Emerson RXi2-UP Quick user guide

Hardware Reference Manual
GFK-3047D
Oct 2021
RXi2-UP Industrial PC
HARDWARE REFERENCE MANUAL

RXi2-UP IPC Hardware Reference Manual Warnings and Cautions
GFK-3047D Oct 2021
Warnings and Cautions
Warnings and Caution Notes as Used in this Publication
WARNING
Warning notices are used in this publication to emphasize that hazardous voltages, currents,
temperatures, or other conditions that could cause personal injury exist in this equipment or may be
associated with its use.
In situations where inattention could cause either personal injury or damage to equipment, a Warning
notice is used.
CAUTION
Caution notices are used where equipment might be damaged if care is not taken.
ATTENTION
Indicates a procedure or condition that should be strictly followed to improve these applications.
Note: Notes merely call attention to information that is especially significant to understanding and operating the
equipment.
These instructions do not purport to cover all details or variations in equipment, nor to provide for
every possible contingency to be met during installation, operation, and maintenance. The
information is supplied for informational purposes only, and Emerson makes no warranty as to the
accuracy of the information included herein. Changes, modifications, and/or improvements to
equipment and specifications are made periodically and these changes may or may not be reflected
herein. It is understood that Emerson may make changes, modifications, or improvements to the
equipment referenced herein or to the document itself at any time. This document is intended for
trained personnel familiar with the Emerson products referenced herein.
Emerson may have patents or pending patent applications covering subject matter in this document.
The furnishing of this document does not provide any license whatsoever to any of these patents.
Emerson provides the following document and the information included therein as-is and without
warranty of any kind, expressed or implied, including but not limited to any implied statutory
warranty of merchantability or fitness for particular purpose.

RXi2-UP IPC Hardware Reference Manual Contents
GFK-3047D Oct 2021
Contents i
Contents
Section 1: Introduction......................................................1
1.1 Revisions to this Manual................................................................................ 1
1.2 Related Documentation................................................................................ 1
1.3 Features........................................................................................................ 1
Section 2: Capabilityand Compatibility..............................4
2.1 SoftwareRequirements................................................................................. 4
2.2 Features........................................................................................................ 4
Section 3: UnpackingandInspection ..................................6
3.1 PackageContents.......................................................................................... 6
3.2 ESD andEMI .................................................................................................. 7
3.3 UnpackandInspect ....................................................................................... 8
3.4 Handling....................................................................................................... 9
Section 4: Mounting ........................................................10
4.1 FlatWall-Mounting ...................................................................................... 10
4.1.1 Flat Wall Mounting with Mounting Plates ........................................... 11
4.1.2 Flat Wall Mounting Through Wall...................................................... 12
Section 5: Installationand Startup.................................... 13
5.1 GeneralInstallationGuidelines..................................................................... 13
5.2 RequiredMaterials ...................................................................................... 13
5.2.1 Power Supply .................................................................................... 14
5.2.2 Keyboard.......................................................................................... 14
5.2.3 Video Monitor .................................................................................. 14
5.3 Minimum System Requirements ................................................................. 14
5.4 Power-On Self-Test (POST).......................................................................... 14
5.5 Installation Procedures ............................................................................... 15
5.5.1 PCIe Board Installation ...................................................................... 15
5.5.2 Mini PCIe Add-onBoard Installation ................................................... 20
5.5.3 M.2 A-KeyAdd-onBoard Installation .................................................. 25
5.5.4 M.2 M-Key Add-onBoard Installation ................................................. 27
5.6 InitialStartup .............................................................................................. 29
5.7 UEFIFirmwareSetup.................................................................................... 29
5.7.1 Entering UEFI Firmware Setup........................................................... 29
5.7.2 Selective Alternative Boot Source ..................................................... 29

