIO_25
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
33
DIO_26
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
34
DIO_29
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
35
DIO_30
Input/Output
Configurable universal IO Port (see CC1352P1F3RGZ Manual)
36
VCC
Input/Output
Module power supply positive reference voltage, voltage range 1.8 ~ 3.8V
37
GND
Input/Output
Ground wire, connected to the power reference ground
4. Programming and Testing:
No
Name
Notice
1
Burning
Program
The module is a SOC module, comes with a GPIO port, please download
program by XDS100 downloader.
2
Test Board
Not available from Ebyte
5. User Guide
5.1 Notice for Hardware
It is recommended to use DC stabilized power supply. The power supply ripple factor should be as small as possible, and
the module should be reliably grounded.
Please ensure that the positive and negative poles of the power supply are properly connected. If the reverse connection is
made, the module may be permanently damaged.
Please ensure the power supply voltage is within the working voltage range. If the maximum voltage is exceeded, the
module will be permanently damaged.
Please check the stability of the power supply, and the voltage cannot be fluctuated frequently;
When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin to

Chengdu Ebyte Electronic Technology Co.,Ltd E79-900DM2005S User Manual
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achieve long-term stable operation of the system;
The installation location of the module should be as far away as possible from the power supply, transformers,
high-frequency wiring and other parts with large electromagnetic interference;
High-frequency digital routing, high-frequency analog routing, and power routing must avoid module locations. If the
wiring must pass under the module, assuming that the module is soldered to the Top Layer, the area where the module is in
contact with the Top Layer should be covered with copper (all copper is well grounded), and the area must be close to the digital
part of the module and routed in the Bottom Layer;
If the module is soldered or placed in the Top Layer, it is wrong to randomly route on the Bottom Layer or other layers,
which will affect the spurs and receiving sensitivity of the module to varying degrees;
If there is a device with large electromagnetic interference around the module, it will greatly affect the performance of the
module. It is recommended to maintain the distance from the module according to the strength of the interference. If
circumstances permit, it is recommended to do proper isolation and shielding;
If there are wirings with large electromagnetic interference around the module (such as high frequency digital, high
frequency analog, power line), the performance of the module will be greatly affected. It is recommended to do proper isolation
and shielding;
Try to keep the module away from some physical layers such as the 2.4GHz TTL protocol, for example: USB3.0;
The antenna installation structure has a great influence on the performance of the module. Make sure that the antenna is
exposed and preferably vertical. When the module is installed inside the casing, it is recommended to use a good antenna
extension cable to extend the antenna to the outside of the casing;
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
5.2 Programming
The core of this module is CC1352P, and the user can operate according to the CC1352P chip manual.
Recommended parameters of frequency accuracy
Adjust the parameter of SET_CCFG_MODE_CONF_XOSC_CAPARRAY_DELTA in ccfg.c file to 0xFA
Power grading: 20dBm, 17dBm, 14dBm, 11dBm, power configuration code is as follows:
20dBm - The code is as follows：
// Overrides for CMD_PROP_RADIO_DIV_SETUP_PA
uint32_t pOverridesTx20[] =
{
// The TX Power element should always be the first in the list
TX20_POWER_OVERRIDE(0x0020AA1B),
// The ANADIV radio parameter based on the LO divider (0) and front-end (0) settings
(uint32_t)0x11C10703,
// override_phy_tx_pa_ramp_genfsk_hpa.xml
// Tx: Configure PA ramping, set wait time before turning off (0x1F ticks of 16/24 us = 20.3 us).

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HW_REG_OVERRIDE(0x6028,0x001F),
(uint32_t)0xFFFFFFFF
};
17dBm - The code is as follows：
// Overrides for CMD_PROP_RADIO_DIV_SETUP_PA
uint32_t pOverridesTx20[] =
{
// The TX Power element should always be the first in the list
TX20_POWER_OVERRIDE(0x00086618),
// The ANADIV radio parameter based on the LO divider (0) and front-end (0) settings
(uint32_t)0x11C10703,
// override_phy_tx_pa_ramp_genfsk_hpa.xml
// Tx: Configure PA ramping, set wait time before turning off (0x1F ticks of 16/24 us = 20.3 us).
HW_REG_OVERRIDE(0x6028,0x001F),
(uint32_t)0xFFFFFFFF
};
14dBm - The code is as follows
// Overrides for CMD_PROP_RADIO_DIV_SETUP_PA
uint32_t pOverridesTx20[] =
{
// The TX Power element should always be the first in the list
TX20_POWER_OVERRIDE(0x0004420E),
// The ANADIV radio parameter based on the LO divider (0) and front-end (0) settings
(uint32_t)0x11C10703,
// override_phy_tx_pa_ramp_genfsk_hpa.xml
// Tx: Configure PA ramping, set wait time before turning off (0x1F ticks of 16/24 us = 20.3 us).
HW_REG_OVERRIDE(0x6028,0x001F),
(uint32_t)0xFFFFFFFF
};
11dBm – The code is as follows
// Overrides for CMD_PROP_RADIO_DIV_SETUP_PA
uint32_t pOverridesTx20[] =
{
// The TX Power element should always be the first in the list
TX20_POWER_OVERRIDE(0x00042E07),
// The ANADIV radio parameter based on the LO divider (0) and front-end (0) settings
(uint32_t)0x11C10703,
// override_phy_tx_pa_ramp_genfsk_hpa.xml
// Tx: Configure PA ramping, set wait time before turning off (0x1F ticks of 16/24 us = 20.3 us).
HW_REG_OVERRIDE(0x6028,0x001F),
(uint32_t)0xFFFFFFFF

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};
Note:
The chip used inside the module is DC/DC mode.
The Sub-1G band module comes with our own RF switch. Please follow the truth table strictly.
Truth Table
DIO_6
DIO_5
Transmit(TX)
Receive(RX)
Low
High
ON
OFF
High
Low
OFF
ON
Burning program: The module is a SOC module with its own GPIO port. Download the program using the XDS100
downloader.
Program download interface definition:
6. FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
E79 Pins
XDS100 Interfaces
JATG_TMSC
TMS
JTAG_TCKC
TCK
RESET_N
SRSTN
GND
DGND
VCC
TVD

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susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER (Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Production Guidance
7.1 Reflow Soldering Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time(tL)Maintained Above(TL)
Time below liquid phase
line
60-90 sec
30-90 sec
Peak temperature(Tp)
Peak temp.
220-235℃
230-250℃
Average ramp-down rate(Tp to Tsmax)
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃to peak temperature
Time to peak temperature
for 25℃
6 minutes max
8 minutes max

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7.2 Reflow soldering curve
8.Package for Batch Order

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9.Revision History
Version
Date
Description
Issued by
1.1
2019-12-14
Ren
About us
Website: www.ebyte.com Sales: [email protected] Support: [e-mail]
Tel: [phone] Ext. 812 Fax: [phone]
Address: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China