Ebyte EO01-MLO1SP4 User manual

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EBYTE
EO01-MLO1SP4 User Manual
nRF24L01P 2.4GHz 100mW SMD Wireless Module
Chengdu Ebyte Electronic Technology Co.,Ltd.

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1. Overview
1.1. Brief Introduction
EO01-MLO1SP4 is SMD module based on original imported nRF24L.01P
18 + 0.2mm
form Nordic in Norway, operates at 2.4Ghz with 100mW transmitting power. je————]
The RF performance of EO1-MLO1SP4 and components selection during
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E01 mLo1sp4 EB TE
mE [f id
Mc X
R&D are all in accordance with industrial grade standards, using
industrial-grade high-precision 16MHz crystal oscillator, also it obtained FCC,
CE and RoHS certification. A power amplifier (PA) and a low noise amplifier
SN: 18013000001 Made in China
Manufacturer: EBYTE
FCC ID: 2ALPH-EQ01
(LNA) are built in, so that the maximum transmit power reaches 100mW and
14.5
+
0.2mm
the receiving sensitivity is further improved. The products have been greatly
improved when there is no PA and LNA in design.
The user needs to use the MCU driver or use a dedicated SPI debugging
tool to develop EO1-MLO1SP4.
1.2 Features
Communication distance tested is up to 1.5KM;
Maximum transmission power of 100mW, software multi-level adjustable;
Support air date rate of 2Mbps, 1Mbps, 250kbps;
125 communication channels to meet the needs of multi-point communication, grouping, frequency hopping, etc.
Connect to the MCU through the SPI interface at a rate of 0 to 10 Mbps.
Support 2.0V~3.6V power supply, power supply over 3.3V can guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
SMA interface for easy connection of coaxial cable or external antenna;
Enhanced ShockBurst, fully compatible with NORDIC all nRF24L, nRF24E, nRF24U series.
1.3 Application
Wearable device;
Smart home and industrial sensors;
Security system, positioning system;
Wireless remote control, drone;
Wireless game remote control;
Healthcare products;
Wireless voice, wireless headset;
Automotive industry applications.
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2. Specification and parameter
2.1 Limit parameter
Performance
Main parameter Remark
Min. Max.
Voltage over 3.6V will cause permanent
Power supply (V) 0 3.6
damage to module
Chances of burn is slim when modules
Blocking power (dBm) - 10 } }
are used in short distance
Operating temperature (°C) -40 85
2.2 Operating Parameter
. Performance
Main parameter Remarks
Min. Typ. Max.
Operating voltage (V) 2.0 33 3.6 >3.3V ensures output power
For 5V TTL, it may be at risk of
Communication level (V) 33 }
burning down
Operating temperature (°C) -40 - 85 Industrial design
Operating frequency (GHz) 24 - 2.525 Support ISM band
TX current (mA) 120 Instant power consumption
Power
) RX current (mA) 26
consumption
Sleep current (uA) 1.0 Software is shut down
Max Tx power (dBm) 19.7 20 20.2
Receiving sensitivity (dBm) -96.5 -96 -97.5 Air data rate is 250kbps
Air data rate (bps) 250k - 2M Controlled via user’s programming
Main parameter Description Remark
Test condition: clear and open area, antenna gain: 5dBi, antenna
Distance for reference 2000m ) )
height: 2.5m, air data rate: 250kbps
FIFO 32Byte Max length transmitted each time
Crystal frequency 16MHz
Modulation GFSK
Package DIP
Connector 1.27mm Pin
Communication interface SPI 0-10Mbps
Size 14.85 * 18mm Without SMA
Antenna IPEX 50ohm impedance
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3. Size and pin definition
14.5£0.1mm 240%0.1mm 127 2.80
—
MMMM | [1 — MMT,
8 7 6 5 4 3 2 1
— 1 2 3 4 5 6 7 8
13.0
E
E
p=
+
[=
=
) ¢ ol» ¢
“ N |
IPX |
0.75 1.00
Toppad: 0.501_D]_ [0.80 Bottom pad : 0.501_ J |_] 0.80
10 J) 130 10] J) 150
Pad quantity : 10
Unit: mm
Pin No. Pin item Pin direction Pin application
1 vce Power supply must be 2.0~ 3.6V
2 CE Chip Enable
3 CSN Input SPI Chip select
4 SCK Input SPI clock
5 MOSI Input SPI master output slave input
6 MISO Output SPI master input slave output
7 IRQ Output Interrupt request.
8 GND Ground
9 GND Ground
10 GND Ground
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4. Basic operation
4.1 Hardware design
10
11
12
13
14
15
16
17
18
Copyright ©2012-2018, Chengdu Ebyte Electronic Technology Co.Ltd.
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged,
Please check the stability of the power supply, the voltage cannot be fluctuated frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding
can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.

