Ebyte MBL Series User manual

MBL Series Testing Kit User Manual
New Generation Package Compatible
Sub-1G Wireless Module
E07-900MBL-01

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Contents
I. Product Overview .............................................................................................................................3
1.1 Product Introduction ................................................................................................................. 3
1.2 Dimensions, interface description .............................................................................................4
1.3 Support List ...............................................................................................................................5
II. Software Introduction .................................................................................................................... 6
2.1 Directory structure .................................................................................................................... 6
2.2 IAR Engineering ....................................................................................................................... 7
2.3 Main function ............................................................................................................................8
2.4 Transceiver Timing ................................................................................................................... 8
2.5 Programming ...........................................................................................................................10
III. Quick Demo ................................................................................................................................. 13
3.1 Signal cable connection .......................................................................................................... 13
3.2 Serial Assistant ........................................................................................................................14
IV. FAQ ............................................................................................................................................... 15
4.1 The transmission distance is not ideal .....................................................................................15
4.2 The module is easily damaged ................................................................................................ 15
4.3 The bit error rate is too high ....................................................................................................16
Revision history ..................................................................................................................................16
About us ..............................................................................................................................................16

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Disclaimer and Copyright Notice
Information in this document, including URL addresses for reference, is subject to change
without notice. Documentation is provided "as is" without warranty of any kind, including any
warranties of merchantability, fitness for a particular purpose, or non-infringement, and any
warranties referred to elsewhere in any proposal, specification or sample. No liability is assumed in
this document, including any liability for infringement of any patent rights arising out of the use of
the information in this document. This document does not hereby grant, by estoppel or otherwise,
any license, express or implied, to any intellectual property rights.
The test data obtained in this article are all obtained by the Ebyte laboratory test, and the actual
results may be slightly different.
All trade names, trademarks and registered trademarks mentioned herein are the property of
their respective owners and are hereby acknowledged.
The final interpretation right belongs to Chengdu Ebyte Electronic Technology Co., Ltd.
Notice :
Due to product version upgrade or other reasons, the contents of this manual may be changed.
Ebyte Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual
without any notice or prompt. This manual is only used as a guide. Chengdu Ebyte Electronic
Technology Co., Ltd. does its best to provide accurate information in this manual. However,
Chengdu Ebyte Electronic Technology Co., Ltd. does not ensure that the contents of the manual are
completely error-free. All statements in this manual , information and advice do not create any
express or implied warranties.

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I. Product Overview
1.1 Product Introduction
MBL series testing kits are designed to help users quickly evaluate Ebyte's new generation of
package-compatible wireless modules. Most of the pins on the board have been led out to pin
headers on both sides, and developers can easily connect various peripheral devices through jumpers
according to actual needs.
The kit provides complete software application examples to help customers quickly get started
with wireless data communication development. According to customer needs, different types of
Sub-1G wireless modules can be mounted on board. Supported modules are available in
pin-compatible packages for quick replacement.
1.2 Dimensions, interface description

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Pin
Definition
Function Description
1
VCC
Module power supply pin. It needs to
be shorted with pin 2 to supply power
to the module.
2
3.3V
3.3V power pin
3
3.3V
3.3V power pin
4
VIO
MCU power supply pin. It needs to be
shorted with pin 3 to power the MCU.
5
GND
Backplane reference ground
6
REST
MCU external reset pin
7
SWIM
MCU's SWIM pin
8
VIO
MCU power supply pin
9
PC0
Module reset pin
10
PB7
Module MISO pin
11
PB6
Module MOSI pin
12
PB5
Module SCLK pin
13
PB4
Module NSS pin
14
TXD
MCU serial port TXD
15
RXD
MCU serial port RXD
16
M1
Module mode switching pin (see
module product manual for details)
17
GND
Backplane reference ground
18
M0
Module mode switching pin (see
module product manual for details)
19
GND
Backplane reference ground

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1.3 Support List
Chip solution
Manufacturer
Module model
1
CC1101
Texas Instruments
E07-400M10S
2
CC1101
Texas Instruments
E07-900M10S
3
SI4438
Silicon Labs
E30-400M20S
4
SI4463
Silicon Labs
E30-900M20S
5
LLCC68
Semtech
E220-400M22S
6
LLCC68
Semtech
E220-900M22S
7
SX1278
Semtech
E32-400M20S
8
SX1276
Semtech
E32-900M20S
9
SX1268
Semtech
E22-400M22S
10
SX1262
Semtech
E22-900M22S
11
AX5243
ON Semiconductor
E31-400M17S
12
LLCC68
Semtech
E220-400MM22S
13
LLCC68
Semtech
E220-900MM22S

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II. Software Introduction
2.1 Directory structure
Item
Description
1
File
Directory
You can download the sample file from the official website, and open the
directory as shown in the figure below.
2
Catalog
description
You can use the IAR For STM8 development environment to find the entry
file and open the project.

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2.2 IAR Engineering
Item
Description
Engineering
structure
Use the IAR For STM8 development environment to open the project, and
you can see the basic structure.
Switch
workspace
The global macro definition and file path are defined in the C/C++ Compiler
option, which are used to distinguish the driver files of different modules.
When switching the workspace, different macro definitions will be used to
switch the driver files of different modules.
When the "Exclude from build" attribute of "Drivers/Ebyte/RF" is changed,
the target module driver folder is selected to participate in the compilation
process. When the "Additional include" in the project "C/C++ Compiler" is
changed, the module driver file path is specified. When the "Defined
symbols" in the project "C/C++ Compiler" is changed, the global macro
definition is defined to help configure the module driver properties.

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2.3 Main function
main.c is the main function entry. The demo function process is simplified as follows:
Item
Description
1
Key Function
When a button is pressed, the command data is sent wirelessly.
Essentially sending a specific string "ping" and expecting a "pong" in
response.
2
Serial data to
wireless
transmission
After the serial port receives the data, it automatically starts wireless
transparent transmission of data. Of course, it contains some special
command responses, which are mainly used for special tests and can be
ignored by users. After the sending is completed, the user function will
be automatically called back to process the sending logic by itself.
3
Receive data
wirelessly
Generally, the internal status flag of the module is read to determine
whether there is data, and the underlying driver will copy the data and
pass it to the user callback function, so as to process the receiving logic
by itself.
The software process is simplified as shown in the figure below:
2.4 Transceiver timing
There are multiple operating states of the wireless module, and specific functions can only be
completed in the corresponding states. From the simplest sending and receiving data, only the
sending mode and receiving mode are considered.
Item
Description
1
Receiving mode
After the default initialization is completed, it automatically enters the
receiving mode. In essence, the receiving function is called in the
initialization to enter the receiving mode. If you need to consider
entering other modes after initialization, such as sleep, you can directly

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replace it with the same type of function Go_xxxxx().
2
Sending mode
When calling the sending function, the underlying driver actually
switches the module into standby mode first, and usually completes the
modulation parameter configuration in this mode, such as frequency,
power, frequency offset, etc. After the parameters are configured
correctly, gradually enter some intermediate modes, open the internal
FIFO, PA, external XTAL, etc., and the current consumption will
gradually increase. Eventually switch into send mode, triggering
wireless data transmission. After completion, the module enters the
standby mode. In this state, sending and receiving cannot continue, and
the user needs to handle the next step in the callback function. When the
function is complex, if continuous reception or continuous transmission
is required, please further switch to other modes according to the
characteristics of the chip.
The timing diagram is as follows: