Emerson RXi2-BP Quick user guide

RXi2-BP Hardware Reference Manual
GFK-3187B
November 2020
RXi2-BP
HARDWARE REFERENCE MANUAL

RXi2-BP Hardware Reference Manual Contents
GFK-3187B November 2020
Contents i
Contents
Section 1: Introduction ..........................................................1
1.1 Document History ............................................................................................... 2
1.2 CapabilityandCompatibility ................................................................................ 2
1.3 SoftwareRequirements ....................................................................................... 2
1.4 Features .............................................................................................................. 2
Section 2: UnpackingandInspection.......................................3
2.1 PackageContents ................................................................................................ 3
2.2 AvailableOptionsandAccessories ........................................................................ 3
2.3 ESD andEMI ......................................................................................................... 4
2.4 Unpackand Inspect.............................................................................................. 5
2.5 Handling ............................................................................................................. 6
Section 3: Mounting...............................................................7
3.1 DIN RailMounting................................................................................................ 7
3.2 Panel Mounting ................................................................................................... 9
3.3 Clearances requirements to all mounting options .............................................. 10
Section 4: Installationand Startup ........................................11
4.1 GeneralInstallationGuidelines ........................................................................... 11
4.2 RequiredMaterials ............................................................................................. 11
4.2.1 PowerSupply........................................................................................... 12
4.2.2 Keyboard ................................................................................................ 12
4.2.3 Video Monitor ......................................................................................... 12
4.3 MinimumSystemRequirements......................................................................... 12
4.4 Initial Startup ..................................................................................................... 12
4.5 UEFIFirmwareSetup .......................................................................................... 13
4.5.1 Entering UEFI Firmware Setup ................................................................. 13
4.5.2 Selective Alternative Boot Source ............................................................ 13
4.5.3 Setting up Boot Priority ........................................................................... 13
4.5.4 Restoring UEFI Settings ........................................................................... 13
4.5.5 Configuring Hibernation and Sleep States ............................................... 13
4.5.6 UEFI Passwords........................................................................................ 13
4.5.7 Secure Boot Configuration ...................................................................... 13
Section 5: Installation and ReplacementProcedures.............14

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Contents ii
5.1 Remove and Attach Cover ................................................................................. 14
5.2 Replace the Real-Time Clock (RTC) battery ........................................................ 15
5.3 Inserting and removal of µSD Card..................................................................... 17
5.4 Change M.2 Mass Storage Device ...................................................................... 18
Section 6: HardwareInterfaces.............................................20
6.1 External Interfaces............................................................................................. 20
6.1.1 Power-In ................................................................................................. 20
6.1.2 LEDs........................................................................................................ 21
6.1.3 Buttons ................................................................................................... 21
6.1.4 Ethernet Ports ......................................................................................... 22
6.1.5 USB2 / USB3.2Gen1................................................................................. 23
6.1.6 DisplayPort ............................................................................................. 24
6.1.7 Serial Ports .............................................................................................. 25
6.1.8 µSD Slot .................................................................................................. 26
6.2 Internal Interfaces ............................................................................................. 26
6.2.1 M.2 (SATA).............................................................................................. 26
6.3 Internal Devices................................................................................................. 26
6.3.1 MRAM ..................................................................................................... 26
6.3.2 Temperature Sensor................................................................................ 27
Section 7: Hardware and Firmware Programmable Devices ...28
7.1 SMBUS Devices.................................................................................................. 28
7.2 I2C Devices........................................................................................................ 28
7.3 Ethernet ............................................................................................................ 28
7.4 PCIe Switch........................................................................................................ 28
7.5 Multi I/O ............................................................................................................ 28
7.6 PCIe Ports.......................................................................................................... 29
7.7 PCI Routing ....................................................................................................... 29
Section 8: Thermal Performance ...........................................31
8.1 x86 Processor Thermal Design Features............................................................. 31
8.1.1 Dynamic CPU Frequency and Boost Modes .............................................. 31
8.1.2 CPU Throttling ........................................................................................ 31
8.1.3 Temperature Monitoring and Protection ................................................. 32
8.2 Thermal Design Strategy ................................................................................... 33
8.2.1 Thermal Guidance................................................................................... 33
8.2.2 Thermal Test Data................................................................................... 34

