Fastwel CPC307 Series User manual

CPC307
PC/104-Plus
Vortex86DX Based
CPU Module
User Manual
Rev. 4.1
October 2019

Product Title: CPC307
Document name: CPC307 User Manual
Manual version: 006
Copyright © 2019 Fastwel Co. Ltd. All rights reserved.
Revision Record
Rev. Index
Brief Description of Changes
Date of Issue
001
Initial preliminary version
July 2010
002
BIOS Setup description added.
August 2010
003
Multiple changes caused by changes in the PCB design
December 2012
005
Compliance assessment
December 2015
006
Second compliance assessment
October 2019
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation
6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011, USA
Tel.:
[phone] Tel:
[phone]
Fax:
[phone]
E-mail:
[email protected] E-mail:
[email protected]
Web:
http://www.fastwel.com/

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Table of Contents
Table of Contents..................................................................................................................................................... 1
List of Tables............................................................................................................................................................ 3
List of Figures .......................................................................................................................................................... 4
Notation Conventions............................................................................................................................................... 5
General Safety Precautions..................................................................................................................................... 6
Unpacking, Inspection and Handling........................................................................................................................ 7
Three Year Warranty................................................................................................................................................ 8
1 Introduction.............................................................................................................................................9
1.1 Module Introduction...................................................................................................................................... 9
1.2 CPC307 Versions....................................................................................................................................... 10
1.3 Delivery Checklist....................................................................................................................................... 11
1.4 Additional Accessories................................................................................................................................ 11
2 Technical Specifications .................................................................................................................... 13
2.1 General....................................................................................................................................................... 13
2.2 Power Requirements.................................................................................................................................. 15
2.3 Environmental............................................................................................................................................. 15
2.4 Mechanical.................................................................................................................................................. 15
2.5 Dimensions and Weight.............................................................................................................................. 16
2.6 MTBF.......................................................................................................................................................... 18
3 Intended Use of the Device ................................................................................................................ 19
4 Functional Description ....................................................................................................................... 20
4.1 Structure and Layout .................................................................................................................................. 20
4.2 Address space allocation............................................................................................................................ 21
4.2.1 Allocation of memory address space……………………………………………………………….28
4.2.2 Allocation of I/O address space……………………………………………………………………..28
4.2.3 Integrated address decoder……………………………………………………………………….…28
4.2.4 Allocation of interrupt lines………………………………………………………………………..….31
4.2.5 Allocation of channels for direct access to memory……………………………………………….33
4.3 Description of the main functional elements of the module……………………………………………………34
4.3.1 Vortex86DX System-on-Chip……………………………………………………………………..….34
4.3.2 DDR2 Memory…………………………………………………………………………………………35
4.3.3 IDE interface…………………………………………………………………………………………..35
4.3.4 MicroSD……………………………………………………………………………………….……….37
4.3.5 ATA Flash disk controller…………………………………………………………………………….38
4.3.6 PS/2-keyboard and mouse……………………………………………………………………….….38
4.3.7 Optoisolated reset/interrupt………………………………………………………………………….39
4.3.8 USB interface…………………………………………………………………………………………40
4.3.9 Ethernet port…………………………………………………………………………………………..41
4.3.10 Serial ports……………………………………………………………………………………………42
4.3.11 Parallel printer port (LPT)……………………………………………………………………………52
4.3.12 PC/104-plus connectors…………………………………………………………………………..…53
4.3.13 PC/104 Connector……………………………………………………………………………………55
4.3.14 CAN-interfaces……………………………………………………………………………………….58
4.3.15 WDT Watchdog timers………………………………………………………………………………60

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4.3.16 RTC, CMOS, FRAM, hardware reset and BIOS backup…………………………………………62
4.3.17 Connecting power supply to the module…………………………………………………………...71
4.3.18 Module’s supply voltage supervisor……………………………………………………….............72
4.3.19 GPIO ports…………………………………………………………………………………………….73
4.3.20 Configuration jumpers……………………………………………………………………………….76
4.3.21 LED indication……………………………………………………….………………………………..80
4.3.22 Features of the console redirect module…………………………………………………………..81
5 BIOS (Basic Input/Ouput System) ..................................................................................................... 83
5.1 Main............................................................................................................................................................ 84
5.2 Advanced (Additional Settings)................................................................................................................... 85
5.3 PCIPNP (Additional PCI Plug and Play configuration)................................................................................ 94
5.4 Boot (Boot Modes)……………………………………………………………………………………………………96
5.5 Security ……………………………………………………………………………………………………………….98
5.6 Chipset (Integrated devices)……………………………………………………………………………………….100
5.7 Exit……………………………………………………………………………………………………………………109
5.8 Functional Constraints of BIOS Versions………………………………………………………………………...110
ANNEX A: DISCLAIMER....................................................................................................................................111

