EMC CLARiiON DAE2P Application guide

EMC Corporation
Corporate Headquarters:
Hopkinton, MA 01748-9103
1 -508-435-1000
www.EMC.com
EMC CLARiiON
DAE2P and DAE3P Disk-Array Enclosures
HARDWARE REFERENCE
P/N 300-002-407
REV A04

DAE2P/DAE3P Hardware Reference
ii
Copyright © 2005 - 2006 EMC Corporation. All rights reserved.
Published August, 2006
EMC believes the information in this publication is accurate as of its publication date. The
information is subject to change without notice.
THE INFORMATION IN THIS PUBLICATION IS PROVIDED “AS IS.” EMC CORPORATION
MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WITH RESPECT TO THE
INFORMATION IN THIS PUBLICATION, AND SPECIFICALLY DISCLAIMS IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Use, copying, and distribution of any EMC software described in this publication requires an
applicable software license.
For the most up-to-date listing of EMC product names, see EMC Corporation Trademarks on
EMC.com.
All other trademarks used herein are the property of their respective owners.

DAE2P/DAE3P Hardware Reference iii
Regulatory Notices Product Type(s) KTN-STL, KTN-STL4
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Testing was done with shielded cables. Therefore, in order to comply with the FCC regulations, you must use shielded
cables with your installation. Changes or modifications to this unit not expressly approved by the party responsible
for compliance could void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense.
This Class A digital apparatus complies with Canadian ICES-003
Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada
Manufacturer’s Declaration of Conformity - CE mark
This equipment has been tested and found to comply with the requirements of European Community Council
Directives 89/336/EEC, 73/23/EEC, and 98/68/EEC relating to electromagnetic compatibility and product safety
respectively.
This product complies with EN55022, CISPR22 and AS/NZS CISPR22 Class A.
This is a Class A product. In a domestic environment this product may cause radio interference in which case the user
may be required to take adequate measures.

DAE2P/DAE3P Hardware Reference
iv
Standards Certification and Compliance
Rackmount disk enclosures are tested and certified for compliance with the international environmental and safety
specifications listed below and marked to indicate such compliance and certification as required.
EMI Standards
Standard Description
CSA 22.2 60950 3rd
Edition
Safety of Information Technology Equipment including Electrical
Business Equipment
TUV GS EN 60950-2000
UL 60950 3rd Edition
GOST
CE Mark European EMC Directive & Low Voltage Directive Requirements
Standard Description
FCC Part 15 Class A, Radio Frequency Device Requirements
ICES-003 Class A, Interference-Causing Equipment Standard - Digital
Apparatus
CE Mark European EMC Directive & Low Voltage Directive Requirements.
VCCI Class A, Voluntary Control Council for Interference
AS/NZS CISPR22 Class A, Electromagnetic Interference - Limits & Methods of
Measurement of ITE
CNS13438 BSMI EMC Requirements

DAE2P/DAE3P Hardware Reference v
Preface............................................................................................................................. ix
Warnings and cautions.......................................................................................... xiii
Chapter 1 About DAE2P and DAE3P disk enclosures
Introduction...................................................................................... 1-2
Link Control Cards (LCCs)............................................................. 1-8
Disk modules.................................................................................... 1-9
Power supply/system cooling modules .................................... 1-11
Chapter 2 Installing a DAE2P/DAE3P
Requirements.................................................................................... 2-2
Installing a disk enclosure in a cabinet......................................... 2-3
Setting up an installed disk enclosure .......................................... 2-4
Connecting AC Power..................................................................... 2-5
Setting the enclosure address....................................................... 2-10
Connecting the DAE2P/DAE3P to the back end bus............... 2-12
Binding disk modules into RAID groups................................... 2-15
Chapter 3 Servicing a DAE2P/DAE3P
Monitoring disk enclosure status .................................................. 3-2
Handling FRUs................................................................................. 3-6
Replacing or adding a disk module............................................ 3-10
Replacing an LCC module............................................................ 3-17
Replacing a power supply/system cooling module................. 3-20
Contents

DAE2P/DAE3P Hardware Reference
vi
Contents
Appendix A Technical specifications
Enclosure specifications ................................................................ A-2
Operating limits ............................................................................. A-5
Index................................................................................................................................ i-1

