Texas Instruments SimpleLink MSP432P4111 User manual

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MSP432P4111 SimpleLink™ microcontroller LaunchPad™ development kit
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User's Guide
SLAU747B–October 2017–Revised January 2019
MSP432P4111 SimpleLink™ microcontroller LaunchPad™
development kit (MSP-EXP432P4111)
The SimpleLink™ MSP-EXP432P4111 LaunchPad™ development kit is an easy-to-use evaluation module
(EVM) for the SimpleLink MSP432P4111 microcontroller (MCU). It contains everything needed to start
developing on the SimpleLink MSP432P4111 low-power 32-bit Arm®Cortex®-M4F MCU with precision
ADC, including onboard emulation for programming, debugging, and energy measurements. The
MSP432P4111 MCU supports low-power applications requiring increased CPU speed, memory, analog,
and 32-bit performance.
Figure 1. MSP-EXP432P4111 LaunchPad Development Kit

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Contents
1 Getting Started............................................................................................................... 4
1.1 Introduction .......................................................................................................... 4
1.2 Key Features ........................................................................................................ 4
1.3 What’s Included..................................................................................................... 4
1.4 First Steps: Out-of-Box Experience .............................................................................. 4
1.5 Next Steps: Looking Into the Provided Code ................................................................... 5
2 Hardware...................................................................................................................... 5
2.1 Block Diagram....................................................................................................... 6
2.2 SimpleLink MSP432P4111 MCU ................................................................................. 6
2.3 XDS110-ET Onboard Emulator................................................................................... 8
2.4 Special Features .................................................................................................. 13
2.5 Power ............................................................................................................... 17
2.6 Measure MSP432 Current Draw ................................................................................ 18
2.7 Clocking ............................................................................................................ 18
2.8 BoosterPack Plug-in Module Pinout ............................................................................ 19
2.9 Design Files........................................................................................................ 21
2.10 Hardware Change Log............................................................................................ 21
3 Software and Additional Resources ..................................................................................... 21
3.1 TI Resource Explorer ............................................................................................. 21
3.2 SimpleLink MSP432P4 SDK..................................................................................... 21
3.3 Integrated Development Environments......................................................................... 21
3.4 LaunchPad Websites ............................................................................................. 22
3.5 MSP432P4111 MCU.............................................................................................. 23
3.6 Community Resources ........................................................................................... 23
4 FAQ .......................................................................................................................... 23
5 Schematics.................................................................................................................. 27
List of Figures
1 MSP-EXP432P4111 LaunchPad Development Kit...................................................................... 1
2 MSP-EXP432P4111 Overview............................................................................................. 5
3 MSP-EXP432P4111 Block Diagram ...................................................................................... 6
4 MSP432P4111IPZ Pinout .................................................................................................. 7
5 XDS110-ET Emulator ....................................................................................................... 8
6 XDS110-ET Isolation Block................................................................................................. 9
7 Application Backchannel UART in Device Manager................................................................... 10
8 EnergyTrace Technology Preferences .................................................................................. 12
9 EnergyTrace Windows .................................................................................................... 13
10 LCD Segment Layout...................................................................................................... 14
11 LMT70 Output Transfer Function ........................................................................................ 16
12 R8 Location ................................................................................................................. 17
13 MSP-EXP432P4111 Power Block Diagram ............................................................................ 17
14 LaunchPad-to-BoosterPack Connector Pinout......................................................................... 20
15 SWD Mode Settings ....................................................................................................... 24
16 Target Configurations...................................................................................................... 24
17 Launch Selected Configuration........................................................................................... 24
18 Show All Cores ............................................................................................................. 25
19 Connect Target............................................................................................................. 25
20 MSP432_Factory_Reset Script........................................................................................... 26
21 Schematics (1 of 6) ........................................................................................................ 28
22 Schematics (2 of 6) ........................................................................................................ 29
23 Schematics (3 of 6) ........................................................................................................ 30

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24 Schematics (4 of 6) ........................................................................................................ 31
25 Schematics (5 of 6) ........................................................................................................ 32
26 Schematics (6 of 6) ........................................................................................................ 33
List of Tables
1 Isolation Block Connections................................................................................................ 8
2 LCD FH-1138P Segment Mapping ...................................................................................... 14
3 LCD-to-MSP Connections................................................................................................. 15
4 Default Clock Operation................................................................................................... 19
5 Hardware Change Log .................................................................................................... 21
6 How MSP Device Documentation is Organized........................................................................ 23
Trademarks
SimpleLink, LaunchPad, BoosterPack, Code Composer Studio, EnergyTrace, E2E are trademarks of
Texas Instruments.
Arm, Cortex, Keil, µVision are registered trademarks of Arm Limited.
IAR Embedded Workbench is a registered trademark of IAR Systems.
All other trademarks are the property of their respective owners.