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List of Tables
Table 1.1: CPC307 Versions.............................................................................................................................................10
Table 1.2: CPC307 Supplied Set ......................................................................................................................................11
Table 1.3: CPC307 Additional Accessories……….............................................................................................................11
Table 1.4: Configurations……………………………………………………………………….……………………………………..12
Table 2.1: Power Supply Requirements............................................................................................................................15
Table 2.2: Weight of the module……………………………………………………………………….……………………………..16
Table 4.1: Allocation of the address space of the first megabyte of memory………………....…………………………………28
Table 4.2: I/O address space allocation……………………………………………………………….……………………………..28
Table 4.3: Structure of GPCS0, GPCS1 registers………………………………………………….……………………………….29
Table 4.4: Preset address values for CAN1 and CAN2 interfaces………………………………………………………………..30
Table 4.5: Preset address values for COM5 and COM6 ports…………………………………………………………………….31
Table 4.6: Allocation of interrupt lines in СPС307…………………………………………………………………………………...32
Table 4.7: Allocation of channels for direct access to memory…………………………………………………………………….33
Table 4.8: Possible configurations of connecting IDE devices to the module …………………………………………………...35
Table 4.9: The purpose of the XP13 contacts for connecting IDE devices……………………………………………………….36
Table 4.10: Table of recommended configurations of IDE devices…………………………………………………………………37
Table 4.11: Purpose of XS3 and XS4 connectors contacts for microSD card connection ………………………………………38
Table 4.12: Purpose of XP23 connector contacts for connection of PS/2 keyboard and mouse………………………………..39
Table 4.13: Purpose of XP12 connector contacts for the connection of USB devices……………………………………………41
Table 4.14: Purpose of contacts of XP9 connector of Ethernet port………………………………………………………………..42
Table 4.15: Purpose of the XP10 connector contacts for COM1 port ……………………………………………………………...46
Table 4.16: Purpose of the XP16 connector contacts for COM2 port…………………….....................…………………………46
Table 4.17: Purpose of the XP6 connector contacts for COM3 port………………………………………………………………..48
Table 4.18: Purpose of the XP7 connector contacts for COM4 port………………………………………………………………..48
Table 4.19: Assigned resources of the COM5 and COM6 controllers………………………………………………………………48
Table 4.20: Purpose of the XP17 connector contacts for the COM5 and COM6 ports…………………………………………...51
Table 4.21: Purpose of the XP12 connector contacts for LPT1 port………………………………………………………………..52
Table 4.22: Purpose of the XS1 connector contacts………………………………………………………………………………….53
Table 4.23: Purpose of XS2 connector contacts………………………………………………………………………………………56
Table 4.24: Assigned resources of CAN1 and CAN2 controllers……………………………………………………………………58
Table 4.25: Purpose of XP5 connector pins for CAN1 and CAN2 ports……………………………………………………………59
Table 4.26: Description of control registers of the WDT0 watchdog timer…………………..…………………………………….60
Table 4.27: Description of the WDT1 watchdog control registers………………………………..………………………………...61
Table 4.28: Purpose of the XP22 additional power connector contacts…………………….…………………………………….72
Table 4.29: Description of GPIO ports…………………………………………………………….………………………………….74
Table 4.30: Description of GPIO ports…………………………………………………………….………………………………….74
Table 4.31: Purpose of XP14 connector contacts for GPIO0 port…………………………….…………………………………..75
Table 4.32: Description of jumpers installation to the XP4 connector……………………………….……………………………76
Table 4.33: Description of jumpers installation to the XP8 connector…………………………………….………………………76
Table 4.34: Description of jumpers installation to the XP15 connector (for module versions up to 4.х)……………………...76
Table 4.35: Description of jumper installation on XP15 connector for module versions 4.x…………………………………...77
Table 4.36: Description of jumper installation on XP18 connector for module versions up to 4.x…………………………….77
Table 4.37: Description of jumper installation on XP18 connector for module versions 4.x…………………………………...77
Table 4.38: Description of jumper installation on XP20 connector for module versions up to 4.x…………………………….77
Table 4.39: Description of jumper installation on XP20 connector for module versions 4.x…………………………………...78
Table 4.40: Description of jumper installation on XP24 connector……………………………………………………………….78
Table 4.41: Description of jumpers installation on XP25 connector………………………………………………………………78
Table 4.42: Description of jumper installation on XP21 connector (for module versions up to 4.x)…………………………..78
Table 4.43: Description of installing the jumpers on the XP26 connector……………………………………………………….79
Table 4.44: Description of installing the jumpers on the XP27 connector……………………………………………………….79
Table 4.45: Purpose of the LEDs on the module…………………………………………………………………………………...80
Table 4.46: Purpose of the XP3 connector contacts……………………………………………………………………………….80
Table 5.1: Description of the “Main» menu…………………………………………………………………………….…………..84
Table 5.2: Description of the “Advanced» (Additional Settings) menu……………………………………………….…………85
Table 5.3: Description of the “CPU Configuration” menu…………………………………………………………………………86
Table 5.4: Description of the IDE Configuration menu……………………………………………………………………………87
Table 5.5: Description of the “Primary IDE Master” menu………………………………………………………………………..88
Table 5.6: Description of the Remote Access Configuration (Console I/O Configuration) menu…………………………….90
Table 5.7: Description of the “USB Configuration” menu…………………………………………………………………………92
Table 5.8: Description of the “USB Mass Storage Device Configuration” menu (Configuration of USB ports)……………..93
Table 5.9: Description of the “PCIPnP” menu (Additional PCI Plug and Play configuration…………………………………..94
Table 5.10: Description of the “Boot» menu (Boot Modes)…………………………………………………………………………96
Table 5.11: Description of the “Boot Settings Configuration” menu (Configuration of boot modes)……………………………97
Table 5.12: Description of the Security menu………………………………………………………………………………………...99
Table 5.13: Description of the "Chipset" menu (Integrated devices)………………………………………………………………100
Table 5.14: Description of the “South Bridge Configuration” menu (South Bridge Configuration)……………………………...101

