Emerson RXi2-EP Quick user guide

Hardware Reference Manual
GFK-3014F
Feb 2023
RXi2-EP
Industrial PC (IPC)

Hardware Reference Manual Document HistoryList of Tables
GFK-3014F Feb 2023
Document HistoryList of Tables i
Document History
Rev
Date
Description
F
2023-02
Removed Slim Mounting
E
2021-09
UKCA Update
D
2021-03
Update to IEC/UL62368
C
2019-11
Emerson rebranding
B
2018-03
Initial version

Hardware Reference Manual Warnings and Caution
GFK-3014F Feb 2023
Warnings and Cautions ii
Warnings and Caution Notes as Used in this Publication
WARNING
Warning notices are used in this publication to emphasize that hazardous voltages, currents,
temperatures, or other conditions that could cause personal injury exist in this equipment or may be
associated with its use.
In situations where inattention could cause either personal injury or damage to equipment, a Warning
notice is used.
CAUTION
Caution notices are used where equipment might be damaged if care is not taken.
Important
Important notices are used when special attention is needed.
Note: Notes merely call attention to information that is especially significant to understanding and
operating the equipment.
These instructions do not purport to cover all details or variations in equipment, nor to
provide for every possible contingency to be met during installation, operation, and
maintenance. The information is supplied for informational purposes only, and Emerson
makes no warranty as to the accuracy of the information included herein. Changes,
modifications, and/or improvements to equipment and specifications are made
periodically and these changes may or may not be reflected herein. It is understood that
Emerson may make changes, modifications, or improvements to the equipment
referenced herein or to the document itself at any time. This document is intended for
trained personnel familiar with the Emerson products referenced herein.
Emerson may have patents or pending patent applications covering subject matter in this
document. The furnishing of this document does not provide any license whatsoever to
any of these patents.
Emerson provides the following document and the information included therein as-is and
without warranty of any kind, expressed or implied, including but not limited to any
implied statutory warranty of merchantability or fitness for particular purpose.

Hardware Reference Manual Table of Contents
GFK-3014F Feb 2023
Table of ContentsList of Tables iii
Contents
Section 1: Overview.........................................................1
1.1 Capability and Compatibility.........................................................................4
1.2 Software Requirements.................................................................................4
1.3 Features ...........................................................................................................5
Section 2: Unpacking and Inspection ............................7
2.1 Package Contents...........................................................................................7
2.2 Available Options and Accessories ..............................................................8
2.3 ESD and EMI....................................................................................................8
2.4 Unpack and Inspect .....................................................................................10
2.5 Handling.........................................................................................................11
Section 3: Mounting ......................................................12
3.1 Wall Mounting with Mounting Plates........................................................13
3.2 Wall Mounting Through Wall......................................................................14
Section 4: Installation and Startup..............................15
4.1 General Installation Guidelines..................................................................15
4.2 Required Materials.......................................................................................16
4.2.1 Power Supply......................................................................................16
4.2.2 Keyboard.............................................................................................16
4.2.3 Video Monitor.....................................................................................16
4.3 Minimum System Requirements................................................................16
4.4 Power-On Self-Test (POST) ..........................................................................17
4.5 Installation Procedures ...............................................................................18
4.5.1 PCIe Board Installation .....................................................................18
4.5.2 Mini PCIe Add-on Board Installation...............................................23
4.5.3 SIM Card Interface Installation........................................................26
4.5.4 M.2 A-Key Add-on Board Installation..............................................28
4.5.5 M.2 M-Key Add-on Board Installation.............................................30
4.6 Initial Startup.................................................................................................31
4.7 UEFI Firmware Setup....................................................................................31
4.8 RTC Battery Replacement............................................................................32