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Contents iii
Section 9: Specifications .......................................................36
9.1 Power Consumption.......................................................................................... 36
9.2 Temperature ..................................................................................................... 37
9.3 Shock and Vibration .......................................................................................... 37
9.4 Altitude ............................................................................................................. 38
9.5 Regulations and Certifications ........................................................................... 38
9.6 Battery .............................................................................................................. 38
9.7 Technical Specifications..................................................................................... 38
Section 10: Troubleshooting ..................................................39
10.1 Unexpected Restarts When Booting .................................................................. 39
10.2 Booting Problems, Hardware Devices Not Present ............................................. 39
General Contact Information ....................................................................................... 40
Technical Support........................................................................................................ 40

RXi2-BP Hardware Reference Manual Warnings and Cautions
GFK-3187B November 2020
Warnings and Cautions iv
Warnings and Caution Notes as Used in this Publication
WARNING
Warning notices are used in this publication to emphasize that hazardous voltages, currents, temperatures, or
other conditions that could cause personal injury, exist in this equipment, or may be associated with its use.
In situations where inattention could cause either personal injury or damage to equipment, a Warning notice is
used.
CAUTION
Caution notices are used where equipment might be damaged if care is not taken.
NOTICE
Notes and information that are not safety-related.
Note: Notes merely call attention to information that is especially significant to understanding and
operating the equipment.
These instructions do not purport to cover all details or variations in the equipment, nor to provide for every
possible contingency to be met during installation, operation, and maintenance. The information is supplied for
informational purposes only, and Emerson makes no warranty as to the accuracy of the information included
herein. Changes, modifications, and/or improvements to equipment and specifications are made periodically and
these changes may or may not be reflected herein. It is understood that Emerson may make changes,
modifications, or improvements to the equipment referenced herein or to the document itself at any time. This
document is intended for use by trained personnel familiar with the Emerson products referenced herein.
Emerson may have patents or pending patent applications covering the subject matter in this document. The
furnishing of this document does not provide any license whatsoever to any of these patents.
Emerson provides the following document and the information included therein as-is, and without warranty of any
kind, expressed or implied, including but not limited to any implied statutory warranty of merchantability or
fitness for a particular purpose.

RXi2-BP Hardware Reference Manual Section 1
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Introduction 1
Section 1: Introduction
A Computer-On-Module (COM) is a module containing all the components necessary for a bootable
host computer, packaged as a super component. A COM requires a carrier board to connect I/O and
power up. COMs are used to build modular solutions and to offer Original Equipment Manufacturer
(OEMs) fast time-to-market with reduced development cost. Like integrated circuits, they provide
OEMs with significant freedom in meeting form-fit-function requirements. For these reasons, the
COM methodology has gained much popularity with OEMs in the embedded industry.
The RXi2-BP IPC industrial computing platform delivers compact, rugged, mid to high-performance
computing and high-performance graphics capabilities to run HMI, historian, and analytics
applications for real-time control of operations.
The RXi2-BP IPC (R2B Series) is composed of the following components:
•mC10L19 COM Express module based on AMD Ryzen V1000 or R1000 series
•CEC10 COM Express type 10 carrier board
•Industrial grade enclosure with heat sink for the module and carrier components
This chapter describes the features, capabilities, and compatibilities of the RXi2-BP IPC and its
components.
Figure 1: RXi2-BP IPC