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Table 5.15: Description of the “ISA Configuration” menu (ISA Bus Setting)…………………………………………………103
Table 5.16: Description of the "Serial/Parallel Port Configuration" menu……………………………………………………..104
Table 5.17: Description of the WatchDog Configuration menu…………………………………………………………………106
Table 5.18: Description of the “GPIO and I2C Configuration” menu…………………………………………………………...107
Table 5.19: Description of the "CAN and COM5,6 Configuration" menu (Configuration of CAN1,2 and COM5,6 ports)...108
Table 5.20: Description of the “Exit» menu………………………………………………………………………………………..109
List of Figures
Figure 2.1: a) Dimensions of versions and location of СPС307 components (this figure is relevant for the versions
3.х)………………………. ........................................................................................................................................................................17
Figure 2.2: b) Dimensions and location of СPС307 components (this figure is relevant for versions 4.х)………………….....18
Figure 3.1: Connection of external devices to CPC307…………………………………………………………………………..…19
Figure 4.1: CPC307 Block Diagram……………………………………………………………………………………………………20
Figure 4.2: (a) location of connectors and main components on the TOP side and BOTTOM side for versions CPC307-02,
CPC307-05 (relevant for CPC307 V. 3.(x)……………………………………………………………………………………………………………22
Figure 4.3: b) location of connectors and main components on the TOP and BOTTOM sides for the CPC307-02 and CPC307-
05 versions (relevant for CPC307 V. 4.x)…………………………………………………………………………………………………………….23
Figure 4.4: a) location of connectors and main components on the TOP side and BOTTOM side for CPC307-03 (relevant for
CPC307 V. 3.x)………………………………………………………………………………………………………………………………………….24
Figure 4.5: b) location of connectors and main components on the TOP and BOTTOM sides for CPC307-03 (relevant for
CPC307 V. 4.x)………………………………………………………………………………………………………………………………………….25
Figure 4.6: a) location of connectors and main components on the TOP side and BOTTOM side for CPC307-04 (relevant for
CPC307 V. 3.x)………………………………………………………………………………………………………………………………………….26
Figure 4.7: b) location of connectors and main components on TOP and BOTTOM sides for the CPC307-04 version (relevant
for CPC307 V. 4.x)………………………………………………………………………………………………………………………………………27
Figure 4.8: Block Diagram of Vortex86DX SoC……………………………………………………………………………………….34
Figure 4.9: Numbering contacts of XP13 connector………………………………………………………………………………….36
Figure 4.10: Numbering contacts of microSD memory card…………………………………………………………………………..38
Figure 4.11: Numbering XP23 connector contacts……………………………………………………………………………………..39
Figure 4.12: Diagram of choosing the source of reset and switching the optoisolated input………………………………………40
Figure 4.13: Numbering XP19 connector contacts……………………………………………………………………………………..40
Figure 4.14: Numbering XP12 connector contacts……………………………………………………………………………………...41
Figure 4.15: Numbering contacts of XP9 connector…………………………………………………………………………………….42
Figure 4.16: Pin assignment of XP18 connector (for module versions 3.x and below)……………………………………………...43
Figure 4.17: a) RS-422/485 Transmitter with offset elements and terminating resistors (for the module’s versions 3.x and
below)………………………………………………………………………………………………………………………………………………………44
Figure 4.17: b) RS-422/485 Transmitter with offset elements and terminating resistors (for module’s versions 4.x)……………45
Figure 4.17: c) Purpose of the XP18 connector contacts (for module versions 4.x and below)……………………………………45
Figure 4.18: Numbering XP10 and XP16 connectors contacts………………………………………………………………………...46
Figure 4.19: Combining several devices via RS-422 interface…………………………………………………………………………47
Figure 4.20: Combining several devices via RS-485 interface…………………………………………………………………………47
Figure 4.21: Numbering contacts of the XP6 and XP7 connectors……………………………………………………………………48
Figure 4.22: a) Purpose of the XP15 and XP20 connector contacts (for module versions up to 4.x)……………………………..49
Figure 4.22: b) Purpose of XP15 and XP20 connectors contacts (for module’s version 4.x)………………………………………50
Figure 4.23: a) Transmitter with protective bias elements and terminating resistors (for module versions up to 4.x)……………50
Figure 4.23: b) Transmitter with protective bias elements and terminating resistors (for module versions 4.x)………………….51
Figure 4.24: Numbering the XP17 connector contacts………………………………………………………………………………….51
Figure 4.25: Numbering the XP12 connector contacts………………………………………………………………………………….52
Figure 4.26: PCI-104 XS1 connector: a) top view of the module; b) bottom view of the module with the organizer installed on
the connector……………………………………………………………………………………………………………………………………………...54
Figure 4.27: Numbering the XS2 connector contacts: a) top view of the module; b) bottom view of the module with the
organizer installed on the connector……………………………………………………………………………………………………………………57
Figure 4.28: a) Purpose of XP4 and XP8 connectors’ pins (for up to 4.x module’s versions)………………………………………58
Figure 4.28: b) Purpose of XP4 and XP8 connectors’ pins for 4.х module versions………………………………………………...59
Figure 4.29: Numbering of XP5 connector pins………………………………………………………………………………………….59
Figure 4.30: Connection of the bias resistor in the CAN line…………………………………………………………………………...59
Figure 4.31: Numbering the XP22 connector contacts………………………………………………………………………………….72
Figure 4.32: Diagram of module’s power supply voltage supervisor………………………………………………………………….73
Figure 4.33:. Numbering the XP14 connector contacts………………………………………………………………………………….76
Figure 4.34: Connecting LEDs to XP3…………………………………………………………………………………………………….80
Figure 5.1: Screen view during the module’s booting (POST)………………………………………………………………………..83
Figure 5.2: Screen of the “Main» menu………………………………………………………………………………………………….84
Figure 5.3: Screen of the “Advanced» menu……………………………………………………………………………………………85
Figure 5.4: Screen of the “CPU Configuration» menu…………………………………………………………………………………86
Figure 5.5: Screen of the IDE Configuration menu…………………………………………………………………………………….87
Figure 5.6: Screen of the “Primary IDE Master” menu………………………………………………………………………………...88
Figure 5.7: Screen of the Remote Access Configuration……………………………………………………………………………...90
Figure 5.8: Screen of the “USB Configuration» menu…………………………………………………………………………………92
Figure 5.9: Screen of the “USB Mass Storage Device Configuration” menu………………………………………………………..93
Figure 5.10: Screen of the “PCIPnP» menu……………………………………………………………………………………………...94
Figure 5.11: Screen of the “Boot» menu………………………………………………………………………………………………….96
Figure 5.12: Screen of the “Boot Settings Configuration” menu……………………………………………………………………….97
Figure 5.13: Screen of the “Security” menu………………………………………………………………………………………………98
Figure 5.14: Screen of the "Chipset" menu……………………………………………………………………………………………..100
Figure 5.15: Screen of the “South Bridge» menu………………………………………………………………………………………101
Figure 5.16: Screen of the “ISA Configuration” menu………………………………………………………………………………….103

