Elatec TWN4 MultiTech 2 HF User manual

TWN4
MultiTech Core
DocRev5, February 5, 2019
Elatec GmbH

Contents
Contents
1Introduction............................................... 3
2Dimensions............................................... 4
3Connectors............................................... 5
3.1ConnectorA ........................................... 5
3.2ConnectorB ........................................... 6
3.3ConnectorC ........................................... 7
3.4 Connector HF1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5 Connector HF2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.6Jumpers.............................................. 9
4 Using PI Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 SIO Chip soldered on PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2 SAM Card Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5PowerSupply.............................................. 11
6 Power states and current consumption breakdown . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7Disclaimer ............................................... 13
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1 Introduction
1 Introduction
Here is a picture of the TWN4 Core Module MIFARE NFC:
There are three models of TWN4 Core Module available:
• TWN4 MultiTech Core (former TWN4 Core Module MIFARE NFC)
• TWN4 MultiTech Core LEGIC 42 (former TWN4 Core Module LEGIC NFC)
• TWN4 MultiTech Core LEGIC 45 (former TWN4 Core Module LEGIC NFC 4500)
TWN4 MultiTech Core contains voltage regulator, control unit, RFID front ends and communication inter-
faces.
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2 Dimensions
2 Dimensions
The dimensions of TWN4 Core Module are as follows.:
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3 Connectors
3 Connectors
TWN4 MultiTech Core has several connectors on-board. There are three connectors (A, B and C) which
connect either to a carrier board or to a host. Furthermore, there is a antenna connector and a optional
position for placing a coaxial connector.
The connectors A, B and C have identical pitch. Following type of connector is recommended:
• Dual row header
• Pitch 2.0mm
• Pin shape square
• Pin width 0.5mm x 0.5mm
• Length of pins appropriate to custom requirements
3.1 Connector A
The connector A is intended for connecting a cable to the TWN4 core module, which allows communication
with a host. Typically, such a cable is either type USB or RS232. Various appropriate USB and RS232
cables are available from stock.
There is a right-angle connector mounted on-board, which is type Hirose, DF11 series.
Pin Pin Name Function
A1 UGND USB Ground
A2 USB_D+ USB Data +
A3 UVCC USB VCC
A4 USB_D- USB Data -
A5 V24_RXD RS232 RXD (Input)
A6 GND Ground
A7 V24_TXD RS232 TXD (Output)
A8 MGND Cable Sense
Note:
If pin A6 and A8 are connected to each other this has two effects:
1. The firmware of TWN4 changes host channel to RS232
2. The integrated circuit, which is interfacing to voltage levels of RS232 is powered up.
Following order codes for connector A and mating parts:
• Pin header on TWN4 Core Module: Hirose DF11-8DP-2DS(24)
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3 Connectors
• Mating part (crimping socket): Hirose DF11-8DS-2C
• Mating part (crimping contact): Hirose DF11-22SC (22 AWG)
3.2 Connector B
Pin Pin Name Function
B1 GND Ground
B2 VIN Unregulated input to on-board voltage regulator
B3 VREG 3.3V output from on-board voltage regulator
B4 VCC 3.3V power supply input
B5 RESET- Low active TTL input with internal pull-up resistor for hard
reset.
B6 PWRDWN- Low active TTL input with internal pull-up resistor for turning
off the voltage regulator.
B7 COM1_RX- Low active TTL input with internal pull-up resistor of asyn-
chronous RXD to COM1.
B8 COM1_TX- Low active TTL output (push/pull) of asynchronous TXD from
COM1.
B9 I2C_SDA Data pin of I2C interface. No internal pull up.
B10 I2C_SCL Clock pin of I2C interface. No internal pull up.
B11 CAN_RX TTL RX pin of CAN interface. A external interface circuit is
required.
B12 CAN_TX TTL TX pin of CAN interface. A external interface circuit is
required.
B13 ECI_MOSI Pin MOSI of ECI
B14 ECI_MISO Pin MISO of ECI.
B15 ECI_CLK Pin CLK of ECI.
B16 ECI_ATTN- Pin ATTN- of ECI.
B17 GND Ground
B18 Res. This pin is reserved for future purposes.
B19 SPI_MOSI Pin MOSI of SPI interface
B20 SPI_MISO Pin MISO of SPI interface
B21 SPI_SCK Pin SCK of SPI interface
B22 SPI_SS- Pin SS- of SPI interface
B23 Res. This pin is reserved for future purposes.
B24 Res. This pin is reserved for future purposes.
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3 Connectors
3.3 Connector C
Pin Pin Name Function
C1 GND Ground
C2 ANT_HF Together with pin C1, this pin builds a 50 ohm output for
connecting external 13.56MHz antennas
C3 ANT_LF1 Output 1 for connecting external 125 kHz / 134.2 kHz anten-
nas.
C4 ANT_LF2 Output 2 for connecting external 125 kHz / 134.2 kHz anten-
nas.
C5 Res. This pin is reserved for future purposes.
C6 SPK+ Digitally modulated output for a speaker. Second connection
for the speaker is ground. The impedance of the speaker
should be greater than 24 ohm.
C7 IO0 GPIO0, I/O pin for general purposes.
C8 IO1 GPIO1, I/O pin for general purposes.
C9 IO2 GPIO2, I/O pin for general purposes.