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Introduction 2
1.1 Document History
Rev
Date
Description
B
November
2020
•Updates to product label
•Updates to Regulations and Certifications
A
Oct 2020
Initial revision
1.2 Capability and Compatibility
The mC10L19 COM Express module is a fully x86 compatible single board computer module,
containing many functions in a very small form-factor. It is based on the PICMG COM Express
Module Base Specification V3.0 Type 10. (Refer to the documentation located at www.picmg.org.)
The mC10L19 uses the AMD family 17h models 10h-1fh (V1000 and R1000) Ryzen Core Processor.
The CEC10 COM Express carrier board is also compliant with the PICMG COM Express Module Base
Specification R3.0 Type 10 (refer to the documentation located at http://www.picmg.org).
The RXi2-BP power supply module provides a voltage input of nominal 24 V DC (± 25%) and
supports under and overvoltage supervisory, and protection against reverse polarity.
1.3 Software Requirements
•Microsoft® Windows® 10 Professional 64-Bit IoT 2019 LTSC
•Linux® Kernel 5.4
1.4 Features
RXi2-BP IPC module features are as follows:
•AMD Ryzen V1000
-4c/8t V1000, TDP 12 - 25W, L2 2MB, L3 4MB, 8 GPU CU, Industrial-temp,
4 to 16GB DDR4-2400 ECC RAM (single rank)
•AMD Ryzen R1000
-2c/4t R1000, TDP 8 - 10W, L2 1MB, L3 2MB, 3 GPU CU,
4 to 16GB DDR4-2400 ECC RAM (single rank)
•1x Display Port V1.4
•2x USB 2.0
•2x USB3.2 Gen1
•4x Gig Ethernet ports (1 Realtek RTL8111 controller and 3 Intel i210IT controllers,
supporting TimeSYNC IEEE1588 and 802.1AS)
•Mini PCIe slot (half size) as option
-Unified Infrastructure Management (UIM) interface
•M.2 PCIe M-Key and SATA Gen3 capability
•fTPM V2.0
•Two serial interfaces (1x RS-232, 1x galvanic isolated RS-485/RS-422)
•Operating at 24 V dc (±25%), including over- and under-voltage protection
•Reverse polarity protection

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Mounting 3
Section 2: Unpackingand Inspection
This chapter describes unpacking, initial inspection, and required preparation considerations
before using the RXi2-BP IPC. Perform the procedures in this chapter to verify proper operation
after shipping and before system integration.
CAUTION
If the RXi2-BP IPC operates in the high ambient temperature up to 70°C (149 ° F), the
surface of the enclosure, especially the heat sink, can reach a temperature of 85°C (185
°F) and above. Be careful and do not touch the RXi2-BP IPC with bare fingers.
Si le RXi2-BP IPC est opérée à une température ambiante élevée jusqu'à 70 ° C (149 ° F), la
surface du boîtier, en particulier le dissipateur thermique, peut atteindre une
température de 85 ° C (185 ° F) et plus. Soyez prudent et ne touchez pas le RXi2-BP IPC
avec les doigts nus.
2.1 Package Contents
Verify that the delivered package contains the contents listed in the following table.
Table 2-1 Delivery Volume
Item
QTY
Description
RXi2-BP
1
RXi2-BP Industrial PC
Serial Connector Plug
2
Serial Connector Plug
24 V Power-In Connector Plug
1
Power Connector Plug
Quick Start Guide
1
Quick Start Guide (GFK-3196)
2.2 Available Options and Accessories
The following tables list the available accessories for the RXi2-BP IPC. For the complete list of
orderable product SKUs please refer to the RXi2-BP Datasheet
Table 2-2 Available Accessories
Item
Description
R2B00ACCMP01
1pcs Mounting Panel Kit R2B
R2B00ACCRM01
1pcs DIN Rail Mounting Kit R2B
Note: For the most current information on options and accessories, contact the nearest Emerson sales or
service office, or an authorized Emerson sales representative. Options are subject to change without
notice.

