Emerson RXi2-BP Quick user guide

RXi2-BP Hardware Reference Manual
GFK-3187B
November 2020
RXi2-BP
HARDWARE REFERENCE MANUAL

RXi2-BP Hardware Reference Manual Contents
GFK-3187B November 2020
Contents i
Contents
Section 1: Introduction ..........................................................1
1.1 Document History ............................................................................................... 2
1.2 CapabilityandCompatibility ................................................................................ 2
1.3 SoftwareRequirements ....................................................................................... 2
1.4 Features .............................................................................................................. 2
Section 2: UnpackingandInspection.......................................3
2.1 PackageContents ................................................................................................ 3
2.2 AvailableOptionsandAccessories ........................................................................ 3
2.3 ESD andEMI ......................................................................................................... 4
2.4 Unpackand Inspect.............................................................................................. 5
2.5 Handling ............................................................................................................. 6
Section 3: Mounting...............................................................7
3.1 DIN RailMounting................................................................................................ 7
3.2 Panel Mounting ................................................................................................... 9
3.3 Clearances requirements to all mounting options .............................................. 10
Section 4: Installationand Startup ........................................11
4.1 GeneralInstallationGuidelines ........................................................................... 11
4.2 RequiredMaterials ............................................................................................. 11
4.2.1 PowerSupply........................................................................................... 12
4.2.2 Keyboard ................................................................................................ 12
4.2.3 Video Monitor ......................................................................................... 12
4.3 MinimumSystemRequirements......................................................................... 12
4.4 Initial Startup ..................................................................................................... 12
4.5 UEFIFirmwareSetup .......................................................................................... 13
4.5.1 Entering UEFI Firmware Setup ................................................................. 13
4.5.2 Selective Alternative Boot Source ............................................................ 13
4.5.3 Setting up Boot Priority ........................................................................... 13
4.5.4 Restoring UEFI Settings ........................................................................... 13
4.5.5 Configuring Hibernation and Sleep States ............................................... 13
4.5.6 UEFI Passwords........................................................................................ 13
4.5.7 Secure Boot Configuration ...................................................................... 13
Section 5: Installation and ReplacementProcedures.............14

RXi2-BP Hardware Reference Manual Contents
GFK-3187B November 2020
Contents ii
5.1 Remove and Attach Cover ................................................................................. 14
5.2 Replace the Real-Time Clock (RTC) battery ........................................................ 15
5.3 Inserting and removal of µSD Card..................................................................... 17
5.4 Change M.2 Mass Storage Device ...................................................................... 18
Section 6: HardwareInterfaces.............................................20
6.1 External Interfaces............................................................................................. 20
6.1.1 Power-In ................................................................................................. 20
6.1.2 LEDs........................................................................................................ 21
6.1.3 Buttons ................................................................................................... 21
6.1.4 Ethernet Ports ......................................................................................... 22
6.1.5 USB2 / USB3.2Gen1................................................................................. 23
6.1.6 DisplayPort ............................................................................................. 24
6.1.7 Serial Ports .............................................................................................. 25
6.1.8 µSD Slot .................................................................................................. 26
6.2 Internal Interfaces ............................................................................................. 26
6.2.1 M.2 (SATA).............................................................................................. 26
6.3 Internal Devices................................................................................................. 26
6.3.1 MRAM ..................................................................................................... 26
6.3.2 Temperature Sensor................................................................................ 27
Section 7: Hardware and Firmware Programmable Devices ...28
7.1 SMBUS Devices.................................................................................................. 28
7.2 I2C Devices........................................................................................................ 28
7.3 Ethernet ............................................................................................................ 28
7.4 PCIe Switch........................................................................................................ 28
7.5 Multi I/O ............................................................................................................ 28
7.6 PCIe Ports.......................................................................................................... 29
7.7 PCI Routing ....................................................................................................... 29
Section 8: Thermal Performance ...........................................31
8.1 x86 Processor Thermal Design Features............................................................. 31
8.1.1 Dynamic CPU Frequency and Boost Modes .............................................. 31
8.1.2 CPU Throttling ........................................................................................ 31
8.1.3 Temperature Monitoring and Protection ................................................. 32
8.2 Thermal Design Strategy ................................................................................... 33
8.2.1 Thermal Guidance................................................................................... 33
8.2.2 Thermal Test Data................................................................................... 34

RXi2-BP Hardware Reference Manual Contents
GFK-3187B November 2020
Contents iii
Section 9: Specifications .......................................................36
9.1 Power Consumption.......................................................................................... 36
9.2 Temperature ..................................................................................................... 37
9.3 Shock and Vibration .......................................................................................... 37
9.4 Altitude ............................................................................................................. 38
9.5 Regulations and Certifications ........................................................................... 38
9.6 Battery .............................................................................................................. 38
9.7 Technical Specifications..................................................................................... 38
Section 10: Troubleshooting ..................................................39
10.1 Unexpected Restarts When Booting .................................................................. 39
10.2 Booting Problems, Hardware Devices Not Present ............................................. 39
General Contact Information ....................................................................................... 40
Technical Support........................................................................................................ 40

RXi2-BP Hardware Reference Manual Warnings and Cautions
GFK-3187B November 2020
Warnings and Cautions iv
Warnings and Caution Notes as Used in this Publication
WARNING
Warning notices are used in this publication to emphasize that hazardous voltages, currents, temperatures, or
other conditions that could cause personal injury, exist in this equipment, or may be associated with its use.
In situations where inattention could cause either personal injury or damage to equipment, a Warning notice is
used.
CAUTION
Caution notices are used where equipment might be damaged if care is not taken.
NOTICE
Notes and information that are not safety-related.
Note: Notes merely call attention to information that is especially significant to understanding and
operating the equipment.
These instructions do not purport to cover all details or variations in the equipment, nor to provide for every
possible contingency to be met during installation, operation, and maintenance. The information is supplied for
informational purposes only, and Emerson makes no warranty as to the accuracy of the information included
herein. Changes, modifications, and/or improvements to equipment and specifications are made periodically and
these changes may or may not be reflected herein. It is understood that Emerson may make changes,
modifications, or improvements to the equipment referenced herein or to the document itself at any time. This
document is intended for use by trained personnel familiar with the Emerson products referenced herein.
Emerson may have patents or pending patent applications covering the subject matter in this document. The
furnishing of this document does not provide any license whatsoever to any of these patents.
Emerson provides the following document and the information included therein as-is, and without warranty of any
kind, expressed or implied, including but not limited to any implied statutory warranty of merchantability or
fitness for a particular purpose.

RXi2-BP Hardware Reference Manual Section 1
GFK-3187B November 2020
Introduction 1
Section 1: Introduction
A Computer-On-Module (COM) is a module containing all the components necessary for a bootable
host computer, packaged as a super component. A COM requires a carrier board to connect I/O and
power up. COMs are used to build modular solutions and to offer Original Equipment Manufacturer
(OEMs) fast time-to-market with reduced development cost. Like integrated circuits, they provide
OEMs with significant freedom in meeting form-fit-function requirements. For these reasons, the
COM methodology has gained much popularity with OEMs in the embedded industry.
The RXi2-BP IPC industrial computing platform delivers compact, rugged, mid to high-performance
computing and high-performance graphics capabilities to run HMI, historian, and analytics
applications for real-time control of operations.
The RXi2-BP IPC (R2B Series) is composed of the following components:
•mC10L19 COM Express module based on AMD Ryzen V1000 or R1000 series
•CEC10 COM Express type 10 carrier board
•Industrial grade enclosure with heat sink for the module and carrier components
This chapter describes the features, capabilities, and compatibilities of the RXi2-BP IPC and its
components.
Figure 1: RXi2-BP IPC