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Table of ContentsList of Tables iv
Section 5: Hardware Interface .....................................33
5.1 Interface.........................................................................................................35
5.1.1 Status LEDs .........................................................................................35
5.1.2 Power Button......................................................................................36
5.1.3 TPM Button.........................................................................................36
5.1.4 Ethernet Ports (Eth1, Eth2, Eth3, Eth4, Eth5) .................................37
5.1.5 Ethernet LEDs.....................................................................................38
5.1.6 DisplayPort..........................................................................................39
5.1.7 USB 3.0 Connectors...........................................................................40
5.1.8 Power Connectors .............................................................................41
5.1.9 Internal SATA Connector ..................................................................41
5.1.10CFast Connector.................................................................................42
5.1.11Serial (COM) Ports..............................................................................42
5.1.12SATA 2.5 inch Drive Tray Replacement...........................................44
5.2 Additional Devices........................................................................................49
5.2.1 Temperature Sensor .........................................................................49
5.2.2 NVSRAM...............................................................................................49
Section 6: Hardware and Firmware Programmable
Devices ......................................................................50
6.1 SMBUS Devices.................................................................................... 50
6.2 Ethernet .........................................................................................................50
6.3 PCIe Ports ......................................................................................................51
Section 7: Specifications ...............................................53
7.1 Power Consumption ....................................................................................53
7.1.1 Power Budget for Add-on Devices..................................................54
7.2 Environmental Specifications .....................................................................54
7.2.1 Ambient Temperatures and Humidity............................................54
7.2.2 Shock and Vibration without 2.5 inch Mass Storage....................54
7.2.3 Shock and Vibration with 2.5 inch Mass Storage..........................54
7.2.4 Altitude................................................................................................55
7.2.5 Regulations and Certification...........................................................55
7.2.6 Battery.................................................................................................56
7.3 Technical Specification.................................................................................56

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Table of ContentsList of Tables v
Appendix.A: Open Source Software (OSS) List (V0.x)......57
Appendix.B: Acronyms and Abbreviations......................58
Appendix.C: Glossary ........................................................60
General Contact Information...........................................63
Technical Support .............................................................63

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List of Tables vi
List of Tables
Table 2-1 Delivery Volume ......................................................................................................................7
Table 2-2 Available Options....................................................................................................................8
Table 2-3 Available Accessories..............................................................................................................8
Table 5-1 Status LEDs ........................................................................................................................... 35
Table 5-2 Ethernet Interface................................................................................................................ 37
Table 5-3 ETH1 to ETH4 LEDs .............................................................................................................. 38
Table 5-4 ETH5 LEDs ............................................................................................................................. 38
Table 5-5 DisplayPort Interface Signals............................................................................................. 39
Table 5-6 USB Port 1-2 Signals............................................................................................................ 40
Table 5-7 USB Port 3-4 Signals............................................................................................................ 40
Table 5-8 Power Connectors ............................................................................................................... 41
Table 5-9 Serial Ports............................................................................................................................ 43
Table 5-10 THRM LED Indication........................................................................................................... 49
Table 6-1 SMBus Devices ..................................................................................................................... 50
Table 6-2 I2C Bus Device...................................................................................................................... 50
Table 6-3 PCI Routing ........................................................................................................................... 51
Table 7-1 Input Power.......................................................................................................................... 53
Table 7-2 Power Entry........................................................................................................................... 53
Table 7-3 Temperature Specifications ............................................................................................... 54
Table 7-4 Temperature Specifications ............................................................................................... 54
Table 7-5 Maximum Altitude ............................................................................................................... 55
Table 7-6 Regulations and Certification............................................................................................. 55
Table 7-7 Technical Specification........................................................................................................ 56
Table 7-8 Software license terms........................................................................................................ 57