DAE2P/DAE3P Hardware Reference vii
1-1 DAE2P/DAE3P ............................................................................................. 1-2
1-2 DAE2P/DAE3P front LED display ............................................................ 1-4
1-3 DAE2P/DAE3P rear components .............................................................. 1-5
1-4 Disk enclosure rear view — LEDs and connectors .................................. 1-5
1-5 Disk enclosure bus and address indicators ............................................... 1-6
1-6 Disk enclosure front bezel ............................................................................ 1-7
1-7 LCC connectors and status LEDs ................................................................ 1-8
1-8 Disk modules ............................................................................................... 1-10
1-9 Power/cooling module LEDs .................................................................... 1-12
2-1 Plugging in the AC line cords ..................................................................... 2-5
2-2 Connecting DAE2P power cords (CX300/CX500 storage system) ........ 2-7
2-3 Connecting DAE3P power cords (CX3-80 storage system) .................... 2-8
2-4 Setting the enclosure address (EA) ........................................................... 2-11
2-5 Connecting a disk enclosure to another FC device ................................ 2-12
2-6 Cabling disk enclosures together — two Fibre Channel buses ............ 2-13
2-7 Cabling DAE2Ps/DAE3Ps together — four Fibre Channel buses ....... 2-14
3-1 Front disk enclosure and disk module status lights (bezel removed) ... 3-2
3-2 Enclosure address and bus ID indicators .................................................. 3-4
3-3 Power/cooling module status indicators .................................................. 3-5
3-4 LCC status LEDs ............................................................................................ 3-5
3-5 Disk module comparison ........................................................................... 3-10
3-6 Unlocking and removing the front bezel ................................................. 3-12
3-7 Removing a disk filler module .................................................................. 3-13
3-8 Removing a disk module ........................................................................... 3-14
3-9 Installing a disk or filler module ............................................................... 3-15
3-10 Installing and locking the front bezel ....................................................... 3-16
3-11 Removing a copper cable from an LCC ................................................... 3-17
3-12 Removing an LCC ....................................................................................... 3-18
Figures

DAE2P/DAE3P Hardware Reference
viii
Contents
3-13 Installing an LCC ........................................................................................ 3-18
3-14 Reconnecting a copper cable to an LCC .................................................. 3-19
3-15 Unplugging the AC power cord ............................................................... 3-20
3-16 Removing a power/cooling module ........................................................ 3-21
3-17 Installing a power/cooling module ......................................................... 3-21
3-18 Plugging in the power cord ....................................................................... 3-22

DAE2P/DAE3P Hardware Reference ix
Preface
This manual is your primary source of information about EMC
CLARiiON 2- and 4-gigabit UltraPoint disk-array enclosure (DAE2P
and DAE3P) hardware.
The DAE2P/DAE3P is often called a disk enclosure.
Audience This guide is part of the DAE2P and DAE3P documentation set, and
is intended for use by system administrators and others responsible
for the installation, setup, and maintenance of the product.
Readers of this guide are expected to be familiar with the following
topics:
◆Storage-system operation
◆Basic computer hardware safety and maintenance procedures.
Organization The information in this guide is organized as follows:
Chapter 1, “About DAE2P and DAE3P disk enclosures,” provides a
descriptive overview of the disk enclosure.
Chapter 2, “Installing a DAE2P/DAE3P,” describes how to set up and
power up the enclosure(s) in your cabinet.
Chapter 3, “Servicing a DAE2P/DAE3P,” provides instructions and
procedures for recognizing and replacing failed components.
Appendix A, “Technical specifications,” lists operating limits,
shipping and storage requirements, and technical specifications.

xDAE2P/DAE3P Hardware Reference
Preface
Related
documentation EMC Rails and Enclosures (CX-Series Storage Systems) Field Installation
Guide (P/N 300-001-799)
EMC Rails and Enclosures (CX3-Series Storage Systems) Field Installation
Guide (P/N 300-003-630)
EMC Navisphere Manager Administrator’s Guide (P/N 300-003-511)
Planning your CX3-Series Fibre Channel Storage System Configuration
Available on EMC Powerlink
EMC Navisphere Security Administrator’s Guide (P/N 069001124)
EMC Installation Roadmap for CX3-Series, CX-Series, AX-Series, and
FC-Series Storage Systems (P/N 069001166)
EMC Storage Systems CX-Series Disk and FLARE OE Matrix
(P/N 014003111)
Conventions used in
this guide EMC uses the following conventions for notes, cautions, warnings,
and danger notices.
A note presents information that is important, but not hazard-related.
CAUTION
!
A caution contains information essential to avoid data loss or
damage to the system or equipment. The caution may apply to
hardware or software.
WARNING
A warning contains information essential to avoid a hazard that can
cause severe personal injury, death, or substantial property damage
if you ignore the warning.
DANGER
A danger notice contains information essential to avoid a hazard
that will cause severe personal injury, death, or substantial property
damage if you ignore the message.