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Figure 5.17: Screen of the "Serial/Parallel Port Configuration" menu……………………………………………….………………104
Figure 5.18: Screen of the "WatchDog Configuration" menu…………………………………………………………………………106
Figure 5.19: Screen of the “GPIO and I2C Configuration” menu……………………………………………………………………..107
Figure 5.20: Screen of the "CAN and COM5,6 Configuration” menu………………………………………………………………..108
Figure 5.21: Screen of “Exit” menu………………………………………………………………………………………………………109
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and is
believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies, omissions or their consequences,
as well as liability arising from the use or application of any product or example described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software
described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of
this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert
it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of Xerox Corporation. IEEE is a
registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation. Microsoft is a trademark of the Microsoft
corporation. In addition, this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their
respective owners. Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.
Notation Conventions
Warning, ESD Sensitive Device!
This symbol draws your attention to the information related to electro static sensitivity of your
product and its components. To keep product safety and operability it is necessary to handle
it with care and follow the ESD safety directions.
Warning!
This sign marks warnings about hot surfaces. The surface of the heatsink andsome
components can get very hot during operation. Take due care when handling, avoid
touching hot surfaces!
Caution: Electric Shock!
This symbol warns about danger of electrical shock (> 60 V) when touching products or
parts of them. Failure to observe the indicated precautions and directions may expose your
life to danger and may lead to damage to your product.
Warning!
Information marked by this symbol is essential for human and equipment safety.
Read this information attentively, be watchful.
Note...
This symbol and title marks important information to be read attentively for your own benefit.