Hardware Reference Manual Table of List of Figures
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List of Figures vii
List of Figures
Figure 1-1 0-slot RXi2-EP IPC....................................................................................................................2
Figure 1-2 1-slot RXi2-EP IPC....................................................................................................................2
Figure 1-3 2-slot RAID RXi2-EP IPC ..........................................................................................................3
Figure 1-4 4-slot RXi2-EP IPC....................................................................................................................3
Figure 1-5 4-slot RAID RXi2-EP IPC ..........................................................................................................4
Figure 1-6 2–slot RXi2-EP IPC System Block Diagram ..........................................................................6
Figure 2-1 RXi2-EP IPC Packaging ........................................................................................................ 10
Figure 3-1 Heat Dissipation Clearance ................................................................................................ 12
Figure 3-2 Flat Wall Mounting with Mounting Plates........................................................................ 13
Figure 3-3 Flat Wall Mounting Through Wall...................................................................................... 14
Figure 4-1 RXi2-EP Top Cover................................................................................................................ 18
Figure 4-2 PCIe Support Bracket Screws............................................................................................. 19
Figure 4-3 Removed PCIe Support Bracket and Screws ................................................................... 19
Figure 4-4 Removed PCIe Slot Cover ................................................................................................... 20
Figure 4-5 PCIe Board Bracket Inserted into Slot .............................................................................. 20
Figure 4-6 PCIe Board Bracket Inserted into PCIe Connector ......................................................... 21
Figure 4-7 Reattached PCIe Support Bracket ..................................................................................... 21
Figure 4-8 Reattached PCIe Bracket Screws ....................................................................................... 22
Figure 4-9 Card Holder Adjustment..................................................................................................... 22
Figure 4-10 Reattached Top Cover......................................................................................................... 23
Figure 4-11 Short Position for mPCIe Bracket...................................................................................... 24
Figure 4-12 Long Position for mPCIe Bracket....................................................................................... 24
Figure 4-13 mPCIe Board Inserted......................................................................................................... 25
Figure 4-14 mPCIe Board Mounted to RXi2-EP IPC.............................................................................. 25
Figure 4-15 SIM Interface Connected to mPCIe –Unlocked but Closed .......................................... 26
Figure 4-16 SIM Card Holder Open........................................................................................................ 26
Figure 4-17 Inserted SIM card................................................................................................................. 27
Figure 4-18 SIM Card Holder Closed and Locked................................................................................. 27
Figure 4-19 RXi2-EP IPC Connector Slot................................................................................................. 28
Figure 4-20 M.2 A-Key Insertion into Connector Slot .......................................................................... 28
Figure 4-21 M.2 A-Key Mounted to RXi2-EP IPC ................................................................................... 29
Figure 4-22 RXi2-EP IPC Connector Slot................................................................................................. 30
Figure 4-23 M.2 M-Key Insertion into Connector Slot......................................................................... 30
Figure 4-24 M.2 M-Key Mounted to RXi2-EP IPC .................................................................................. 31
Figure 4-25 RTC Battery (Removed Top Cover) .................................................................................... 32
Figure 5-1 RXi2-EP IPC Hardware Interface Overview....................................................................... 34
Figure 5-2 RXi2-EP IPC Hardware Interface Overview (2-slot Option) ............................................ 35
Figure 5-3 Status LEDs ........................................................................................................................... 35
Figure 5-4 Power Button........................................................................................................................ 36
Figure 5-5 Ethernet Interface Ports (1–slot Option) .......................................................................... 37
Figure 5-6 RJ-45 Pinout................................................................................................................................... 37
Figure 5-7 RXi2-EP IPC GBE ................................................................................................................... 38
Figure 5-8 DisplayPort Interface Ports (2–slot Option) ..................................................................... 39

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Figure 5-9 USB 3.0 Connectors ............................................................................................................. 40
Figure 5-10 Power Connectors ............................................................................................................... 41
Figure 5-11 CFast Connector................................................................................................................... 42
Figure 5-12 Serial Ports –0-Slot Variant ................................................................................................ 42
Figure 5-13 Serial Ports –4-Slot Variant ................................................................................................ 42
Figure 5-14 Pin Assignment .................................................................................................................... 43
Figure 5-15 2.5 inch SATA Drive Device Tray Location ........................................................................ 44
Figure 5-16 Removing Storage Device Tray from Mounted Position................................................ 45
Figure 5-17 Storage Device Tray Fully Open Position ......................................................................... 45
Figure 5-18 Removal of Storage Device Tray........................................................................................ 46
Figure 5-19 Storage Device Tray Screws ............................................................................................... 46
Figure 5-20 Insert the replacement hard drive.................................................................................... 47
Figure 5-21 Insert the storage device tray............................................................................................ 47
Figure 5-22 Insert the tray....................................................................................................................... 48
Figure 7-1 RXi2-EP Data Nameplate..................................................................................................... 55

