Fluke PM3082 User manual

PM3082 - PM3084 100 MHz
PM3092 - PM3094 200 MHz
ANALOG OSCILLOSCOPES
Service Manual
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PM3082 - PM3084 100 MHz
PM3092 - PM3094 200 MHz
Analog Oscillosco es
Service Manual
4822 872 05373
10 April ’97
Warning: Theseservicing instructions are for use by qualified ersonnel only. To reduce the rise
of electric shock donot erform any servicing other than that contained in the o erating
instructions unless you are fully qualified to do so.

DECLARATION OF CONFORMITY
for
FLUKE
Analog Oscilloscopes
PM3082, PM3084, PM3092, PM3094
Manufacturer
Fluke Indus rial B.V.
Lelyweg 1
7602 EA Almelo
The Ne herlands
Statement of Conformity
Based on es resul s using appropria e s andards, he produc is in conformi y wi h
Elec romagne ic Compa ibili y Direc ive 89/336/EEC
Low Vol age Direc ive 73/23/EEC
Sam le tests
S andards used:
I EC 348 (1978)
Safe y Requiremen s for Elec ronic Measuring Appara us
EN 50081-1 (1992)
Elec romagne ic Compa ibili y. Generic Emission S andard:
EN55022 and EN60555-2
EN 50082-1 (1992)
Elec romagne ic Compa ibili y. Generic Immuni y S andard:
IEC801 -2, -3, -4, -5
The es s have been performed in a ypical configura ion.
This Conformi y is indica ed by he symbol , i.e. "Conformi y europ6enne".
9

CONTENTS
“Z*f
TABLE OF CONTENTS Page
If'1 V* V • f • ..1 -
1 SAFETY INSTRUCTIONS.................................................. 1-1
1.1 INTRODUCTION............................................................................................................................1-1
1.2 SAFETY PRECAUTIONS......................................................... 1-1
f 1.3 CAUTION AND WARNING STATEMENTS .......... , . ............................................................ 1-1
V ' T • " ',r'
1.4 SYMBOLS ........................................ ...................................... "... ............................................ 1-1
1.5 IMPAIRED SAFETY-PROTECTION.............................................................................................1-2
1.6 GENERAL SATETY INFORMATION............................................................................................1-2
2 CHARACTERISTICS...................................................................................................2-1
2.1 VERTICAL..................................................................................................................................... 2-2
2.1.1 Channels.......................................................................................................................2-2
2.1.2 Deflec ion modes...........................................................................................................2-2
2.1.3 Bandwid h.....................................................................................................................2-2
2.1.4 A enua or.....................................................................................................................2-2
2.1.5 Inpu charac eris ics.......................................................................................................2-3
2.1.6 Coupling.........................................................................................................................2-3
2.1.7 Dynamic range...............................................................................................................2-3
2.1.8 Posi ion range...............................................................................................................2-3
2.1.9 Trace separa ion...........................................................................................................2-3
2.1.10 Inpu vol age limi s.........................................................................................................2-4
2.1.11 S ep response...............................................................................................................2-4
2.1.12 Signal delay...................................................................................................................2-5
2.1.13 Ver ical accuracies.........................................................................................................2-5
2.2 TIMEBASE...................................................................................................................................2-6
2.2.1 Timebase modes...........................................................................................................2-6
2.2.2 Timebase se ings.........................................................................................................2-6
2.2.3 DTB delay.....................................................................................................................2-6
2.2.4 Timebase accuracies, Delay ime accuracy, DTB ji er...................................................2-7
2.2.5 Ex ernal horizon al deflec ion.........................................................................................2-7
2.3 TRIGGERING.............................................................................................................................2-8
2.3.1 Source...........................................................................................................................2-8
2.3.2 Modes...........................................................................................................................2-8
2.3.3 TV sys ems...................................................................................................................2-8
2.3.4 Coupling.........................................................................................................................2-8
2.3.5 Sensi ivi y.......................................................................................................................2-9
2.3.6 Slope.............................................................................................................................2-9
2.3.7 Level...........................................................................................................................2-10
2.3.8 Hold O ff......................................................................................................................2-10
.■*»*• i < .
2> - CURSORS ................ : ............/:'V .. ’. ...................................... v . ........................ . , .......... 2-10
2.4.1 Cursor Con rol...............................................................v - ....... .. .... ..............■ .......... 2-10
2.4.2 Cursor Accuracies.......................................................................................................2-11
2.5 FRONT PANEL MEMORY...........................................................................................................2-11