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General Safety Precautions
This product was developed for fault-free operation. Its design provides conformance to all related
safety requirements. However, the life of this product can be seriously shortened by improper
handling and incorrect operation. That is why it is necessary to follow general safety and
operational instructions below.
Caution, Electric Shock!
Before installing this product into a system and before installing
other devices on it, always ensure that your mains power is switched
off.
Always disconnect external power supply cables during all handling
and maintenance operations with this module to avoid serious
danger of electrical shock.
Warning!
When handling this product, special care must be taken not to hit
the heatsink (if installed) against another rigid object. Also, be
careful not to drop the product, since this may cause damage
to the heatsink, CPU or other sensitive components as well.
Please, keep in mind that any physical damage to this product
is not covered under warranty.
Note:
This product is guaranteed to operate within the published
temperature ranges and relevant conditions. However, prolonged
operation near the maximum temperature is not recommended by
Fastwel or by electronic chip manufacturers due to thermal stress
related failure mechanisms. These mechanisms are common to all
silicon devices, they can reduce the MTBF of the product by
increasing the failure probability. Prolonged operation at the lower
limits of the temperature ranges has no limitations.
Warning!
All operations on this device must be carried out by sufficiently
skilled personnel only.

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Unpacking, Inspection and Handling
Please read the manual carefully before unpacking the module or mounting the device into your
system. Keep in mind the following:
ESD Sensitive Device!
Electronic modules and their components are sensitive to static
electricity. Even a non-perceptible by human being static discharge
can be sufficient to destroy or degrade a component's operation!
Therefore, all handling operations and inspections of this product
must be performed with due care, in order to keep product integrity
and operability:
Preferably, unpack or pack this product only at EOS/ESD safe workplaces. Otherwise, it is
important to be electrically discharged before touching the product. This can be done by
touching a metal part of your system case with your hand or tool. It is particularlyimportant
to observe anti-static precautions when setting jumpers or replacing components.
If the product contains batteries for RTC or memory back-up, ensure that the module is not
placed on conductive surfaces, including anti-static mats or sponges. This can cause short-
circuit and result in damage to the battery and other components.
Store this product in its protective packaging while it is not used for operational purposes.
Unpacking
The product is carefully packed in an antistatic bag and in a carton box to protect it against
possible damage and harmful influence during shipping. Unpack the product indoors only at a
temperature not less than +15°C and relative humidity not more than 70%. Please note, that if the
product was exposed to the temperatures below 0°С for a long time, it is necessary to keep it at
normal conditions for at least 24 hours before unpacking. Do not keep the product close to a heat
source.
Following ESD precautions, carefully take the product out of the shipping carton box. Proper
handling of the product is critical to ensure correct operation and long-term reliability. When
unpacking the product, and whenever handling it thereafter, be sure to hold the module preferably
by the front panel, card edges or ejector handles. Avoid touching the components and connectors.
Retain all original packaging at least until the warranty period is over. You may need it for
shipments or for storage of the product.
Initial Inspection
Although the product is carefully packaged, it is still possible that shipping damages may occur.
Careful inspection of the shipping carton can reveal evidence of damage or rough handling. Should
you notice that the package is damaged, please notify the shipping service and the manufacturer
as soon as possible. Retain the damaged packing material for inspection.
After unpacking the product, you should inspect it for visible damage that could have occurred
during shipping or unpacking. If damage is observed (usually in the form of bent component leads
or loose socketed components), contact Fastwel's official distributor from which you have
purchased the product for additional instructions. Depending on the severity of the damage, the
product may even need to be returned to the factory for repair. DO NOT apply power to the product
if it has visible damage. Doing so may cause further, possibly irreparable damage, as well as result
in a fire or electric shock hazard.
If the product contains socketed components, they should be inspected to make sure they are
seated fully in their sockets.

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Handling
In performing all necessary installation and application operations, please follow only the
instructions supplied by the present manual.
In order to keep Fastwel’s warranty, you must not change or modify this product in any way, other
than specifically approved by Fastwel or described in this manual.
Technical characteristics of the systems in which this product is installed, such as operating
temperature ranges and power supply parameters, should conform to the requirements stated by
this document.
Retain all the original packaging, you will need it to pack the product for shipping in warranty cases
or for safe storage. Please, pack the product for transportation in the way it was packed by the
supplier.
When handling the product, please, remember that the module, its components and connectors
require delicate care. Always keep in mind the ESD sensitivity of the product.
Three Year Warranty
Fastwel Co. Ltd. (Fastwel), warrants that its standard hardware products will be free from defects
in materials and workmanship under normal use and service for the currently established warranty
period. Fastwel’s only responsibility under this warranty is, at its option, to replace or repair any
defective component part of such products free of charge.
Fastwel neither assumes nor authorizes any other liability in connection with the sale, installation
or use of its products. Fastwel shall have no liability for direct or consequential damages of any
kind arising out of sale, delay in delivery, installation, or use of its products.
If a product should fail through Fastwel's fault during the warranty period, it will be repaired free of
charge. For out of warranty repairs, the customer will be invoiced for repair charges at current
standard labor and materials rates.
Warranty period for Fastwel products is 36 months since the date of purchase.
The warranty set forth above does not extend to and shall not apply to:
1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.
2. Products, which have been subject to power supply reversal, misuse, neglect,
accident, or improper installation.
Returning a product for repair
1. Apply to Fastwel company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