DAE2P/DAE3P Hardware Reference xi
Preface
Typographical conventions
This manual uses the following format conventions:
Finding current
information The most up-to-date information about the DAE2P and DAE3P is
posted on the EMC Powerlink website. We recommend that you
download the latest information before you install or service your
enclosure. If you purchased this product from an EMC reseller and
you cannot access Powerlink, the latest product information should
be available from your reseller.
To access EMC Powerlink, use the following link:
http://Powerlink.EMC.com
After you log in, select Support > Documentation/White Paper
Library and find the following:
◆The FLARE™ software release notes
◆The latest version of this reference.
This
typeface Indicates text (including punctuation) that you type
verbatim, all commands, pathnames, filenames,
and directory names. It indicates the name of a
dialog box, field in a dialog box, menu, menu
option, or button.
This typeface Represents variables for which you supply the
values; for example, the name of a directory or file,
your username or password, and explicit
arguments to commands.
This
typeface
Represents a system response (such as a message or
prompt), a file or program listing.
x> yRepresents a menu path. For example, Operations
> Poll All Storage Systems tells you to select Poll
All Storage Systems on the Operations menu.
[ ] Encloses optional entries.
|Separates alternative parameter values; for
example:
LUN-name | LUN-number means you can use either
the LUN-name or the LUN-number.

xii DAE2P/DAE3P Hardware Reference
Preface
◆EMC Installation Roadmap for CX3-Series, CX-Series, AX-Series, and
FC-Series Storage Systems, which provides a checklist of the tasks
that you must complete to install your storage system in a storage
area network (SAN) or direct attach configuration.
Where to get help EMC support, product, and licensing information can be obtained as
follows.
Product information — For documentation, release notes, software
updates, or for information about EMC products, licensing, and
service, go to the EMC Powerlink website (registration required) at:
http://Powerlink.EMC.com
Technical support — For technical support, go to EMC WebSupport
on Powerlink. To open a case on EMC WebSupport, you must be a
WebSupport customer. Information about your site configuration and
the circumstances under which the problem occurred is required.
Your comments Your suggestions will help us continue to improve the accuracy,
organization, and overall quality of user publications. Please send a
message to [email protected] with your opinions of this
manual.

DAE2P/DAE3P Hardware Reference xiii
The following warnings and cautions pertain throughout this guide.
WARNING Trained service personnel only
Ground circuit continuity is vital for safe operation of the machine.
Never operate the machine with grounding conductors disconnected.
Remember to reconnect any grounding conductors removed for or
during any installation procedure.
ATTENTION Resérvé au personnel autorisé.
Un circuit de terre continu est essentiel en vue du fonctionnement
sécuritaire de l'apareil. Ne jamais mettre l'appareil en marche lorsque
le conducteur de mise a la terre est débranché.
WARNUNG Nur für Fachpersonal.
STROMSTREUVERLUST: Gerät muss geerdet werden, bevor es am
Stromnetz angeschlossen wird.
Warnings and
cautions

xiv DAE2P/DAE3P Hardware Reference
Warnings and Cautions
WARNING
Trained personnel are advised to exercise great care at all times
when working on the unit. Remember to:
◆Remove rings, watches, or other jewelry and neckties before
you begin any procedures.
◆Use caution near any moving part and any part that may start
unexpectedly such as fans, motors, solenoids, and so on.
◆Always use the correct tools for the job.
◆Always use the correct replacement parts.
◆Keep all paperwork, including incident reports, up to date,
complete, and accurate.
Static precautions EMC incorporates state-of-the-art technology in its designs, including
the use of LSI and VLSI components. These chips are very susceptible
to damage caused by static discharge and need to be handled
accordingly.
CAUTION
!
Before handling printed-circuit boards or other parts containing
LSI and/or VLSI components, observe the following precautions:
◆Store all printed-circuit boards in antistatic bags.
◆Use a ground strap whenever you handle a printed-circuit
board.
◆Unless specifically designed for nondisruptive replacement,
never plug or unplug printed-circuit boards with the power on.
Severe component damage may result.

DAE2P/DAE3P Hardware Reference xv
Warnings and Cautions
Replacing the SP battery
A lithium battery on the storage processor powers the real-time clock
(RTC) for three to four years in the absence of power. Only trained
personnel should change or replace this battery.
WARNING
Danger of explosion if battery is incorrectly replaced. Replace only
with the same or equivalent type recommended by the equipment
manufacturer. Discard used batteries according to manufacturer's
instructions.

xvi DAE2P/DAE3P Hardware Reference
Warnings and Cautions

About DAE2P and DAE3P disk enclosures 1-1
1
Invisible Body Tag
Topics in this chapter include:
◆Introduction ........................................................................................1-2
◆Link Control Cards (LCCs)...............................................................1-8
◆Disk modules......................................................................................1-9
◆Power supply/system cooling modules.......................................1-11
About DAE2P and
DAE3P disk enclosures