IV CONTENTS
2.6 BLANKING OR Z-AXIS...... ...... . ...................... . . .......... ........................... .. ...................... 2-1V
2.7 DISPLAY......................................................................................................................................2-11
2.8 EXTERNAL INTERFACES.................................................................„ .... . . . - .......... 2-12
2.8.1 Calibra or .................................................................................... 2-12
2.8.2 S andard ex ernal in erfaces ........................................................ .2-12
2.8.3 Op ional ex ernal in erfaces.........................................................................................2-13
2.9 AUTOSET & CALIBRATION ............................................................... n ............ .................... 2-14
2.9.1 AUTO SET. ;T ............... 2-14
2.9.2 Calibra ion.............................................................................. ..........2-14
2.10 POWER SUPPLY & BATTERY BACKUP .................................................. ... ............ . . . f ___ 2-14
2.10.1 Power supply........................ 2-14
2.10.2 Ba ery backup .................................................... 2-15
2.11 MECHANICS................................................................................................... 2-15
2.12 ENVIRONMETAL....................................................................................................... . ............. 2-15 >
2.12.1 General......................................................... .... ...................... .. .................... . ...... 2-15
2.12.2 Environmen al .................................. .......................................... .... ......................... 2-15
2.13 EMI................................................................................... 2-17
2.13.1 General aspec s and Suscep ibili y .............. 2-17
2.13.2 VDE requiremen s................................. . ........ V-,.....- ........... , .................... ;..... 2-19
2.13.3 Addi ional EMI requiremen s ................... ,= ...................... 2-19
2.14 SAFETY................................................................,. . ........ .. . .................. • • • 2-20
... I. ", -5
2.15 ACCESSORIES................................................. .......................................................... .. .... - 2-20
2.16 OPTIONS & OPTIONAL VERSIONS .................. .1 ................................................ " ■ • • 2-20
2.16.1 Line Cord...................................................................................................•-/ ■ • • • - 2-20
2.16.2 Op ions versions .............................................. 2-20
2.16.3 Op ional ou pu s...................................................... 2-21
2.16.4 Op ional ex ernal MTB rigger inpu .............................................. 2-21
♦ . «1 'v
2.17 SPECIFICATION OF IEEE-OPTION........................................... .’ ..................................2-22
3 DESCRIPTIONS............................................................... ........ .................. .... 3-3
3.1 General descrip ion................................................................. .. ........................ ............ ♦..7..... 3-3
3.1.1 In roduc ion o oscilloscope family ............................................ 3-3
3.1.2 In roduc ion o descrip ions................................................. • - -- --------------------------- 3-3
, 3.1.3 Explana ion of signal names....................................... .. f . . . ............... 3-4
3.1.4 Vol age values in he circui diagrams ............................. .. . .. . .......... • • • • 3-4
3.2 BLOCK DIAGRAM DESCRIPTION................................................. .. . . .' .......... 7.-. -.... 3-5
3.2.1 In roduc ion .......................................................................... .. ...................... ^ .... .........3-5
3.2.2 Ver ical channels.................................................................. . ...................... . .... 3-6
< . 3.2.3 Triggering and ime bases ................................................. .......................................... 3-7
3.2.4 Final amplifiers .......................................................................... 3-8
3.2.5 Fron uni and microprocessor.......................................................................................3-9
3.2.6 Power supply...............................................................................................................3-10

CONTENTS V
4 PARTS...................................................................................... 4-1
4.1 UNITS................................................................................. . . .................................................4-1
4.2 INTERCONNECTION CABLES ........................................ 7;~V. .........................................4-1
4.3 MECHANICAL PARTS...................................................•’.' /. V'. . .............................................. 4-3
5 UNIT DESCRIPTIONS.............................................................. 5.1-1
5.1 SIGNAL UNIT A1 ................................................................................‘ . ................................ 5.1-1
5.1.1 Descrip ion A1.......................................................... 5.1-1
5.1.2 Signal name lis .................................................... ;...., .................................... 5.1-14
5.1.3 Uni lay-ou s.............................................................. 5.1-21
5.1.4 Loca ion lis Signal Uni A 1 ............................................................ 5.1-23
5.1.5 Circui diagrams..................................................................................................... 5.1-33
V 5.1.6 Par s lis .................................................................................................................. 5.1-55
* ' 5.2 FINAL XYZ AMPLIFIER A2..................................................................................................... 5.2-1
5.2.1 Descrip ion A2-200 MHz version ................................ v. : ,. ............................ 5.2-1
5.2.2 Signal name lis A2-200 MHz version...................................... 5.2-5
5.2.3 Uni lay-ou s A2-200 MHz version........................................................................... 5.2-7
5.2.4 Loca ion lis A2-200 MHz version .................................. 5.2-9
5.2.5 Circui diagrams A2-200 MHz version.................... 5.2-13
5.2.6 Par s lis A2-200 MHz version............................................................................... 5.2-19
5.2.7 Descrip ion of A2-100 MHz version............................. 5.2-35
5.2.8 Signal name lis A2-100 MHz version................................................................... 5.2-39
' 5.2.9 Uni lay-ou s A2-100 MHz version .......................................................................... 5.2-41
5.2.10 Loca ion Lis A2-100 MHz version......................................................................... 5.2-43
5.2.11 Circui diagrams A2-100 MHz version.................................................................... 5.2-47
5.2.12 Par s lis A2-100 MHz version............................... 5.2-53
5.3 MICROPROCESSOR A3 ... ........................................................... 5.3-1
5.3.1 Descrip ion A3......................................................................................................... 5.3-1
5.3.2 Signal name lis A 3 ................................ ^ . ............ .. . ............................................ 5.3-3
^ ; 5.3.3 Uni lay-ou s.............................................................. ’. ............................................ 5.3-5
5.3.4 Loca ion lis Microprocessor uni A 3....................................................................... 5.3-7
5.3.5 Circui diagrams ........................................ ' ............... '.7 ......................................... 5.3-9
5.3.6 Par s lis ................................................................................................................. 5.3-15
5.4 FRONT UNIT A4 .............. .................................................................................. .............. ‘ 5.4-1
5.4.1 Descrip ion............................................................................................................... 5.4-1
5.4.2 Signal name lis A4................................................................................ 5.4-1
5.4.3 Key swi ches.......................................................................... 5.4-2
5.4.4 Uni lay-ou s.............................................................f:.:..: ...................... 5.4-5
> 5:4.5 Circui diagrams. . ........................................................................’ .......................... 5.4-7
5.4.6 Par s lis .......................................................................... ; ........ .. ................ .. .’ ___ 5.4-9
5.5 CRT CONTROLS UNIT A5 .................................................... 1......................................... .. 5.5-1
5.5.1 Descrip ion....................................................................................................... 5.5-1
5.5.2 Uni Lay-ou s .......................................................... .'..' ................................ .-.... 5.5-2
5.5.3 Circiui diagram............................................................ 5.5-3
5.5.4 Par s lis .................................................................. 5.5-4