RXi2-UP IPC Hardware Reference Manual Contents
GFK-3047D Oct 2021
Contents ii
5.7.3 Setting up Boot Priority..................................................................... 29
5.7.4 Restoring UEFI Settings..................................................................... 29
5.7.5 UEFI Passwords ................................................................................. 29
5.7.6 Secure Boot Configuration................................................................ 29
5.8 RTCBatteryReplacement ............................................................................ 30
5.8.1 To replace the Real-Time Clock (RTC) battery..................................... 30
Section 6: HardwareInterface.......................................... 31
6.1 Interface ..................................................................................................... 33
6.1.1 StatusLEDs ....................................................................................... 33
6.1.2 PowerButton.................................................................................... 34
6.1.3 TPM Button....................................................................................... 34
6.1.4 Ethernet Ports (Eth1, Eth2, Eth3, Eth4, Eth5) ...................................... 35
6.1.5 EthernetLEDs ................................................................................... 35
6.1.6 DisplayPort ...................................................................................... 36
6.1.7 USB 3.0 Connectors .......................................................................... 37
6.1.8 PowerConnectors............................................................................. 38
6.1.9 Internal SATA Connector .................................................................... 39
6.1.10CFast Connector ............................................................................... 39
6.1.11Serial (COM) Ports ............................................................................. 39
6.1.12SATA 2.5 inch Drive Tray Replacement.............................................. 41
6.2 AdditionalDevices....................................................................................... 46
6.2.1 Temperature Sensor ......................................................................... 46
6.2.2 NVSRAM........................................................................................... 46
Section 7: Hardwareand Firmware ProgrammableDevices
47
7.1 SMBUSDevices............................................................................................ 47
7.2 Ethernet...................................................................................................... 47
7.3 PCIePorts.................................................................................................... 47
7.4 PCIRouting ................................................................................................. 48
Section 8: Specifications ..................................................50
8.1 PowerConsumption.................................................................................... 50
8.1.1 Power Budget for Add-on Devices...................................................... 50
8.2 EnvironmentalSpecifications....................................................................... 51
8.2.1 Ambient Temperatures and Humidity............................................... 51
8.2.2 Shock and Vibration without 2.5 inch Mass Storage ............................ 51
8.2.3 Shock and Vibration with 2.5 inch Mass Storage.................................. 51

RXi2-UP IPC Hardware Reference Manual Contents
GFK-3047D Oct 2021
Contents iii
8.2.4 Altitude ............................................................................................ 51
8.2.5 Regulationsand Certification ............................................................ 52
8.2.6 Battery ............................................................................................. 52
8.3 TechnicalSpecifications............................................................................... 53
Section 9: Troubleshooting.............................................. 54
9.1 Movicon.NExT License File Recovery in Windows 10 .................................... 54
Appendix A: Open Source Software (OSS) List (V0.x) ............55
Appendix B: Acronyms and Abbreviations ............................56
Appendix C: Glossary............................................................58
General Contact Information................................................................................. 61
Technical Support ................................................................................................. 61

RXi2-UP IPC Hardware Reference Manual Section 1
GFK-3047D Oct 2021
Introduction 1
Section 1: Introduction
1.1 Revisions to this Manual
Rev
Date
Description
D
Oct 2021
Updates to support Movicon.NExT software bundle
C
Nov 2021
UKCA Update
B
March 2021
Update to IEC/UL 62368
A
Nov 2019
Emerson Rebranding
-
May 2019
Initial Release
1.2 Related Documentation
Documents
Document Number
RXi2-UP Quick Start Guide
GFK-3221
RXi2-UP Hardware Reference Manual
GFK-3047
RXi2 IPC Secure Deployment Guide
GFK-3200
RXi2-UP Industrial PC Datasheet
00813-0100-0120
1.3 Features
The RXi2-UP IPC industrial computing platform delivers compact, rugged, high-
performance computing and high-performance graphics capabilities to run Human-
machine Interface (HMI), historian, and analytics applications for real-time control of
operations. It offers expansion options of 1, 2, or 4 (mini and low profile) PCI Express (PCIe)
slots and CFast storage.
A Computer-On-Module (COM) is a module containing all components necessary for a
bootable host computer, packaged as a super component. A COM requires a carrier board
to connect I/O and power up. COMs are used to build modular solutions and offer Original
Equipment Manufacturers (OEMs) fast time-to-market with reduced development costs.
Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-
function requirements. For these reasons, the COM methodology has gained much
popularity with OEMs in the embedded industry.
The RXi2-UP IPC is composed of the following components:
•bCOM6L20 COM Express module based on Intel® Kaby Lake 7th Generation
Core™ i5/i7 and Xeon® V6 series

