FDI ?YG-S7G2-70C-MDK User manual

Copyright ©2017, Future Designs, Inc., All Rights Reserved
User’s Manual
ΣYG-S7G2-70C-MDK

ΣYG-S7G2-70C-MDK User’s Manual
6/26/2017
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Future Designs, Inc
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Important Legal Information
Information in this document is provided solely to enable the use of Future Designs, Inc. (FDI) products.
FDI assumes no liability whatsoever, including infringement of any patent or copyright. FDI reserves the
right to make changes to these specifications at any time, without notice. No part of this document may be
reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without
the express written permission of Future Designs, Inc. 996 A Cleaner Way, Huntsville, AL 35805.
NOTE: The inclusion of vendor software products in this kit does not imply an endorsement of the
product by Future Designs, Inc.
yG™ is a trademark of Future Designs, Inc.
Renesas Synergy™ is a trademark of Renesas Electronics Corporation.
Microsoft, MS-DOS, Windows, Windows XP, Microsoft Word are registered trademarks of Microsoft
Corporation.
Other brand names are trademarks or registered trademarks of their respective owners.
Printed in the United States of America.
For more information on FDI or our products please visit www.TeamFDI.com.
 2017 Future Designs, Inc. All rights reserved.

ΣYG-S7G2-70C-MDK User’s Manual
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Table of Contents
Important Legal Information ......................................................................................................................................... 2
ΣyG-S7G2-70C Modular Development Kit (MDK) Overview ........................................................................ 5
1.1 Introduction ................................................................................................................................................... 5
1.2 ESD Warning ................................................................................................................................................ 5
1.3 Renesas Synergy S7G2 Microcontoller Block Diagram ............................................................................... 6
1.4 ΣyG-S7G2-70C-MDK System Block Diagram ............................................................................................ 7
1.5 Requirements ................................................................................................................................................. 8
1.6 ΣyG-S7G2 SOM Power Requirements ......................................................................................................... 8
Getting Started .................................................................................................................................................. 9
2.1 Setting up the Hardware ................................................................................................................................ 9
2.2 Demonstration Software .............................................................................................................................. 10
ΣyG-S7G2 SOM System on Module Board Components .............................................................................. 11
3.1 ARM Mini-JTAG J2 ................................................................................................................................... 11
3.2 Tag Connect J3 ............................................................................................................................................ 12
3.3 MicroSD Socket J1 ..................................................................................................................................... 12
3.3.1 Inserting the microSD card into the microSD socket .......................................................................... 13
3.3.2 Removing the microSD card from the microSD socket ...................................................................... 14
3.4 Ethernet PHY U5 ........................................................................................................................................ 14
3.5 200-pin SOMDIMM Connector Details J4 ................................................................................................. 15
Carrier Board Components.............................................................................................................................. 19
4.1 DC Power Input ........................................................................................................................................... 19
4.2 Alternate Power Input ................................................................................................................................. 19
4.3 USB Power Device ..................................................................................................................................... 19
4.4 USB Power Host ......................................................................................................................................... 20
4.5 Ethernet ....................................................................................................................................................... 21
4.6 CAN/RS485 ................................................................................................................................................ 21
4.7 RS232 .......................................................................................................................................................... 22

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4.8 External I2C ................................................................................................................................................ 23
4.9 External I2S Audio ...................................................................................................................................... 23
ΣyG-S7G2 System on Module Board Layout ................................................................................................. 24
3.1 Schematics......................................................................................................................................................... 24
3.2 Mechanicals....................................................................................................................................................... 24
Support ............................................................................................................................................................ 26
6.1 Where to Get Help ...................................................................................................................................... 26
6.2 Useful Links ................................................................................................................................................ 26