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Mounting 4
2.3 ESD and EMI
Electrostatic Discharge (ESD) is the discharge of static electricity. Electromagnetic Interference
(EMI) is a disturbance generated by an external source that affects an electrical circuit by
electromagnetic induction, electrostatic coupling, or conduction. ESD and EMI issues may come up
when installing and connecting the system to the other components. There are many ways to
avoid problems with these issues.
Any operational system with cables for I/O signals, connectivity, or peripheral devices provide an
entry point for ESD and EMI. If Emerson has not manufactured the complete system, including the
enclosure and cables, then it is the responsibility of the system integrator and end-user to protect
their system against potential problems. Filtering, optical isolation, ESD gaskets, and other
measures might be required at the physical point of entry (enclosure).
Products manufactured by Emerson should normally be suitable for use in properly designed and
produced customer equipment (cabinets, racks) without any major redesign. However, the
systems might be subject to ESD and EMI problems once installed and interconnected with other
systems. The end-user, system integrator, or installer must test for possible problems and in some
cases, show compliance to local regulations as required in his country or by the intended
application.
CAUTION
Static-sensitive Devices: Handle only at static-safe work stations.
CAUTION
This is an FCC Class A product intended for use in an industrial environment. In a home or
residential environment, this product may cause radio interference, in which case the user
may be required to take adequate measures.
CAUTION
Drain static electricity before you install or remove any parts. Installing or removing modules
without observing this precaution could result in damage to this and/or other modules or
components in your system.
Wear a properly-functioning anti-static strap and make sure you are fully grounded. Any surface
upon which you place the unprotected module or unit should be static-safe, which is usually
facilitated by the use of anti-static mats. From the time it is removed from the anti-static bag until
it is in the board carrier and functioning properly, extreme care should be taken to avoid zapping
the component with ESD. Be aware that you could zap the component without knowing it; a small
discharge, imperceptible to the eye and touch, can often be enough to damage electronic
components. Extra caution should be taken in cold and dry weather when electrostatics easily
builds up.
Only after ensuring that both you and the surrounding area are protected from ESD, carefully
remove the component from the shipping carton by grasping the module on its edges. Place the
component, in its anti-static bag, flat down on a suitable surface. You may then remove the
component from the anti-static bag by tearing the ESD warning labels.

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Mounting 5
2.4 Unpack and Inspect
WARNING
Before installing or removing any board or module, ensure that the system power and
external supplies have been turned off.
WARNING
DO NOT apply power to the board if it has visible damage. Doing so may cause further,
possibly irreparable damage, as well as introduce a fire or shock hazard.
NOTICE
Retain all packing material in case of future need.
Before unpacking the board or module, or fitting the device into your system, read the manual
carefully. Also, adhere to the following guidelines:
•Observe all precautions for electrostatic sensitive modules.
•If the product contains batteries, do not place it on conductive surfaces, anti-static plastic,
or a sponge, which can cause shocks and lead to battery or board trace damage.
•Do not exceed the specified operational temperatures. Batteries and storage devices
might also have temperature restrictions.
•Keep all original packaging material for future storage or warranty shipments of the board.
After unpacking the component, inspect it for visible damage that may have occurred during
shipping or unpacking. Although the product is carefully packaged to protect it against the rigors of
shipping, it is still possible that shipping damages may occur. A careful inspection of the shipping
carton should reveal some information about how the package was handled by the shipping service.
If evidence of damage or rough handling is found (usually in the form of bent component leads or
loose socketed components), notify the shipping service as soon as possible and contact Emerson
for additional instructions. Depending on the severity of the damage, it may be necessary to return
the product to the factory for repair.

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Mounting 6
2.5 Handling
WARNING
If the RXi2-BP IPC operates in high ambient temperature up to 70°C (149 ° F), the surface of the
enclosure, especially the heat sink, can reach a temperature of 85°C (185 °F) and above. Be careful
and do not touch the RXi2-BP IPC with bare fingers.
Si le RXi2-BP IPC est opérée à une température ambiante élevée jusqu'à 70 ° C (149 ° F), la surface
du boîtier, en particulier le dissipateur thermique, peut atteindre une température de 85 ° C (185 °
F) et plus. Soyez prudent et ne touchez pas le RXi2-BP IPC avec les doigts nus.
CAUTION
Install the RXi2-BP IPC only in areas with restricted access.
Equipment for use in locations where children are not likely to be present.
Pour l'équipement destiné à être utilisé dans des endroits où les enfants ne sont probablement pas
présents.

