Fastwel CPC307 Series User manual

CPC307
PC/104-Plus
Vortex86DX Based
CPU Module
User Manual
Rev. 006
September 2022

Product Title: CPC307
Document name: CPC307 User Manual
Manual version: 006
Ref. doc. v.: 3.2 R (467444 038)
Copyright © 2022 Fastwel Co. Ltd. All rights reserved.
Revision Record
Rev. Index
Brief Description of Changes
Board Index
Date of Issue
001
Initial preliminary version
CPC307 v 2.0
July 2010
002
BIOS Setup description added.
CPC307 v 2.0
August 2010
003
Multiple changes caused by changes in the PCB design
CPC307 v 3.1
December 2012
005
Compliance assessment
CPC307 v 3.1
December 2015
006
2nd compliance assessment
CPC307 v 3.1
September 2022
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya st.,
Moscow 117437,
Russian Federation
6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011, USA
Tel.:
[phone] Tel:
[phone]
Fax:
[phone]
E-mail:
[email protected] E-mail:
[email protected]
Web:
http://www.fastwel.com/

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 3 © 2 0 2 2 F a s t w e l v . 0 0 6
Table of Contents
Table of Contents.....................................................................................................................................................3
List of Tables............................................................................................................................................................4
List of Figures ..........................................................................................................................................................5
Notation Conventions............................................................................................................................................... 7
General Safety Precautions..................................................................................................................................... 8
Unpacking, Inspection and Handling........................................................................................................................9
Three Year Warranty ............................................................................................................................................. 10
1Introduction..........................................................................................................................................................11
1.1 Purpose of the device................................................................................................................................. 11
1.2 CPC307 Versions, delivery checklist, ordering information ........................................................................ 12
1.2.1 Versions and ordering information…………………………………………………………………………..12
1.2.2 Delivery checklist………………………………………………………………………………………………13
2Technical Specifications.....................................................................................................................................16
2.1 General information on module functionality............................................................................................... 16
2.2 Power Requirements.................................................................................................................................. 17
2.3 Operating conditions................................................................................................................................... 18
2.4 Mechanical.................................................................................................................................................. 18
2.5 Dimensions and Weight.............................................................................................................................. 19
2.6 MTBF………………………………………………………………………………………………………………….21
3Intended use of the module ................................................................................................................................22
4Device and operation...........................................................................................................................................23
4.1 Structure and Layout of main elements...................................................................................................... 23
4.2 Address Space Allocation…………………………………………………………………………………………...31
4.2.1 Address space allocation……………………………………………………………………………………..31
4.2.2 I/O address space allocation…………………………………………………………………………………31
4.2.3 Integrated address decoder…………………………………………………………………………………..33
4.2.4 Distribution of interrupt lines………………………………………………………………………………….36
4.2.5 Distribution of direct memory access channels…………………………………………………………….37
4.3 Description of the main functional elements of the module……………………………………………………...37
4.3.1 Vortex86DX SoC………………………………………………………………………………………………37
4.3.2 DDR2 Memory…………………………………………………………………………………………………38
4.3.3 IDE interface……………………………………………………………………………………………………38
4.3.4 MicroSD………………………………………………………………………………………………………...41
4.3.5 ATA Flash disk controller……………………………………………………………………………………..41
4.3.6 PS/2-keyboard and mouse…………………………………………………………………………………...42
4.3.7 Opto-isolated reset/interrupt………………………………………………………………………………….42
4.3.8 USB interface…………………………………………………………………………………………………..43
4.3.9 Ethernet-port…………………………………………………………………………………………………...44
4.3.10 Serial ports……………………………………………………………………………………………………45
4.3.11 Printer Parallel Port (LPT)…………………………………………………………………………………..56
4.3.12 PC/104-plus connector………………………………………………………………………………………57
4.3.13 PC/104 connector……………………………………………………………………………………………60
4.3.14 CAN-interfaces……………………………………………………………………………………………….62
4.3.15 WDT watchdog timers…………………………………………………………………………………….…64
4.3.16 RTC, CMOS, FRAM, hardware reset and BIOS backup………………………………………………...67
4.3.17 Connecting power supply to the module…………………………………………………………………..76
4.3.18 Module power supply voltage supervisor………………………………………………………………….77
4.3.19 GPIO ports……………………………………………………………………………………………………77
4.3.20 Configuration jumpers……………………………………………………………………………………….80
4.3.21 LEDs…………………………………………………………………………………………………………..84
4.3.22 Specific features of console redirect module operation………………………………………………….85
5Basic Input/Output System (BIOS).....................................................................................................................86
5.1 Main……………………………………………………………………………………………………………...........87
5.2 Advanced ……………………………………………………………………………………………………………..88
5.3 PCIPNP………………………………………………………………………………………………………………….97
5.4 Boot………………………………………………………………………………………………………………………99
5.5 Security………………………………………………………………………………………………………………...102

