Elatec TWN4 MultiTech 2 HF User manual

TWN4
MultiTech Nano
DocRev9, June 17, 2020
Elatec GmbH

Contents
Contents
1 Introduction .............................................. 3
2 Versions................................................ 4
2.1 Color Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Connector and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Assembly Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.1 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.2 Through-Hole Technology (THT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3 Surface Mount Technology (SMT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3.1 Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.3.2 Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1.3.3 Temperature Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.3.4 Baking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Antenna ................................................ 13
4.1 LF-Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2 HF-Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 PowerSupply ............................................. 14
6 Power states and current consumption breakdown . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Label on TWN4 Nano Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8 Additional Hardware Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1 Programming Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.2 Using PI Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.2.1 SIO Chip soldered on PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.2.2 SAM Card Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.3 Bluetooth BLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.3.1 Connecting BLE Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.3.2 Initial Programming of BLE Module . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.3.3 Connection to the BGM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.3.3.1 Debug Connector of Development Kit . . . . . . . . . . . . . . . . . . . . 21
8.3.3.2 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9 Packaging............................................... 25
9.1 Carrier Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
9.1.1 Dimensions of Tape Leader & Trailer . . . . . . . . . . . . . . . . . . . . . . . . . . 26
9.2 Tray ............................................... 26
9.3 Package ............................................. 26
9.4 Label............................................... 28
9.5 Position of Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10Disclaimer............................................... 30
Page 2 of 30

1 Introduction
1 Introduction
Here is a picture of the TWN4 MultiTech Nano:
Currently, there are two models of TWN4 Nano Module available:
• TWN4 MultiTech Nano
• TWN4 MultiTech Nano LEGIC 42
The TWN4 Nano Module contains voltage regulator, control unit, RFID front ends and communication
interfaces.
Page 3 of 30

2 Versions
2 Versions
As mentioned above, there are two models with different HF frontends (MIFARE and LEGIC) of the TWN4
Nano Module. In case of MIFARE it is available in three different versions, which support either both LF
(125kHz / 134.2kHz) and HF (13.56MHz), LF only or HF only. In case of LEGIC there is only the full version
with both LF (125kHz / 134.2kHz) and HF (13.56MHz). The following table lists all possible options.
Feature TWN4 MultiTech TWN4 MultiTech TWN4 MultiTech TWN4 MultiTech
Nano Module Nano Module HF Nano Module LF Nano Legic 42
LF √-√ √
HF √ √ -√
Table 2.1: Different features of TWN4 MultiTech Nano Module Versions
2.1 Color Marking
The different versions of the TWN4 Nano Module are marked with a color dot on the label.
Page 4 of 30

3 Connector and Pin-Out
3 Connector and Pin-Out
The TWN4 Nano Module has two rows of pins (24 pins each), which can be used either for THT or SMT
mounting on the carrier board. The contact pitch is 1.27mm (50mil).
Page 5 of 30

3 Connector and Pin-Out
Pin Pin Name Function
1 HF_ANT1 TWN4 MultiTech Nano:
Together with pin HF_ANT2, this pin is doing load modulation on antenna
13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
2 HF_RXP TWN4 MultiTech Nano:
Together with pin HF_RXN, this pin builds the input from the direct
matched antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
3 HF_TX1 TWN4 MultiTech Nano:
Together with pin HF_TX2, this pin builds the output to the direct matched
antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Output for antenna (50 Ohm)
4 HF_GND Antenna Ground (connected to GND)
5 HF_TX2 TWN4 MultiTech Nano:
Together with pin HF_TX1, this pin builds the output to the direct matched
antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
6 HF_RXN TWN4 MultiTech Nano:
Together with pin HF_RXP, this pin builds the input from the direct matched
antenna 13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
7 HF_ANT2 TWN4 MultiTech Nano:
Together with pin HF_ANT1, this pin is doing load modulation on antenna
13.56MHz
TWN4 MultiTech Nano LEGIC 42:
Not connected
8 LF_ANT1 Output 1 for connecting external 125 kHz / 134.2 kHz antennas
9 LF_ANT2 Output 2 for connecting external 125 kHz / 134.2 kHz antennas
continued on next page. . .
Page 6 of 30