Hardware Reference Manual Section 1
GFK-3014F Feb 2023
Overview 1
Section 1: Overview
A Computer-On-Module (COM) is a module containing all components
necessary for a bootable host computer packaged as a super component.
A COM requires a carrier board to connect I/O and power up. COMs are
used to build modular solutions and offer Original Equipment
Manufacturer (OEMs) fast time-to-market with reduced development
cost. Like integrated circuits, they provide OEMs with significant freedom
in meeting form-fit-function requirements. For these reasons, the COM
methodology has gained much popularity with OEMs in the embedded
industry.
The RXi2-EP IPC industrial computing platform delivers compact, rugged,
mid to high performance computing and high-performance graphics
capabilities to run HMI, historian, and analytics applications for real time
control of operations. It offers the expandability of 0, 1, 2, or 4 (mini and
low profile) PCI Express (PCIe) slots and CFast storage.
The RXi2-EP IPC (NextGenIPC) is composed of the following components:
•bCOM6L17 COM Express module based on AMD R-Series CPU
•CEC09 COM Express carrier board
•PERC12 (1-slot), PERC10 (2-slot) and PERC11 (4-slot) PCIe riser board
•PIP24VDC power supply module
•SRC SATA riser board for additional 2.5 inch mass storage devices
support
•Industrial grade enclosure with heatsink for the module and carrier
components
This chapter describes features, capabilities, and compatibilities of the
RXi2-EP IPC and its components.

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Overview 2
Figure 1-1 0-slot RXi2-EP IPC
Figure 1-2 1-slot RXi2-EP IPC

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Overview 3
Figure 1-3 2-slot RAID RXi2-EP IPC
Figure 1-4 4-slot RXi2-EP IPC

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Overview 4
Figure 1-5 4-slot RAID RXi2-EP IPC
1.1 Capability and Compatibility
The bCOM6L17 COM Express module is a fully IBM-AT compatible single
board computer module containing many functions in a very small form-
factor. It is based on the PICMG COM Express Module Base Specification
V2.1 Type 6. The bCOM6L17 uses the AMD x86 Bald Eagle CPU and the
AMD A77E chipset to provide most of the interface for Type 6.
The CEC09 COM Express carrier board is also compliant with the PICMG
COM Express Module Base Specification V2.1 Type 6.
The PERC10 and PERC11 PCI Express (PCIe) riser boards provide signals
from the Edge connector interface to a PCIe packet switch device (limited
to PCIe Gen2) through PCIe expansion slots. The PERC12 riser board
provides signals from the Edge and is a passive device that supports a
PCIe Gen3 link.
The PIP24VDC power supply module provides a voltage input of nominal
24 V (± 25%).
1.2 Software Requirements
•Microsoft® Windows® 7 Professional 64-Bit
•Microsoft Windows 10 Professional 64-Bit
•Linux® Kernel 4.8

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Overview 5
1.3 Features
RXi2-EP IPC module features are as follows:
•Processor
—RX427BB, quad core, 2.7 GHz, L2 4 MB, 8CUs 600 MHz, DDR3
2133 MHz, 35 W
—RX225FB, dual core, 2.2 GHz, L2 2 MB, 3CUs 464 MHz, DDR3
1600 MHz, 17 W
•System memory:
—4 GB up to 16 GB DDR3 SDRAM (soldered) with ECC
—Organized dual channel with two ranks each
•2x DisplayPort
•4x USB 3.0
•5x Gig Ethernet ports (1 from module plus 4 Ethernet controller (4x
i210IT) with TimeSYNC IEEE1588 and 802.1AS
•Alternative 1x GigE and 4x SFP (4x i210IS) (Emerson support is
available)
•Mini PCIe slot (half and full size)
—Unified Infrastructure Management (UIM) interface
•M.2 PCIe M-Key (PCIe Gen3 x4) and SATA capability
•M.2 PCIe A-Key (general connectivity)
•TPM V1.2 or V2.0
•Up to 4 serial interfaces (2x RS-232, 2x galvanic isolated RS-485/RS-
422)
•Capable of two additional 2.5 inch storage devices with SATA riser
board/RAID option
•UIM interface
•0, 1, 2 or 4-slots with active/passive riser board (depending on slot
size)
•Operating at 24 V dc (±25%), including over and under-voltage
protection