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1 Getting Started
1.1 Introduction
The SimpleLink MSP-EXP432P4111 LaunchPad development kit is an easy-to-use evaluation module
(EVM) for the MSP432P4111 MCU. It contains everything needed to start developing on the SimpleLink
MSP432 low-power and performance Arm 32-bit Cortex-M4F MCU, including onboard emulation for
programming, debugging, and energy measurements. The MSP432P4111 MCU supports low-power
applications requiring increased CPU speed, memory, analog, and 32-bit performance. The board features
onboard buttons and LEDs for quick integration of a simple user interface and an liquid crystal display
(LCD) that showcases the integrated driver that can drive up to 320 segments.
Rapid prototyping is simplified by access to the 40-pin headers and a wide variety of BoosterPack™ plug-
in modules that enable technologies such as wireless connectivity, graphical displays, environmental
sensing, and many more. Free software development tools are also available such as TI’s Eclipse-based
Code Composer Studio™ IDE,IAR Embedded Workbench®IDE, and Keil®µVision®IDE.
Code Composer Studio IDE supports EnergyTrace™ technology when paired with the MSP432P4111
LaunchPad development kit. For more information about the LaunchPad kit, the supported BoosterPack
plug-in modules, and the available resources, visit the TI LaunchPad development kit portal. To get
started quickly and find available resources in the SimpleLink MSP432 software development kit (SDK),
visit the TI Cloud Development Environment.
1.2 Key Features
• Low-power Arm Cortex-M4F MSP432P4111
• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem
• XDS110-ET, an open-source onboard debugger featuring EnergyTrace+ technology and application
UART
• Two buttons and two LEDs for user interaction
• Segmented LCD
• LMT70 precision analog temperature sensor
• Backchannel UART through USB to PC
1.3 What’s Included
1.3.1 Kit Contents
• One MSP-EXP432P4111 LaunchPad development kit
• One Micro USB cable
• One quick start guide
1.3.2 Software Examples (See Section 3)
• SimpleLink MSP432P4 SDK
Includes both low-level examples and more in-depth demos that use various middleware and libraries
1.4 First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features of the LaunchPad from a user level, showing how to use the pushbutton switches
together with onboard LEDs and basic serial communication with a computer.
For a more detailed explanation of the out-of-box demo, see Section 3.

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1.5 Next Steps: Looking Into the Provided Code
It is now time to start exploring more features of the EVM!
http://www.ti.com/tool/msp-exp432p4111
To get started, you need an integrated development environment (IDE) to explore and start editing the
code examples. See Section 3 for more information on IDEs and where to download them.
The out-of-box source code and more code examples can be found in TI Resource Explorer or
downloaded from http://www.ti.com/tool/msp-exp432p4111. Find what code examples are available and
more details about each example in Section 3. All code is licensed under BSD, and TI encourages reuse
and modifications to fit specific needs.
2 Hardware
Figure 2 shows an overview of the EVM hardware.
Figure 2. MSP-EXP432P4111 Overview