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 4 © 2 0 2 2 F a s t w e l v . 0 0 6
5.6 Chipset…………………………………………………………………………………………………………………103
5.7 Exit……………………………………………………………………………………………………………………...112
6Guidelines on operation and use .....................................................................................................................114
7Existing limitations and special features of the CPC307 module (ERRATA)................................................115
ANNEX A: LIST OF CHANGES IN THE MODULE VERSION 4.х.………….………………………………………116
ANNEX B: DISCLAIMER……………………..………………………………………………………………………..…117
List of Tables
Table 1.1: Module configuration depending on the module versions................................................................12
Table 1.2: Delivery checklist of the module............................................. Ошибка! Закладка не определена.
Table 1.3: Additional accessories for СРС307 ........................................ Ошибка! Закладка не определена.
Table 1.4: Differences among the supplied configurations………………………………………………………….15
Table 2.1: Power Supply Requirements……………………………………………………………………………….18
Table 2.2: Ranges of ambient air temperature changes…………………………………………………………….18
Table 2.3: Module weight……………………………………………………………………………………………….19
Table 4.1: Address space allocation of the first megabyte of memory…………………………………………….31
Table 4.2: I/O address space allocation……………………………………………………………………………….31
Table 4.3: Structure of GPCS0 and GPCS1 registers……………………………………………………………….33
Table 4.4: Preset address value for CAN1 and CAN2 interfaces…………………………………………………..35
Table 4.5: Preset address values for COM5 and COM6 ports……………………………………………………...35
Table 4.6: Distribution of interrupt lines in the CPC307 module…………………………………………………....36
Table 4.7: Distribution of direct memory access channels…………………………………………………………..37
Table 4.8: Possible configurations for connecting IDE devices to the module……………………………………39
Table 4.9: Pin assignment of the XP13 for connection of IDE devices………………………………………….…39
Table 4.10: Recommended configurations for IDE devices…………………………………………………………..40
Table 4.11: Pin assignment of XS3 and XS4 for connection of microSD cards ...………………………………....41
Table 4.12: Pin assignment of XP23 connector for PS/2 keyboard and mouse connection ……………………..42
Table 4.13: Pin assignment of the XP12 for connection of USB devices ……..……………………………………44
Table 4.14: Pin assignment of the XP9 connector of Ethernet-port …………………………..………………….…45
Table 4.15 Pin assignment of the XP10 connector for COM1 port………………………………………………….49
Table 4.16: Pin assignment of the XP16 connector for COM2 port ……………………………………………...…49
Table 4.17: Pin assignment of the XP6 connector for COM3 port …………………………………………………..51
Table 4.18: Pin assignment of the XP7 connector for COM4 port ...………………………………..……………....51
Table 4.19: Resources assigned for COM5 and COM6 controllers …………………………………….…………..52
Table 4.20: Pin assignment of the XP17 connector for COM5 and COM6 ports ……..…………………………...55
Table 4.21: Pin assignment of the XP12 for connection of the LPT1 port..…………………..………………….…56
Table 4.22: Pin assignment of the XS1 connector…………………………………………………………………….57
Table 4.23: Pin assignment of the XS2 connector………………………………. ...………………………………....60
Table 4.24: Assigned resources of the CAN1 and CAN2 controllers …………………………………...…………..62
Table 4.25: Pin assignment of the XP5 connector for CAN1 and CAN2 ports ……..……...………………………63
Table 4.26: Description of the WDT0 watchdog timer control registers..……………………..………………….…65
Table 4.27 Description of the WDT1 watchdog timer control registers …………………………………………….66
Table 4.28: Pin assignment of the XP22 additional power supply connector …………………………………...…76
Table 4.29: Description of GPIO ports…………………………….. …………………………………………………..78
Table 4.30: Description of GPIO ports…………………………….. ...………………………………..……………....78
Table 4.31: Pin assignment of the XP14 connector for GPIO0 port …………………………………….…………..79
Table 4.32: Description of setting the jumpers to the XP4 connector…………... ……..…………………………...80
Table 4.33: Description of setting the jumpers to the XP8 connector……..…………………..………………….…80
Table 4.34: Description of setting the jumpers to the XP15 connector (for module versions lower than 4.х ..….80
Table 4.35: Description of setting the jumpers to the XP15 connector for module versions 4.х .………………..80
Table 4.36: Description of setting the jumpers to the XP18 connector for module versions lower than 4.х …....81
Table 4.37: Description of setting the jumpers to the XP18 connector for module versions 4.х….….…………..81
Table 4.38: Description of setting the jumpers to the XP20 connector for module versions lower than 4.х .…...81
Table 4.39: Description of setting the jumpers to the XP20 connector for module versions 4.х …..………….…82
Table 4.40: Description of setting the jumpers to the XP24 connector………………………………………... ..….82
Table 4.41: Description of setting the jumpers to the XP25 connector …...…………………..………………….…82
Table 4.42: Description of setting the jumpers to the XP21 connector (for module versions lower than 4.х) ….83
Table 4.43: Description of setting the jumpers to the XP26 connector…………………………... .………………..83
Table 4.44: Description of setting the jumpers to the XP27 connector……………………………………….. …....83
Table 4.45: Assignment of module LEDs …………………………………………………………...….….…………..84
Table 4.46: Pin assignment of the XP3 connector……………………………………………………………… .…...84
Table 5.1: Description of the “Main” menu ……………………………………………………………..………….…87
Table 5.2: Description of "Advanced" menu …………………………………….……………………………... ..….88
Table 5.3: Description of the “CPU Configuration” menu …………………………..……….…...….….…………..89