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Overview 6
Figure 1-6 2–slot RXi2-EP IPC System Block Diagram

Hardware Reference Manual Section 2
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Mounting 7
Section 2: Unpacking and Inspection
WARNING
If the RXi2-EP IPC operates at an enhanced ambient temperature up to 65°C (149 ° F), the
surface of the enclosure, especially the heatsink, can reach a temperature of 85°C (185 °F)
and above and presents a burn hazard. Be careful to not touch the RXi2-EP IPC with bare
fingers.
Install the RXi2-EP IPC only in rooms with restricted access.
Si le RXi2-EP IPC fonctionne à une température ambiante améliorée jusqu'à 65 °C (149 °F),
la surface du boîtier, en particulier le dissipateur thermique, peut atteindre une
température de 85 °C (185 °F) et plus et présente un risque de brûlure. Veillez à ne pas
toucher le RXi2-EP IPC avec les doigts nus.
Installez le RXi2-EP IPC uniquement dans des pièces à accès restreint.
This chapter describes unpacking, initial inspection, and required
preparation considerations prior to using the RXi2-EP IPC. Perform the
procedures in this chapter to verify proper operation after shipping and
prior to system integration.
2.1 Package Contents
Verify that the delivered package contains the contents listed in the
following table.
Table 2-1 Delivery Volume
Qty
Item
Purpose
1
RXi2-EP
RXi2-EP Industrial PC

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Mounting 8
2.2 Available Options and Accessories
The following tables list the available options and accessories for the
RXi2-EP IPC.
Table 2-2 Available Options
Item
Description
R2E0N1A0A1T0A
0–slot, Quad Core 2.7 GHz, 128 GB, RJ–45
R2E0N1C0A1T0A
0–slot, Dual Core 2.2 GHz, 128 GB, RJ–45
R2E2N1A0A2T0A
2–slot, Quad Core 2.7 GHz, 128 GB, RJ–45
R2E2N1C0A2T0A
2–slot, Dual Core 2.2 GHz, 128 GB, RJ–45
Table 2-3 Available Accessories
Item
Description
Contact Emerson
10 pcs Flat mounting kit
R2X00ACCMP05
1 pc Flat mounting kit
Contact Emerson
1 pc Slim mounting kit
Note: For the most current information on options and accessories, go to
https://www.emerson.com/en-us/where-to-buy?w=2&c=180&r=500&p=1&l=4&v=c to find the
nearest Emerson sales or service office, or an authorized Emerson sales representative.
Options are subject to change without notice.
2.3 ESD and EMI
Electrostatic Discharge (ESD) is the discharge of static electricity.
Electromagnetic Interference (EMI) is a disturbance generated by an
external source that affects an electrical circuit by electromagnetic
induction, electrostatic coupling, or conduction. ESD and EMI issues may
show up in complete and operational systems. There are many ways to
avoid problems with these issues.
Any operational system with cables for I/O signals, connectivity, or
peripheral devices provides an entry point for ESD and EMI. If Emerson
does not manufacture the complete system, including enclosure and
cables, it is the responsibility of the system integrator and end user to
protect their system against potential problems. Filtering, optical
isolation, ESD gaskets, and other measures might be required at the
physical point of entry (enclosure wall of box or rack). For example, it is
state-of-the-art that protection cannot be done at the internal connector
of an RTM if a cable is attached and routed outside the enclosure. It has
to be done at the physical entry point as specified in this document.
Products manufactured by Emerson should normally be suitable for use
in properly designed and produced customer equipment (system boxes
or operational systems) without any major redesign. However, the
systems might be subject to problems and issues once assembled,
cabled, and used. The end user, system integrator or installer must test