Target Device
MSP432P4111
Crystal,
48 MHz
Micro-B
USB
EnergyTrace+
Current-
Measurement
Hardware
LDO
5 V, 3.3 V
ESD
Protection
Power
Switch
Debug
MCU
LEDs
Red, Green
Jumper Block
Power, UART, SBW to Target
User Interface
Buttons and LEDs
40-pin
LaunchPad
Standard
Headers
Segmented LCD
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2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. MSP-EXP432P4111 Block Diagram
2.2 SimpleLink MSP432P4111 MCU
The MSP432P4111 is the next device in the MSP432 family featuring low-power performance with an Arm
Cortex-M4F core. Device features include:
• Low-power Arm Cortex-M4F MSP432P4111 MCU
• Up to 48-MHz system clock
• 2MB of flash memory, 256KB of SRAM, and 32KB of ROM with SimpleLink MSP432 SDK Libraries
• Four 16-bit timers with capture, compare, or PWM; two 32-bit timers; and RTC
• Up to eight serial communication channels (I2C, SPI, UART, and IrDA)
• Analog: Precision ADC, two comparators, integrated LCD driver
• Digital: AES256, CRC, µDMA
• 100-pin LQFP (PZ) package (see Figure 4)

1P10.1/UCB3CLK/L38
2P10.2/UCB3SIMO/UCB3SDA/L37
3P10.3/UCB3SOMI/UCB3SCL/L36
4P1.0/UCA0STE/L19
5P1.1/UCA0CLK/L18
6P1.2/UCA0RXD/UCA0SOMI/L17
7P1.3/UCA0TXD/UCA0SIMO/L16
8P1.4/UCB0STE/L15
9P1.5/UCB0CLK/L14
10P1.6/UCB0SIMO/UCB0SDA/L13
11P1.7/UCB0SOMI/UCB0SCL/L12
12VCORE
13DVCC1
14VSW
15DVSS1
16P2.0/PM_UCA1STE/L11
17P2.1/PM_UCA1CLK/L10
18P2.2/PM_UCA1RXD/PM_UCA1SOMI/L9
19P2.3/PM_UCA1TXD/PM_UCA1SIMO/L8
20P2.4/PM_TA0.1/L23
21P2.5/PM_TA0.2/L22
22P2.6/PM_TA0.3/L21
23P2.7/PM_TA0.4/L20
24P10.4/TA3.0/C0.7/L35
25P10.5/TA3.1/C0.6/L34
26
P7.4/PM_TA1.4/C0.5/L31
27
P7.5/PM_TA1.3/C0.4/L30
28
P7.6/PM_TA1.2/C0.3/L29
29
P7.7/PM_TA1.1/C0.2/L28
30
P8.0/UCB3STE/TA1.0/C0.1
31
P8.1/UCB3CLK/TA2.0/C0.0
32
P3.0/PM_UCA2STE/L7
33
P3.1/PM_UCA2CLK/L6
34
P3.2/PM_UCA2RXD/PM_UCA2SOMI/L5
35
P3.3/PM_UCA2TXD/PM_UCA2SIMO/L4
36
P3.4/PM_UCB2STE/L3
37
P3.5/PM_UCB2CLK/L2
38
P3.6/PM_UCB2SIMO/PM_UCB2SDA/L1
39
P3.7/PM_UCB2SOMI/PM_UCB2SCL/L0
40
AVSS3
41
PJ.0/LFXIN
42
PJ.1/LFXOUT
43
AVSS1
44
DCOR
45
AVCC1
46
P8.2/TA3.2/A23/L47
47
P8.3/TA3CLK/A22/L46
48
P8.4/A21/L45
49
P8.5/A20/L44
50
P8.6/A19/L19
51 P8.7/A18/L18
52 P9.0/A17/L17
53 P9.1/A16/L16
54 P6.0/A15/L15
55 P6.1/A14/L14
56 P4.0/A13/L13
57 P4.1/A12/L12
58 P4.2/ACLK/TA2CLK/A11
59 P4.3/MCLK/RTCCLK/A10
60 P4.4/HSMCLK/SVMHOUT/A9
61 P4.5/A8
62 P4.6/A7
63 P4.7/A6
64 P5.0/A5
65 P5.1/A4
66 P5.2/A3
67 P5.3/A2
68 P5.4/A1
69 P5.5/A0
70 P5.6/TA2.1/VREF+/VeREF+/C1.7
71 P5.7/TA2.2/VREF-/VeREF-/C1.6
72 DVSS2
73 DVCC2
74 P9.2/TA3.3/L33
75 P9.3/TA3.4/L32
76
P6.2/UCB1STE/C1.5/L27
77
P6.3/UCB1CLK/C1.4/L26
78
P6.4/UCB1SIMO/UCB1SDA/C1.3/L25
79
P6.5/UCB1SOMI/UCB1SCL/C1.2/L24
80
P6.6/TA2.3/UCB3SIMO/UCB3SDA/C1.1
81
P6.7/TA2.4/UCB3SOMI/UCB3SCL/C1.0
82
DVSS3
83
RSTn/NMI
84
AVSS2
85
PJ.2/HFXOUT
86
PJ.3/HFXIN
87
AVCC2
88
P7.0/PM_SMCLK/PM_DMAE0/R03
89
P7.1/PM_C0OUT/PM_TA0CLK/R13
90
P7.2/PM_C1OUT/PM_TA1CLK/R23
91
P7.3/PM_TA0.0
92
PJ.4/TDI
93
PJ.5/TDO/SWO
94
SWDIOTMS
95
SWCLKTCK
96
P9.4/UCA3STE/L43
97
P9.5/UCA3CLK/L42
98
P9.6/UCA3RXD/UCA3SOMI/L41
99
P9.7/UCA3TXD/UCA3SIMO/L40
100
P10.0/UCB3STE/L39
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Figure 4. MSP432P4111IPZ Pinout