Introduction CPC307
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Table 5.4: Description of the “IDE Configuration” menu ...…………………………………………………… .…...90
Table 5.5: Description of the “Primary IDE Master” menu...…………………………………………..………….…91
Table 5.6: Description of the “Remote Access Configuration” menu ………………………………………... ..….93
Table 5.7: Description of the “USB Configuration” menu.……………………………………………..………….…95
Table 5.8: Description of the “USB Mass Storage Device Configuration” menu.…………………………... ..….96
Table 5.9: Description of the “PCIPnP” menu …………………………………...…..……….…...….….…………..97
Table 5.10: Description of the “Boot” menu ……………......…………………………………………………… .…...99
Table 5.11: Description of the “Boot Settings Configuration” menu.…………………………………..…………...100
Table 5.12: Description of the “Security” menu……………………….. ………………………………………... ….102
Table 5.13: Description of the “Chipset” menu …………………………………...…..……….…...….….…………103
Table 5.14: Description of the “South Bridge Configuration” menu ……………......………………………… .….104
Table 5.15: Description of the “ISA Configuration” menu…………..…………………………………..…………...106
Table 5.16: Description of the “Serial/Parallel Port Configuration” menu ..…………………………………... ….107
Table 5.17: Description of the “WatchDog Configuration” menu .……………………………………..…………...108
Table 5.18: Description of the “GPIO and I2C Configuration” menu ..………………………………………... ….109
Table 5.19: Description of the “CAN and COM5,6 Configuration” menu……………………………..…………...111
Table 5.20: Description of the “Exit” menu…………………………… ..………………………………………... ….112
List of Figures
Figure 2.1: a) Overall dimensions of CPC307 components and their locations (this figure is valid for ver.3x)...20
Figure 2.2: b) Overall dimensions of CPC307 components and their locations (this figure is valid for ver.4.х)...21
Figure 3.1: Connection of external devices to the CPC307 ………………..…………………………….…………..22
Figure 4.1: CPC307 Block Diagram …………………………………...…………... ……..…………………………...23
Figure 4.2: a) Location of connectors and main components on the TOP and BOTTOM for the CPC307-02,
CPC307-05 versions (valid for CPC307 v.3.x)…………………………………...……..…………………..………………….…25
Figure 4.3: b) Location of connectors and main components on the TOP and BOTTOM sides of the CPC307-
02, CPC307-05 versions (relevant to CPC307 v.4.x)………………………………………………………………………....….26
Figure 4.4: a) Location of connectors and main components on the TOP and BOTTOM for the CPC307-03
version (valid for CPC307 v.3.x)………………………………………………………………………………… .………………..27
Figure 4.5: b) Location of connectors and main components on the TOP and BOTTOM sides for the CPC307-
03 version (valid for CPC307 v.4.x)…………………………………………………………………………………………..…....28
Figure 4.6: a) Location of connectors and main components on the TOP and BOTTOM for the CPC307-04
version (valid for CPC307 v.3.x)…………………………………………………...……..…………………..………………….…29
Figure 4.7: b) Location of connectors and main components on the TOP and BOTTOM sides for the CPC307-
04 version (relevant for CPC307 v.4.x)………………………………………………………………………………………....….30
Figure 4.8: Block diagram of Vortex86DX SoC .…………………………………………………… .………………..38
Figure 4.9: Numbering of the XP13 connector pins ……………………………………………………………..…....40
Figure 4.10: Numbering pins of the microSD memory card………………………………………… .………………..41
Figure 4.11: Numbering pins of the XP23 connector ……………………………………………………………..…....42
Figure 4.12: Reset source selection and switching diagram of the opto-isolated input.………… .………………..43
Figure 4.13: Numbering pins of the XP19 connector ……………………………………………………………..…....43
Figure 4.14: Numbering pins of the XP12 connector…...…………………………………………… .………………..44
Figure 4.15 Numbering pins of the XP9 connector ……………………………………………………………..…......45
Figure 4.16: Pin assignment of the XP18 connector (for module versions 3.x and lower)……… .………………..46
Figure 4.17: a) The RS-422/485 transmitter with bias elements and termination resistors (for ver.3.x & lower)...47
Figure 4.17: b) RS-422/485 transmitter with bias elements and with terminating resistors (for 4x versions)….....48
Figure 4.17: c) Pin assignment of the XP18 connector (for module versions 4.х and lower)…… .………………..48
Figure 4.18 Numbering pins of the XP10 and XP16 connectors ………….…………………………………..…......49
Figure 4.19: Connecting several devices via RS-422 Interface …………………………………… .………………..50
Figure 4.20: Connecting several devices via RS-485 interface …………………………………… .………………..50
Figure 4.21: Numbering pins of the XP6 and XP7 connectors………………………………………………………...52
Figure 4.22: a) Pin assignment of the XP15 and XP20 connectors (for module versions older than 4.х)….….....53
Figure 4.22: b) Pin assignment of the XP15 and XP20 connectors (for module version 4.х)…….………………..53
Figure 4.23 a) Transmitter with protective bias elements and terminating resistors (for ver. lower than 4.x).......54
Figure 4.23: b) Transmitter with protective bias elements and terminating resistors (for module version 4.x).…..55
Figure 4.24: Numbering pins of the XP17 connector …………………………………………………………….….....56
Figure 4.25: Numbering pins of the XP12 connector …………………………………………..…… .………………..57
Figure 4.26 PCI-104 XS1 connector: a) module top view; b) module bottom view with organizer mounted on the
connector……………………………………………………………………………….….…………………………………..…......60
Figure 4.27: Numbering the XS2 pins: a) top view of the module; b) bottom view of the module with the organizer
mounted on the connector …………………………………………………………………….………………… .………………..62
Figure 4.28: a) Pin assignment of the XP4 and XP8 connector (for module versions lower than 4.x)…..………..63
Figure 4.28: b) Pin assignment of the XP4 and XP8 connectors for module versions 4.х ………………………...63
Figure 4.29: Numbering pins of the XP5 connector ……….……………………………………………………….......64
Figure 4.30: Connection of the fail-safe biasing on CAN line ……………………………….....…….………………..64
Figure 4.31 Numbering of XP22 connector pins………………………………………………………………….........76