3 Connector and Pin-Out
10 GPIO0 GPIO0, I/O pin for general purposes.
11 GPIO1 GPIO1, I/O pin for general purposes.
12 GPIO2 GPIO2, I/O pin for general purposes.
13 GPIO3 GPIO3, I/O pin for general purposes.
14 GPIO4 GPIO4, I/O pin for general purposes.
15 GPIO5 GPIO5, I/O pin for general purposes.
16 GPIO6 GPIO6, I/O pin for general purposes.
17 GPIO7 GPIO7, I/O pin for general purposes.
18 SAM1_CLK Clock output for SAM1
19 SAM1_IO I/O line for SAM1
20 SAM1_RST Reset output for SAM1
21 GND Ground
22 SAM2_CLK Clock output for SAM2
23 SAM2_IO I/O line for SAM2
24 SAM2_RST Reset output for SAM2
25 BOOT Shortcut against ground during reset will guide firmware di-
rectly into boot loader
26 SPK+ Digitally modulated output for a speaker. Second connection
for the speaker is ground. The impedance of the speaker
should be greater than 24 ohm.
27 COM2_TX- Low active output (logic level, push/pull) of asynchronous TXD
from COM2.
28 COM2_RX- Low active input (logic level) with internal pull-up resistor of
asynchronous RXD to COM2.
29 SPI_SS- Pin SS- of SPI interface
30 SPI_MISO Pin MISO of SPI interface
31 SPI_MOSI Pin MOSI of SPI interface
32 SPI_SCK Pin SCK of SPI interface
33 GND Ground
34 CAN_TX TTL TX pin of CAN interface. A external interface circuit is
required.
35 CAN_RX TTL RX pin of CAN interface. A external interface circuit is
required.
continued on next page. . .
Page 7 of 30

3 Connector and Pin-Out
36 I2C_SCL Clock pin of I2C interface. No internal pull up.
37 I2C_SDA Data pin of I2C interface. No internal pull up.
38 PWRDWN- Low active TTL input with internal pull-up resistor for turning off
the voltage regulator.
39 RESET- Low active TTL input with internal pull-up resistor for hard re-
set.
40 VCC 3.3V power supply input.
41 VREG 3.3V output from on-board voltage regulator
42 HOSTSEL Host channel selector: Low = COM1, high = USB. This pin is
internally pulled high.
43 USB_DM USB Data -
44 USB_DP USB Data +
45 COM1_TX- Low active output (logic level, push/pull) of asynchronous TXD
from COM1.
46 COM1_RX- Low active input (logic level) with internal pull-up resistor of
asynchronous RXD to COM1.
47 VIN Unregulated input to on-board voltage regulator.
48 GND Ground
Page 8 of 30

3 Connector and Pin-Out
3.1 Assembly Information
3.1.1 Dimensions
The dimensions of TWN4 Nano Module are as follows (All dimensions in mm unless otherwise stated.)
Page 9 of 30

3 Connector and Pin-Out
3.1.2 Through-Hole Technology (THT)
Suggested connector for THT assembly is Samtec TMS-124-02-G-S.
In case a detachable connection is required, mating part (to be mounted on carrier board) is Samtec
SLM-124-01-G-S.
3.1.3 Surface Mount Technology (SMT)
3.1.3.1 Footprint
Page 10 of 30

3 Connector and Pin-Out
3.1.3.2 Placement
Please take special care about correct placement of TWN4 MultiTech Nano on the soldering pads. Wrong
placement might cause holes for THT assembly to absorb tin from the SMT pads. Please follow these
rules:
Page 11 of 30

3 Connector and Pin-Out
3.1.3.3 Temperature Profile
For reflow soldering, following temperature profile is recommended:
tS
tP
T
240°C
217°C
200°C
TP245°C
tL
25°C
150°C
t
Ramp-up rate 1-3 K/s
Preheat time (ts) 60-180 seconds
Time within liquidus temperature (tL) 60-150 seconds
Peak temperature (TP) 245 +0/-5 °C
Time within peak (tP) 10-30 seconds
3.1.3.4 Baking
The TWN4 MultiTech Nano has a moisture sensitivity level (MSL) of 3. This means, that the modules must
be baked prior to reflow soldering, if the modules are removed from their sealed dry-bags and not soldered
within their out-of-bag time, which is 168 hours.
In this case it is recommended to bake the TWN4 MultiTech Nano for 10 days at 85°C
Page 12 of 30

4 Antenna
4 Antenna
4.1 LF-Antenna
The nominal inductance for an external 125 kHz/134.2 kHz antenna is 490 µH. The series resistance of the
antenna should be lower than 10 ohms.
4.2 HF-Antenna
Please see separate document TWN4 Nano Antenna Match Calc Guide DocRev1.pdf and AntennaTuner.exe.
AntennaTuner allows to do an antenna design interactively.
Page 13 of 30

