Ebyte E73-2G4M04S1B User manual

E73-2G4M04S1B User Manual
nRF52832 BLE 4.2/5.0 SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E73-2G4M04S1B User
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Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
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目录
1. OVERVIEW.................................................................................................................................. 3
1.1 INTRODUCTION......................................................................................................................... 3
1.2 FEATURES......................................................................................................................................................................3
1.3 APPLICATION................................................................................................................................................................. 4
2. SPECIFICATION AND PARAMETER..................................................................................... 4
2.1 LIMIT PARAMETER.........................................................................................................................................................4
2.2 OPERATING PARAMETER................................................................................................................................................4
3. SIZE AND PIN DEFINITION.....................................................................................................5
4. BASIC OPERATION................................................................................................................... 7
4.1 HARDWARE DESIGN...................................................................................................................................................... 7
4.2 SOFTWARE PROGRAMMING...........................................................................................................................................8
5. FAQ.................................................................................................................................................9
5.1 COMMUNICATION RANGE IS TOO SHORT....................................................................................................................... 9
5.2 MODULE IS EASY TO DAMAGE...................................................................................................................................... 9
5.3 HIGH BIT ERROR RATE...................................................................................................................................................9
6. WELDING OPERATION GUIDANCE..................................................................................... 9
6.1 REFLOW SOLDERING TEMPERATURE............................................................................................................................ 9
6.2 REFLOW SOLDERING CURVE...................................................................................................................................... 10

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REVISION HISTORY......................................................................................................................13
ABOUT US.........................................................................................................................................13

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1. Overview
1.1 Introduction
E73-2G4M04S1B is a SMD bluetooth wireless module based on
NORDIC's nRF52832 RF chip. NRF52832 has high-performance ARM
CORTEX-M4 core and Bluetooth 4.2 and Bluetooth 5 RF transceiver and
protocol stack, and has abundant peripheral resources such as UART, I2C, SPI,
ADC, DMA, PWM, etc.The module brings out almost all IO ports, which is
convenient for users to conduct multi-faceted development, Please see pin
definitions for details. The module has built-in PCB antenna and can connect
other antennas through IPEX. The product has obtained FCC, CE, RoHS and
other international authoritative certification reports, users do not need to worry about its performance. We use a 32MHz
high precision low temperature drift active crystal to ensure its industrial properties and stability.
Because this module is a pure hardware SoC module, users need to program it before they can use it.
1.2 Features
Communication distance tested is up to 100m；
Maximum transmission power of 2.5mW, software multi-level adjustable；
Support bluetooth 4.2 and bluetooth 5.0；
Built-in 32.768 kHz clock crystal oscillator；
Support for the global license-free ISM 2.4GHz band；
Rich resources, 512KB FLASH, 64KB RAM;
Support 2.0V~3.6V power supply, more than 3.3V power supply can guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for a long time；
Support onboard PCB antenna and IPEX interface, users can choose according to their needs；

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1.3 Application
Smart home and industrial sensors；
Security system and positioning system;
Wireless remote control, UAV；
Wireless Game Remote Controller；
Health care products；
Wireless voice, wireless headset；
Automotive industry applications.
2. Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min.
Max.
Power supply（V）
0
3.6
Voltage over 3.6V will cause permanent
damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules are
used in short distance
Operating temperature（℃）
-40
85
/
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operating voltage（V）
1.8
3.3
3.6
≥3.3 V ensures output power
Communication level（V）
-
3.0
-
For 5V TTL, it may be at risk of burning
down
Operating temperature（℃）
-40
-
85
Industrial design
Operating frequency（MHz）
2379
2430
2496
Support ISM band
Power
consumpti
on
TX current（mA）
-
14
-
Instant power consumption
RX current（mA）
-
5
-
-
Sleep current （μA）
-
2
-
Software is shut down
Max Tx power（dBm）
3.8
4
4.3
-
Receiving sensitivity（dBm）
-94
-95
-96
Air data rate is 1Mbps

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Main parameter
Description
Remark
Distance for reference
100m
Test condition：clear and open area, antenna gain: 5dBi，
antenna height: 2.5m，air data rate: 1Mbps
Crystal frequency
24MHz / 32.768KHz
-
Support protocal
BLE 4.2/5.0
-
Package
SMD
-
Connector
1.27mm
-
IC
nRF52832-QFAA
-
FLASH
512KB
-
RAM
64KB
-
kernel
ARM CORTEX-M4F
-
Size
17.5 * 28.7 mm
-
Antenna
Onboard PCB / IPEX
Equivalent impedance is about 50 ohms
3. Size and pin definition
No.
Pin item
Pin direction
Application
0
GND
Input
Ground electrode, connect to reference ground of power