VI CONTENTS
5.6 POWER SUPPLY A 6 ............................................................................................................. 5.6-1
5.6.1 Descrip ion A 6.7 . . .................................................. 5.6-1
5.6.2 Signal name lis A6 . ................................................................................................ 5.6-4
5.6.3 Uni lay-ou s.............................................................. 5.6-5
5.6.4 Loca ion lis Power Supply uni A3................................................................ 5.6-7
5.6.5 Circui diagrams.................................................. 5.6-9
5.6.6 Par s lis .......... .. ............................................................................................'.... 5.6-13
5.7 RESERVED FOR FUTURE EXTENSIONS......................................................................1 . . 5.7-1
5.8 RESERVED FOR FUTURE EXTENSIONS............................................................. .......... 5.8-1
5.9 RESERVED FOR FUTURE EXTENSIONS........................................................................... 5.9-1
5.10 CONNECTOR BOARD A10........................................................................................ 5.10-1
5.10.1 Uni lay-ou ............................................................................................................. 5.10-1
5.10.2 Circui Diagrams................................................................................................ 5.10-2
5.10.3 Par s lis ................................................................................................................. 5.10-4
J 5
5.11 FACTORY INSTALLED OPTIONS........................................................................................ 5.11-1
5.11.1 IEEE-OPTION.......................................................................................... 5.11-1
5.11.2 AUXILIARY OUTPUTS AND EXTERNAL TRIGGER OPTION.............................. 5.11-1
6 PERFORMANCE TEST...............................................................................................6-1
6.1 GENERAL INFORMATION...............................................................................................................- . 6-1
6.2 RECOMMENDED TEST EQUIPMENT..........................................................................77. .... 6-2
6.3 TEST PROCEDURE...............................................................................................\ . 7 . ? ......... 6-3
6.3.1 Preliminary se ings.......................................................................................................6-3
6.3.2 Power supply.................................................................................................... .-..7.6-3
6.3.3 Au o se .........................................................................................................................6-4
6.3.4 Or hogonali y.................................................................................................................6-4
6.3.5 Trace dis or ion.............................................................................................................6-6
6.3.6 Ver ical deflec ion; deflec ion coefficien s.....................................................................6-7
6.3.7 Ver ical deflec ion; variable gain con rol range (con inua ion of 6.3.6) ........................ 6-8
6.3.8 Ver ical deflec ion; inpu coupling (con inua ion of 6.3.7) ...................................... f .7 6-8
6.3.9 Ver ical cursor accuracy (con inua ion of 6.3.8.)...........................................................6-8
6.3.10 Ver ical deflec ion, high-frequency response..............................................'...............6-9
6.3.11 Ver ical deflec ion, low-frequency response.................................................................6-9
6.3.12 Ver ical deflec ion; dynamic range a 25/50 MHz.........................................................6-10
6.3.13 Ver ical deflec ion; dynamic range a 100/200 MHz (con inua ion of 6.3.12) .............. 6-11
6.3.14 Ver ical deflec ion; posi ion range................................................................ 6-11
6.3.15 Ver ical deflec ion; cross alk be ween channels a 100/200 MHz .............................. 6-12
6.3.16 Ver ical deflec ion; common mode rejec ion ra io a 1 MHz ........................................ 6-13
6.3.17 Ver ical deflec ion; common mode rejec ion ra io a 50 MHz ...................................... 6-13
6.3.18 Ver ical deflec ion; LF lineari y.....................................................................................6-14
6.3.19 Ver ical deflec ion; visual signal delay .................... .............................. .V7 .... 6-15
6.3.20 Ver ical deflec ion; base line ins abili y...........................................................: .... 6-16
6.3.21 Delay difference be ween ver ical channels...............................................: ___ .... 6-16
6.3.22 Horizon al deflec ion; display modes and race separa ion.........................................6-18
6.3.23 Horizon al deflec ion; X deflec ion....................................................................1... 6-19
■v 6.3.24 Horizon al deflec ion; main ime-base deflec ion coefficien s ........................ .. 6-20
6.3.25 Horizon al deflec ion; VARiable mode accuracy MTB ..................... . ............. .... 6-2
' 6.3.26 Time cursor accuracy (con inua ion of 6.3.25) ................ .......... 'f-v ........... , , . . 6-22
6.3.27 Horizon al deflec ion; delayed ime-base deflec ion coefficien s ................................ 6-22
6.3.28 Horizon al deflec ion; delay ime mul iplier...................................................................6-24