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2.3 XDS110-ET Onboard Emulator
To keep development easy and cost effective, the TI LaunchPad development kits integrate an onboard
emulator, which eliminates the need for expensive programmers. The MSP-EXP432P4111 has the
XDS110-ET emulator, which is a simple and low-cost debugger that supports nearly all TI Arm device
derivatives.
Figure 5. XDS110-ET Emulator
The XDS110-ET hardware can be found in the schematics in Section 5 and in the MSP-EXP432P4111
Hardware Design Files.
2.3.1 XDS110-ET Isolation Block
The J101 isolation block is composed of 10 jumpers (see Table 1). The J101 isolation block allows the
user to connect or disconnect signals that cross from the XDS110-ET domain into the MSP432P4111
target domain. This crossing is shown by the dotted line across the LaunchPad development kit through
J101. No other signals cross this domain, so the XDS110-ET can be decoupled from the MSP432P4111
target side. This includes XDS110-ET power and GND signals, UART, and JTAG signals.
Table 1 lists the signals that are controlled at the isolation block (also see Figure 6).
Table 1. Isolation Block Connections
Signal Description
GND GND power connection between XDS110 and MSP432 target GND planes. The GND jumper is populated to
connect the separate GND planes. This connection is required for proper operation with 3V3, 5V, and JTAG
5V 5-V power rail, VBUS from USB
3V3 3.3-V power rail, derived from VBUS by an LDO in the XDS110-ET domain
RXD << Backchannel UART: The target MCU receives data through this signal. The arrows indicate the direction of the
signal.
TXD >> Backchannel UART: The target MCU sends data through this signal. The arrows indicate the direction of the
signal.
RST MCU RST signal (active low)
TCK_SWCLK Serial wire clock input (SWCLK); JTAG clock input (TCK)
TMS_SWDIO Serial wire data input/output (SWDIO); JTAG test mode select (TMS)
TDO_SWO Serial wire trace output (SWO); JTAG trace output (TWO) (also PJ.5)
TDI JTAG test data input (also PJ.4)

J101
Isolation Block
JTAG and SWD
Application UART
3.3-V Power
5-V Power
XDS110-ETMSP432 Target
USB Connector
in out
LDO
BoosterPack Header
BoosterPack Header
USB
EnergyTrace
eUSCI_A0
XDS110-ET
Emulator MCU
MSP432P4111
Target MCU
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Reasons to open these connections:
• To remove any and all influence from the XDS110-ET emulator for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the XDS110-ET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the XDS110-ET so that it can be used for devices
other than the onboard MCU.
Figure 6. XDS110-ET Isolation Block
2.3.2 Application (or “Backchannel”) UART
The XDS110-ET provides a “backchannel” UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC.
The backchannel UART allows communication with the USB host that is not part of the main functionality
of the target application. This is very useful during development, and also provides a communication
channel to the PC host side. This can be used to create GUIs and other programs on the PC that
communicate with the LaunchPad development kit.
The pathway of the backchannel UART is shown in Figure 7. The backchannel UART eUSCI_A0 is
independent of the UART on the 40-pin BoosterPack plug-in module connector eUSCI_A2.