5 Power Supply
5 Power Supply
The picture below is showing how power is routed through TWN4 Nano Module:
Page 14 of 30

6 Power states and current consumption breakdown
6 Power states and current consumption
breakdown
The TWN4 Nano Module supports 3 power states that can be used to reduce the current consumption of
the reader when the application calls for it.
In Normal state the reader can accommodate a request to search for a high-/low-frequency tag, perform
a BLE action or interact with peripherals on short notice; the current consumption in this state is the
highest.
In Sleep state the reader is not capable of any of the above, but consumes considerably less current. The
reader can be woken by communication on USB/COM ports, predefined timeout, or a Low-Power-Card-
Detection (LPCD) event and taken to Normal state.
In Stop state the reader consumes the least current and can be woken up via external/internal interrupt, or
a Low-Power-Card-Detection (LPCD) event and taken to Normal state.
Changing the LPCD poll time will change the current consumption, which can be estimated with the fol-
lowing formula:
ILP CD = 0.5mA +0.1mAs
tP oll[s]
.
Table 6.1 shows the expected typical current draw in the 3 states described above, depending on the
reader interface connected. It is assumed that a +5V DC Power Source is used. Results vary marginally
when +3.3V source is used in the UART-TTL option. The UART-RS232 option was exercised using
MAX3221A chip.
Host Connection USB UART-TTL
Normal Idle 65 59,4
Sleep 15,0 7,1
Sleep LPCD Option 15,4 7,5
Stop N/A 0,45
Stop LPCD Option N/A 0,8
Table 6.1: Typical Current Consumption in Base System States (mA)
Table 6.2 shows the extra current observed when the TWN4 Nano Module is integrated into a reader
(these results are to be taken as example only and are expected to change); these values are to be added
to those in the "Normal Idle" base state.
Page 15 of 30

6 Power states and current consumption breakdown
Function Current Consumption
SearchTag-HF +130
SearchTag-LF +25
RS232 +4
BLE Active Packet Reception +9
BLE Active Transmission (0 dBm output power) +9
BLE Active Transmission (8 dBm output power) +24
Speaker Constant Tone +80
Table 6.2: Extra Current Consumption per Function added to "Normal Idle" base state (mA)
Page 16 of 30

7 Label on TWN4 Nano Module
7 Label on TWN4 Nano Module
The content of the label is as follows:
R YYWW
ZZZ
Code Meaning Example
YY Year 17
WW Calendar week 05
ZZZ Part number code
6th to 8th digit of part number, e.g.
part number: T4NM-FDC0
part number code: FDC
FDC
Table 7.1: Label content description
Page 17 of 30

8 Additional Hardware Requirements
8 Additional Hardware Requirements
8.1 Programming Firmware
To program firmware to the TWN4 Nano Module, it is mandatory to have at least one of the following
connections:
• USB
• COM1
• COM2
This should be kept in mind while designing a mainboard for the TWN4 Nano Module.
For a description how to program firmware to the TWN4 Nano Module please refer to documents TWN4
AppBlaster Config Cards User Guide DocRev6.pdf for Windows and TWN4 Programming with Command
Line under Linux DocRev1.pdf for Linux.
8.2 Using PI Option
To use the PI Option, e.g. to read the PAC bits from an iCLASS transponder, a SIO processor is needed.
This can be either a SIO chip which is soldered directly on a PCB or a SAM card incorporating the SIO
processor.
8.2.1 SIO Chip soldered on PCB
The SIO processor has to be added to the design of the mainboard. The chip can be connected either to
SAM1 or SAM2 of the TWN4 Nano Module.
Recommended schematic:
8.2.2 SAM Card Connection
A SAM socket has to be added to the design of the mainboard. The SAM socket can be connected either
to SAM1 or SAM2 of the TWN4 Nano Module.
Page 18 of 30

8 Additional Hardware Requirements
Following SAM sockets are recommended:
• Molex 47388-2001
• Molex 47308-0001
Recommended schematic:
8.3 Bluetooth BLE
8.3.1 Connecting BLE Module
The firmware of the TWN4 Nano Module has direct support for the Silicon Labs BGM111, BGM121 and
BGM11S BLE module.
To use this feature, it is needed to connect following signals to the TWN4 Nano Module:
• COM2_TX-
• COM2_RX-
• GPIO7
The signals TDI, TDO, TMS and TCK are needed to do an initial programming of the BLE Module.
Please note:
In order to have BLE module with support by TWN4 Nano Module firmware, TWN4 must be purchased
with activated B Option. Otherwise, BLE functionality must be programmed from within the App. Please
contact your distributor for TWN4 Nano Module with B option.
Page 19 of 30

8 Additional Hardware Requirements
Following schematics are recommended:
BGM111
BGM121 / BGM11S
8.3.2 Initial Programming of BLE Module
All the BGM Bluetooth Modules from Silicon Labs must first be programmed.
With Silicon Labs Development Kit SLWSTK6101C all BGM modules can be programmed via the SWD
pins TMS and TCK. The Silicon Labs software Simplicity Studio is a universal development package which
can be used for the initial programming of the BGM modules. This software contains the tool "Flash Pro-
grammer" for programming the BGM Modules. The following part describes a possible way to programm
the BGM Modules.
Page 20 of 30