CONTENTS VII
■" 6.3.29 Horizon al deflec ion; delayed imebase ji er...........................................................6-24
6.3.30 Horizon al deflec ion; X deflec ion coefficien via CHI ................................................ 6-25
6.3.31 Horizon al deflec ion; X deflec ion coefficien via ’line’ ................................................ 6-26
6.3.32 Horizon al deflec ion; high frequency response .......................................................... 6-26
6.3.33 Maximum phase shif be ween horizon al and ver ical deflec ion .............................. 6-27
6.3.34 MTB riggering PM3092/3094; rigger sensi ivi y via CH1, CH2, CH3 and CH4 ------ 6-28
6.3.35 MTB riggering PM3082/3084; rigger sensi ivi y via CH1, CH2, CH3 and CH4 ------ 6-29
6.3.36 MTB/DTB riggering; rigger sensi ivi y TVL-TVF ........................................................ 6-30
6.3.37 DTB riggering PM3092/3094; rigger sensi ivi y via CH1, CH2, CH3 and CH4 .... 6-31
6.3.38 DTB riggering PM3082/3084; rigger sensi ivi y via CH1, CH2, CH3 and CH4 .... 6-32
6.3.39 Z-MOD sensi ivi y.............................................T- ■ .... ..............................................6-33
6.3.40 Probe Adjus signal; frequency and ou pu vol age .................................................... 6-34
7 CALIBRATION ADJUSTMENT PROCEDURE ............ ............................................. 7-1
7.1 INTRODUCTION ........................................................................ 7-1
7.2 DARK LEVEL OF CRT.................................................................................................................7-1
7.3 TRACE ROTATION.....................................................................................................................7-1
7.4 HORIZONTAL (X) GAIN AND OFFSET.......................................................................................7-2
7.5 TEXT STABILITY AND X-OFFSET...............................................................................................7-2
7.6 VERTICAL (Y) GAIN AND OFFSET.............................................................................................7-2
7.7 ASTIGMATISM.............................................................................................................................7-2
7.8 AUTOCAL PROCEDURE.............................................................................................................7-3
7.9 LF SQUARE-WAVE RESPONSE CH1.........................................................................................7-3
7.10 LF SQUARE-WAVE RESPONSE CH2 ....................................................................................... 7-4
_ 7.11 LF SQUARE-WAVE RESPONSE CH3 ....................................................................................... 7-4
. 67.12 LF SQUARE-WAVE RESPONSE CH4.........................................................................................7-4
7.13 HF SQUARE-WAVE RESPONSE FINAL Y AMPLIFIER ............................................................ 7-5
7.14 SAVING THE CALIBRATION DATA.............................................................................................7-6
7.15 TESTING THE INSTRUMENT’S PERFORMANCE.....................................................................7-6
8 CORRECTIVE MAINTENANCE PROCEDURES ...................................................... 8-1
8.1 DISMANTLING THE INSTRUMENT.............................................................................................8-1
8.1.1 General informa ion.......................................................................................................8-1
8.1.2 Removing he cabine and carrying handle...................................................................8-1
i
8.2 REPLACEMENTS.........................................................................................................................8-1
8.2.1 S andard par s.................................................................................................................8-2
4 -v . 8.2.2 Special par s...................................................................................................................8-2
■: 6 . 8.2.3 Transis ors and In egra ed Circui s ................................................................ ............. 8-2