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On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the
target application. You need to identify the COM port for the backchannel. On Windows PCs, Device
Manager can assist.
Figure 7. Application Backchannel UART in Device Manager
The backchannel UART is the XDS110 Class Application/User UART port. In this case, Figure 7 shows
COM156, but this port can vary from one host PC to the next. After you identify the correct COM port,
configure it in your host application according to its documentation. You can then open the port and begin
communication to it from the host.
The XDS110-ET has a configurable baud rate; therefore, it is important that the PC application configures
the baud rate to be the same as what is configured on the eUSCI_A0 backchannel UART.
2.3.3 Using an External Debugger Instead of the Onboard XDS110-ET
Many users have a specific debugger that they prefer to use, and may want to bypass the XDS110-ET to
program the MSP432 target MCU. This is enabled by jumpers on isolation block J101, and the connector
J8. Using an external debug probe is simple, and full JTAG access is provided through J8.
1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO,
and TDI.
2. Plug any Arm debugger into J8.
a. J8 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors
3. Plug USB power into the LaunchPad, or power it externally
a. Ensure that the jumpers across 3V3 and GND are connected if using USB power
b. External debuggers do not provide power, the Vcc pin is a power sense pin
c. See Section 2.5 for more details on powering the LaunchPad development kit.

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2.3.4 Using the XDS110-ET Emulator With a Different Target
The XDS110-ET emulator on the LaunchPad can interface to most Arm Cortex-M devices, not just the
onboard MSP432P4111 device. This functionality is enabled by the J102 10-pin Cortex-M JTAG connector
and a 10-pin cable, such as the FFSD-05-D-06.00-01-N (sold separately from the LaunchPad
development kit).
Header J102 follows the Cortex-M Arm standard; however, pin 1 is not a voltage sense pin. The XDS110-
ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the user must provide level
shifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can be sourced from the
XDS110-ET when jumper JP102 is connected. This allows the XDS110-ET to power the external target at
3.3 V through pin 1. By default, JP102 is not populated as it does not explicitly follow the standard.
1. Remove jumpers on the JTAG signals on the isolation block, including RST, TMS, TCK, TDO, and TDI.
2. Plug the 10-pin cable into J102, and connect to an external target.
a. J102 allows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.
3. Plug USB power into the LaunchPad development kit, or power it externally.
a. JTAG levels are 3.3 V only.
b. 3.3-V power can be sourced through J102 by shorting the JP102 jumper.
2.3.5 EnergyTrace Technology
EnergyTrace technology is an energy-based code analysis tool that measures and displays the energy
profile of the application and helps to optimize it for ultra-low power consumption.
MSP432 devices with built-in EnergyTrace+[CPU State] (or in short EnergyTrace+) technology allow real-
time monitoring of internal device states while user program code executes.
EnergyTrace+ technology is supported on the LaunchPad development kit MSP432P4111 device and
XDS110-ET debug probe. EnergyTrace technology is available as part of Code Composer Studio IDE.
During application debug, additional windows are available for EnergyTrace technology.
To enable EnergyTrace technology:
1. Click Window > Preferences > Code Composer Studio > Advanced Tools > EnergyTrace™
Technology.
2. Check the Enable Auto-Launch on target connect box.

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Figure 8. EnergyTrace Technology Preferences
Starting a debug session opens the EnergyTrace technology windows. These windows show energy,
power, profile, and states to give a full view of the energy profile of the application.

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Figure 9. EnergyTrace Windows
This data allows the user to see exactly where and how energy is consumed in their application.
Optimizations for energy can be quickly made for the lowest power application possible.
On the LaunchPad development kit, EnergyTrace technology measures the current that enters the target
side of the LaunchPad. This includes all BoosterPacks plug-in modules plugged in, and anything else
connected to the 3V3 power rail. For more information about powering the LaunchPad kit, see Section 2.5.
For more information about EnergyTrace technology, see http://www.ti.com/tool/energytrace.
For more details and questions about setting up and using EnergyTrace technology with the
MSP432P4111, see the Code Composer Studio™ IDE 7.1+ for SimpleLink™ MSP432™ Microcontrollers
User’s Guide.
2.4 Special Features
2.4.1 Liquid Crystal Display
The MSP432P4111 LaunchPad development kit features an onboard LCD. This LCD is driven by the
internal LCD driver on the MSP432P4111 device.
Many LCD segments are available, including six full alpha-numeric numbers or letters in addition to
several symbols at the top for various modes or applications. Figure 10 shows the layout of the LCD, and
Table 2 and Table 3 list the mapping of these segments.