RXi2-UP IPC Hardware Reference Manual Section 1
GFK-3047D Oct 2021
Introduction 2
•CEC09 COM Express carrier board
•PERC12 (1-slot), PERC10 (2-slot) and PERC11 (4-slot) PCIe riser board
•PIP24VDC power supply module
•SRC SATA riser board for additional 2.5-inch mass storage devices support
•Industrial grade enclosure with heat sink for the module and carrier components
This chapter describes the features, capabilities, and compatibilities of the RXi2-UP IPC and
its components.
Figure 1: 0-Slot RXi2-UP IPC
Figure 2: 1-Slot RXi2-UP IPC

RXi2-UP IPC Hardware Reference Manual Section 1
GFK-3047D Oct 2021
Introduction 3
Figure 3: 2-Slot RAID RXi2-UP IPC
Figure 4: 4-Slot RXi2-UP IPC
Figure 5: 4-Slot RAID RXi2-UP IPC

RXi2-UP IPC Hardware Reference Manual Section 2
GFK-3047D Oct 2021
Capability and Compatibility 4
Section 2: Capability and Compatibility
The bCOM6L20 COM Express module is a fully IBM-AT compatible single board computer
module containing many functions in a very small form factor. It is based on the PICMG COM
Express Module Base Specification V2.1 Type 6. (Refer to the documentation located at
www.picmg.org.) The bCOM6L20 uses the Intel x86 7th Generation Core Processor and
Intel Xeon v6 Processors to provide most of the interface.
The CEC09 COM Express carrier board is also compliant with the PICMG COM Express
Module Base Specification V2.1 Type 6.
The PERC10 and PERC11 PCI Express (PCIe) riser boards provide signals from the Edge
connector interface to a PCIe packet switch device (limited to PCIe Gen2) through PCIe
expansion slots. The PERC12 riser board provides signals from the Edge and is a passive
device that supports a PCIe Gen3 link.
The PIP24VDC power supply module provides a voltage input of nominal 24 V (± 25%).
2.1 Software Requirements
•Microsoft® Windows® 10 Professional 64-Bit
•Linux® Kernel 4.8
2.2 Features
RXi2-UP IPC module features are as follows:
•7th Generation Intel Core Processor and Intel Xeon Processor E3-1200 v6 product
line
▪i5-7442EQ 25W 4c/4t HD530 2.1GHz (max 2.9) GHz 6MB, 16GB no ECC
with QM175
▪i7-7820EQ 45/35W 4c/8t HD530 3.0 GHz (max 3.7) GHz 8MB, 16GB no
ECC with QM175
▪E3-1501L v6 25W 4c/4t HDP530 2.1 GHz (max 2.9) GHz 6MB, 32GB ECC
with CM238
▪E3-1501M v6 45W 4c/4t HDP530 2.9 GHz (max 3.6) GHz 6MB, 32GB ECC
with CM238
▪E3-1505L v6 25W 4c/8t HDP530 2.2 GHz (max 3.0) GHz 8MB, 32GB ECC
with CM238
▪E3-1505M v6 45/35W 4c/8t HDP530 3.0 GHz (max 4.0) GHz 8MB,32GB
ECC with CM238
•System memory:
▪8 GB up to 32 GB DDR3 SDRAM (soldered) with ECC running at
2133/2400 MHz
▪Organized dual channel with two ranks each
•2x Display Port
•4x USB 3.0