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1 Introduction
This document presents general information on CPC307 CPU module, the details of its proper and safe
installation, configuration and operation. The issues of PC/104 modules and external devices connection
are also considered. This document applies to the module version 3.1.
1.1 Module Introduction
Fastwel CPC307 is designed for applications requiring high-performance low-power industrial controller
with CAN interface. Fastwel СPС307 conforms to PC/104-Plus specification (except CPC307-01) and is
compatible with a large number of peripheral and power supply modules delivered by a wide range of
manufacturers.
Based on x86-compatible 32-bit Vortex86DX System-on-Chip (SoC) operating at 600 MHz, the module
bears 256 MB soldered DDR2 memory and wide range of input/output interfaces. CPC307 allows
system designers simple programming and provides portability of previously developed libraries for x86
architecture with DOS, Linux, Windows CE, and QNX support. Having two isolated CAN ports onboard
along with a wide set of popular industrial interfaces, such as RS232, RS485, RS422, USB, and Fast
Ethernet, CPC307 offers integrated functionality which is usually achieved by using several products
from different manufacturers.
The module is designed for operation at temperatures from -40C to +85C.
CPC307 is supplied with the preinstalled FDOS 6.22 operating system and supports MS DOS 6.22,
QNX 6.4, and Linux 2.6 operating systems.
The User Manual provides information on the proper and safe installation, switching on the module and
configuring it, connection and interaction with the extension modules and external devices.
The User Manual also covers the questions relating to the start, debugging and use of programs
from among the base and service software (hereinafter referred to as the software), nature of BIOS
redundancy for module’s version 3.x and earlier versions.

CPC307
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1.2 CPC307 Versions
At the present time the CPC307 module is manufactured in several versions differing in interface
capabilities.
Table 1.1: CPC307 Versions
Name
Conventional notation
Ordering name
Description
CPC307 CPU Module
CPC307
CPC307-02
Vortex86DX (600 MHz), 256 MB HDD,
flash-drive 1 GB –for the module’s versions
up to the 4.x; 2 GB –for the module’s
versions up to the 4.х, IDE, 2xRS-
232/485/422, 2xRS-232, 2xRS-422/485,
2хCAN, LAN 10/100, LPT, 4xUSB2.0,
8xGPIO, 2xI2C, PC/104-plus format (ISA,
PCI).
CPC307-03
Vortex86DX (600 Mhz), 256 MB HDD, flash
drive 1 GB –for module’s versions up to 4.x; 2
–for module’s versions of up to 4.х, IDE,
2xRS-232/485/422, 2xRS-232, LAN 10/100,
LPT, 4xUSB2.0, 8xGPIO, 2xI2C, PC/104-plus
format (ISA, PCI)
CPC307-04
Vortex86DX (600 MHz), 256 MB HDD, 2x
microSD, IDE, 2xRS-232/485/422, 2xRS-232,
2xRS-422/485, 2xCAN, LAN 10/100, LPT,
4xUSB2.0, 8xGPIO, 2xI2C, PC/104-plus
format (ISA, PCI)
CPC307-05
Vortex86DX (600 MHz), 256 MB HDD, flash
drive 1 GB –for the module’s versions of up to
4.х; 2 GB –for the module’s version 4.х, IDE,
2xRS-232/485/422, 2xRS-232, 2xRS-422/485,
2хCAN, LAN 10/100, LPT, 4xUSB2.0,
8xGPIO, 2xI2C, PC/104-plus format (ISA,
PCI), COATED, from -50 to +90 ºС
Other options:
\COATED –Protective coating option for CPC307-02, -03, -04;
\LNX –Preinstalled Linux 2.6 for CPC307-02, -03, -05;
Preinstalled upon request (for CPC307-02, -03, -05);
\WCE5 –Preinstalled Windows CE 5.0;
\QNX –QNX 6.4.