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1
GND
Input
Ground electrode, connect to reference ground of power
2
GND
Input
Ground electrode, connect to reference ground of power
3
DEC2
-
1.3 V Digital power supply decoupling controller
4
DEC3
-
Power supply decoupling
5
P0.25
Input/Output
MCU GPIO
6
P0.26
Input/Output
MCU GPIO
7
P0.27
Input/Output
MCU GPIO
8
P0.28
Input/Output
MCU GPIO
9
P0.29
Input/Output
MCU GPIO
10
P0.30
Input/Output
MCU GPIO
11
P0.31
Input/Output
MCU GPIO
12
DEC4
-
1.3 V Digital power supply decoupling controller
Input from DC/DC regulator Output from1.3 V LDO
13
DCC
-
DC/DC DC regulator output
14
DEC1
-
0.9 V Digital power supply decoupling controller
15
GND
Input
MCU GPIO
16
VCC
Input
Power supply 1.8 ~ 3.6V DC（Note: The voltage higher 3.6V is forbidden）
17
P0.02
Input/Output
MCU GPIO
18
P0.03
Input/Output
MCU GPIO
19
P0.04
Input/Output
MCU GPIO
20
P0.05
Input/Output
MCU GPIO
21
P0.06
Input/Output
MCU GPIO
22
P0.07
Input/Output
MCU GPIO
23
P0.08
Input/Output
MCU GPIO
24
P0.09
Input/Output
MCU GPIO
25
P0.10
Input/Output
MCU GPIO
26
P0.11
Input/Output
MCU GPIO
27
P0.12
Input/Output
MCU GPIO
28
P0.13
Input/Output
MCU GPIO
29
P0.14
Input/Output
MCU GPIO
30
P0.15
Input/Output
MCU GPIO
31
P0.16
Input/Output
MCU GPIO
32
P0.17
Input/Output
MCU GPIO
33
P0.18
Input/Output
MCU GPIO
34
P0.19
Input/Output
MCU GPIO

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35
P0.20
Input/Output
MCU GPIO
36
P0.21
Input/Output/RST
MCU GPIO
37
SWDCLK
Input
Serial Line Debugging / Clock Input Debugging and Programming
38
SWDIO
Input
Serial line debugging and programming debugging
39
P0.22
Input/Output
MCU GPIO
40
P0.23
Input/Output
MCU GPIO
41
P0.24
Input/Output
MCU GPIO
42
GND
Input
Ground electrode, connect to power reference ground
43
GND
Input
Ground electrode, connect to power reference ground
★For more details, please refer to《nRF528XXDatasheet》in NORDIC ★
4. Basic Operation
4.1 Hardware Design
It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple
coefficient is as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse
connection is connected, the module may be permanently damaged.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged.
Please check the stability of the power supply, the voltage can not be significantly frequent.
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is beneficial for long-term stable operation.
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If
it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to
the digital part of the module and routed in the Bottom Layer.
Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees.
Assume that there are traces with large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to
stay away from the module according to the strength of the interference. If possible, you can do it properly. Isolation
and shielding
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage).
Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good

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antenna extension cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
4.2 Software Programming
The core of this module is nRF52832, which is completely equivalent to nRF52832. Users can operate according to
the nRF52832 chip manual (see nRF52832 manual for details).
Because the officially provided programming tool nRFgo Studio has poor compatibility, it is recommended to use
J-LINK-V8 or above for program burning.
About the issue that the old model can be programmed, while the new model can't be programmed, It is because the
new model being added with read/write protection during production. It needs to be properly connected to the line
and then use the official nRFgo Studio for Recover (Jlink supports the official nRFgo). Studio), as shown below:

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5. FAQ
5.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is,
the lower the transmitting power is.
Due to antenna quality or poor matching between antenna and module.
5.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
5.3 High bit error rate
There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel
to avoid interference.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly

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Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to
Tsmax）
Average descent rate
6℃/second max
6℃/second max
Time 25℃to peak temperature
Time of 25 ° C to peak temperature
6 minutes max
8 minutes max
6.2 Reflow Soldering Curve
7. Related Model
Model
Chip
Frequency
Hz
Transmit
power
dBm
Test
distance
km
Air Data rate
Packaging
Size
mm
Anten
na
Type
E73-2G4M08S1C
nRF52840
2.4G
8
0.1
BLE 4.2/5.0
SMD
13.0 *
18.0
PCB/IP
X
E73-2G4M04S1A
nRF52810
2.4G
4
0.1
BLE 4.2
PCB/IPEX
17.5 *
PCB/IP

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28.7
X
E73-2G4M04S1D
nRF51822
2.4G
4
0.1
BLE 4.2
PCB/IPX
17.5 *
28.7
PCB/IP
X
E73-2G4M04S1B
nRF52832
2.4G
4
0.1
BLE 4.2/5.0
PCB/IPX
17.5 *
28.7
PCB/IP
X
8. Antenna Type
8.1 Antenna recommendation
The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the
communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent
performance and reasonable price.
Product
Type
Frequency
Hz
Interface
Gain
dBi
Size
Feeder
Features
TX2400-NP-5010
Flexible antenna
2.4G
IPEX
2
50*10m
m
-
Built-in flexible FPC soft
antenna
TX2400-XP-150
Sucker antenna
2.4G
SMA-J
3.5
15cm
150cm
High Gain
TX2400-JK-20
Rubber antenna
2.4G
SMA-J
3
200mm
-
Flexible, Omnidirectional
TX2400-JK-11
Rubber antenna
2.4G
SMA-J
2.5
110mm
-
Flexible, Omnidirectional
TX2400-JZ-3
Rubber antenna
2.4G
SMA-J
2
30mm
-
Ultra short straight，
Omnidirectional
8.2 Antenna Choice

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Type: onboard PCB antenna (default) Type: IPEX interface

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Revision history
Version
Date
Description
Issued by
1.00
2018/8/30
Original version
huaa
1.10
2018/9/30
Model No. split
huaa
1.30
2020/05/09
du
1.4
2020/05/11
2.2 The middle reference distance is changed from 300m
to 100m
du
About us
Technical support: [email protected]om
Documents and RF Setting download link: www.ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or suggestions: [e-mail]
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Fax: [phone] ext. 821
Web: www.ebyte.com
Address: Innovation Center D347, 4# XI-XIN Road,Chengdu, Sichuan, China

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