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 6 © 2 0 2 2 F a s t w e l v . 0 0 6
Figure 4.32: Diagram of the module's power supply voltage supervisor………………………………………….…..77
Figure 4.33: Numbering pins of the XP14 connector ….………………………….………………… .………………..79
Figure 4.34: Connection of LEDs to the XP3…………………………………………………………………..………..84
Figure 5.1: Screen during the module boot (POST)..……………………………………… ………………………...86
Figure 5.2: Screen of the “Main” menu ……………...…….……………………………………………………….......87
Figure 5.3: Screen of the “Advanced” menu…………………...…………………………….....…….………………..88
Figure 5.4: Screen of the “CPU Configuration” menu …………….…………………………………………….........89
Figure 5.5: Screen of the “IDE Configuration” menu ………………………………….………………………….…..90
Figure 5.6: Screen of the “Primary IDE Master” menu ...……..…………………………… ………………………...91
Figure 5.7: Screen of the “Remote Access Configuration” menu………….…………………………………….......93
Figure 5.8: Screen of the “USB Configuration” menu …...…...…………………………….....…….………………..95
Figure 5.9: Screen of the “USB Mass Storage Device Configuration” menu………...……………………….........96
Figure 5.10: Screen of the “PCIPnP” menu …………..………………………………….………………………….…..97
Figure 5.11: Screen of the “Boot” menu ……………………………………………………… ………………………...99
Figure 5.12: Screen of the “Boot Settings Configuration” menu ………………………………………………….....100
Figure 5.13: Screen of the “Security” menu …………………...…………………………….....…….………………..102
Figure 5.14: Screen of the “Chipset” menu ………………………….…………………………………………….......103
Figure 5.15: Screen of the “South Bridge” menu …….………………………………….………………………….…104
Figure 5.16: Screen of the “ISA Configuration” menu ………..…………………………….....…….………………..105
Figure 5.17: Screen of the “Serial/Parallel Port Configuration” menu….……………………………………….......106
Figure 5.18: Screen of the “WatchDog Configuration” menu…….…………………….………………………….…108
Figure 5.19: Screen of the “GPIO and I2C Configuration” menu .......….……………………………………….......109
Figure 5.20: Screen of the “CAN and COM5,6 Configuration” menu ……...………….………………………….…111
Figure 5.21: Screen of the “Exit” menu……………………………….. ……...………….………………………….…112
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and
is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies, omissions or their
consequences, as well as liability arising from the use or application of any product or example described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software
described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of
this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert
it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. Ethernet is a registered trademark of Xerox Corporation. IEEE is a
registered trademark of the Institute of Electrical and Electronics Engineers Inc. Intel is a trademark of Intel Corporation. Microsoft is a trademark of the Microsoft
corporation. In addition, this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their
respective owners. Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.
Ownership rights
This document contains information that is the property of Fastwel Group. It may not be copied or
transmitted by any known means, nor may it be stored in information storage and retrieval systems
without the prior written consent of Fastwel Group or one of its authorized agents. The information
contained in this document, to the best of our knowledge, is free from any errors, however, Fastwel
Group accepts no responsibility for any inaccuracies and their consequences, as well as liability
arising from the use or application of any diagram, product or example given in this document.
Fastwel Group reserves the right to change and improve both this document and the product
presented inside of it at its discretion without any further notice.
Safety requirements
This Fastwel Group’s product is developed and tested for the purpose of ensuring compliance to
the electric safety requirements. Its design provides long-term trouble-free operation. The service
life of the product can be significantly reduced due to the improper handling during unpacking and
installation. Therefore, in the interests of your safety and in order to ensure proper operation of the
product, you should follow the recommendations below.