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Figure 10. LCD Segment Layout
Table 2. LCD FH-1138P Segment Mapping
Pin COM3 COM2 COM1 COM0
1 A1E A1F A1G A1M
2 A1A A1B A1C A1D
3 A1Q NEG A1N A1DP
4 A1H A1J A1K A1P
5 A2E A2F A2G A2M
6 A2A A2B A2C A2D
7 A2Q A2COL A2N A2DP
8 A2H A2J A2K A2P
9 A3R A3F A3G A3M
10 A3A A3B A3C A3D
11 A3Q ANT A3N A3DP
12 A3H A3J A3K A3P
13 A4R A4F A4G A4M
14 A4A A4B A4C A4D
15 A4Q A4COL A4N A4DP
16 A4H A4J A4K A4P
17 A5E A5F A5G A5M
18 A5A A5B A5C A5D
19 A5Q DEG A5N A5DP
20 A5H A5J A5K A5P
21 COM3 - - -
22 - COM2 - -
23 - - COM1 -
24 - - - COM0
25 - - - -
26 - - - -
27 - - - -
28 - - - -
29 - - - -
30 - - - -
31 - - - -
32 TMR HRT REC !
33 B6 B4 B2 BATT
34 B5 B3 B1 []

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Table 2. LCD FH-1138P Segment Mapping (continued)
Pin COM3 COM2 COM1 COM0
35 A6E A6F A6G A6M
36 A6A A6B A6C A6D
37 A6Q TX A6N RX
38 A6H A6J A6K A6P
Table 3. LCD-to-MSP Connections
MSP432 Pin
Function
MSP432 LCD
Memory
Register
MSP432 Port
Pin FH-1138P LCD Pin COM3 COM2 COM1 COM0
L47 LCDM47 P8.2 38 A6H A6J A6K A6P
L46 LCDM46 P8.3 37 A6Q TX A6N RX
L45 LCDM45 P8.4 36 A6A A6B A6C A6D
L44 LCDM44 P8.5 35 A6E A6F A6G A6M
L43 LCDM43 P9.4 12 A3H A3J A3K A3P
L42 LCDM42 P9.5 11 A3Q ANT A3N A3DP
L41 LCDM41 P9.6 10 A3A A3B A3C A3D
L40 LCDM40 P9.7 9 A3R A3F A3G A3M
L39 LCDM39 P10.0 16 A4H A4J A4K A4P
L38 LCDM38 P10.1 15 A4Q A4COL A4N A4DP
L37 LCDM37 P10.2 14 A4A A4B A4C A4D
L36 LCDM36 P10.3 13 A4R A4F A4G A4M
L35 LCDM35 P10.4 8 A2H A2J A2K A2P
L34 LCDM34 P10.5 7 A2Q A2COL A2N A2DP
L33 LCDM33 P9.2 6 A2A A2B A2C A2D
L32 LCDM32 P9.3 5 A2E A2F A2G A2M
L31 LCDM31 P7.4 20 A5H A5J A5K A5P
L30 LCDM30 P7.5 19 A5Q DEG A5N A5DP
L29 LCDM29 P7.6 18 A5A A5B A5C A5D
L28 LCDM28 P7.7 17 A5E A5F A5G A5M
L27 LCDM27 P6.2 23 - - COM1 -
L26 LCDM26 P6.3 24 - - - COM0
L25 LCDM25 P6.4
L24 LCDM24 P6.5
L23 LCDM23 P2.4
L22 LCDM22 P2.5
L21 LCDM21 P2.6
L20 LCDM20 P2.7
L19 LCDM19 P8.6 4 A1H A1J A1K A1P
L18 LCDM18 P8.7 3 A1Q NEG A1N A1DP
L17 LCDM17 P9.0 2 A1A A1B A1C A1D
L16 LCDM16 P9.1 1 A1E A1F A1G A1M
L15 LCDM15 P1.4/P6.0
L14 LCDM14 P1.5/P6.1
L13 LCDM13 P1.6/P4.0
L12 LCDM12 P1.7/P4.1
L11 LCDM11 P2.0
L10 LCDM10 P2.1