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1.3 Delivery Checklist
Table 1.2: CPC307 Supplied Set
Name
Description
Amount
CPC307
CPC307 Processor Module
1 pcs.
Installation kit that includes:
1 pcs.
ACS00023
DB9F to IDC2-10 2 mm adapter cable for connection to COM port
(685611.082)
1 pcs.
–
М3 nut DIN934
4 pcs.
–
Rack for PCBs, PCSN-15, made of brass
4 pcs.
–
Star lock washer, Ø3 DIN6798A
4 pcs.
–
Packaging, consumer carton box for PС104, 155х140х45 mm
1 pcs.
1.4 Additional Accessories
The table 1.3 below shows the list of additional accessories for СPС307 module, which are not
included in the standard delivery checklist and can be ordered separately.
Table 1.3: CPC307 Additional Accessories
Name
Description
CDM02
Adapter module for connection of 3.5" HDD
ACS00010
FC44 cable for 2.5" HDD connection to 44-contact header, pitch of 2 mm.
ACS00023
IDC2-10 –D-SUB 9M cable (plug, two rows, enclosed) for connection to RS-232
ports.
ACS00031-03
ACS0054
PHR-2 connector set. Includes JST PHR-2 socket and a set of contacts
SPH-002T-P0.5S or connector with 0.5 m wires.
Recommended counterpart connector for XP19 header (optoisolated Reset/IRQ)
of the module.
ACS00038
ACS00038-01
ACS00038-02
Connector set for connection of a power supply unit to the module.
Includes AMP 4-171822-4 socket and a set of contacts 170262-1 (ACS00038) or
a connector with 1.0 m wires (ACS00038-01, -02).
Recommended counterpart connector for XP22 header (additional power
connector)
ACS00040-01
Leotronics IDC2-10 2 mm socket.
Recommended counterpart for XP5 (CAN), XP6 (COM3), XP7 (COM4), XP9
(LAN), XP10 (COM1), XP14 (GPIO), XP16 (COM2), XP17 (COM5,6) headers of
the module
ACS00040-05
Leotronics IDC2-44 2 mm socket. Recommended counterpart for
XP12 (LPT, USB), XP13 (IDE) headers of the module
ACS00048-04,
ACS00049,
ACS00049-02
Leotronics socket, 44 positions, 2 mm pitch and contacts set (ACS00049) or
contacts with 1 m wires (ACS00049-02). Recommended counterpart for XP12
(LPT, USB), XP13 (IDE) headers of the module
ACS00042
Null modem cable

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Name
Description
ACS00043-01
PS/2 cable. Recommended counterpart for XP23 header of the module
ACS00051
Cable for connection of two standard USB devices to XP12 (LPT/USB) connector
The table 1.3 below shows the list of additional accessories for СPС307 module, which are not
included in the standard delivery checklist and can be ordered separately.
Table 1.4: Configurations
Ordering
number
IDE
LAN
CAN
COM
GPIO
I2C
Format
Coating
СPС307-02
ATA Flash
Disk
(soldered, 1
GB –for
versions of up
to 4.х; 2 GB –
for versions up
to 4.х)
LAN
CAN 1-2
COM 1-6
GPIO
I2C
PС104-plus
(ISA, PCI)
СPС307-03
ATA Flash
Disk
(soldered, 1
GB –for
versions up to
4.х; 2 GB –for
versions up to
4.х)
LAN
COM 1-4
GPIO
I2C
PС104-plus
(ISA, PCI)
СPС307-04
microSD 1-2
LAN
CAN 1-2
COM 1-6
GPIO
I2C
PС104-plus
(ISA, PCI)
СPС307-05
ATA Flash
Disk
(soldered, 1
GB –for
versions up to
4.х; 2 GB –for
versions up to
4.х)
LAN
CAN 1-2
COM 1-6
GPIO
I2C
PС104-plus
(ISA, PCI)
Conformal
coating,
from - 50 to
+ 90°C
fr

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2 Technical Specifications
2.1 General
Form-factor:
PC/104-Plus
CPU: Integrated in DM&P Vortex86DX SoC
600 MHz
32-bit x86 compatible core
16-bit memory bus
Math coprocessor
32 KB L1, 256 KB L2 cache
6-stage pipeline
System memory:
256 MB soldered DDR2 SDRAM, for module’s versions up to 4.x;
DDR333, for module’s versions 4.x
Port for HDD and CD/DVD-ROM:
2x connectors for microSD cards (only for CPC307-04, ATA Flash Disk is not supported);
For the rest of the versions, it is possible to connect one additional IDE-device;
Support of Ultra-DMA2 mode.
Flash-memory:
For module’s versions of up to 4.x: with the volume of 1 GB, using the NAND
technology (via ATA Flash disk controller) for the versions -02, -03, -05. The
volume available for the user: 870 MB;
For module’s versions 4.х: with a volume of 2 GB, using the NAND technology
(via ATA Flash disk controller) for the versions -02, -03, -05. The volume
available for the user: 1870 MB;
it is possible to connect one additional IDE-device;
Support of Ultra-DMA2 mode.
SD controller: connection of up to two microSD memory cards with the volume up to 4 GB (for the
version -04).
PS/2 keyboard and mouse port.
Optoisolated reset/interruption, isolation voltage no less than 500 V.
USB port:
Support of up to four USB 1.1, USB 2.0 devices;
Support of booting from USB devices;
Ethernet 10/100 Mb, isolation voltage of no less than 500 V;
Serial ports:
СOМ1, COM2: RS-232/422/485, up to 115,2 Kbaud, full;