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 7 © 2 0 2 2 F a s t w e l v . 0 0 6
Notation Conventions
Warning, ESD Sensitive Device!
This symbol draws your attention to the information related to electro static
sensitivity of your product and its components. To keep product safety and
operability it is necessary to handle it with care and follow the ESD safety
directions.
Warning!
This sign marks warnings about hot surfaces. The surface of the heatsink
and some components can get very hot during operation. Take due care
when handling, avoid touching hot surfaces!
Caution: Electric Shock!
This symbol warns about danger of electrical shock (> 60 V) when touching
products or parts of them. Failure to observe the indicated precautions and
directions may expose your life to danger and may lead to damage to your
product.
Warning!
Information marked by this symbol is essential for human and equipment
safety.
Read this information attentively, be watchful.
Note...
This symbol and title marks important information to be read attentively for
your own benefit.

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 8 © 2 0 2 2 F a s t w e l v . 0 0 6
General Safety Precautions
This product was developed for fault-free operation. Its design provides conformance to all related
safety requirements. However, the life of this product can be seriously shortened by improper
handling and incorrect operation. That is why it is necessary to follow general safety and
operational instructions below.
Warning!
All operations on this device must be carried out by sufficiently
skilled personnel only.
Warning!
When handling this product, special care must be taken not to hit
the heatsink (if installed) against another rigid object. Also, be
careful not to drop the product, since this may cause damage
to the heatsink, CPU or other sensitive components as well.
Please, keep in mind that any physical damage to this product
is not covered under warranty.
Note:
This product is guaranteed to operate within the published
temperature ranges and relevant conditions. However, prolonged
operation near the maximum temperature is not recommended by
Fastwel or by electronic chip manufacturers due to thermal stress
related failure mechanisms. These mechanisms are common to all
silicon devices, they can reduce the MTBF of the product by
increasing the failure probability. Prolonged operation at the lower
limits of the temperature ranges has no limitations.
Caution, Electric Shock!
Before installing this product into a system and before installing
other devices on it, always ensure that your mains power is switched
off.
Always disconnect external power supply cables during all handling
and maintenance operations with this module to avoid serious
danger of electrical shock.

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 9 © 2 0 2 2 F a s t w e l v . 0 0 6
Unpacking, Inspection and Handling
Please read the manual carefully before unpacking the module or mounting the device into your
system. Keep in mind the following:
ESD Sensitive Device!
Electronic modules and their components are sensitive to static
electricity. Even a non-perceptible by human being static discharge
can be sufficient to destroy or degrade a component's operation!
Therefore, all handling operations and inspections of this product
must be performed with due care, in order to keep product integrity
and operability:
Preferably, unpack or pack this product only at EOS/ESD safe workplaces. Otherwise, it is
important to be electrically discharged before touching the product. This can be done by
touching a metal part of your system case with your hand or tool. It is particularly important
to observe anti-static precautions when setting jumpers or replacing components.
If the product contains batteries for RTC or memory back-up, ensure that the module is not
placed on conductive surfaces, including anti-static mats or sponges. This can cause short-
circuit and result in damage to the battery and other components.
Store this product in its protective packaging while it is not used for operational purposes.
Unpacking
The product is carefully packed in an antistatic bag and in a carton box to protect it against
possible damage and harmful influence during shipping. Unpack the product indoors only at a
temperature not less than +15°C and relative humidity not more than 70%. Please note, that if the
product was exposed to the temperatures below 0°С for a long time, it is necessary to keep it at
normal conditions for at least 24 hours before unpacking. Do not keep the product close to a heat
source.
Following ESD precautions, carefully take the product out of the shipping carton box. Proper
handling of the product is critical to ensure correct operation and long-term reliability. When
unpacking the product, and whenever handling it thereafter, be sure to hold the module preferably
by the front panel, card edges or ejector handles. Avoid touching the components and connectors.
Retain all original packaging at least until the warranty period is over. You may need it for
shipments or for storage of the product.
Initial Inspection
Although the product is carefully packaged, it is still possible that shipping damages may occur.
Careful inspection of the shipping carton can reveal evidence of damage or rough handling. Should
you notice that the package is damaged, please notify the shipping service and the manufacturer
as soon as possible. Retain the damaged packing material for inspection.
After unpacking the product, you should inspect it for visible damage that could have occurred
during shipping or unpacking. If damage is observed (usually in the form of bent component leads
or loose socketed components), contact Fastwel's official distributor from which you have
purchased the product for additional instructions. Depending on the severity of the damage, the
product may even need to be returned to the factory for repair. DO NOT apply power to the product
if it has visible damage. Doing so may cause further, possibly irreparable damage, as well as result
in a fire or electric shock hazard.
If the product contains socketed components, they should be inspected to make sure they are
seated fully in their sockets.