RXi2-BP Hardware Reference Manual Section 1
GFK-3187B November 2020
Introduction 2
1.1 Document History
Rev
Date
Description
B
November
2020
•Updates to product label
•Updates to Regulations and Certifications
A
Oct 2020
Initial revision
1.2 Capability and Compatibility
The mC10L19 COM Express module is a fully x86 compatible single board computer module,
containing many functions in a very small form-factor. It is based on the PICMG COM Express
Module Base Specification V3.0 Type 10. (Refer to the documentation located at www.picmg.org.)
The mC10L19 uses the AMD family 17h models 10h-1fh (V1000 and R1000) Ryzen Core Processor.
The CEC10 COM Express carrier board is also compliant with the PICMG COM Express Module Base
Specification R3.0 Type 10 (refer to the documentation located at http://www.picmg.org).
The RXi2-BP power supply module provides a voltage input of nominal 24 V DC (± 25%) and
supports under and overvoltage supervisory, and protection against reverse polarity.
1.3 Software Requirements
•Microsoft® Windows® 10 Professional 64-Bit IoT 2019 LTSC
•Linux® Kernel 5.4
1.4 Features
RXi2-BP IPC module features are as follows:
•AMD Ryzen V1000
-4c/8t V1000, TDP 12 - 25W, L2 2MB, L3 4MB, 8 GPU CU, Industrial-temp,
4 to 16GB DDR4-2400 ECC RAM (single rank)
•AMD Ryzen R1000
-2c/4t R1000, TDP 8 - 10W, L2 1MB, L3 2MB, 3 GPU CU,
4 to 16GB DDR4-2400 ECC RAM (single rank)
•1x Display Port V1.4
•2x USB 2.0
•2x USB3.2 Gen1
•4x Gig Ethernet ports (1 Realtek RTL8111 controller and 3 Intel i210IT controllers,
supporting TimeSYNC IEEE1588 and 802.1AS)
•Mini PCIe slot (half size) as option
-Unified Infrastructure Management (UIM) interface
•M.2 PCIe M-Key and SATA Gen3 capability
•fTPM V2.0
•Two serial interfaces (1x RS-232, 1x galvanic isolated RS-485/RS-422)
•Operating at 24 V dc (±25%), including over- and under-voltage protection
•Reverse polarity protection

RXi2-BP Hardware Reference Manual Section 2
GFK-3187B November 2020
Mounting 3
Section 2: Unpackingand Inspection
This chapter describes unpacking, initial inspection, and required preparation considerations
before using the RXi2-BP IPC. Perform the procedures in this chapter to verify proper operation
after shipping and before system integration.
CAUTION
If the RXi2-BP IPC operates in the high ambient temperature up to 70°C (149 ° F), the
surface of the enclosure, especially the heat sink, can reach a temperature of 85°C (185
°F) and above. Be careful and do not touch the RXi2-BP IPC with bare fingers.
Si le RXi2-BP IPC est opérée à une température ambiante élevée jusqu'à 70 ° C (149 ° F), la
surface du boîtier, en particulier le dissipateur thermique, peut atteindre une
température de 85 ° C (185 ° F) et plus. Soyez prudent et ne touchez pas le RXi2-BP IPC
avec les doigts nus.
2.1 Package Contents
Verify that the delivered package contains the contents listed in the following table.
Table 2-1 Delivery Volume
Item
QTY
Description
RXi2-BP
1
RXi2-BP Industrial PC
Serial Connector Plug
2
Serial Connector Plug
24 V Power-In Connector Plug
1
Power Connector Plug
Quick Start Guide
1
Quick Start Guide (GFK-3196)
2.2 Available Options and Accessories
The following tables list the available accessories for the RXi2-BP IPC. For the complete list of
orderable product SKUs please refer to the RXi2-BP Datasheet
Table 2-2 Available Accessories
Item
Description
R2B00ACCMP01
1pcs Mounting Panel Kit R2B
R2B00ACCRM01
1pcs DIN Rail Mounting Kit R2B
Note: For the most current information on options and accessories, contact the nearest Emerson sales or
service office, or an authorized Emerson sales representative. Options are subject to change without
notice.