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Mounting 7
Section 3: Mounting
RXi2-BP IPC cooling is designed for wall mounted orientation of the box. There are two possible
mounting options:
•Din Rail Mounting
•Mounting Panel
3.1 DIN Rail Mounting
To mount the IPC to a DIN rail, the user will need to connect DIN Rail Clamp #R2B00ACCRM01 to
the rear of the IPC:
1. Place the DIN Rail on the rear face of the RXI2-BP IPC.
2. Using a T9 Torx driver, secure the DIN rail with the provided M3x5-A2 screws, tightening to
0.6 Nm. (Do not overtighten.)
Note: For rugged applications, use a thread-locker to ensure that screws do not loosen.
Figure 2: Attaching a DIN Rail to an RXI2-BP IPC

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Mounting 8
There are two DIN rail mounting options available, depending on the size of the DIN rail connector.
•If the DIN connector is 7.5 mm in height: use a single DIN rail support to offset the bottom
of the IPC.
•If the DIN connector is 15 mm in height: use two DIN rail supports in a stack to increase the
height to offset the bottom of the IPC.
Figure 3: RXi2-BP IPC DIN Rail Mounting Options

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Mounting 9
3.2 Panel Mounting
To mount the IPC in a panel mount configuration, the user will need to connect Mounting Panel
#R2B00ACCMP01 to the rear of the IPC:
1. Place the mounting plate on the rear of the IPC.
2. Using a T9 Torx driver, secure the mounting plate with the two provided M3x6 screws,
tightening to 0.6 Nm. (Do not overtighten.)
3. For regular mounting, secure the mounting plate and IPC through the top and bottom
center holes. For more rugged applications, secure the mounting plate with the four
provided M3x6 screws in all four corners of the mounting panel.
Figure 4: Attaching Mounting Plate RXi2-BP IPC
Figure 5: RXi2-BP IPC DIN Rail pre-mounting

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Mounting 10
3.3 Clearances requirements to all mounting options
Figure 6 shows the optimal clearances requested by RXi2-BP to operate within full thermal
specifications and is applicable for DIN rail and panel mount option.
Any deviation in requested clearance will result in reduced thermal performance and must be
evaluated by the customer based on the final setup.
Figure 6: Minimum Clearances

RXi2-BP Hardware Reference Manual Section 4
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Installation and Setup 11
Section 4: Installationand Startup
This chapter describes the installation and initial startup operations.
WARNING
Before installing or removing any component, make sure that the system power and external
supplies have been turned off.
CAUTION
Static-sensitive Devices: Handle only at static-safe work stations.
CAUTION
Drain static electricity before you install or remove any parts. Installing or removing modules
without observing this precaution could result in damage to this and/or other components in your
system.
4.1 General InstallationGuidelines
Adhere to the following guidelines during installation:
•Observe all safety procedures to avoid damaging the system, and to protect operators and
users.
•Before installing or removing any board, verify that the system power and external
supplies have been turned off.
•Make sure the RXi2-BP IPC is properly mounted.
•Connect all I/O cables.
•Do not restore power until all components are fitted correctly into the system and all
connections have been made properly.
4.2 Required Materials
The following items are required to start the RXi2-BP IPC in a standard configuration:
•Power supply
•Keyboard and mouse
•Video monitor