Introduction CPC307
C P C 3 0 7 U s e r M a n u a l 10 © 2 0 2 2 F a s t w e l v . 0 0 6
Handling
In performing all necessary installation and application operations, please follow only the
instructions supplied by the present manual.
In order to keep Fastwel’s warranty, you must not change or modify this product in any way, other
than specifically approved by Fastwel or described in this manual.
Technical characteristics of the systems in which this product is installed, such as operating
temperature ranges and power supply parameters, should conform to the requirements stated by
this document.
Retain all the original packaging, you will need it to pack the product for shipping in warranty cases
or for safe storage. Please, pack the product for transportation in the way it was packed by the
supplier.
When handling the product, please, remember that the module, its components and connectors
require delicate care. Always keep in mind the ESD sensitivity of the product.
Three Year Warranty
Fastwel Co. Ltd. (Fastwel), warrants that its standard hardware products will be free from defects
in materials and workmanship under normal use and service for the currently established warranty
period. Fastwel’s only responsibility under this warranty is, at its option, to replace or repair any
defective component part of such products free of charge.
Fastwel neither assumes nor authorizes any other liability in connection with the sale, installation
or use of its products. Fastwel shall have no liability for direct or consequential damages of any
kind arising out of sale, delay in delivery, installation, or use of its products.
If a product should fail through Fastwel's fault during the warranty period, it will be repaired free of
charge. For out of warranty repairs, the customer will be invoiced for repair charges at current
standard labor and materials rates.
Warranty period for Fastwel products is 36 months since the date of purchase.
For custom-made products, the warranty period is 60 months from the date of sale (unless
otherwise specified in the supply agreement).
The warranty set forth above does not extend to and shall not apply to:
1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.
2. Products, which have been subject to power supply reversal, misuse, neglect,
accident, or improper installation.
Returning a product for repair
1. Apply to Fastwel company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

Introduction CPC307
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1 Introduction
1.1 Purpose of the device
This User Manual (hereinafter referred to as the User Manual or UM) presents general information
on CPC307 CPU module (hereinafter referred to as the module), the details of its proper and safe
installation, configuration and operation. The issues of PC/104 modules and external devices
connection are also considered.
Based on x86-compatible 32-bit Vortex86DX System-on-Chip (SoC) operating at 600 MHz. The
module is made in PC/104-plus format and designed for embedded applications that require CAN
interfaces, high-speed RS-422/485 and RS-232 ports, low power consumption in the operating
temperature range from - 40 to +85 ºС.
The module functionality can be expanded by connecting additional modules - PC/104 and
PC/104-plus expansion boards depending on the module version.
The User Manual provides instructions on correct and safe installation, power-up and configuration
of the module, connection and interaction with expansion modules or external devices.
The User Manual also describes how to start, debug and use the programs from the basic and
service software (hereinafter referred to as the Software), as well as BIOS backup features for
module versions 3.x and older versions.

Introduction CPC307
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1.2 CPC307 Versions, delivery checklist, ordering information
1.2.1 Versions and ordering information
The versions and designations of the module are specified in Table 1.1.
Table 1.1: Module configuration depending on the module versions
Name
Designation
Ordering name
Description
CPC307 CPU
Module
СРС307
CPC307-02
Vortex86DX (600 MHz), 256 MB RAM, flash drive - 1 GB –
for module versions up to 4.х; 2 GB –for module versions
4.х, IDE, 2xRS-232/485/422, 2xRS232, 2xRS-422/485,
2хCAN, LAN 10/100, LPT, 4xUSB2.0, 8xGPIO, 2xI2C,
PC/104-plus (ISA, PCI) format.
CPC307-03
Vortex86DX (600 MHz), 256 MB RAM, flash drive - 1 GB
–for module versions up to 4.х; 2 GB –for module
versions 4.х, IDE, 2xRS-232/485/422, 2xRS232, LAN
10/100, LPT, 4xUSB2.0, 8xGPIO, 2xI2C, PC/104-plus
(ISA, PCI) format.
CPC307-04
Vortex86DX (600 MHz), 256 MB RAM, 2x microSD, IDE,
2xRS-232/485/422, 2xRS-232, 2xRS-422/485, 2xCAN,
LAN 10/100, LPT, 4xUSB2.0, 8xGPIO, 2xI2C, PC/104-plus
(ISA, PCI) format.
CPC307-05
Vortex86DX (600 MHz), 256 MB RAM, flash drive 1 GB –
for versions up to 4.х; 2 GB –for module versions 4.х,
IDE, 2xRS-232/485/422, 2xRS232, 2xRS-422/485,
2хCAN, LAN 10/100, LPT, 4xUSB2.0, 8xGPIO, 2xI2C,
PC/104-plus (ISA, PCI) format, COATED, from -50 up to
+90 ºС
Options available for CPC307:
\COATED –Protective coating option (for CPC307-02, -03, -04 versions);
\LNX –Preinstalled Linux 2.6 (for CPC307-02, -03, -05);
Pre-installation on special order (for modules CPC307-02,-03,-05):
\WCE5 –Windows CE 5.0
\QNX –QNX 6.4