C10 IO3 GPIO3, I/O pin for general purposes.
C11 IO4 GPIO4, I/O pin for general purposes.
C12 IO5 GPIO5, I/O pin for general purposes.
C13 IO6 GPIO6, I/O pin for general purposes.
C14 IO7 GPIO7, I/O pin for general purposes.
C15 SAM1_CLK Clock output for SAM1
C16 GND Ground
C17 SAM1_IO I/O line for SAM1
C18 SAM1_RST Reset output for SAM1
C19 SAM2_CLK Clock output for SAM2
C20 GND Ground
C21 SAM2_IO I/O line for SAM2
C22 SAM2_RST Reset output for SAM2
continued on next page. . .
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3 Connectors
Pin Pin Name Function
C23 COM2_RX- Low active TTL input with internal pull-up resistor of asyn-
chronous RXD to COM2.
C24 COM2_TX- Low active TTL output (push/pull) of asynchronous TXD from
COM2.
C25 Res. This pin is reserved for future purposes.
C26 Res. This pin is reserved for future purposes.
C27 Res. This pin is reserved for future purposes.
C28 VCC 3.3V power supply input or output for supplying external com-
ponents. Internally connected to B4.
Note:
• The nominal inductance for an external 125 kHz/134.2 kHz antenna is 490 µH. The series resistance
of the antenna should be lower than 10 ohms.
3.4 Connector HF1
HF connector 1 is a UMCC series 50-ohms output, which is connected internally in parallel to pins C1 and
C2.
3.5 Connector HF2
Position of HF2 offers the possibility to place another 50-ohm connector. It is connected internally in parallel
to pins C1 and C2. There are several series of RF connectors, which can be used for position HF2, like
SMA, SMB, SMC, MCX.
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3 Connectors
3.6 Jumpers
There are several jumpers on-board of the TWN4 Core Module. Depending on the requirements these
jumpers can be soldered together.
Jumper Function
J1 The function is identical to pins A6 and A8. If J1 is closed, the RS232
interface is turned on and the host channel is assumed to be RS232.
J2 Same function like J1 but other side of PCB.
J3 This jumper must be closed, if TWN4 Core Module is powered via con-
nector A, e.g. from USB. It connects VCC from the Core Module to
the on-board voltage regulator, which is supplied from connector A. If
TWN4 Core Module is mounted on a carrier board, this connection can
be avoided by connecting pins B3 and B4 at the carrier board, which
results in exactly the same functionality.
J4 This jumper is for internal purposes only.
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4 Using PI Option
4 Using PI Option
To use the PI Option, e.g. to read the PAC bits from an iCLASS transponder, a SIO processor is needed.
This can be either a SIO chip which is soldered directly on a PCB or a SAM card incorporating the SIO
processor.
4.1 SIO Chip soldered on PCB
The SIO processor has to be added to the design of the mainboard. The chip can be connected either to
SAM1 or SAM2 of the TWN4 Core Module.
Recommended schematic:
4.2 SAM Card Connection
A SAM socket has to be added to the design of the mainboard. The SAM socket can be connected either
to SAM1 or SAM2 of the TWN4 Core Module.
Following SAM sockets are recommended:
• Molex 47388-2001
• Molex 47308-0001
Recommended schematic:
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5 Power Supply
5 Power Supply
The picture below is showing, how power is routed through TWN4 Core Module:
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6 Power states and current consumption breakdown
6 Power states and current consumption
breakdown
The TWN4 Core Module supports 2 power states that can be used to reduce the current consumption of
the reader when the application calls for it.
In Normal state the reader can accommodate a request to search for a high-/low-frequency tag or interact
with peripherals on short notice; the current consumption in this state is the highest.
In Sleep state the reader is not capable of any of the above, but consumes considerably less current. The
reader can be woken by communication on USB/COM ports or a predefined timeout and taken to Normal
state.
In Stop state the reader consumes the least current and can be woken up via external/internal interrupt
and taken to Normal state.
Table 6.1 shows the expected typical current draw in the 2 states described above, depending on the
reader interface connected. It is assumed that a +5V DC Power Source is used. Results vary marginally
when +3.3V source is used in the UART-TTL option. The UART-RS232 option was exercised using
MAX3221A chip.
Module Version MIFARE LEGIC
Normal Idle 69,1 72,1
Sleep 8 20
Stop 0,5 13,5
Table 6.1: Typical Current Consumption in Base System States (mA)
Table 6.2 shows the extra current observed when the TWN4 Core Module is integrated into a reader (these
results are to be taken as example only and are expected to change); these values are to be added to those
in the "Normal Idle" base state.
Function Current Consumption
SearchTag-HF +130
SearchTag-LF +25
RS232 +4
Speaker Constant Tone +80
Table 6.2: Extra Current Consumption per Function added to "Normal Idle" base state (mA)
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7 Disclaimer
7 Disclaimer
Elatec reserves the right to change any information or data in this document without prior notice. The
distribution and the update of this document is not controlled. Elatec declines all responsibility for the use
of product with any other specifications but the ones mentioned above. Any additional requirement for a
specific custom application has to be validated by the customer himself at his own responsibility. Where
application information is given, it is only advisory and does not form part of the specification.
All referenced brands, product names, service names and trademarks mentioned in this document are the
property of their respective owners.
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