RXi2-BP Hardware Reference Manual Section 4
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Installation and Setup 12
4.2.1 Power Supply
WARNING
Verify that the power supply is turned off while installing boards or modules into the RXi2-BP IPC.
Adhere to the following guidelines:
•Verify that the power supply can meet the total power requirements of the RXi2-BP IPC.
(Refer to the section Specifications.)
•Verify that the power supply is not turned ON while opening the enclosure to install add-
on boards and modules into the RXi2-BP IPC (such as the PCIe boards or internal SATA
drives).
4.2.2 Keyboard
A compatible USB keyboard for the initial system operation of the RXi2-BP IPC is required.
Depending on your application, this may be a standard keyboard or one that uses membrane
switches for harsh environments.
4.2.3 Video Monitor
Any video monitor with a native Display Port (or a suitable adaptor for the Display Port) can be used
for the initial setup.
4.3 Minimum System Requirements
The RXi2-BP IPC has been thoroughly tested and is nearly ready for usage in the target system. To
verify operation for the first time, Emerson recommends that you only configure a minimal system.
It is not necessary to have disk drives, a flash disk, or other accessories connected, to perform the
Power-On Self-Test (POST).
4.4 Initial Startup
A few seconds after powering up, the RXi2-BP IPC system UEFI Firmware banner will display on the
screen. If you do not see any error messages up to this point, the RXi2-BP IPC is running properly
and ready to be configured for your application.
Note: If the RXi2-BP IPC does not perform as described above, some damage may have occurred during
shipment, or the board is not installed or configured properly. Contact Emerson for technical support.
(Refer to the section Contact Information.)

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Installation and Setup 13
4.5 UEFI Firmware Setup
4.5.1 Entering UEFI Firmware Setup
To enter setup during the initial startup sequence: press the Delete or F2 key during the startup
sequence.
Adhere to the applicable on-screen messages when prompted.
To save changes, go to Save & Exit page and choose Save Changes and Exit option
4.5.2 Selective Alternative Boot Source
To select an alternative boot device (for example, boot from USB stick), without changing settings
in UEFI Firmware, please press and hold the F7 key during the power-up sequence
4.5.3 Setting up Boot Priority
To configure a particular boot priority, within UEFI Firmware Setup, navigate to the Boot page and
configure Boot Option #1 and Boot Option #2, as required. Go to Save & Exit page and choose Save
Changes and Exit option.
4.5.4 Restoring UEFI Settings
When within UEFI Firmware Setup, navigate to the Save & Exit page, choose Restore Defaults,
choose Save Changes and Exit.
4.5.5 Configuring Hibernation and Sleep States
When within UEFI Firmware Setup, navigate to the Advanced page, choose ACPI Settings, make
required changes. Go to Save & Exit page and choose Save Changes and Exit option.
4.5.6 UEFI Passwords
To configure Administrator and User passwords, within UEFI Firmware Setup, navigate to Advanced
page, choose Security, make required changes. Go to Save & Exit page and choose Save Changes
and Exit option
4.5.7 Secure Boot Configuration
To configure Secure Boot, change/reset Keys, within UEFI Firmware Setup, navigate to the
Advanced page, choose the Secure Boot option, make required changes. Go to Save & Exit page
and choose Save Changes and Exit option
Note: For in-depth technical information about the CPU and its peripherals, please refer to the
mC10L19 Hardware Reference Manual (GFK-3096).

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Installation and Replacement Procedures 14
Section 5: Installation and Replacement Procedures
5.1 Remove and Attach Cover
1. Shut down the system and remove power from the RXi2-BP IPC.
2. Loosen the four screws on the RXi2-BP IPC’s top cover and remove it (Figure 7).
Figure 7: IPC Cover

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Installation and Replacement Procedures 15
3. Please be aware that all six gap pads are in position (Figure 8). They are a part of thermal
management, and important for the system's lifetime. The battery has a thicker gap pad.
Do not mix!
Figure 8: Position of Six Gap Pads
4. Once the desired maintenance or replacement task is completed, attach the cover again,
double-check that the lid is correctly placed. Tighten the four screws with 0.6 Nm.
5.2 Replace the Real-Time Clock (RTC) battery
WARNING
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the same or
equivalent to Rayovac BR2032 or CR2032. Dispose of used batteries according to Emerson
provided instructions and applicable local regulations.
Battery can only be exchanged by skilled person.
CAUTION
Static-sensitive Devices: Handle only at static-safe work stations.