VIII CONTENTS
8.3 STATIC SENSITIVE COMPONENTS...........................................................................................8-2
8.4 SOLDERING TECHNIQUES.......................................................................................................8-3
8.4.1 General soldering echniques.......................................................................................8-3
8.4.2 Soldering micro-minia ure semi-conduc ors...................................................................8-3
8.5 REMOVING THE UNITS, MECHANICAL PARTS AND CRT.......................................................8-4
8.5.1 Removing he ro ary knobs...........................................................................................8-4
8.5.2 De achmen of ribbon cables.........................................................................................8-4
8.5.3 Removal of he uni s in he fron frame.........................................................................8-4
8.5.4 Removal of he Power supply uni A 6...........................................................................8-5
8.5.5 Removal of microprocessor uni A3...............................................................................8-5
8.5.6 Removal of Final XYZ amplifier uni A2.........................................................................8-6
8.5.7 Removal of uni a socke of CRT.................................................................................8-7
8.5.8 Removal of signal uni A 1 .............................................................................................8-7
8.5.9 Removal of Ca hode Ray Tube (CRT)...........................................................................8-8
8.6 INSTRUMENT REPACKING.......................................................................................................8-8
8.7 TROUBLESHOOTING TECHNIQUES.........................................................................................8-8 -
8.8 TROUBLESHOOTING THE POWER SUPPLY...........................................................................8-9
8.9 SPECIAL TOOLS........................................................................................................................8-10
8.9.1 Ex ension board...........................................................................................................8-10
8.9.2 Flash-ROM loader program.........................................................................................8-10
8.10 RECALIBRATION AFTER REPAIR...........................................................................................8-10
8.11 TROUBLE SHOOTING TOOLS................................................................................................8-11
8.12 TESTS BUILT INTO THE INSTRUMENT..................................................................................8-11
8.12.1 Power-up es ...............................................................................................................8-11
8.12.2 In roduc ion o diagnos ic es s...................................................................................8-12
8.12.3 Self es ......................................................................................................................... 8-12
8.12.4 Repair ools.................................................................................................................8-15
8.13 THE AUTOCAL PROCEDURE...................................................................................................8-19
8.13.1 In roduc ion.................................................................................................................8-19
8.13.2 FAULT LOCATION VIA ERROR CODES...................................................................8-20
8.13.3 HOWTO USE THE ERROR CODE LISTS.................................................................8-20
8.13.4 ERROR CODE LISTS.................................................................................................8-21
9 SAFETY INSPECTION AND TESTS AFTER REPAIR AND
MAINTENANCE IN THE PRIMARY CIRCUIT ............................................................ 9-1
9.1 GENERAL DIRECTIONS.............................................................................................................9-1
9.2 SAFETY COMPONENTS.............................................................................................................9-1
9.3 CHECKING PROTECTIVE GROUND.........................................................................................9-1
9.4 CHECKING INSULATION RESISTANCE.....................................................................................9-1
9.5 CHECKING LEAKAGE CURRENT...............................................................................................9-f
9.6 VOLTAGE TEST............................................................................................................................9-1

SAFETY INSTRUCTIONS 1 -1
1 SAFETY INSTRUCTIONS
Read hese pages carefully before ins alla ion and use of he ins rumen .
1.1 INTRODUCTION
The following paragraphs con ain informa ion, cau ions and warnings which mus be followed o
ensure safe opera ion and o keep he ins rumen in a safe condi ion.
WARNING: Servicing described in this manual is to be done only by qualified service
ersonnel. To avoid electric shock, do not service the instrument unless you are
qualified to do so.
1.2 SAFETY PRECAUTIONS
For he correc and safe use of his ins rumen i is essen ial ha bo h opera ing and servicing
personnel follow generally accep ed safe y procedures in addi ion o he safe y precau ions specified
in his manual.
Specific warning and cau ion s a emen s, where hey apply, will be found hroughou he manual.
Where necessary, he warning and cau ion s a emen s and/or symbols are marked on he appara us.
1.3 CAUTION AND WARNING STATEMENTS
CAUTION: Is used to indicate correct o erating or maintentance rocedures in order to
revent damage to or destruction of the equi ment or other ro erty.
WARNING: Calls attention to a otential danger that requires correct rocedures or
ractices in order to revent ersonal injury.
1.4 SYMBOLS
Live par (black/yellow)
High vol age erminal > 1000 V (red)
A en ion refer o he manual:
This symbol is o indica e ha informa ion abou usage of a fea ure is con ained in
he manual.
Pro ec ive ground erminal (black)
S a ic sensi ive componen s (black/yellow)