RXi2-UP IPC Hardware Reference Manual Section 2
GFK-3047D Oct 2021
Capability and Compatibility 5
•5x Gig Ethernet ports (1 from module plus 4 Ethernet controller (4x i210IT) with
TimeSYNC IEEE1588 and 802.1AS
oAlternative 1x GigE and 4x SFP (4x i210IS) (contact Emerson for support)
•Mini PCIe slot (half and full size)
oUnified Infrastructure Management (UIM) interface
•M.2 PCIe M-Key (PCIe Gen3 x4) and SATA capability
•M.2 PCIe A-Key (general connectivity)
•TPM V1.2 or V2.0
•Up to 4 serial interfaces (2x RS-232, 2x galvanic isolated RS-485/RS-422)
•Capability for two additional 2.5 inch storage devices with SATA riser board/RAID
option
•UIM interface
•0, 1, 2 or 4-slot with active/passive riser board (depending on slot size)
•Operating at 24 V dc (±25%), including over and under-voltage protection
Figure 6: 2–Slot RXi2-UP IPC System Block Diagram

RXi2-UP IPC Hardware Reference Manual Section 3
GFK-3047D Oct 2021
Unpacking and Inspection 6
Section 3: Unpackingand Inspection
CAUTION
If the RXi2-UP IPC operates in an enhanced ambient temperature up to 65°C (149 ° F),
the surface of the enclosure, especially the heat sink, can reach a temperature of 85°C
(185 °F) and above. Be careful and do not touch the RXi2-UP IPC with bare fingers.
Install the RXi2-UP IPC only in rooms with restricted access.
This chapter describes unpacking, initial inspection, and required preparation
considerations before using the RXi2-UP IPC. Perform the procedures in this chapter to
verify proper operation after shipping and before system integration.
3.1 Package Contents
Verify that the delivered package contains the contents listed in the following table.
Table 3-1 Delivery Volume
Qty
Item
Purpose
1
RXi2-UP
RXi2-UP Industrial PC
1
FKCN 2,5/ 3-STF
Power Connector
1
R2X00ACCMP05
Flat Mounting Kit
1
FB-HW-058
Important Information
2
-
keys for RAID caddys

RXi2-UP IPC Hardware Reference Manual Section 3
GFK-3047D Oct 2021
Unpacking and Inspection 7
3.2 ESD and EMI
Electrostatic Discharge (ESD) is the discharge of static electricity. Electromagnetic
Interference (EMI) is a disturbance generated by an external source that affects an electrical
circuit by electromagnetic induction, electrostatic coupling, or conduction. ESD and EMI
issues may show up incomplete and operational systems. There are many ways to avoid
problems with these issues.
Any operational system with cables for I/O signals, connectivity, or peripheral devices
provides an entry point for ESD and EMI. If Emerson does not manufacture the complete
system, including enclosure and cables, it is the responsibility of the system integrator and
end-user to protect their system against potential problems. Filtering, optical isolation, ESD
gaskets, and other measures might be required at the physical point of entry (enclosure wall
of box or rack). For example, it is state-of-the-art that protection cannot be done at the
internal connector of an RTM if a cable is attached and routed outside the enclosure. It has
to be done at the physical entry point as specified in this document.
Products manufactured by Emerson should normally be suitable for use in properly
designed and produced customer equipment (system boxes or operational systems)
without any major redesign. However, the systems might be subject to problems and issues
once assembled, cabled, and used. The end-user, system integrator, or installer must test
for possible problems and in some cases show compliance to local regulations as required
in his country or by the intended application.
ESD is a major cause of electronic component failure. The component has been packed in a
static-safe bag to protect it from ESD while it is in the bag. Before removing the component
or any other electronic product from its static-safe bag, be prepared to handle it in a static-
safe environment.
CAUTION
Static-sensitive Devices: Handle only at static-safe workstations.
CAUTION
This is an FCC Class A product for use in an industrial environment. In a home or
residential environment, this product may cause radio interference in which case the
user may be required to take adequate measures.
CAUTION
Drain static electricity before you install or remove any parts. Installing or removing
modules without observing this precaution could result in damage to this and/or other
modules or components in your system.
Wear a properly functioning anti-static strap and make sure you are fully grounded. Any
surface upon which you place the unprotected module or unit should be static-safe, which
is usually facilitated by the use of anti-static mats. From the time it is removed from the anti-
static bag until it is in the board carrier and functioning properly, extreme care should be
taken to avoid zapping the component with ESD. Be aware that you could zap the
component without knowing it; a small discharge, imperceptible to the eye and touch, can