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1.2.2 Delivery checklist
Table 1.2 contains delivery checklist for all the module versions.
Table 1.2. Delivery checklist of the module
Name
Designation
Description
Number
IMES.467444.038
CPC307
CPC307 CPU Module
1 pcs
IMES.467941.010
Set of mounting parts consisting of:
1 pcs
FAPI.685611.082
ACS00023
Adapter cable IDC2-10 2 mm –
DB9M for connecting COM-port
1 pcs
–
–
M3 nut DIN934
4 pcs
–
–
PCSN-15 rack for printed circuit
boards, brass
4 pcs
–
–
Toothed lock washer Ø3 DIN6798A
4 pcs
IMES.467941.010
Packaging
РС104 box 155х140х45 mm
1 pcs
Table 1.3 shows a list of optional accessories for the CPC307 module, which are not included in the delivery
checklist and can be purchased additionally.
Table 1.3. Additional accessories for СРС307
Designation
Ordering name
Description
CDM02
CDM02
Adapter for connecting a 3.5” HDD
FC44
ACS00010
Cable with 44 pins with 2 mm pitch to connect a 2.5" HDD
ACS00023
ACS00023
Cable IDC2-10 - D-SUB 9M (plug, two-row, in the enclosure) to
connect to the RS-232 ports

Introduction CPC307
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Designation
Ordering name
Description
ACS00031-03,
ACS0054
ACS00031-03,
ACS0054
Includes JST PHR-2 connector and SPH-002T-P0.5S pin
set or 0.5 m crimped wire connector.
Recommended mating part for the XP19 connector (opto-
isolated reset/interrupt)
ACS00038,
ACS00038-01,
ACS00038-02
ACS00038,
ACS00038-01,
ACS00038-02
Power socket with single pins (ACS00038) or crimped wire
length of 1 m (ACS00038-01,-02).
Recommended mating part for the XP22 connector
(Additional power connector)
ACS00040-01
ACS00040-01
2mm IDC2-10 socket (Leotronics).
Recommended mating part for XP5 (CAN), XP6 (COM3),
XP7 (COM4), XP9 (LAN), XP10 (COM1), XP14 (GPIO),
XP16 (COM2), XP17 (COM5,6)
ACS00048,
ACS00049,
ACS00049-02
ACS00048,
ACS00049,
ACS00049-02
Insert (socket, Leotronics) for 10 positions, with a pin pitch
of 2 mm and a set of individual pins (ACS00049) or crimped
wire with a length of 1 m (ACS00049-02).
Recommended mating part for XP5 (CAN), XP6 (COM3),
XP7 (COM4), XP9 (LAN), XP10 (COM1), XP14 (GPIO),
XP16 (COM2), XP17 (COM5,6)
ACS00040-05
ACS00040-05
IDC2-44 2 mm socket (Leotronics).
Recommended mating part for XP12 (LPT, USB), XP13
(IDE) connectors.
ACS00048-04,
ACS00049,
ACS00049-02
ACS00048-04,
ACS00049,
ACS00049-02
Insert (socket, Leotronics) for 44 positions, with a pin
pitch of 2 mm and a set of individual contacts
(ACS00049) or crimped to a wire length of 1 m
(ACS00049-02).
Recommended mating part for XP12 (LPT, USB), XP13
(IDE) connectors.
ACS00042
ACS00042
Null-modem cable
ACS00043-01
ACS00043-01
PS/2 cable. Used to connect PS/2 devices to XP23
connector.
ACS00051
ACS00051
Cable for connecting two standard USB devices to XP12
(LPT/USB) connector.

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Table 1.4. Differences among the supplied configurations
Ordering
number
IDE
LAN
CAN
COM
GPIO
I2C
Format
Coating
СРС307-02
ATA Flash Disk
(soldered, 1 GB
for versions
before 4.x; 2 GB
–for versions 4.х)
LAN
CAN 1-2
COM 1-6
GPIO
I2C
РС104-plus (ISA,
PCI)
СРС307-03
ATA Flash Disk
(soldered, 1 GB
for versions
before 4.x; 2 GB
–for versions 4.х)
LAN
COM 1-4
GPIO
I2C
РС104-plus (ISA,
PCI)
СРС307-04
microSD 1-2
LAN
CAN 1-2
COM 1-6
GPIO
I2C
РС104-plus (ISA,
PCI)
СРС307-05
ATA Flash Disk
(soldered, 1 GB
for versions
before 4.x; 2 GB
–for versions 4.х)
LAN
CAN 1-2
COM 1-6
GPIO
I2C
РС104-plus (ISA,
PCI)
Conformal coating,
from - 50 to +90 ◦C