1 -2 SAFETY INSTRUCTIONS
1.5 IMPAIRED SAFETY-PROTECTION
Whenever i is likely ha safe y has been impaired, he ins rumen mus be urned off and
disconnec ed from line power. The ma er should hen be referred o qualified echnicians. Safe y
pro ec ion is likely o be impaired if, for example, he ins rumen fails o perform he in ended
measuremen s or shows visible damage.
1.6 GENERAL SATETY INFORMATION
WARNING: Removing the instrument cover or removing arts, exce t those to which
access can be gained by hand, is likely to ex ose live arts and accessible
terminals which can be dangerous to live.
The ins rumen shall be disconnec ed from all vol age sources before i is opened.
Capaci ors inside he ins rumen can hold heir charge even if he ins rumen has been separa ed
from all vol age sources.
WARNING: Any interru tion of the rotective ground conductor inside or outside the
instrument, or disconnection of the rotective ground terminal, is likely to make
the instrument dangerous. Intentional interru tion is rohibited.
Componen s which are impor an for he safe y of he ins rumen may only be replaced by
componen s ob ained hrough your local FLUKE organisa ion. (See also sec ion 9).
Af er repair and main enance in he primary circui , safe y inspec ion and es s, as men ioned in
sec ion 9 have o be performed.

CHARACTERISTICS 2-1
2 CHARACTERISTICS
A. Performance Charac eris ics
Proper ies expressed in numerical values wi h olerances, ranges or limi s s a ed, are
guaran eed by he manufac urer.
Proper ies expressed in numerical values wi hou olerances, ranges or limi s s a ed, represen
he charac eris ics of an average ins rumen .
This specifica ion is valid if he empera ure has no changed more han + or -5 °C since he las
AUTO CAL and he probe is of he same 10:1 model as delivered wi h he ins rumen .
For defini ions of erms, reference is made o IEC Publica ion 351 -1, 359.
B. Safe y Charac eris ics
This ins rumen has been designed and es ed in accordance wi h IEC Publica ion 348, Safe y
requiremen s for Elec ronic Measuring Appara us and has been supplied in a safe condi ion. This
manual con ains informa ion and warnings which mus be followed by he user o ensure safe
opera ion and o keep he ins rumen in safe condi ion. The ins rumen has been designed for indoor
use. I may occasionally be subjec ed o empera ures be ween + 5 °C and 10 °C wi hou degrada ion
of i s safe y.
C. Ini ial Charac eris ics
Overall dimensions:
Heigh (wi hou fee ) : 139 mm 5.5"
Wid h (wi hou handle) : 341 mm 13.5"
Leng h (wi hou handle and fron cover) : 481 mm 19"
Figure 2.1 Dimensions
Mass :8.5 kg 17.61b.
Opera ing posi ions:
a) Horizon ally on bo om fee
b) Ver ically on rear fee
c) On he carrying handle in hree sloping posi ions

2-2 CHARACTERISTICS
2.1 VERTICAL
2.1.1 Channels
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
CHANNELS CH1; CH2; Form a channelse
CH3; CH4 Form a channelse
Deflection modes
MODES CH1, CH2, CH3, CH4 CH2 and CH4 can be inver ed o
allow -CH2 or -CH4
CH1 +CH2 CH2 can be inver ed o allow
CH1 - CH2
CH3 + CH4 CH4 can be inver ed o allow
CH3- CH4
Al erna e/Chopped
Chopped mode:
Chop. freq. 1 MHz
Bandwidth
FREQUENCY RESPONSE
Lower ransi ion
poin of BW inpu
coupling in AC pos. <10 Hz
A BNC
Upper ransi ion
poin of BW
PM3094 CH1 ... CH4 in 50Q posi ion
PM3092 CH1, CH2 in 500 posi ion
CH3, CH4 a probe ip
(Ambien 5...40 °C) >200 MHz
(Ambien 0...50 °C) >175 MHz
PM3082/84 CH1 ... CH4 wi h ex . 50Q
(Ambien 5...40 °C) >100 MHz
(Ambien 0...50 °C) >90 MHz
BANDWIDTH LIMITER
Upper ransi ion
poin of BW 20 MHz
Attenuator
CH1 and CH2
(PM3092/PM3082)
S eps 2 mV/div ... 5 V/div In a 1-2-5 sequence
CH3 and CH4
(PM3092/PM3082)
S eps O.IV/div, 0.5V/div
CH1 o CH4
(PM3094/PM3084)
S eps 2m V/div...5V/div in a 1 -2-5- sequence
Variable gain mode 2mV/div...12.5V/div Con inuously variable