1-2 DAE2P/DAE3P Hardware Reference
About DAE2P and DAE3P disk enclosures
Introduction
EMC® CLARiiON® DAE2P and DAE3P UltraPoint™ (sometimes
called "point-to-point") disk-array enclosures are highly available,
high-performance, high-capacity storage systems that use a Fibre
Channel Arbitrated Loop (FC-AL) as the interconnect interface. An
enclosure connects to another DAE or a CX-series processor, and is
managed by storage-system software in RAID (Redundant Array of
Independent Disk) configurations. The enclosure is only 3U (5.25
inches) high, but can include 15 hard disk drive/carrier modules. Its
modular, scalable design allows for additional disk storage as your
needs increase. The examples and illustrations in this manual show
the rackmounted DAE2P/DAE3P in a standard 40U EMC cabinet.
DAE2P enclosures include high-performance Fibre Channel disk
drives. DAE3P enclosures can include either Fibre Channel or
economical Serial Advanced Technology Attach (SATA 3 Gb/s,
sometimes called SATA II) drives. You can integrate and connect Fibre
Channel and SATA enclosures within a storage system, but you
cannot mix SATA and Fibre Channel components within a DAE3P.
Figure 1-1 DAE2P/DAE3P
EMC2164stil
Disk
Drive
(0 - 14)
Front
Bezel
Rackmount
Cabinet

Introduction 1-3
About DAE2P and DAE3P disk enclosures
The DAE2P/DAE3P uses FC-AL link control cards to manage disks
and I/O traffic between enclosures. A DAE2P supports 2- or 4-gigabit
disks and 2-gigabit data transfer to and from disks on a Fibre Channel
loop called a back-end bus. DAE3P enclosures can support 2- or
4-gigabit disk modules and operate at either 2- or 4-gigabit bus speed.
2 Gb processors, enclosures, and disk modules cannot support or operate on
a 4 Gb bus. The DAE2P and DAE3P are externally identical except for
a distinguishing "4GB" label on the back of DAE3P enclosures.
Any DAE2P or DAE3P includes up to fifteen 3.5-inch disk modules.
Simple serial cabling provides easy scalability. You can interconnect
disk enclosures to form a large disk storage system; the number and
size of buses depends on the capabilities of your storage processor.
Highly available configurations require at least one pair of physically
independent loops (A and B sides of bus 0, sharing the same
dual-port disks). Other configurations use two, three, four, or more
buses. You can place the disk enclosures in the same cabinet, or in one
or more separate cabinets. High-availability features are standard.
The DAE2P/DAE3P includes the following components:
◆A sheet-metal enclosure with a midplane and front bezel
◆Two link control cards (LCCs)
◆As many as 15 disk modules
◆Two power supply/system cooling modules
The power supply and system cooling components of the power/cooling
modules function independently of each other, but the assemblies are
packaged together into a single field-replaceable unit (FRU).
Any unoccupied disk module slot has a filler module to maintain air
flow.
The LCCs, disk modules, power supply/system cooling modules,
and filler modules are field-replaceable units (FRUs), which you can
add or replace without tools while the array is powered up.
The enclosure can continue running with one operating power
supply and a single functional LCC. At least three of the four system
cooling blowers must be running correctly for continuous operation.
Figures 1-2 through1-4 show the disk enclosure components. Details
on each component accompany the figures. Where the enclosure
provides slots for two identical components, the components are
called component-name A or component-name B, as shown in the
illustrations.

1-4 DAE2P/DAE3P Hardware Reference
About DAE2P and DAE3P disk enclosures
For increased clarity, the following figures depict the disk enclosure outside
of the rack cabinet. Your disk enclosure may be installed in a rackmount
cabinet as shown in Figure 1-1.
As shown in Figure 1-2, the front LED display contains two status
lights for each disk module, and two disk enclosure status lights. The
enclosure status lights are visible with the front bezel installed.
Figure 1-2 DAE2P/DAE3P front LED display
A blue power LED indicates a DAE3P enclosure operating at four
gigabits per second. The power LED is green in DAE2P enclosures,
and DAE3Ps operating at two Gb.
Figure 1-3 and Figure 1-4 show the DAE2P/DAE3P components
visible from the rear of the enclosure. Each highly-available enclosure
includes two link control cards and two power supply/system
cooling (power/cooling) modules.
EMC2166a
Power LED
(Green or Blue)
Fault LED
(Amber)
Fault LED
(Amber)
Disk Activity
LED
(Green)