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Table 3. LCD-to-MSP Connections (continued)
MSP432 Pin
Function
MSP432 LCD
Memory
Register
MSP432 Port
Pin FH-1138P LCD Pin COM3 COM2 COM1 COM0
L9 LCDM9 P2.2
L8 LCDM8 P2.3
L7 LCDM7 P3.0
L6 LCDM6 P3.1 22 - COM2 - -
L5 LCDM5 P3.2
L4 LCDM4 P3.3
L3 LCDM3 P3.4 21 COM3 - - -
L2 LCDM2 P3.5 32 TMR HRT REC !
L1 LCDM1 P3.6 34 B5 B3 B1 []
L0 LCDM0 P3.7 33 B6 B4 B2 BATT
2.4.1.1 LCD Design Considerations
The LCD_F peripheral on the MSP432P4111 allows each LCD pin to be configured as either COMMON or
SEGMENT functionalities. Particular care was taken to determine LCD pin connections between the
microcontroller and the LCD on the MSP-EXP432P4111 LaunchPad. Pin connections were chosen to
optimize software ease-of-use while minimizing hardware layout complexity.
The LCD_F peripheral also features hardware animation, and up to 8 segments can be put into a
repetitive animation pattern. In 4-mux mode, the animation feature is supported on LCD pins L0 and L1.
The battery symbol on the MSP-EXP432P4111 onboard LCD consists of 8 segments and serves as a
good example to demonstrate the LCD_F animation feature. Therefore, the battery segments are
connected to L0 and L1 (see Table 3).
Pins P3.5, P3.6, and P3.7 from the MSP432P4111 are connected to both the BoosterPack plug-in module
connector and the LCD. If these pins are driven with a digital voltage from either the MSP432P4111 or a
BoosterPack plug-in module, the LCD segments connected to these pins may be damaged.
2.4.2 LMT70 Temperature Sensor
The MSP432P4111 LaunchPad development kit features an LMT70 ultra-small high-precision low-power
CMOS analog temperature sensor. The analog output voltage of the LMT70 correlates directly to the
ambient temperature (see Figure 11).
Figure 11. LMT70 Output Transfer Function
The analog output pin of the LMT70 is connected to Analog Input A2 (P5.3) on the MSP432P4111. The
VCC pin on the LMT70 is connected to the target side 3.3 V on the LaunchPad development kit through a
0-ohm resistor, R8. By default, R8 is not-populated to enable accurate low-power measurements of the
MSP432P4111 on the LaunchPad development kit. To enable the LMT70 to make analog temperature
measurements, populate R8 with a 0402 0-ohm resistor. Figure 12 shows the location of R8.

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Figure 12. R8 Location
2.5 Power
The board was designed to accommodate various powering methods, including through the onboard
XDS110-ET and from an external source or BoosterPack module.
Figure 13. MSP-EXP432P4111 Power Block Diagram