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4.2 Software editing
® This module is nRF241L.01+PA+LNA, the drive mode is exactly equivalent to nRF24L01P, the user can operate
according to the nRF241.01P manual (Please see nRF241.01P manual for more details).
® Asinterrupt pin for IRQ, it can be used to wake-up MCU and achieve fast response;
® But the user can get the interrupt status through SPI (not recommended, it is not conducive to the overall power
consumption, and with low efficiency) .
® CE pin can be high level for long-term, but it needs to set as POWER DOWN mode when the module write
registers, and it is recommended that CE is controlled by MCU pin.
® Make sure the CE pin connect to LNA enable pin, when CE equal to 1, LNA is turned on, when CE to 0, LNA is
turned off. This operation is perfectly matched with the transceiver mode of nRF241.01; that is to say, users do not
have to care about the LNA operation
® [f the automatic response is needed, the CE pin must keep high level when transmitting, instead of keeping high
level time just more than 10us like the datasheet mentioned. The operation we recommended is: when CE equal to 1,
the module begin sending, after sending all, then make the CE equal to 0, instead of making the CE equal to 0 after
10 us. The reason is: the module turns into receiving mode immediately after sending LO1P,If CE equal to 0,it means
LNA closed, will not be beneficial to the receiving senility.
S. Basic application
5.1 Basic circuit diagram
U1 MCU
GND VCC
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6. FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) 1s high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Soldering guidance
7.1 Reflow soldering temperature
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Profile Feature Curve characteristics Sn-Pb Pb-Free Assembly
Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin) Min preheating temp. 100°C 150°C
Preheat temperature max (Tsmax) Mx preheating temp. 150°C 200°C
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3°C/second max 3°C/second max
Liquidous Temperature (TL) Liquid phase temp. 183°C 217°C
Time (tL) Maintained Above (TL) Time below liquid phase line 60-90 sec 30-90 sec
Peak temperature (Tp) Peak temp. 220-235°C 230-250°C
Aveage ramp-down rate (Tp to Tsmax) Average ramp-down rate 6°C/second max 6°C/second max
Time 25°C to peak temperature
Time to peak temperature for
25°C
6 minutes max 8 minutes max
7.2 Reflow soldering curve
Critical Zone
[ER TSE cl
TLto Te
1
Id TSmax
i SE | SR
©
a T
o Smin
E ..5...
fia ts
Preheat
25
1 25C to Peak
Time
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8. E01 Series
Test
Model No. IC Frequency Tx power distance Package Antenna
Hz dBm km
E01-MLO1S nRF24L01P 24G 0 0.1 SMD PCB
E01-MLO1D nRF24L01P 24G 0 0.1 DIP PCB
E01-MLOIIPX nRF24L01P 24G 0 02 SMD IPEX
E01-ML0O1DP4 nRF24L01P 24G 20 18 DIP PCB
E01-MLO1DPS nRF24L01P 24G 20 25 DIP SMA-K
E01-MLO1SP2 nRF24L01P 24G 20 18 SMD PCB/IPEX
E01-MLO1SP4 nRF24L01P 24G 20 2 SMD IPEX
E01-2G4AM27D nRF24L01P 24G 27 5 DIP SMA-K
9.Guidance for choosing antenna
9.1 Antenna recommendation
Antenna plays important role in the communication process. Good antenna can largely improve the communication
system. Therefore, we recommend some antennas with excellent performance and reasonable price.
Frequency Gain :
Model Type Interface i siza Fender Feature
Hz dBi
TX2400-NP-5010 FPC 24G IPEX 2 50*10mm - FPC
TX2400-XP-150 Sucker 24G SMA-J 35 15cm 150cm | High gain
TX2400-JK-20 Whip 24G SMA-J 3 200mm - Omnidirectional antenna
TX2400-JK-11 Whip 24G SMA-J 25 110mm - Omnidirectional antenna
TX2400-J7-3 Whip 24G SMA-J 2 30mm - Omnidirectional antenna
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10. Packing
10.1 Anti-statistic pallet
{ A \ 330%0.2
®L5 4
A
18.8(32.0
v
—
20.0 15.3
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y
325%0.1
y
36.5+0.1
2.9%0.1
Unit: mm
Each Tray: 1000 pcs