CHARACTERISTICS 2-3
2.1.9
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
In ut characteristics
INPUT CONNECTOR BNC See no e 1
INPUT IMPEDANCE Measured a freq.
(in 1 MQ pos.)
R parallel:
- value 1 MQ
<1 MHz
- olerance
C parallel: ±1 %
- value 25 pF
- olerance ±2 pF
INPUT IMPEDANCE PM3092 only CH1 and CH2.
(in 50 £2 pos.)
R parallel:
- value 50 Q
PM3094 all channels
- olerance ±1 %
VSWR ( ypical) 1.5: 1 See no e 2
Note 1: NC with Probe Read Out Pin which causes the instrument to change V/div indication,
input impedance and attenuator setting according to probe (when fitted with a probe
indicator).
Note 2: Measured up to 200 MHz input frequency; in d.c. and a.c. coupling of input.
Cou ling
COUPLING d.c.; a.c.; ground See no e 1
Note 1: In GND position: channel disconnected from input, and connected to ground, NC open
(when not in 50Q. position). The GND coupling is not available for CH3 and CH4 in
PM3092 and PM3082.
Dynamic range
DYNAMIC RANGE
Up o 25 MHz
(PM3082/84)
Up o 50 MHz ±12 div Symme rical
(PM3092/94) ±12 div Symme rical
Up o 100 MHz
(PM3082/84) ±4 div Symme rical
Up o 200 MHz
(PM3092/94) ±4 div Symme rical
Position range
POSITION RANGE ±£8 div Symme rical
Trace se aration
TRACE SEPARATION MTB and DTB
Min. range >± 4 div MTB fixed, DTB shif s

2-4 CHARACTERISTICS
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
2.1.10 In ut voltage limits
INPUT VOLTAGE LIMITS See no e 1
A In high Z posi ion ±400 V See no e 2
/ f \ (d.c. + a.c. peak)
l * » In 50 Q posi ion
d.c. ±5 V
a.c. r.m.s. 5 V See no e 3
a.c. peak ±50 V See no e 3
Note 1: Apparatus should be property grounded through the protective ground conductor of the
power cord.
Note 2: Up to 10 kHz; > 10 kHz see figure 2.2
Note 3: Maximum of 50 mJ during any 100 ms interval.
MAX. INPUT
VOLTAGE (Vpk)
1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
Figure 2.2 Max input voltage versus frequency
2.1.11 Ste res onse
STEP RESPONSE Is calcula ed from he formula: Rise ime = 0.35 / Bandwid h and
is measured over cen ral 5 divisions (ver ical)

CHARACTERISTICS 2-5
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
2.1.12 Signal delay
VISUAL SIGNAL DELAY >15 ns
>13 ns
DELAY BETWEEN
CHANNELS
CH1 and CH2 <250 ps
CH3 and CH4 <250 ps
CH1...CH4 <250 ps
Any wo channels <500 ps
2.1.13 Vertical accuracies
ACCURACY
deflec ion fac or
Gain error (d.c.) ±1.3 %
Non lineari y <2 %
MAX. BASELINE
INSTABILITY
Jump (all be ween s eps, 0.2 div or 1 mV Whichever is grea er
VAR and N/l) (af er au ocal)
Drif 0.1 div/h
Tempera ure
coefficien 0.03div/K
CHANNEL ISOLATION
Of deselec ed channels
a 10 MHz 100:1 See no e 3
Of deselec ed channels
a upper ransi ion poin 50 :1 See no e 4
Be ween selec ed channel 50 :1 See no e 5
CMRR See no e 6
a 1 MHz 100:1
a 50 MHz 25:1
Note 1: add 1.5 % for variable gain mode
Note 2: 2 div centerscreen signal with a frequency of 50 kHz, shifted within central 6 div.
Note 3: At 10 MHz; input to deselected channel equivalent to 8 div. or less.
Note 4: PM3092/3094 at200 MHz; PM3082/3084 at 100 MHz; channels with equal V/div setting;
input to deselected channels equivalent to 6 div.
Note 5: PM3092/3094 at 200 MHz; PM3082/3084 at 100 MHz; channels with equal V/div.
settings; input to either channel 6 div. PM3092/94: max input amplitude 3 Vpp
Note 6: etween any two input channels at same attenuator setting; VAR of V/div setting adjusted
for best CMRR; measured with max. 8 div input at each channel (center screen).
PM3092, PM3094
PM3082, PM3084
4 channel ins rumen s
2+2 channel ins rumen s
Over cen ral 6 div.
See no e 1
See no e 2

2-6 CHARACTERISTICS
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
2.2 TIMEBASE
2.2.1 Timebase modes
TIMEBASE MODES MTB only
MTB and DTB
DTB only
MTB = Main Time Base
al erna ing
DTB = Delayed Time Base
MTB rigger modes AUTO
TRIGGERED
SINGLE
free run af er 100ms
DTB rigger modes DTB s ar s
DTB riggered s ar s af er adjus ed DELAY ime
s ar s on firs rigger af er
DELAY ime
2.2.2 Timebase settings
MTB (PM3092/94)
Se ings
Variable Time/Div range 0.5 s/div ... 20 ns/div
1.25s/div... 20 ns/div No e 1
MTB only; con inuously variable
DTB (PM3092/94)
Se ings 0.5 ms/div ... 20 ns/div No e 1
No e 3
MTB (PM3082/84)
Se ings
Variable Time/Div range 0.5 s/div ... 50 ns/div
1.25 s/div ... 50 ns/div No e 1
MTB only; con inuously variable
DTB (PM3082/84)
Se ings 0.5 ms/div ... 50 ns/div No e 1
No e 3
TIMEBASE 10x No e 2
MAGNIFICATION
Note 1: In a 1-2-5 sequence. y means of the timebase magnifier (x10) the range is extended to
2 ns/div (PM3092/94) or to 5 ns/div (PM3082/84).
Note 2: Expands the normal time/div. by 10 times (MT and DT )
Note 3: The DT sweepspeed is higher or equal to MT time/div. setting.
2.2.3 DTB delay
DELAY TIME
Posi ion range
Resolu ion
2 ns ... 4.9 s
0.1 ... 9.9 div
1 ; 40000