RXi2-UP IPC Hardware Reference Manual Section 3
GFK-3047D Oct 2021
Unpacking and Inspection 8
often be enough to damage electronic components. Extra caution should be taken in cold
and dry weather when electrostatics easily builds up.
Only after ensuring that both you and the surrounding area are protected from ESD,
carefully remove the component from the shipping carton by grasping the module on its
edges. Place the component, in its anti-static bag, flat down on a suitable surface. You may
then remove the component from the anti-static bag by tearing the ESD warning labels.
3.3 Unpack and Inspect
WARNING
Before installing or removing any board or module, ensure that the system power and
external supplies have been turned off.
WARNING
Do not apply power to the board if it has visible damage. Doing so may cause further,
possibly irreparable damage, as well as introduce a fire or shock hazard.
ATTENTION
Retain all packing material in case of future need.
Before unpacking the board or module, or fitting the device into your system, read the
manual carefully. Also, adhere to the following guidelines:
•Observe all precautions for electrostatic sensitive modules.
•If the product contains batteries, do not place it on conductive surfaces, anti-
static plastic, or a sponge, which can cause shocks and lead to battery or board
trace damage.
•Do not exceed the specified operational temperatures. Batteries and storage
devices might also have temperature restrictions.
•Keep all original packaging material for future storage or warranty shipments of
the board.
After unpacking the component, inspect it for visible damage that may have occurred
during shipping or unpacking. Although the product is carefully packaged to protect it
against the rigors of shipping, it is still possible that rare shipping damages may occur.
Careful inspection of the shipping carton should reveal some information about how the
package was handled by the shipping service.
If evidence of damage or rough handling is found (usually in the form of bent component
leads or loose socketed components), notify the shipping service as soon as possible and
contact Emerson for additional instructions. Depending on the severity of the damage, it
may be necessary to return the product to the factory for repair.

RXi2-UP IPC Hardware Reference Manual Section 3
GFK-3047D Oct 2021
Unpacking and Inspection 9
Figure 7: RXi2-UP IPC Packaging
3.4 Handling
WARNING
If the RXi2-UP IPC operates with an enhanced ambient temperature up to 65°C (149 ° F),
the surface of the enclosure, especially the heat sink, can reach a temperature of 85°C
(185 °F) and above. Be careful and do not touch the RXi2-UP IPC with bare fingers.
CAUTION
Install the RXi2-UP IPC only in rooms with restricted access.
CAUTION
Hot surfaces are possible, depending on factors such as CPU load, ambient temperature,
and so forth. Be careful and do not touch the RXi2-UP with bare fingers!

RXi2-UP IPC Hardware Reference Manual Section 4
GFK-3047D Oct 2021
Mounting 10
Section 4: Mounting
RXi2-UP IPC cooling is designed for the wall-mounted orientation of the box.
•Flat wall mounting
4.1 Flat Wall-Mounting
There are two types of wall mounting:
•Flat wall mounting with mounting plates
•Flat wall mounting through the wall
For the best results of heat dissipation, observe the minimum clearances for flat wall
mounting as illustrated in the following figure.
Figure 8: Heat Dissipation Clearance

RXi2-UP IPC Hardware Reference Manual Section 4
GFK-3047D Oct 2021
Mounting 11
4.1.1 Flat Wall Mounting with Mounting Plates
The screws selected for use depend on the nature of the wall. The mounting plates have four
drills holes with a diameter of 5.3 mm (0.209 in), so the maximum screw diameter cannot
be higher than 5.2 mm (0.205 in). The head of the screws must be smaller than 10 mm (0.4
in) to pass the hole of the top fixing points of the mounting plate.
Note: The mounting plate for the 2-slot and 4-slot versions will be the same.
Figure 9: Flat Wall Mounting with Mounting Plates