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Mounting 9
for possible problems and in some cases show compliance to local
regulations as required in his country or by the intended application.
ESD is a major cause of electronic component failure. The component has
been packed in a static-safe bag to protect it from ESD while it is in the
bag. Before removing the component or any other electronic product
from its static-safe bag, be prepared to handle it in a static-safe
environment.
CAUTION
•Static-sensitive Devices: Handle only at static-safe workstations.
•Drain static electricity before you install or remove any parts. Installing or removing
modules without observing this precaution could result in damage to this and/or other
modules or component in your system.
CAUTION
This is an FCC Class A product for use in an industrial environment. In a home or residential
environment, this product may cause radio interference in which case the user may be
required to take adequate measures.
Wear a properly functioning antistatic strap and make sure you are fully
grounded. Any surface upon which you place the unprotected module or
unit should be static-safe, which is usually facilitated by the use of
antistatic mats. From the time it is removed from the antistatic bag until
it is in the board carrier and functioning properly, extreme care should be
taken to avoid damage the component with ESD. Be aware that you could
damage the component without knowing it; a small discharge,
imperceptible to the eye and touch, can often be enough to damage
electronic components. Extra caution should be taken in cold and dry
weather as electrostatic charge will easily build up.
Only after ensuring that both you and the surrounding area are
protected from ESD, carefully remove the component from the shipping
carton by grasping the module on its edges. Place the component in its
antistatic bag flat on a suitable surface. You may then remove the
component from the antistatic bag by tearing the ESD Caution labels.

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Mounting 10
2.4 Unpack and Inspect
WARNING
Before installing or removing any board or module, ensure that the system power and
external supplies have been turned off.
WARNING
Do not apply power to the board if it has visible damage. Doing so may cause further,
possibly irreparable damage, as well as introduce a fire or shock hazard
Important
Retain all packing material in case of future need.
Before unpacking the board or module, or fitting the device into your
system, read the manual carefully. Also adhere to the following
guidelines:
•Observe all precautions for electrostatic sensitive modules.
•If the product contains batteries, do not place it on conductive
surfaces, antistatic plastic, or a sponge, which can cause shocks and
lead to battery or board trace damage.
•Do not exceed the specified operational temperatures. Batteries and
storage devices might also have temperature restrictions.
•Keep all original packaging material for future storage or warranty
shipments of the board.
After unpacking the component, inspect it for visible damage that may
have occurred during shipping or unpacking. Although the product is
carefully packaged to protect it against the rigors of shipping, it is still
possible that shipping damage may occur. Careful inspection of the
shipping carton should reveal some information about how the package
was handled by the shipping service.
If evidence of damage or rough handling is found (usually in the form of
bent component leads or loose socketed components), notify the
shipping service as soon as possible and contact Emerson for additional
instructions. Depending on the severity of the damage, it may be
necessary to return the product to the factory for repair.
Figure 2-1 RXi2-EP IPC Packaging

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Mounting 11
2.5 Handling
WARNING
If the RXi2-EP IPC operates at an enhanced ambient temperature up to 65°C (149 ° F), the
surface of the enclosure, especially the heatsink, can reach a temperature of 85°C (185 °F)
and above and presents a burn hazard. Be careful to not touch the RXi2-EP IPC with bare
fingers.
Install the RXi2-EP IPC only in rooms with restricted access.
Si le RXi2-EP IPC fonctionne à une température ambiante améliorée jusqu'à 65 °C (149 °F),
la surface du boîtier, en particulier le dissipateur thermique, peut atteindre une
température de 85 °C (185 °F) et plus et présente un risque de brûlure. Veillez à ne pas
toucher le RXi2-EP IPC avec les doigts nus.
Installez le RXi2-EP IPC uniquement dans des pièces à accès restreint.