CHARACTERISTICS 2-7
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
2.2.4 Timebase accuracies, Delaytime accuracy, DTB jitter
TIMEBASE ACCURACY
2.2.5
Unmagnified: ± (1.3% of reading +
0.5% of cen ral 8 div) No e 1
Magnified: ± (1.3% of reading + No e 2
up o 10 ns/div 1.0% of cen ral 8 div) No e 1
in 5ns/div and 2ns/div ± (1.8% of reading +
1.5% of cen ral 8 div) No e 1
Note 1: add 1% of reading in variable mode
Note 2: valid over central unmagnified 8 div
DELAYTIME ACCURACY ±(0.8% of reading + 0.3% No e 1
of cen ral 8 div + 4ns) PM3092, PM3094
±(0.8% of reading + 0.3% No e 1
of cen ral 8 div + 5ns) PM3082, PM3084
Note 1: add 1%of reading in variable mode.
DTB ji er in s ar s 1 par of 25000
External horizontal deflection
DEFLECTION SOURCES Line and CH1...CH4
LINE DEFLECTION
Deflec ion ampli ude 6 ±1.7 div Be ween 49 and 61 I
CHANNEL DEFLECTION Refer o VERTICAL
Error limi ±5% Over cen ral 6.div.
Lineari y error limi ±2% No e 1
Dynamic range
up olOOkHz 20 div
up o 2MHz 10 div
POSITION RANGE ±5 div
FREQUENCY RESPONSE
Upper ransi ion poin 2 MHz
MAX. PHASE DIFFERENCE
Be ween horizon al 3° Up o 100 kHz
and ver ical

2-8 CHARACTERISTICS
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
2.3 TRIGGERING
2.3.1 Source
SOURCE(S)
MTB- riggering CH1...CH4, Line;
Composi e No e 1
SOURCE(S)
DTB- riggering CH1...CH4, TV-line No e 2
Note 1: Each displayed channel provides its own triggering. This feature is available in the
alternated mode.
Note 2: Only available when MT -mode is switched in TV
2.3.2 Modes
MODES
MTB- riggering EDGE
TV
MODES
DTB- riggering EDGE
2.3.3 TV systems
TV sys ems TV No e 1
HDTV No e 1
Note 1: Fieldl, Field2 and TVline selection possible.
2.3.4 Cou ling
BANDWIDTH EDGE
TRIGGER MTB ver ical coupling in DC
Lower ransi ion poin of BW BW = Bandwid h
Trigger coupling:
DC d.c.
AC 10 Hz
LF-rejec 30 kHz
HF-rejec d.c.
Upper ransi ion poin of BW
Trigger coupling:
DC See sensi ivi y
AC See sensi ivi y
LF-rejec See sensi ivi y
HF-rejec 30 kHz

CHARACTERISTICS 2-9
CHARACTERISTICS SPECIFICATION ADDITIONAL INFORMATION
BANDWIDTH EDGE
TRIGGER DTB ver ical coupling in DC
Lower ransi ion poin of BW BW = Bandwid h
Trigger coupling:
DC d.c.
AC 10 Hz
LF-rejec 30 kHz
HF-rejec d.c.
Upper ransi ion poin of BW
Trigger coupling:
DC See sensi ivi y
AC See sensi ivi y
LF-rejec See sensi ivi y
HF-rejec 30 kHz
Sensitivity
EDGE TRIGGER SENSITIVITY
MTB/DTB (PM3092/94)
d.c. o 100 MHz 0.5 div
See no e 1 & 3
d.c. o 200 MHz 1.0 div
d.c. o 300 MHz 2.0 div See no e 2
EDGE TRIGGER SENSITIVITY
MTB/DTB (PM3082/84)
d.c. o 50 MHz 0.5 div
See no e 1 & 3
d.c. o 100 MHz 1.0 div
d.c. o 200 MHz 2.0 div See no e 2
TV TRIGGER SENSITIVITY
ampli ude of sync pulse 0.7 div See no e 1
Note 1: All figures are valid for an ambient temperature range of 5... 40°C, add 20 % for ambient
0... 50°C.
Note 2: Measured with a 2 div centerscreen signal.
Note 3: In noise trigger multiply stated value by 2.
2.3.6 Slo e
Slope selec ion edge + or - MTB and DTB. See no el
Note 1: In TV-triggering pos/neg video.