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COM3, COM4: RS-232, up to 115,2 Kbaud, full;
COM5, COM6: RS-422/485, up to 3,6 Mbaud, channel-by-channel isolation, isolation
voltage of no less than 500 V;
Console I/O via serial port (COM1 –COM4);
Two CAN 2.0b interfaces, SJA1000T controller, data transfer rate up to 1 Mb/sec,
channel-by-channel isolation, isolation voltage of no less than 500 V;
Universal parallel port (LPT) with support of SPP, EPP, ECP modes;
PCI-104 (PCI) bus;
PC-104 (ISA) bus;
GPIO port, 8x digital I/O lines;
Two I2C ports (aligned with the GPIO port);
Three watchdog timers:
Two with capability of software control, integrated into the Vortex86DX SoC;
Hardware timer with a fixed actuation range of 1.6 sec.;
FLASH BIOS:
-For module’s versions of up to 4.x:
512 KB, parallel Flash (ISA);
256 KB (backup copy, SPI Flash);
Modifiable within the system;
Function of automatic reboot from a backup copy;
-For module’s versions 4.x:
256 KB (SPI Flash), with no BIOS backup copy;
Availability of hardware reset of BIOS settings;
Real-Time Clock;
CMOS RAM 256 byte and non-volatile memory FRAM (SPI), volume 256 Kb;
Automatic storing and restoration of CMOS memory settings when the module is operating
without a DC plug-in battery;
Reading/Writing user data via BIOS functions;
Software compatibility with MS DOS 6.22, FreeDOS, Windows CE 5.0, Linux 2.6,
QNX 6.4.
For all other versions one IDE device can be connected

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2.2 Power Requirements
The power supply of the module should comply with the requirements given in Table. 2.1.
The module is powered via the PC/104 and PC/104-plus (if installed) connectors. Additionally, power
can be supplied via XP22 (4-contact AMP 4-171826-4) power connector by an external DC power
source.
For versions 3.x and below the starting current of the module is 2.1 A for the CPC307-02 version. The
power supply must provide starting current. It is allowed to use a power supply with a current limiting
mode of at least 1.2 A. when choosing a power supply, the starting current and the current consumption
of the expansion modules should be considered.
In modules versions 4.0 and above the mechanism of "soft" start is implemented. The module’s on-
delay after supplying the voltage is about 200 ms (no more). Additional measures should be taken to
ensure a certain level on the I/O port lines within 200 ms after power is supplied.
The typical current consumption value is 0.6 A.
Important:
To protect external devices from conducted interference at the voltage "+5
V" in the case of using a single voltage output of the power supply, it is
recommended to take additional measures.
Table 2.1: Power Supply Requirements
Connectors
Power Voltage
Voltage Limits
Load current
Starting current
PC/104 and PCI-104-
plus
+5 V
From +4.75V to +5.25V
1 A
2.1 A (0.5 ms) –for module’s
versions up to 4.х
2.5 A (0,5 ms) –for module’s
version 4.х
Additional power
supply connector
+5 V
From +4.8V to +5.3V
1 A
2.1 A (0.5 ms) –for module’s
versions up to 4.х
2.5 A (0,5 ms) –for module’s
version 4.х
2.3 Environmental
(Industrial temperature range) Operating temperature range: –40C to +85C (-50C to +90C for
CPC307-05)
(Industrial temperature range) Storage temperature: –55C to +90C
Relative humidity: up to 80% at 25°С, noncondensing
The modules’ storage conditions 1 as defined in the GOST standard 15150-69.
2.4 Mechanical
Vibration resistance for the frequencies (5 ... 2000 Hz) –acceleration 10g;
Single shock resistance, peak acceleration –150 g;
Multiple shock resistance, peak acceleration –50 g.
If the module is operated in harsh environment, it is recommended to additionally fix counterpart
connectors and cables.
Note:
Protective coating of CPC307 versions makes them resistant to
damp heat cyclic exposure at temperatures up to +552C and
relative humidity of up to 933%.

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2.5 Dimensions and Weight
Weight of the module should not exceed the value specified in the table below:
Table 2.2: Weight of the module
Version
Net Weight in kg, no more than
Gross Weight in kg, no more than
CPC307-02
0.125
0.265
CPC307-03
0.120
0.260
CPC307-04
0.125
0.265
CPC307-05
0.135
0.275
Dimensions of module’s versions and location of components is shown in Figure 2.1.

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CPC307
Fig. 2.1 a) Dimensions of versions and location of СPС307 components (this figure is relevant for the versions 3.х)

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CPC307
Fig. 2.2 b) Dimensions and location of СPС307 components (this figure is relevant for versions 4.х)
2.6 MTBF
MTBF for CPC307 is 200000 hours.
The value is calculated according to: Telcordia Issue 1 model, Method I Case 3, for continuous operation at a
surface location, at normal environmental conditions and at ambient temperature 30  С.