RXi2-UP IPC Hardware Reference Manual Section 4
GFK-3047D Oct 2021
Mounting 12
4.1.2 Flat Wall Mounting Through Wall
To mount the IPC with screws from the wall side, place drill holes in the wall. Refer to the
following figure for the positions for the holes. The thread in the enclosure is an M6 with a
usable thread length of 15 mm (0.60 in). Select the screw length so that a minimum of 10
mm (0.4 in) thread will be used and torque to 3.5 Nm (30.98 in-lb).
Figure 10: Flat Wall Mounting Through Wall

RXi2-UP IPC Hardware Reference Manual Section 5
GFK-3047D Oct 2021
Installation and Startup 13
Section 5: Installationand Startup
This chapter describes the installation and initial startup operations. Because the unit is
available in several configurations, the description in this chapter is related to a standard
configuration.
WARNING
Before installing or removing any component, make sure that the system power and
external supplies have been turned off.
CAUTION
Static-sensitive Devices: Handle only at static-safe workstations.
CAUTION
Drain static electricity before you install or remove any parts. Installing or removing
modules without observing this precaution could result in damage to this and/or other
components in your system.
5.1 General InstallationGuidelines
Adhere to the following guidelines during installation:
•Observe all safety procedures to avoid damaging the system and protect
operators and users.
•Before installing or removing any board, verify that the system power and external
supplies have been turned off.
•Verify that the jumpers (if any) are correctly configured for your application.
•Make sure the RXi2-UP IPC is properly mounted.
•Connect all I/O cables.
•Do not restore power until all components are fitted correctly into the system and
all connections have been made properly.
5.2 Required Materials
The following items are required to start the RXi2-UP IPC in a standard configuration:
•Power supply
•Keyboard and mouse
•Video monitor

RXi2-UP IPC Hardware Reference Manual Section 5
GFK-3047D Oct 2021
Installation and Startup 14
5.2.1 Power Supply
WARNING
Verify that the power supply is turned OFF while installing boards or modules into the
RXi2-UP IPC.
Adhere to the following guidelines:
•Verify that the power supply is capable of meeting the total power requirements
of the RXi2-UP IPC. (Refer to the section Specifications.)
•Verify you do not have the power supply turned ON while opening the enclosure
to install add-on boards and modules into the RXi2-UP IPC (such as the PCIe
boards or internal SATA drives).
5.2.2 Keyboard
A compatible USB keyboard for the initial system operation of the RXi2-UP IPC is required.
Depending on your application, this may be a standard keyboard or one that uses
membrane switches for harsh environments.
5.2.3 Video Monitor
Any video monitor with a native Display Port (or a suitable adaptor for the Display Port) can
be used for initial setup.
5.3 Minimum System Requirements
The RXi2-UP IPC has been thoroughly tested and is nearly ready for use in the target system.
To verify operation for the first time, Emerson recommends that you only configure a
minimal system. It is not necessary to have disk drives, a flash disk, or other accessories
connected to perform the Power-On Self-Test (POST).
5.4 Power-On Self-Test (POST)
Each time the computer boots up it must pass the POST. If the computer does not pass any
of the test items, the unit will fail the POST.
Test items are as follows:
•CPU must exit the reset status mode and thereafter be able to execute instructions
•SPI Flash ROM and Non-Volatile Random-Access Memory (NOVRAM) is readable
•The checksum is valid (readable)
•CMOS is readable (CMOS checksum is valid)
•CPU can read all forms of memory, such as the memory controller, memory bus, and
memory module
•The first 64 KB of memory is operational and can be Read and Written to and from, and
contains the POST code
•I/O bus/controller is accessible
•I/O bus can Read/Write from the video subsystem and be able to read all video RAM

RXi2-UP IPC Hardware Reference Manual Section 5
GFK-3047D Oct 2021
Installation and Startup 15
5.5 Installation Procedures
5.5.1 PCIe Board Installation
Install a PCIe board into the RXi2-UP IPC using the following procedure.
To install the PCIe board
WARNING
Verify that the power supply is turned OFF while installing boards or modules into the
RXi2-UP IPC.
1. Remove the top cover by removing the four screws in each corner (Tx20).
Figure 11: RXI2-UP Top Cover