Technical Specifications CPC307
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2 Technical Specifications
2.1 General information on module functionality
CPU: Integrated in DM&P Vortex86DX SoC
600 MHz
32-bit x86 compatible core
16-bit memory bus
Math coprocessor
32 KB L1, 256 KB L2 cache
6-stage pipeline
System memory256 MB soldered DDR2 SDRAM:
bus frequency 266 MHz for module versions lower than 4.х;
bus frequency 333 MHz for module versions 4.х.
Connection of HDD and optical disc drive for DVD/CD:
2 x connectors for microSD cards (only for CPC307-04, ATA Flash Disk is not
installed);
For other module versions connection of one additional IDE device is available;
Ultra-DMA2 mode support;
Flash memory
For module versions before 4.х: 1 GB, using NAND technology (via ATA Flash
disk controller) for -02, -03, -05 versions. Space available to the user: 870 MB;
For module versions 4.x: 2 GB, using NAND technology (via ATA Flash disk
controller) for -02, -03, -05 versions. Space available to the user: 1870 MB;
SD controller: connection of up to two microSD cards up to 4 GB (for -04
version).
PS/2 keyboard and mouse port.
Opto-isolated reset/interrupt, isolation voltage not less than 500 V.
USB port:
Supports up to 4 x USB 1.1 devices, USB 2.0;
Supports downloading from USB devices;
Ethernet 10/100 Mbit controller, isolation voltage not less than 500 V;
Serial ports:
COM1, COM2: RS-232/422/485, up to 115.2 kbaud, full;
COM3, COM4: RS-232, up to 115.2 kbaud, full;
COM5, COM6: RS-422/485, up to 3.6 Mbaud, channel-to-channel isolation,
isolation voltage at least 500 V;
Console input/output via serial port (COM1 to COM4).
Two CAN 2.0b interfaces, SJA1000T controller, baud rate up to 1 Mbit/s, per channel
isolation, isolation voltage at least 500 V;
Universal parallel port (LPT) with support for SPP, EPP, ECP modes;
PCI-104 bus (PCI);

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PC-104 bus (ISA);
GPIO port, 8 digital I/O lines;
Two I2C ports (combined with GPIO port);
3 x watchdog timers:
2 x with software control capability, integrated into the Vortex86DX SoC;
Hardware timer with a fixed 1.6 s interval;
Flash BIOS:
- For module versions before 4.x:
512 Kbyte parallel Flash (ISA);
256 Kbyte (backup, SPI Flash);
Modifiable within the system;
Option to automatically reboot from the BIOS backup;
- For 4.x module versions:
256 Kbytes (SPI Flash) without BIOS backup;
BIOS hardware reset option;
Real-time clock;
256 byte of CMOS RAM and 256 KB of non-volatile FRAM (SPI) memory:
Automatic saving and retrieval of CMOS memory settings when the module is
operated without a replaceable DC battery installed;
Write/read user data via BIOS functions.
Software compatibility:
MS DOS 6.22;
FreeDOS;
Windows CE 5.0;
Linux 2.6;
QNX 6.4;
2.2 Power Requirements
The module’s power supply must comply with the requirements given in Table 2.1.
The module is powered via the PC/104 and PC/104-plus connector (if installed). If an external
power supply is required, an additional XP22 power connector (4-pin AMP 4-171826-4 connector)
can be used.
For versions 3.x and below, the starting current of the module is 2.1 A for the CPC307-02 version.
The power supply source must be capable of providing the starting current. A power supply source
with a current limiting mode of at least 1.2 A can be used. When selecting a power supply, the
starting current and the current consumption of the expansion modules must be taken into account.
The module version 4.0 and higher have a “soft” start mechanism. The module’s power-up delay
after applying power is about 200 ms (max). To ensure a certain level on the I/O port lines within
200 ms after power-up, additional measures must be taken.
Attention!
It is recommended to take additional measures to ensure protection of external
devices against "+5 V" conductive interference in case of using one voltage output
of the power supply.
Consumption current typical value is 0.6 A.

Technical Specifications CPC307
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Table 2.1: Power Supply Requirements
Connectors
Power Voltage
Voltage limits
Maximum load
current
Starting current
PC/104 и
PC/104-plus
+5 V
From +4.75 to
+5.25V
1A
2.1 (0.5 ms) –for
module versions
lower than 4.х.
2.5 (0.5 ms) –for
module versions 4.х.
Additional power
supply connector
+5 V
From +4.75 to
+5.25V
1A
2.1 (0.5 ms) –for
module versions
lower than 4.х.
2.5 (0.5 ms) –for
module versions 4.х.
2.3 Operating conditions
Modules must be resistant to ambient air temperature changes in the range according to Table 2.2
at relative humidity up to 80 %, non-condensing, according to the GOST 28209-89 standard.
Modules with conformal coating must be resistant to cyclic damp heat at ambient air temperature +
(55 ±2) °С, relative humidity (93 ±3) % in accordance with the GOST 28216-89 standard.
Table 2.2. Ranges of ambient air temperature changes
Version by
temperature range
Module
Lower range
value, оС
Higher range
value,оС
Industrial temperature
range
CPC307-02/03/04
- 40
+ 85
CPC307-05
- 50
+ 90
Modules storage conditions 1 according to the GOST 15150-69 standard.
2.4 Mechanical
Vibration (5 ... 2000 Hz) –10g;
Single shock, peak acceleration –150 g;
Multiple shock, peak acceleration –50 g.
If the module is operated in harsh environment, it is recommended to additionally fix counterpart
connectors and cables.

Technical Specifications CPC307
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2.5 Dimensions and Weight
The module weight should not exceed the values specified in Table 2.3.
2.3. Module weight
Version
Net weight in
kg, max
Gross weight in
kg, max
CPC307-02
0.125
0.265
CPC307-03
0.120
0.260
CPC307-04
0.125
0.265
CPC307-05
0.135
0.275
The overall dimensions of the versions and the location of the components are shown in Figure
2.1.

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Figure 2.1 a) Overall dimensions of the CPC307 components and their locations (this figure is valid for versions
3.x)