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ΣyG-S7G2-70C Modular Development Kit (MDK) Overview
1.1 Introduction
The Future Designs, Inc. ΣyG
TM
Family provides a complete and qualified Graphical User
Interface (GUI) / Human Machine Interface (HMI) platform for the rapid release of customer
products. The core of ΣyG (pronounced, “sig”) is Renesas Synergy
TM
– a comprehensive and
integrated software-based microcontroller platform. FDI adds the Synergy platform to its GUI
hardware, systems and production expertise. The end result is a sum of high-quality products that
provide a robust and proven source for GUI and HMI solutions:
ΣyG = Renesas Synergy+ GUI
The ΣyG-S7G2 Modular Development Kit for the System on Module is the gateway for
beginning Renesas Synergy
TM
projects. The ΣyG-S7G2 Modular Development Kit is compatible
with FDI’s ΣyG Modular Development LCD Kits but can be used independently as a lower cost
option for those embedded applications without the need for a touch screen display. FDI offers low
cost customization services for customer specific hardware, software or packaging applications at
volumes of 500 units or more.
The ΣYG-S7G2-70C-MDK kit is a member of the ΣYG family and it combines the ΣYG-
S7G2-SOM with FDI’s Carrier Board, LCD Carrier Board, and 7.0” capacitive touch screen LCD.
This combination enables evaluation and development with the Renesas Synergy S7G2 MCU.
1.2 ESD Warning
The ΣYG-S7G2-70C-MDK is shipped in a protective anti-static package. Do not subject the
module to high electrostatic potentials. Exposure to high electrostatic potentials may cause damage
to the boards that will not be covered under warranty. General practice for working with static
sensitive devices should be followed when working with the kit.

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1.3 Renesas Synergy S7G2 Microcontoller Block Diagram
Figure 1: S7G2 System Block Diagram

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1.4 ΣyG-S7G2-70C-MDK System Block Diagram
Figure 2: ΣYG-S7G2-70C Kit Block Diagram

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1.5 Requirements
The ΣYG-S7G2-70C -MDK requires a carrier board with a 200-pin SO-DIMM socket. The
socket should have the key at the 1.8V location. The CARRIER Board from Future Designs
provides this socket and should be utilized to develop your application for initial verification.
Each yG development kit includes:
• ΣyG-S7G2 System on Module (SOM)
• Renesas Synergy Software Platform
• Carrier Board
• 5 VDC, 2.3A North American Power Supply
• USB and Ethernet Cables
• Segger ARM Cortex-M Mini-JTAG debugger and cables
• Optional LCD Carrier Board
• Optional 4.3” or 7.0″ PCAP Touch Screen LCD
• microSDHC card
• USB Flash Drive
1.6 ΣyG-S7G2 SOM Power Requirements
The power requirement for the ΣYG-S7G2-70C-MDK is 5V DC Center Positive 2A Power
Supply.

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Getting Started
2.1 Setting up the Hardware
The SOMDIMM should be inserted into the DIMM Socket as shown below and then
locked into place by pushing down to the Carrier Board. Ensure the SOMDIMM is inserted
completely into the socket prior to locking. The socket utilized on the CARRIER Board is
rated for a minimum of 25 insertions.
Figure 3: SOMDIMM Insertion
The following are step by step instructions for setting up the hardware.
1) Make sure you have a SOMDIMM board plugged into the CARRIER board at J1.
2) Verify the LCD Interface ribbon cable connects the LCD CARRIER board to the CARRIER (J7)
board.
3) With the power off, plug the 5V center-positive Power Supply into 5V (P5) of the CARRIER
board.
4) Connect an RJ-45 Ethernet cable to the ETHERNET (J5) interface of the CARRIER board.
5) Plug in a female-to-female DB9 serial cable between PC and RS232 (P4) on the CARRIER board.
6) Insert the microSD card with the demonstration files (included) into microSD connector on the
SOMDIMM.

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2.2 Demonstration Software
Once the device is powered on, the demonstration software start menu will appear on the LCD
screen. The software consists of the Weatherpanel demonstration.
2.2.1 Weatherpanel Demonstration
After showing the splash screen for a short time, the Weatherpanel demo starts automatically.
Pressing on a day of the week will update the background with the weather for that day and play
the animation associated with the image in the center of the screen. Pressing on the (+) or (-)
buttons simulates adjusting a thermostat.