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2.5.1 XDS110-ET USB Power
The most common power-supply scenario is from USB through the XDS110-ET debugger. This provides
5-V power from the USB and also regulates this power rail to 3.3 V for XDS110-ET operation and 3.3 V to
the target side of the LaunchPad. Power from the XDS110-ET is controlled by the isolation block 3V3
jumper, ensure this jumper is connected for power to be provided to the target MCU side.
Under normal operation, the LDO on the XDS110-ET can supply up to 500 mA of current to the target side
including any BoosterPack plug-in modules plugged in. However, when debugging and using the
EnergyTrace technology tool, this current is limited to 75 mA total. Be aware of this current limitation when
using EnergyTrace technology.
2.5.2 BoosterPack Plug-in Module and External Power Supply
Header J6 is present on the board to supply external power directly. It is important to comply with the
device voltage operation specifications when supplying external power. The MSP432P4111 has an
operating range of 1.62 V to 3.7 V. More information can be found in the MSP432P4x1xI SimpleLink
Mixed-Signal Microcontroller data sheet.
2.6 Measure MSP432 Current Draw
To measure the current draw of the MSP432P4111, use the 3V3 jumper on the jumper isolation block.
The current measured includes the target device and any current drawn through the BoosterPack
headers.
To measure ultra-low power:
1. Remove the 3V3 jumper in the isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSP432P4111 may
have on current draw. Disconnect these at the isolation block if possible, or at least consider their
current sinking and sourcing capability in the final measurement.
3. Make sure there are no floating input I/Os. These cause unnecessary extra current draw. Every I/O
should either be driven out or, if it is an input, should be pulled or driven to a high or low level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
For a better look at the power consumed in your application use EnergyTrace+ Technology. EnergyTrace+
Technology allows the user to see energy consumed as the application progresses. For more details
about EnergyTrace+ technology, see Section 2.3.5.
2.7 Clocking
The MSP-EXP432P4111 provides external clocks in addition to the internal clocks in the device.
• Q1: 32-kHz crystal (LFXTCLK)
• Q2: 48-MHz crystal (HFXTCLK)
The 32-kHz crystal allows for lower LPM3 sleep currents and higher precision clock source than the
default internal 32-kHz REFOCLK. Therefore, the presence of the crystal allows the full range of low-
power modes to be used.
The 48-MHz crystal allows the device to run at its maximum operating speed for MCLK and HSMCLK.
The MSP432P4111 device has several internal clocks that can be sourced from many clock sources. Most
peripherals on the device can select which of the internal clocks to use to operate at the desired speed.

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Table 4 lists the default configuration of the internal clocks in the device.
Table 4. Default Clock Operation
Clock Default Clock
Source Default Clock Frequency Description
MCLK DCO 3 MHz Master clock. Sources CPU and peripherals.
HSMCLK DCO 3 MHz Subsystem master clock. Sources peripherals.
SMCLK DCO 3 MHz Low-speed subsystem master clock. Sources peripherals.
ACLK LFXT (or REFO if no
crystal present) 32.768 kHz Auxiliary clock. Sources peripherals.
BCLK LFXT (or REFO if no
crystal present) 32.768 kHz Low-speed backup domain clock. Sources LPM peripherals.
For more information about configuring internal clocks and using the external oscillators, see the
MSP432P4xx SimpleLink™ Microcontrollers Technical Reference Manual.
2.8 BoosterPack Plug-in Module Pinout
The MSP-EXP432P4111 LaunchPad development kit adheres to the 40-pin LaunchPad development kit
pinout standard. A standard was created to aid compatibility between LaunchPad and BoosterPack tools
across the TI ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPads like the
MSP-EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPacks to be used with
20-pin LaunchPads.
While most BoosterPacks are compliant with the standard, some are not. The MSP-EXP432P4111
LaunchPad kit is compatible with all 20-pin and 40-pin BoosterPack plug-in modules that are compliant
with the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly indicate
compatibility with the MSP-EXP432P4111 LaunchPad development kit, compare the schematic of the
candidate BoosterPack plug-in module with the LaunchPad development kit to ensure compatibility. Keep
in mind that sometimes conflicts can be resolved by changing the MSP432P4111 device pin function
configuration in software. More information about compatibility can also be found at
http://www.ti.com/launchpad.
Pins P3.5, P3.6, and P3.7 from the MSP432P4111 are connected to both the BoosterPack plug-in module
connector and the LCD. If these pins are driven with a digital voltage from either the MSP432P4111 or a
BoosterPack plug-in module, the LCD segments connected to these pins may be damaged.
Figure 14 shows the 40-pin pinout of the MSP-EXP432P4111 LaunchPad development kit.
Software configuration of the pin functions plays a role in compatibility. The MSP-EXP432P4111
LaunchPad development kit side of the dashed line in Figure 14 shows all of the functions for which the
MSP432P4111 device pins can be configured. This can also be seen in the MSP432P4111 data sheet.
The BoosterPack plug-in module side of the dashed line shows the standard. The MSP432P4111 function
whose color matches the BoosterPack function shows the specific software-configurable function by which
the MSP-EXP432P4111 LaunchPad kit adheres to the standard.

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Figure 14. LaunchPad-to-BoosterPack Connector Pinout