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GFK-3187B November 2020
Mounting 4
2.3 ESD and EMI
Electrostatic Discharge (ESD) is the discharge of static electricity. Electromagnetic Interference
(EMI) is a disturbance generated by an external source that affects an electrical circuit by
electromagnetic induction, electrostatic coupling, or conduction. ESD and EMI issues may come up
when installing and connecting the system to the other components. There are many ways to
avoid problems with these issues.
Any operational system with cables for I/O signals, connectivity, or peripheral devices provide an
entry point for ESD and EMI. If Emerson has not manufactured the complete system, including the
enclosure and cables, then it is the responsibility of the system integrator and end-user to protect
their system against potential problems. Filtering, optical isolation, ESD gaskets, and other
measures might be required at the physical point of entry (enclosure).
Products manufactured by Emerson should normally be suitable for use in properly designed and
produced customer equipment (cabinets, racks) without any major redesign. However, the
systems might be subject to ESD and EMI problems once installed and interconnected with other
systems. The end-user, system integrator, or installer must test for possible problems and in some
cases, show compliance to local regulations as required in his country or by the intended
application.
CAUTION
Static-sensitive Devices: Handle only at static-safe work stations.
CAUTION
This is an FCC Class A product intended for use in an industrial environment. In a home or
residential environment, this product may cause radio interference, in which case the user
may be required to take adequate measures.
CAUTION
Drain static electricity before you install or remove any parts. Installing or removing modules
without observing this precaution could result in damage to this and/or other modules or
components in your system.
Wear a properly-functioning anti-static strap and make sure you are fully grounded. Any surface
upon which you place the unprotected module or unit should be static-safe, which is usually
facilitated by the use of anti-static mats. From the time it is removed from the anti-static bag until
it is in the board carrier and functioning properly, extreme care should be taken to avoid zapping
the component with ESD. Be aware that you could zap the component without knowing it; a small
discharge, imperceptible to the eye and touch, can often be enough to damage electronic
components. Extra caution should be taken in cold and dry weather when electrostatics easily
builds up.
Only after ensuring that both you and the surrounding area are protected from ESD, carefully
remove the component from the shipping carton by grasping the module on its edges. Place the
component, in its anti-static bag, flat down on a suitable surface. You may then remove the
component from the anti-static bag by tearing the ESD warning labels.

RXi2-BP Hardware Reference Manual Section 2
GFK-3187B November 2020
Mounting 5
2.4 Unpack and Inspect
WARNING
Before installing or removing any board or module, ensure that the system power and
external supplies have been turned off.
WARNING
DO NOT apply power to the board if it has visible damage. Doing so may cause further,
possibly irreparable damage, as well as introduce a fire or shock hazard.
NOTICE
Retain all packing material in case of future need.
Before unpacking the board or module, or fitting the device into your system, read the manual
carefully. Also, adhere to the following guidelines:
•Observe all precautions for electrostatic sensitive modules.
•If the product contains batteries, do not place it on conductive surfaces, anti-static plastic,
or a sponge, which can cause shocks and lead to battery or board trace damage.
•Do not exceed the specified operational temperatures. Batteries and storage devices
might also have temperature restrictions.
•Keep all original packaging material for future storage or warranty shipments of the board.
After unpacking the component, inspect it for visible damage that may have occurred during
shipping or unpacking. Although the product is carefully packaged to protect it against the rigors of
shipping, it is still possible that shipping damages may occur. A careful inspection of the shipping
carton should reveal some information about how the package was handled by the shipping service.
If evidence of damage or rough handling is found (usually in the form of bent component leads or
loose socketed components), notify the shipping service as soon as possible and contact Emerson
for additional instructions. Depending on the severity of the damage, it may be necessary to return
the product to the factory for repair.